Powerex CM2500DY-24S Data Sheet

CM2500DY-24S

Powerex, Inc., 173 Pavilion Lane, Youngwood, Pennsylvania 15697 [phone]

AN

F

J (18 PLACES)

E2 E2

D

E

AT

C1 C1

K

F

AF AF AF

E2 E2

C1 C1

AP

K

M (8 PLACES)

AG AJ

AFAF

E2 (Es2)

A

AQ

E2 G2 C2

L

L

G1 E1 C1

F

G2

Di1

Tr 1

G1

AR

P

Q

P

N

AM

Tr 2

Di2

E1 (Es1)

S

L

L

R

AKAH

C2 (Cs2)

C1 (Cs1)

G

C2E1

C2E1

K

AC

AF

F

AL

F

C2E1

C2E1

T

AE

NTC

AS

H (12 PLACES)

F

V

B

C

AA

F

W

U

TH1

TH2

AB

AU

AC
(SCREWING
DEPTH)

Z
(SCREWING
DEPTH)

Tolerance Otherwise Specified (mm)

Division of Dimension Tolerance

0.5 to 3 ±0.2
over 3 to 6 ±0.3
over 6 to 30 ±0.5
over 30 to 120 ±0.8

over 120 to 400 ±1.2
The tolerance of size between
terminals is assumed to ±0.4

AD

Outline Drawing and Circuit Diagram

Dimensions Inches Millimeters

A 12.2 310.0

B 5.6 142.5

C 4.96 126.0

D 1.89 48.0

E 1.85 46.9

F 0.28 7. 0

G 2.28 58.0

H 0.21±0.004 Dia. 5.5±0.1 Dia.

J M6 Metric M6

K 1.65 42.0

L 0.91 23.0

M M4 Metric M4

N 0.35 9.0

P 0.47 11.9

Q 0.21 5.4

R 0.33 8.5

S 4.92 125.0

T 0.6 15.0

U 0.83 21.0

V 1.5 38.0

W 2.04 51.9

X 1.85+0.04/-0.02 47.1+1.0/-0.5

Dimensions Inches Millimeters

Z 0.63 16.0

AA 0.24 6.2

AB 0.16 4.0

AC 0.45 11.5

AD 2.01+0.04/-0.02 51.0+1.0/-0.5

AE 0.32 8.2

AF 0.55 14.0

AG 2.05 52.0

AH 0.59 15.0

AJ 7.01 178.0

AK 3.98 101.0

AL 1.63 41.5

AM 1.54 39.0

AN 11.42 290.0

AP 9.13 232.0

AQ 6.85 174.0

AR 4.56 116.0

AS 0.39 10.0

AT 0.03 8.0

AU 0.02 5.0

AV 0.16 4.0

AW 1.425+0.04/-0.02 36.2+1.0/-0.5

Y 1.55 39.4

5/14 Rev. 3

Dual Half-Bridge
IGBT HVIGBT
Series Module

2500 Amperes/1200 Volts

X

Y

AV

AW

Description:

Powerex IGBT Modules are
designed for use in switching
applications. Each module
consists of two IGBT Transistors
in a half-bridge configuration with
each transistor having a reverse­connected super-fast recovery
free-wheel diode. All components
and interconnects are isolated from
the heat sinking baseplate, offering
simplified system assembly and
thermal management.

Features:

£ Low Drive Power
£ Low V
£

£ Isolated Baseplate for Easy

£ NTC Thermistor

Applications:

£ AC Motor Control
£ Motion/Servo Control
£ Photovoltaic/Wind
£ UPS Inverter

Ordering Information:

Example: Select the complete
module number you desire from
the table below -i.e.
CM2500DY-24S is a 1200V
(V

CES

Half-Bridge IGBT HVIGBT
Power Module.

Type Current Rating
Amperes Volts (x 50)

CM 2500 24

CE(sat)

Discrete Super-Fast Recovery
Free-Wheel Diode

Heat Sinking

), 2500 Ampere Dual

V

CES

1

Powerex, Inc., 173 Pavilion Lane, Youngwood, Pennsylvania 15697 [phone]

CM2500DY-24S
Dual Half-Bridge IGBT HVIGBT Module

2500 Amperes/1200 Volts

Absolute Maximum Ratings, Tj = 25°C unless otherwise specied

Inverter Part IGBT/FWDi

Characteristics Symbol Rating Units

Collector-Emitter Voltage (VGE = 0V) V

Gate-Emitter Voltage (VCE = 0V) V

Collector Current (DC, TC = 84°C)

*2,*4

IC 2500 Amperes

Collector Current (Pulse, Repetitive)*3 I

Total Maximum Power Dissipation (TC = 25°C)

*2,*4

P

Emitter Current (DC)*2 I

Emitter Current (Pulse, Repetitive)*3 I

1200 Volts

CES

±20 Volts

GES

5000 Amperes

CRM

11535 Watts

tot

*1

2500 Amperes

E

*1

5000 Amperes

ERM

Module

Characteristics Symbol Rating Units

Isolation Voltage (Terminals to Baseplate, RMS, f = 60Hz, AC 1 minute) V

Maximum Junction Temperature, Instantaneous Event (Overload) T

Maximum Case Temperature*4 T

Operating Junction Temperature, Continuous Operation (Under Switching) T

Storage Temperature T

*1 Represent ratings and characteristics of the anti-parallel, emitter-to-collector free wheeling
diode (FWDi).
*2 Junction temperature (Tj) should not increase beyond maximum junction
temperature (T
*3 Pulse width and repetition rate should be such that device junction temperature (Tj)
does not exceed T
*4 Case temperature (TC) and heatsink temperature (Ts) is measured on the surface
(mounting side) of the baseplate and the heatsink side just under the chips.
Refer to the figure to the right for chip location.
The heatsink thermal resistance should be measured just under the chips.

j(max)

) rating.

j(max)

rating.

