Philips TZA3000 Technical data
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TZA3000
SDH/SONET STM4/OC12 optical
receiver
Objective specification
File under Integrated Circuits, IC19
1997 Oct 17
Philips Semiconductors Objective specification
SDH/SONET STM4/OC12 optical receiver TZA3000
FEATURES
• Low equivalent input noise, typically 3.5 pA/√Hz
• Wide dynamic range, typically 1 µA to 1.5 mA
• On-chip low-pass filter. The bandwidth can be varied
between 370 and 600 MHz using an external resistor.
Default value is 470 MHz.
• Differential transimpedance of 1.8 MΩ
• On-chip AGC (Automatic Gain Control)
• PECL (Positive Emitter-Coupled Logic) or CML
(Current-Mode Logic) compatible data outputs
• LOS (Loss-Of-Signal) detection
• LOS threshold level can be adjusted using a single
external resistor
• On-chip DC offset compensation
• Single supply voltage from 3.0 to 5.5 V
• Bias voltage for PIN diode.
ORDERING INFORMATION
TYPE
NUMBER
TZA3000HL LQFP32 plastic low profile quad flat package; 32 leads; body 5 × 5 × 1.4 mm SOT401-1
TZA3000U naked die die in waffle pack carriers; die dimensions 1.58 × 1.58 mm −
NAME DESCRIPTION VERSION
APPLICATIONS
• Digital fibre optic receiver in short, medium and long
haul optical telecommunications transmission systems
or in high speed data networks
• Wideband RF gain block.
DESCRIPTION
The TZA3000 optical receiver is a low-noise
transimpedance amplifier with AGC plus a limiting
amplifier designed to be used in SDH/SONET fibre optic
links. The TZA3000 amplifies the current generated by a
photo detector (PIN diode or avalanche photodiode) and
converts it to a differential output voltage.
PACKAGE
1997 Oct 17 2
Philips Semiconductors Objective specification
SDH/SONET STM4/OC12 optical receiver TZA3000
BLOCK DIAGRAM
handbook, full pagewidth
DREF
V
CCA
2
kΩ
4
7IPhoto
PREAMPLIFIER
AGC
2 2
2, 5 17, 2031
peak detector
GAIN-
CONTROL
V
CCD
A1 A2
LOS DETECTION
LIMITING
AMPLIFIER
DC-OFFSET
COMPENSATION
TTL
PECL
CML
PECL
29 LOSTH
LOSTTL
28
26 LOS
LOSQ
27
18 OUTCML
19 OUTQCML
OUTSEL
15
22 OUTPECL
OUTQPECL
23
BIASING
11
V
ref
AGND
1, 3, 6, 8
9, 30, 32
7
TESTING
14
RFTEST
Fig.1 Block diagram.
1997 Oct 17 3
BWC
TZA3000
10
DGND
13, 16, 21
24, 25
5
MGK881
Philips Semiconductors Objective specification
SDH/SONET STM4/OC12 optical receiver TZA3000
PINNING
SYMBOL PIN TYPE DESCRIPTION
AGND 1 ground analog ground
V
CCA
AGND 3 ground analog ground
DREF 4 analog output bias voltage for PIN diode (V
V
CCA
AGND 6 ground analog ground
IPhoto 7 analog input current input; connect the anode of PIN diode to this pin; DC bias level is
AGND 8 ground analog ground
AGND 9 ground analog ground
BWC 10 analog input bandwidth control pin; default bandwidth is 470 MHz; a resistor should be
V
ref
SUB 12 substrate substrate pin; to be connected to AGND
DGND 13 ground digital ground
RFTEST 14 analog input test pin; not used in application; not connected
OUTSEL 15 CMOS input output select pin; when OUTSEL is HIGH, CML data outputs are active and
DGND 16 ground digital ground
V
CCD
OUTCML 18 CML output CML data output; OUTCML goes HIGH when current flows into IPhoto (pin 7)
OUTQCML 19 CML output CML compliment of OUTCML (pin 18)
V
CCD
DGND 21 ground digital ground
