C 0.67+0.04/-0.02 17.0+1.0/-0.5
D 4.79 121.7
E 4.33±0.02 110.0±0.5
F 3.89 99.0
G 3.72 94.5
H 0.83 21.14
J 0.37 6.5
K 2.44 62.0
L 2.26 57.5
M 1.97±0.02 50.0±0.5
N 1.53 39.0
P 0.24 6.0
Q 0.48 12.0
R 0.67 17.0
S 1.53 39.0
T 0.87 22.0
U 0.55 14.0
V 0.54 13.64
W 0.33 8.5
X 0.53 13.5
Y 0.81 20.71
Z 0.9 22.86
AA 0.22 Dia. 5.5 Dia.
AB M5 M5
AC 0.06 1.5
Dimensions Inches Millimeters
AD 0.51 13.0
AE 0.12 3.0
AF 0.21 5.4
AG 0.49 12.5
AH 0.81 20.5
AJ 0.30 7.75
AK 0.28 7.25
AL 0.15 3.81
AM 0.45 11.44
AN 0.14 3.5
AP 0.16 4.06
AQ 0.78 20.05
AR 0.03 0.8
AS 0.27 7.0
AT 0.16 4.2
AU 0.61 15.48
AV 0.60 15.24
AW 0.46 11.66
AX 0.04 1.15
AY 0.02 0.65
AZ 0.29 7.4
BA 0.05 6.2
BB 0.49 12.5
BC 0.17 Dia. 4.3 Dia.
BD 0.10 Dia. 2.5 Dia.
BE 0.08 Dia. 2.1Dia.
Six IGBTMOD™ + Brake
NX-S Series Module
100 Amperes/1200 Volts
Description:
Powerex IGBTMOD™ Modules
are designed for use in switching
applications. Each module
consists of six IGBT Transistors in
a three phase bridge configuration
and a seventh IGBT with freewheel diode for dynamic braking.
All components and interconnects
are isolated from the heat sinking
baseplate, offering simplified
system assembly and thermal
management.
Features:
£ Low Drive Power
£ Low V
£ Discrete Super-Fast Recovery
£ Isolated Baseplate for Easy
Applications:
£ AC Motor Control
£ Motion/Servo Control
£ Photovoltaic/Fuel Cell
Ordering Information:
Example: Select the complete
module number you desire from
the table below -i.e.
CM100RX-24S is a 1200V (V
100 Ampere Six-IGBTMOD™ +
Brake Power Module.
CM100RX-24S
Six IGBTMOD™ + Brake NX-S Series Module
100 Amperes/1200 Volts
Absolute Maximum Ratings, Tj = 25°C unless otherwise specied
Characteristics Symbol CM100RX-24S Units
Maximum Junction Temperature T
Operating Power Device Junction Temperature T
Storage Temperature T
+175 °C
j(max)
-40 to 150 °C
j(op)
-40 to 125 °C
stg
Mounting Torque, M5 Mounting Screws — 31 in-lb
Mounting Torque, M5 Main Terminal Screws — 31 in-lb
Module Weight (Typical) — 330 Grams
Isolation Voltage (Terminals to Baseplate, f = 60Hz, AC 1 minute) V
2500 V
ISO
rms
Inverter Sector
Collector-Emitter Voltage (VGE = 0V) V
Gate-Emitter Voltage (VCE = 0V) V
Collector Current (DC, TC = 118°C)
*1,*5
IC 100 Amperes
Collector Current (Pulse)*4 I
Total Power Dissipation (TC = 25°C)
Emitter Current, Free Wheeling Diode Forward Current (TC = 25°C)
*1,*5
P
*1,*5
I
Emitter Current, Free Wheeling Diode Forward Current (Pulse)*4 I
1200 Volts
CES
±20 Volts
GES
200 Amperes
CRM
750 Watts
tot
*3
100 Amperes
E
*3
200 Amperes
ERM
Brake Sector
Collector-Emitter Voltage (VGE = 0V) V
Gate-Emitter Voltage (VCE = 0V) V
Collector Current (DC, TC = 125°C)
Collector Current (Pulse)*4 I
Total Power Dissipation (TC = 25°C)
Repetitive Peak Reverse Voltage V
Forward Current (TC = 25°C)
Forward Current (Pulse)*4 I
*1 Case temperature (TC) and heatsink temperature (Tf) measured point is just under the chips.
*3 Represent ratings and characteristics of the anti-parallel, emitter-to-collector free wheeling diode (FWDi).
*4 Pulse width and repetition rate should be such that device junction temperature (Tj) does not exceed T
*5 Junction temperature (Tj) should not increase beyond maximum junction temperature (T
Thermal and Mechanical Characteristics, Tj = 25°C unless otherwise specied
Characteristics Symbol Test Conditions Min. Typ. Max. Units
Thermal Resistance, Junction to Case*1 R
Thermal Resistance, Junction to Case*1 R
Internal Gate Resistance rg Per Switch — 0 — Ω
*1 Case temperature (TC) and heatsink temperature (Tf) measured point is just under the chips.
*3 Represent ratings and characteristics of the anti-parallel, emitter-to-collector free wheeling diode (FWDi).
*6 Pulse width and repetition rate should be such as to cause negligible temperature rise.
*7 Recommended maximum collector supply voltage VCC is 800Vdc.
*3 Represent ratings and characteristics of the anti-parallel, emitter-to-collector free wheeling diode (FWDi).
*6 Pulse width and repetition rate should be such as to cause negligible temperature rise.
Characteristics Symbol Test Conditions Min. Typ. Max. Units
Zero Power Resistance R TC = 25°C 4.85 5.00 5.15 kΩ
Deviation of Resistance ∆R/R TC = 100°C, R
B Constant B
Approximate by Equation*9 — 3375 — K
(25/50)
Power Dissipation P25 TC = 25°C — — 10 mW
Module, Tj = 25°C unless otherwise specied
Characteristics Symbol Test Conditions Min. Typ. Max. Units
Lead Resistance (Main Terminals-Chip) R
Contact Thermal Resistance*1 R
TC = 25°C (Per Switch) — — 2.2 mΩ
lead
Thermal Grease Applied — 0.015 — K/W
th(c-f)
(Case to Heatsink) (Per 1 Module)
*1 Case temperature (TC) and heatsink temperature (Tf) measured point is just under the chips.
*2 Typical value is measured by using thermally conductive grease of λ = 0.9 [W/(m • K)].