284.2

256.0

226.2

Tr2

Di2

Tr2

Di2

286.0

Each mark points to the center position of each chip.

Tr1 / Tr2: IGBT Di1 / Di2: FWDi Th: NTC Thermistor

Tr2

Di1

Di2

Tr1

Tr2

Di1

Di2

Tr1

257.7

228.0

4000 V

ISO

175 °C

j(max)

125 °C

C(max)

-40 ~ 150 °C

j(opr)

-40 ~ 125 °C

stg

198.0

168.2

140.0

110.2

82.0

52.2

Tr2

Di1

Di2

Tr1

Tr2

Di1

Di2

Tr1

199.7

170.0

Tr2

Di1

Di2

Tr1

Tr2

Di1

Di2

Tr1

141.7

112.0

Tr2

Di1

Di2

Tr1

Tr2

Di1

Di2

Tr1

Th

83.7

54.0

46.5

Di1

Tr1

Di1

Tr1

24.0

25.7

0

10 1.2

96.2

87.7

82.7

59.2

54.2

45.7

40.7

24.5

0

0

LABEL SIDE

2

5/14 Rev. 3

Powerex, Inc., 173 Pavilion Lane, Youngwood, Pennsylvania 15697 [phone]

CM2500DY-24S
Dual Half-Bridge IGBT HVIGBT Module

2500 Amperes/1200 Volts

Electrical Characteristics, Tj = 25°C unless otherwise specied

Inverter Part IGBT/FWDi

Characteristics Symbol Test Conditions Min. Typ. Max. Units

Collector-Emitter Cutoff Current I

Gate-Emitter Leakage Current I

Gate-Emitter Threshold Voltage V

Collector-Emitter Saturation Voltage V

(Terminal) IC = 2500A, VGE = 15V, Tj = 125°C*5 — 2.00 — Volts

IC = 2500A, VGE = 15V, Tj = 150°C*5 — 2.05 — Volts

Collector-Emitter Saturation Voltage V

(Chip) IC = 2500A, VGE = 15V, Tj = 125°C*5 — 1.90 — Volts

IC = 2500A, VGE = 15V, Tj = 150°C*5 — 1.95 — Volts

Input Capacitance C

Output Capacitance C

Reverse Transfer Capacitance C

Gate Charge QG VCC = 600V, IC = 2500A, VGE = 15V — 5800 — nC

Turn-on Delay Time t

Rise Time tr VCC = 600V, IC = 2500A, VGE = ±15V, — — 200 ns

Turn-off Delay Time t

Fall Time tf — — 300 ns

Emitter-Collector Voltage V

(Terminal) IE = 2500A, VGE = 0V, Tj = 125°C*5 — 1.80 — Volts

IE = 2500A, VGE = 0V, Tj = 150°C*5 — 1.80 — Volts

Emitter-Collector Voltage V

(Chip) IE = 2500A, VGE = 0V, Tj = 125°C*5 — 1.70 — Volts

IE = 2500A, VGE = 0V, Tj = 150°C*5 — 1.70 — Volts

Reverse Recovery Time t

Reverse Recovery Charge Q

Turn-on Switching Energy per Pulse Eon VCC = 600V, IC = IE = 2500A, — 174 — mJ

Turn-off Switching Energy per Pulse E

Reverse Recovery Energy per Pulse E

Internal Lead Resistance R

Per Switch,TC = 25°C

Internal Gate Resistance rg Per Switch — 1.1 — Ω

*1 Represent ratings and characteristics of the anti-parallel, emitter-to-collector free wheeling
diode (FWDi).
*4 Case temperature (TC) and heatsink temperature (Ts) are measured on the surface
(mounting side) of the baseplate and the heatsink side just under the chips.
Refer to the figure on page 1 for chip location.
The heatsink thermal resistance should be measured just under the chips.
*5 Pulse width and repetition rate should be such as to cause negligible temperature rise.

VCE = V

CES

VGE = V

GES

IC = 250mA, VCE = 10V 5.4 6.0 6.6 Volts

GE(th)

IC = 2500A, VGE = 15V, Tj = 25°C*5 — 1.80 2.25 Volts

CE(sat)

IC = 2500A, VGE = 15V, Tj = 25°C*5 — 1.70 2.15 Volts

CE(sat)

— — 250 nF

ies

VCE = 10V, VGE = 0V — — 50 nF

oes

— — 4.2 nF

res

— — 800 ns

d(on)

RG = 0Ω, Inductive Load — — 700 ns

d(off)

*1

IE = 2500A, VGE = 0V, Tj = 25°C*5 — 1.80 2.25 Volts

EC

*1

IE = 2500A, VGE = 0V, Tj = 25°C*5 — 1.70 2.15 Volts

EC

*1

VCC = 600V, IE = 2500A, VGE = ±15V — — 300 ns

rr

*1

RG = 0Ω, Inductive Load — 70 — µC

rr

VGE = ±15V, RG = 0Ω, — 259 — mJ

off

*1

Tj = 150°C, Inductive Load — 195 — mJ

rr

CC' + EE'

Main Terminals-Chip, — 0.11 — mΩ

, VGE = 0V — — 1 mA

CES

, VCE = 0V — — 5.0 µA

GES

*4

5/14 Rev. 3

3