Philips TJA1054A User Manual

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DATA SH EET

TJA1054A

Fault-tolerant CAN transceiver

Product speciﬁcation Supersedes data of 2002 Feb 11

2004 Mar 23

Page 2

Philips Semiconductors Product speciﬁcation

Fault-tolerant CAN transceiver TJA1054A

FEATURES Optimized for in-car low-speed communication

• Baud rate up to 125 kBaud

• Up to 32 nodes can be connected

• Supports unshielded bus wires

• Very low ElectroMagnetic Emission (EME) due to

built-in slope controlfunction and a very good matching of the CANL and CANH bus outputs

• Good ElectroMagnetic Immunity (EMI) in normal operating mode and in low power modes

• Fully integrated receiver filters

• Transmit Data (TxD) dominant time-out function.

Bus failure management

• Supports single-wire transmission modes with ground offset voltages up to 1.5 V

• Automatic switching to single-wire mode in the event of bus failures, even when the CANH bus wire is short-circuited to V

• Automatic reset to differential mode if bus failure is removed

• Full wake-up capability during failure modes.

Protections

• Bus pins short-circuit safe to battery and to ground

• Thermally protected

• Bus lines protected against transients in an automotive

environment

• An unpowered node does not disturb the bus lines.

GENERAL DESCRIPTION

The TJA1054A is the interface between the protocol controller and the physical bus wires in a Controller Area Network (CAN). It is primarily intended for low-speed applications up to 125 kBaud in passenger cars. The device provides differential receive and transmit capability but will switch to single-wire transmitter and/or receiver in error conditions.

The TJA1054A is the ESD improved version of the TJA1054. For an overview of the differences between the TJA1054 and the TJA1054A, please refer to “Appendix A”.

The TJA1054AT is, as the TJA1054T, pin and downwards compatiblewiththePCA82C252TandtheTJA1053T. This means that these two devices can be replaced by the TJA1054AT or the TJA1054T with retention of all functions.

Themost important improvements of the TJA1054 and the TJA1054A with respect to the PCA82C252 and the TJA1053 are:

• Very low EME due to a very good matching of the CANL and CANH output signals

• Good EMI, especially in low power modes

• Full wake-up capability during bus failures

• Extended bus failure management including

short-circuit of the CANH bus line to V

• Support for easy system fault diagnosis

• Two-edge sensitive wake-up input signal via pin WAKE.

Support for low power modes

• Low current sleep and standby mode with wake-up via the bus lines

• Power-on reset flag on the output.

ORDERING INFORMATION

TYPE

NUMBER

NAME DESCRIPTION VERSION

PACKAGE

TJA1054AT SO14 plastic small outline package; 14 leads; body width 3.9 mm SOT108-1 TJA1054AU − bare die; 1990 × 2730 × 375 µm −

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Philips Semiconductors Product speciﬁcation

Fault-tolerant CAN transceiver TJA1054A

QUICK REFERENCE DATA

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

BAT

CANH

CANL

∆V

PD(L)

CANH

CANL

supply voltage on pin V

4.75 − 5.25 V

battery voltage on pin BAT no time limit −0.3 − +40 V

operating mode; note 1 5.0 − 27 V load dump −−40 V

battery current on pin BAT sleep mode; VCC=0V;

=12V

BAT

CANH bus line voltage VCC= 0 to 5.0 V; V

BAT

≥ 0V;

− 30 50 µA

−27 − +40 V

no time limit

CANL bus line voltage VCC= 0 to 5.0 V; V

BAT

≥ 0V;

−27 − +40 V

no time limit

CANH bus line transmitter

= −40 mA −−1.4 V

CANH

voltage drop CANL bus line transmitter

=40mA −−1.4 V

CANL

voltage drop propagation delay TXD (LOW)

− 1 −µs

to RXD (LOW) bus line output rise time between 10% and 90%;

− 0.6 −µs

C1 = 10 nF; see Fig.5

bus line output fall time between 10% and 90%;

− 0.3 −µs

C1 = 1 nF; see Fig.5

virtual junction temperature −40 − +150 °C

Note

1. A local or remote wake-up event will be signalled at the transceiver pins RXD and NERR if V

(see Table 2).

=5.3Vto27V

BAT

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Philips Semiconductors Product speciﬁcation

Fault-tolerant CAN transceiver TJA1054A

BLOCK DIAGRAM

handbook, full pagewidth

WAKE

STB

TXD

ERR

RXD

INH

BAT

1 7

5 6

TIMER

GND

WAKE-UP STANDBY

CONTROL

FAILURE DETECTOR

PLUS WAKE-UP PLUS TIME-OUT

TEMPERATURE

PROTECTION

DRIVER

TJA1054A

RECEIVER

FILTER

RTL

CANH

CANL

RTH

MGU383

Fig.1 Block diagram.

