A 4.79 121.7
B 2.44 62.0
C 0.51 13.0
D 4.65 118.1
E 4.33±0.02 110.0±0.5
F 3.9 99.0
G 3.72 94.5
H 0.61 15.415
J 1.125 28.575
K 0.15 3.81
L 0.45 11.43
M 0.6 15.24
N 0.22 Dia. 5.5 Dia.
P 2.30 58.4
Q 0.21 5.34
R 1.97±0.02 50.0±0.5
S 2.26 57.5
Dimensions Inches Millimeters
U 0.285 7.245
V 0.018 0.45
W 0.625 15.865
X 0.14 3.5
Y 0.03 0.8
Z 0.28 7.0
AA 0.81 20.5
AB 0.67 17.0
AC 0.03 0.65
AD 0.05 1.15
AE 0.29 7.4
AF 0.05 6.2
AG 0.49 12.5
AH 0.06 1.5
AJ 0.17 Dia. 4.3 Dia.
AK 0.10 Dia. 2.5 Dia.
AL 0.08 Dia. 2.1 Dia.
T 0.465 11.805
Six IGBTMOD™
NX-S Series Module
100 Amperes/1200 Volts
AF
AK
AL
Description:
Powerex IGBTMOD™ Modules
are designed for use in switching
applications. Each module
consists of six IGBT Transistors in
a three phase bridge configuration,
with each transistor having a
reverse-connected super-fast
recovery free-wheel diode. All
components and interconnects
are isolated from the heat sinking
baseplate, offering simplified
system assembly and thermal
management.
Features:
£ Low Drive Power
£ Low V
CE(sat)
£ Discrete Super-Fast Recovery
Free-Wheel Diode
£ Isolated Baseplate for Easy
Heat Sinking
Applications:
£ AC Motor Control
£ Motion/Servo Control
£ Photovoltaic/Fuel Cell
Ordering Information:
Example: Select the complete
module number you desire from
the table below -i.e.
CM100TX-24S is a 1200V (V
100 Ampere Six-IGBTMOD™ Power Module.
Absolute Maximum Ratings, Tj = 25°C unless otherwise specied
Characteristics Symbol CM100TX-24S Units
Maximum Junction Temperature T
Operating Power Device Junction Temperature T
Storage Temperature T
+175 °C
j(max)
-40 to 150 °C
j(op)
-40 to 125 °C
stg
Mounting Torque, M5 Mounting Screws — 31 in-lb
Module Weight (Typical) — 270 Grams
Isolation Voltage (Terminals to Baseplate, f = 60Hz, AC 1 minute) V
2500 V
ISO
rms
Inverter Sector
Collector-Emitter Voltage (VGE = 0V) V
Gate-Emitter Voltage (VCE = 0V) V
Collector Current (DC, TC = 118°C)
*1,*5
IC 100 Amperes
Collector Current (Pulse)*4 I
Total Power Dissipation (TC = 25°C)
Emitter Current, Free Wheeling Diode Forward Current (TC = 25°C)
*1,*5
P
*1,*5
I
Emitter Current, Free Wheeling Diode Forward Current (Pulse)*4 I
*1 Case temperature (TC) and heatsink temperature (Tf) measured point is just under the chips.
*3 Represent ratings and characteristics of the anti-parallel, emitter-to-collector free wheeling diode (FWDi).
*4 Pulse width and repetition rate should be such that device junction temperature (Tj) does not exceed T
*5 Junction temperature (Tj) should not increase beyond maximum junction temperature (T
Thermal and Mechanical Characteristics, Tj = 25°C unless otherwise specied
Characteristics Symbol Test Conditions Min. Typ. Max. Units
Thermal Resistance, Junction to Case*1 R
Thermal Resistance, Junction to Case*1 R
Internal Gate Resistance rg Per Switch — 0 — Ω
*1 Case temperature (TC) and heatsink temperature (Tf) measured point is just under the chips.
*3 Represent ratings and characteristics of the anti-parallel, emitter-to-collector free wheeling diode (FWDi).
*6 Pulse width and repetition rate should be such as to cause negligible temperature rise.
*7 Recommended maximum collector supply voltage VCC is 800Vdc.
Characteristics Symbol Test Conditions Min. Typ. Max. Units
Zero Power Resistance R TC = 25°C 4.85 5.00 5.15 kΩ
Deviation of Resistance ∆R/R TC = 100°C, R
B Constant B
Approximate by Equation*9 — 3375 — K
(25/50)
= 493Ω–7.3 — +7.8 %
100
Power Dissipation P25 TC = 25°C — — 10 mW
Module, Tj = 25°C unless otherwise specied
Characteristics Symbol Test Conditions Min. Typ. Max. Units
Lead Resistance (Main Terminals-Chip) R
Contact Thermal Resistance*1 R
(Case to Heatsink) (Per 1 Module)
*1 Case temperature (TC) and heatsink temperature (Tf) measured point is just under the chips.
*2 Typical value is measured by using thermally conductive grease of λ = 0.9 [W/(m • K)].