Philips TZA3000U, TZA3000HL Datasheet

INTEGRATED CIRCUITS

DATA SH EET

TZA3000

SDH/SONET STM4/OC12 optical
receiver

Objective specification
File under Integrated Circuits, IC19

1997 Oct 17

Philips Semiconductors Objective specification

SDH/SONET STM4/OC12 optical receiver TZA3000

FEATURES

• Low equivalent input noise, typically 3.5 pA/√Hz

• Wide dynamic range, typically 1 µA to 1.5 mA

• On-chip low-pass filter. The bandwidth can be varied

between 370 and 600 MHz using an external resistor.
Default value is 470 MHz.

• Differential transimpedance of 1.8 MΩ

• On-chip AGC (Automatic Gain Control)

• PECL (Positive Emitter-Coupled Logic) or CML

(Current-Mode Logic) compatible data outputs

• LOS (Loss-Of-Signal) detection

• LOS threshold level can be adjusted using a single

external resistor

• On-chip DC offset compensation

• Single supply voltage from 3.0 to 5.5 V

• Bias voltage for PIN diode.

ORDERING INFORMATION

TYPE

NUMBER

TZA3000HL LQFP32 plastic low profile quad flat package; 32 leads; body 5 × 5 × 1.4 mm SOT401-1
TZA3000U naked die die in waffle pack carriers; die dimensions 1.58 × 1.58 mm −

NAME DESCRIPTION VERSION

APPLICATIONS

• Digital fibre optic receiver in short, medium and long
haul optical telecommunications transmission systems
or in high speed data networks

• Wideband RF gain block.

DESCRIPTION

The TZA3000 optical receiver is a low-noise
transimpedance amplifier with AGC plus a limiting
amplifier designed to be used in SDH/SONET fibre optic
links. The TZA3000 amplifies the current generated by a
photo detector (PIN diode or avalanche photodiode) and
converts it to a differential output voltage.

PACKAGE

1997 Oct 17 2

Philips Semiconductors Objective specification

SDH/SONET STM4/OC12 optical receiver TZA3000

BLOCK DIAGRAM

handbook, full pagewidth

DREF

V

CCA

2

kΩ

4

7IPhoto

PREAMPLIFIER

AGC

2 2
2, 5 17, 2031

peak detector

GAIN-

CONTROL

V

CCD

A1 A2

LOS DETECTION

LIMITING

AMPLIFIER

DC-OFFSET

COMPENSATION

TTL

PECL

CML

PECL

29 LOSTH

LOSTTL

28

26 LOS

LOSQ

27

18 OUTCML
19 OUTQCML

OUTSEL

15

22 OUTPECL

OUTQPECL

23

BIASING

11

V

ref

AGND

1, 3, 6, 8
9, 30, 32

7

TESTING

14

RFTEST

Fig.1 Block diagram.

1997 Oct 17 3

BWC

TZA3000

10

DGND

13, 16, 21
24, 25

5

MGK881

Philips Semiconductors Objective specification

SDH/SONET STM4/OC12 optical receiver TZA3000

PINNING

SYMBOL PIN TYPE DESCRIPTION

AGND 1 ground analog ground
V

CCA

AGND 3 ground analog ground
DREF 4 analog output bias voltage for PIN diode (V
V

CCA

AGND 6 ground analog ground
IPhoto 7 analog input current input; connect the anode of PIN diode to this pin; DC bias level is

AGND 8 ground analog ground
AGND 9 ground analog ground
BWC 10 analog input bandwidth control pin; default bandwidth is 470 MHz; a resistor should be

V

ref

SUB 12 substrate substrate pin; to be connected to AGND
DGND 13 ground digital ground
RFTEST 14 analog input test pin; not used in application; not connected
OUTSEL 15 CMOS input output select pin; when OUTSEL is HIGH, CML data outputs are active and

DGND 16 ground digital ground
V

CCD

OUTCML 18 CML output CML data output; OUTCML goes HIGH when current flows into IPhoto (pin 7)
OUTQCML 19 CML output CML compliment of OUTCML (pin 18)
V

CCD

DGND 21 ground digital ground
OUTPECL 22 PECL output PECL data output; OUTPECL goes HIGH when current flows into IPhoto (pin 7)
OUTQPECL 23 PECL output PECL compliment of OUTPECL (pin 22)
DGND 24 ground digital ground
DGND 25 ground digital ground
LOS 26 PECL output PECL-compatible LOS detection pin; LOS output is HIGH when the input signal

