Power BD241D, BD241E, BD241F Technical data

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3 A Continuous Collector Current
5 A Peak Collector Current
Customer-Specified Selections Available
BD241D, BD241E, BD241F
NPN SILICON POWER TRANSISTORS
SEPTEMBER 1981 - REVISED MARCH 1997Copyright © 1997, Power Innovations Limited, UK
TO-220 PACKAGE
(TOP VIEW)
B C E
1 2 3
Pin 2 is in electrical contact with the mounting base.
absolute maximum ratings at 25°C case temperature (unless otherwise noted)
RATING SYMBOL VALUE UNIT
BD241D
Collector-emitter voltage (R
Collector-emitter voltage (I
Emitter-base voltage V Continuous collector current I Peak collector current (see Note 1) I Continuous base current I Continuous device dissipation at (or below) 25°C case temperature (see Note 2) P Continuous device dissipation at (or below) 25°C free air temperature (see Note 3) P Unclamped inductive load energy (see Note 4) ½LI Operating junction temperature range T Storage temperature range T Lead temperature 3.2 mm from case for 10 seconds T
NOTES: 1. This value applies for tp 0.3 ms, duty cycle 10%.
2. Derate linearly to 150°C case temperature at the rate of 0.32 W/°C.
3. Derate linearly to 150°C free air temperature at the rate of 16 mW/°C.
4. This rating is based on the capability of the transistor to operate safely in a circuit of: L = 20 mH, I = 0, RS = 0.1, VCC = 20 V.
V
BE(off)
= 100 Ω)
BE
= 0)
B
BD241E BD241F BD241D BD241E BD241F
V
V
CER
CEO
EBO
C
CM
B tot tot
stg
L
C
j
2
B(on)
MDTRACA
160 180 200 120 140 160
5 V 3 A 5 A 1 A
40 W
2 W
32 mJ
-65 to +150 °C
-65 to +150 °C 250 °C
= 0.4 A, RBE = 100 Ω,
V
V
PRODUCT INFORMATION
Information is current as of publication date. Products conform to specifications in accordance with the terms of Power Innovations standard warranty. Production processing does not necessarily include testing of all parameters.
1
BD241D, BD241E, BD241F NPN SILICON POWER TRANSISTORS
SEPTEMBER 1981 - REVISED MARCH 1997
electrical characteristics at 25°C case temperature
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
BD241D BD241E BD241F BD241D BD241E BD241F
(see Notes 5 and 6)
V
(BR)CEO
I
CES
I
CEO
I
EBO
h
V
CE(sat)
V
h
|hfe|
Collector-emitter breakdown voltage
Collector-emitter cut-off current
Collector cut-off current Emitter cut-off current Forward current
FE
transfer ratio Collector-emitter saturation voltage Base-emitter
BE
voltage Small signal forward
fe
current transfer ratio Small signal forward current transfer ratio
= 30 mA
I
C
IB = 0 (see Note 5) V
= 160 V
CE
= 180 V
V
CE
= 200 V
V
CE
= 90 V IB= 0 0.3 mA
V
CE
= 5 V IC= 0 1 mA
V
EB
VCE = 4 V
= 4 V
V
CE
= 750 mA IC= 3 A (see Notes 5 and 6) 2.5 V
I
B
= 4 V IC= 3 A (see Notes 5 and 6) 1.8 V
V
CE
= 10 V IC= 0.5 A f = 1 kHz 20
V
CE
= 10 V IC= 0.5 A f = 1 MHz 3
V
CE
V
BE
V
BE
V
BE
I
C
I
C
= 0 = 0 = 0
= 1 A = 3 A
NOTES: 5. These parameters must be measured using pulse techniques, tp = 300 µs, duty cycle 2%.
6. These parameters must be measured using voltage-sensing contacts, separate from the current carrying contacts.
120 140 160
25
5
0.2
0.2
0.2
V
mA
thermal characteristics
PARAMETER MIN TYP MAX UNIT
R R
Junction to case thermal resistance 3.125 °C/W
θJC
Junction to free air thermal resistance 62.5 °C/W
θJA
resistive-load-switching characteristics at 25°C case temperature
PARAMETER TEST CONDITIONS
Turn-on time IC = 1 A
t
on
t
Turn-off time 1 µs
off
Voltage and current values shown are nominal; exact values vary slightly with transistor parameters.