OUTPECL 22 PECL output PECL data output; OUTPECL goes HIGH when current flows into IPhoto (pin 7)
OUTQPECL 23 PECL output PECL compliment of OUTPECL (pin 22)
DGND 24 ground digital ground
DGND 25 ground digital ground
LOS 26 PECL output PECL-compatible LOS detection pin; LOS output is HIGH when the input signal
LOSQ 27 PECL output PECL compliment of LOS
LOSTTL 28 TTL output CMOS-compatible LOS detection pin; the LOSTTL output is HIGH when the
LOSTH 29 analog I/O pin for setting input threshold level; nominal DC voltage is V
AGND 30 ground analog ground
AGC 31 analog I/O AGC monitor voltage; the internal AGC circuit can be disabled by applying an
AGND 32 ground analog ground
2 supply analog supply voltage
); cathode should be connected to this pin
CCA
5 supply analog supply voltage
800 mV, one diode voltage above ground
connected between V
(pin 11) and BWC (pin 10) to decrease bandwidth, or
ref
between BWC (pin 10) and AGND to increase bandwidth
11 analog output band gap reference voltage; nominal value approximately 1.2 V
PECL data outputs are disabled; OUTSEL is pulled LOW if left unconnected,
PECL data outputs will then be active and CML data outputs disabled
17 supply digital supply voltage
20 supply digital supply voltage
is below the user programmable threshold level
input signal is below the user programmable threshold level
CCA
threshold level set by connecting an external resistor between LOSTH and
V
or by forcing a current into LOSTH; default value for this resistor is 86 kΩ
CCA
external voltage to this pin
− 1.5 V;
1997 Oct 17 4
Philips Semiconductors Objective specification
SDH/SONET STM4/OC12 optical receiver TZA3000
handbook, full pagewidth
AGND
V
CCA
AGND
DREF
V
CCA
AGND
IPhoto
AGND
AGC
AGND
32
1
2
3
4
AGND
31
30
LOSTH
29
LOSTTL
28
TZA3000HL
5
6
7
8
9
AGND
10
BWC
11
12
13
ref
V
SUB
DGND
LOS
LOSQ
27
26
14
15
RFTEST
OUTSEL
DGND
25
16
DGND
DGND
24
OUTQPECL
23
OUTPECL
22
21
DGND
V
20
CCD
19
OUTQCML
18
OUTCML
V
17
CCD
MGK880
Fig.2 Pin configuration.
1997 Oct 17 5
Philips Semiconductors Objective specification
SDH/SONET STM4/OC12 optical receiver TZA3000
CHIP DIMENSIONS AND BONDING PAD LOCATIONS
COORDINATES
(1)
SYMBOL PAD
xy
AGND 1 102 1251
V
CCA
2 102 1111
AGND 3 102 971
DREF 4 102 814
V
CCA
5 102 674
AGND 6 102 534
IPhoto 7 102 395
AGND 8 102 254
AGND 9 243 105
BWC 10 383 105
V
ref
11 523 105
SUB 12 663 105
DGND 13 803 105
RFTEST 14 943 105
OUTSEL 15 1100 105
DGND 16 1257 105
V
CCD
17 1398 263
OUTCML 18 1398 403
SYMBOL PAD
COORDINATES
xy
OUTQCML 19 1398 543
V
CCD
20 1398 683
DGND 21 1398 823
OUTPECL 22 1398 963
OUTQPECL 23 1398 1103
DGND 24 1398 1243
DGND 25 1283 1400
LOS 26 1143 1400
LOSQ 27 986 1400
LOSTTL 28 829 1400
LOSTH 29 671 1400
AGND 30 514 1400
AGC 31 357 1400
AGND 32 217 1400
Note
1. All coordinates are referenced, in µm, to the bottom
left-hand corner of the die.
(1)
handbook, full pagewidth
AGND31AGC30AGND29LOSTH28LOSTTL27LOSQ26LOS25DGND
32
AGND 1
1.58
mm
V
AGND
DREF 4
V
AGND 6
IPhoto 7
AGND 8
x
CCA
CCA
2
3
TZA3000U
5
9
10
11
12
0
0
y
AGND
BWC
ref
V
Fig.3 Bonding pad locations: TZA3000U.
1997 Oct 17 6
13
SUB
1.58 mm
14
DGND
15
RFTEST
16
DGND
OUTSEL
DGND
24
OUTQPECL23
OUTPECL22
DGND21
V
20
17
CCD
OUTQCML19
OUTCML18
V
CCD
MGK882
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