Powerex IGBTMOD™ Modules
are designed for use in switching
applications. Each module consists
of one IGBT Transistor in a
reverse-connected super-fast
recovery free-wheel diode.
All components and interconnects
are isolated from the heat sinking
baseplate, offering simplified
system assembly and thermal
management.
Features:
£ Low Drive Power
£ Low V
£ Super-Fast Recovery
Free-Wheel Diode
£ Isolated Baseplate for Easy
Heat Sinking
Applications:
£ Traction
£ Medium Voltage Drives
£ High Voltage Power Supplies
Ordering Information:
Example: Select the complete
part module number you desire
from the table below -i.e.
CM200HG-130H is a 6500V
(V
Isolation Voltage (Charged Part to Baseplate, AC 60Hz 1 min.) V
Maximum Turn-Off Switching Current – 400 Amperes
(VCC ≤ 4500V, VGE = ±15V, R
≥ 72Ω, Tj = 125°C)
G(off)
Short Circuit Capability, Maximum Pulse Width – 10 µs
(VCC ≤ 4500V, VGE = ±15V, R
≥ 72Ω, Tj = 125°C)
G(off)
Maximum Reverse Recovery Instantaneous Power – 1200 kW
(VCC ≤ 4500V, die/dt ≤ 1000A/μs, Tj = 125°C)
* Pulse width and repetition rate should be such that device junction temperature (Tj) does not exceed T
**Represents characteristics of the anti-parallel, emitter-to-collector free-wheel diode (FWDi).
* Pulse width and repetition rate should be such that device junction temperature rise is negligible.
**Represents characteristics of the anti-parallel, emitter-to-collector free-wheel diode (FWDi).
VCE = V
CES
IC = 20mA, VCE = 10V 5.0 6.0 7.0 Volts
GE(th)
VGE = V
GES
IC = 200A, VGE = 15V, Tj = 25°C – 5.1 – Volts
CE(sat)
VCE = 10V, VGE = 0V, – 41.0 – nF
ies
f = 100kHz, – 2.5 – nF
oes
Tj = 25°C – 0.7 – nF
res
VCC = 3600V, IC = 200A, – 1.2 – µs
d(on)
GE1
VCC = 3600V, IC = 200A, – 6.6 – µs
d(off)
Tj = 125°C, t
off
VCC = 3600V, IE = 200A, – 1.0 – µs
rr1
die/dt = -670A/μs, – 2.4 – µs
rr2
t
rec
, VGE = 0V, Tj = 25°C – – 3.0 mA
CES
, VGE = 0V, Tj = 125°C – 10 30.0 mA
CES
, VCE = 0V – – 0.5 µA
GES
= -V
off
= 15V, R
GE2
= 60µs, Inductive Load – 1.5 – J/P
off
= -V
GE1
GE2
= 72Ω, – 3.3 – µs
G(off)
= 60µs, Inductive Load – 1.2 – J/P
off
= 30Ω, – 0.35 – µs
G(on)
= 15V, – 0.5 – µs
= 60µs, Inductive Load – 0.7 – J/P
Thermal Characteristics, Tj = 25 °C unless otherwise specified
Characteristics Symbol Test Conditions Min. Typ. Max. Units
Thermal Resistance, Junction to Case R
Thermal Resistance, Junction to Case R
Contact Thermal Resistance, Case to Fin R
Q Per IGBT – – 42.0 K/kW
th(j-c)
D Per FWDi – – 66.0 K/kW
th(j-c)
Per Module, Thermal Grease Applied – 18.0 – K/kW
th(c-f)
Mechanical Characteristics, Tj = 25 °C unless otherwise specified
Characteristics Symbol Test Conditions Min. Typ. Max. Units