LOSQ 27 PECL output PECL compliment of LOS
LOSTTL 28 TTL output CMOS-compatible LOS detection pin; the LOSTTL output is HIGH when the

LOSTH 29 analog I/O pin for setting input threshold level; nominal DC voltage is V

AGND 30 ground analog ground
AGC 31 analog I/O AGC monitor voltage; the internal AGC circuit can be disabled by applying an

AGND 32 ground analog ground

2 supply analog supply voltage

); cathode should be connected to this pin

CCA

5 supply analog supply voltage

800 mV, one diode voltage above ground

connected between V

(pin 11) and BWC (pin 10) to decrease bandwidth, or

ref

between BWC (pin 10) and AGND to increase bandwidth

11 analog output band gap reference voltage; nominal value approximately 1.2 V

PECL data outputs are disabled; OUTSEL is pulled LOW if left unconnected,
PECL data outputs will then be active and CML data outputs disabled

17 supply digital supply voltage

20 supply digital supply voltage

is below the user programmable threshold level

input signal is below the user programmable threshold level

CCA

threshold level set by connecting an external resistor between LOSTH and
V

or by forcing a current into LOSTH; default value for this resistor is 86 kΩ

CCA

external voltage to this pin

− 1.5 V;

1997 Oct 17 4

Philips Semiconductors Objective specification

SDH/SONET STM4/OC12 optical receiver TZA3000

handbook, full pagewidth

AGND

V

CCA

AGND

DREF
V

CCA

AGND
IPhoto
AGND

AGC

AGND
32

1
2
3
4

AGND

31

30

LOSTH
29

LOSTTL
28

TZA3000HL

5
6
7
8

9

AGND

10

BWC

11

12

13

ref

V

SUB

DGND

LOS

LOSQ
27

26

14

15

RFTEST

OUTSEL

DGND
25

16

DGND

DGND

24

OUTQPECL

23

OUTPECL

22
21

DGND
V

20

CCD

19

OUTQCML

18

OUTCML
V

17

CCD

MGK880

Fig.2 Pin configuration.

1997 Oct 17 5

Philips Semiconductors Objective specification

SDH/SONET STM4/OC12 optical receiver TZA3000

CHIP DIMENSIONS AND BONDING PAD LOCATIONS

COORDINATES

(1)

SYMBOL PAD

xy

AGND 1 102 1251
V

CCA

2 102 1111
AGND 3 102 971
DREF 4 102 814
V

CCA

5 102 674
AGND 6 102 534
IPhoto 7 102 395
AGND 8 102 254
AGND 9 243 105
BWC 10 383 105
V

ref

11 523 105
SUB 12 663 105
DGND 13 803 105
RFTEST 14 943 105
OUTSEL 15 1100 105
DGND 16 1257 105
V

CCD

17 1398 263
OUTCML 18 1398 403

SYMBOL PAD

COORDINATES

xy

OUTQCML 19 1398 543
V

CCD

20 1398 683
DGND 21 1398 823
OUTPECL 22 1398 963
OUTQPECL 23 1398 1103
DGND 24 1398 1243
DGND 25 1283 1400
LOS 26 1143 1400
LOSQ 27 986 1400
LOSTTL 28 829 1400
LOSTH 29 671 1400
AGND 30 514 1400
AGC 31 357 1400
AGND 32 217 1400

Note

1. All coordinates are referenced, in µm, to the bottom
left-hand corner of the die.

(1)

handbook, full pagewidth

AGND31AGC30AGND29LOSTH28LOSTTL27LOSQ26LOS25DGND

32

AGND 1

1.58
mm

V

AGND

DREF 4

V

AGND 6
IPhoto 7
AGND 8

x

CCA

CCA

2
3

TZA3000U

5

9

10

11

12

0

0

y

AGND

BWC

ref

V

Fig.3 Bonding pad locations: TZA3000U.

1997 Oct 17 6

13

SUB

1.58 mm

14

DGND

15

RFTEST

16

DGND

OUTSEL

DGND

24

OUTQPECL23

OUTPECL22
DGND21
V

20

17

CCD

OUTQCML19
OUTCML18
V

CCD

MGK882