V
BE(off)
= -3.7 V
I
B(on)
= 20
R
L
= 0.1 A
I
= -0.1 A
B(off)
= 20 µs, dc 2%
t
p
MIN TYP MAX UNIT
0.3 µs
PRODUCT INFORMATION
2
NPN SILICON POWER TRANSISTORS
TYPICAL CHARACTERISTICS
BD241D, BD241E, BD241F
SEPTEMBER 1981 - REVISED MARCH 1997
TYPICAL DC CURRENT GAIN
vs
COLLECTOR CURRENT
1000
VCE = 4 V tp = 300 µs, duty cycle < 2%
100
- DC Current Gain
FE
h
10
0·01 0·1 1·0 10
IC - Collector Current - A
TC = 25°C TC = 80°C
Figure 1. Figure 2.
TCS631AH
COLLECTOR-EMITTER SATURATION VOLTAGE
vs
BASE CURRENT
10
1·0
0·1
- Collector-Emitter Saturation Voltage - V
V
IC = 100 mA IC = 300 mA IC = 1 A
CE(sat)
IC = 3 A
0·01
0·1 1·0 10 100 1000
IB - Base Current - mA
TCS631AB
BASE-EMITTER VOLTAGE
vs
COLLECTOR CURRENT
1·0
VCE = 4 V TC = 25°C
0·9
0·8
0·7
- Base-Emitter Voltage - V
BE
V
0·6
0·5
0·01 0·1 1·0 10
IC - Collector Current - A
Figure 3.
TCS631AC
PRODUCT INFORMATION
3
BD241D, BD241E, BD241F NPN SILICON POWER TRANSISTORS
SEPTEMBER 1981 - REVISED MARCH 1997
MAXIMUM SAFE OPERATING REGIONS
MAXIMUM FORWARD-BIAS
100
10
1·0
- Collector Current - A
C
I
0·1
SAFE OPERATING AREA
tp = 300 µs, d = 0.1 = 10% tp = 1 ms, d = 0.1 = 10% tp = 10 ms, d = 0.1 = 10% DC Operation
SAS631AH
BD241D BD241E
0·01
1·0 10 100 1000
BD241F
VCE - Collector-Emitter Voltage - V
Figure 4.
THERMAL INFORMATION
MAXIMUM POWER DISSIPATION
vs
CASE TEMPERATURE
50
40
30
20
TIS631AA
- Maximum Power Dissipation - W
tot
10
P
0
0 25 50 75 100 125 150
TC - Case Temperature - °C
PRODUCT INFORMATION
4
Figure 5.
BD241D, BD241E, BD241F
Version 1, 18.0 mm. Version 2, 17.6 mm.
NPN SILICON POWER TRANSISTORS
SEPTEMBER 1981 - REVISED MARCH 1997
MECHANICAL DATA
TO-220
3-pin plastic flange-mount package
This single-in-line package consists of a circuit mounted on a lead frame and encapsulated within a plastic compound. The compound will withstand soldering temperature with no deformation, and circuit performance characteristics will remain stable when operated in high humidity conditions. Leads require no additional cleaning or processing when used in soldered assembly.
TO220
3,96
ø
3,71
see Note B
see Note C
0,97 0,61
10,4 10,0
1 2 3
1,70 1,07
2,74 2,34
5,28 4,88
2,95 2,54
6,1 3,5
4,70 4,20
1,32 1,23
6,6 6,0
15,90 14,55
14,1 12,7
0,64 0,41
2,90 2,40
NOTES: A. The centre pin is in electrical contact with the mounting tab. B. Mounting tab corner profile according to package version. C. Typical fixing hole centre stand off height according to package version.
PRODUCT INFORMATION
VERSION 2 VERSION 1
ALL LINEAR DIMENSIONS IN MILLIMETERS
MDXXBE
5
BD241D, BD241E, BD241F NPN SILICON POWER TRANSISTORS
SEPTEMBER 1981 - REVISED MARCH 1997
IMPORTANT NOTICE
Power Innovations Limited (PI) reserves the right to make changes to its products or to discontinue any semiconductor product or service without notice, and advises its customers to verify, before placing orders, that the information being relied on is current.
PI warrants performance of its semiconductor products to the specifications applicable at the time of sale in accordance with PI's standard warranty. Testing and other quality control techniques are utilized to the extent PI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily performed, except as mandated by government requirements.
PI accepts no liability for applications assistance, customer product design, software performance, or infringement of patents or services described herein. Nor is any license, either express or implied, granted under any patent right, copyright, design right, or other intellectual property right of PI covering or relating to any combination, machine, or process in which such semiconductor products or services might be or are used.
PI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, INTENDED, AUTHORIZED, OR WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT APPLICATIONS, DEVICES OR SYSTEMS.
Copyright © 1997, Power Innovations Limited
PRODUCT INFORMATION
6
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