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Philips Semiconductors Product speciﬁcation

Fault-tolerant CAN transceiver TJA1054A

PINNING

SYMBOL PIN DESCRIPTION

INH 1 inhibit output for switching an external voltage regulator if a wake-up signal occurs TXD 2 transmit data input for activating the driver to the bus lines RXD 3 receive data output for reading out the data from the bus lines ERR 4 error, wake-up and power-on indication output; active LOW in normaloperating mode when the bus

has a failure, and in low power modes (wake-up signal or in power-on standby)

STB 5 standby digital control signal input (active LOW); together with the input signal on pin EN this input

determines the state of the transceiver (in normal and low power modes); see Table 2 and Fig.3

EN 6 enable digital control signal input; together with the input signal on pin STB this input determines

the state of the transceiver (in normal and low power modes); see Table 2 and Fig.3 WAKE 7 local wake-up signal input (active LOW); both falling and rising edges are detected RTH 8 termination resistor connection; in case of a CANH bus wire error the line is terminated with a

predeﬁned impedance RTL 9 termination resistor connection; in case of a CANL bus wire the line is terminated with a predeﬁned

impedance V

CANH 11 HIGH-level CAN bus line CANL 12 LOW-level CAN bus line GND 13 ground BAT 14 battery supply voltage

10 supply voltage

handbook, halfpage

1INH 2

TXD GND

RXD CANL

ERR CANH

STB V

WAKE RTH

TJA1054AT

5 6

EN RTL

Fig.2 Pin configuration.

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MGU379

14 BAT 13 12 11 10

9 8

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Philips Semiconductors Product speciﬁcation

Fault-tolerant CAN transceiver TJA1054A

FUNCTIONAL DESCRIPTION

The TJA1054A is the interface between the CAN protocol controller and the physical wires of the CAN bus (see Fig.7). It is primarily intended for low-speed applications, up to 125 kBaud, in passenger cars. The device provides differential transmit capability to the CAN bus and differential receive capability to the CAN controller.

To reduce EME, the rise and fall slopes are limited. This allows the use of an unshielded twisted pair or a parallel pair of wires for the bus lines. Moreover, the device supportstransmission capability on either bus line if one of the wires is corrupted. The failure detection logic automatically selects a suitable transmission mode.

In normal operating mode (no wiring failures) the differential receiver is output on pin RXD (see Fig.1). The differential receiver inputs are connected to pins CANH and CANL through integrated filters. The filtered input signals are also used for the single-wire receivers. The receivers connected to pins CANH and CANL have threshold voltages that ensure a maximum noise margin in single-wire mode.

A timer function (TxD dominant time-out function) has been integrated to prevent the bus lines from being driven into a permanent dominant state (thus blocking the entire network communication) due to a situation in which pin TXD is permanently forced to a LOW level, caused by a hardware and/or software application failure.

If the duration of the LOW level on pin TXD exceeds a certain time, the transmitter will be disabled. The timer will be reset by a HIGH level on pin TXD.

Failure detector

The failure detector is fully active in the normal operating mode. After the detection of a single bus failure the detector switches to the appropriate mode (see Table 1). The differential receiver threshold voltage is set at −3.2 V typical (VCC= 5 V). This ensures correct reception with a noise margin as high as possible in the normal operating mode and in the event of failures 1, 2, 5 and 6a. These failures, or recovery from them, do not destroy ongoing transmissions. The output drivers remain active, the termination does not change and the receiver remains in differential mode (see Table 1).

Failures 3, 3a and 6 are detected by comparators connected to the CANH and CANL bus lines. Failures 3 and 3a are detected in a two-step approach. If the CANH bus line exceeds a certain voltage level, the differential comparator signals a continuous dominant condition. Because of inter operability reasons with the predecessor products PCA82C252 and TJA1053, after a first time-out the transceiver switches to single-wire operation through CANH. If the CANH bus line is still exceeding the CANH detection voltage for a second time-out, the TJA1054A switches to CANL operation; the CANH driver is switched off and the RTH bias changes to the pull-down current source. The time-outs (delays) are needed to avoid false triggering by external RF fields.

Table 1 Bus failures

FAILURE DESCRIPTION

1 CANH wire interrupted on on on on differential 2 CANL wire interrupted on on on on differential 3 CANH short-circuited to battery weak; note 1 on off on CANL

3a CANH short-circuited to V

4 CANL short-circuited to ground on weak; note 2 on off CANH 5 CANH short-circuited to ground on on on on differential 6 CANL short-circuited to battery on weak; note 2 on off CANH

6a CANL short-circuited to V

7 CANL and CANH mutually

short-circuited

Notes

1. A weak termination implies a pull-down current source behaviour of 75 µA typical.

2. A weak termination implies a pull-up current source behaviour of 75 µA typical.

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TERMINATION

CANH (RTH)

weak; note 1 on off on CANL

on on on on differential on weak; note 2 on off CANH

TERMINATION

CANL (RTL)

CANH

DRIVER

CANL

DRIVER

RECEIVER

MODE

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Philips Semiconductors Product speciﬁcation

Fault-tolerant CAN transceiver TJA1054A

Failure 6 is detected if the CANL bus line exceeds its comparator threshold for a certain period of time. This delay is needed to avoid false triggering by external RF fields. After detection of failure 6, the reception is switched to the single-wire mode through CANH; the CANL driver is switched off and the RTL bias changes to the pull-up current source.

Recovery from failures 3, 3a and 6 is detected automatically after reading a consecutive recessive level by corresponding comparators for a certain period of time.

Failures 4 and 7 initially result in a permanent dominant level on pin RXD. After a time-out the CANL driver is switched off and the RTL bias changes to the pull-up current source. Reception continues by switching to the single-wire mode via pins CANH or CANL. When failures 4 or 7 are removed, the recessive bus levels are restored. If the differential voltage remains below the recessive threshold level for a certain period of time, reception and transmission switch back to the differential mode.

If any of the wiring failure occurs, the output signal on pin ERR will be set to LOW. On error recovery, the output signal on pin ERR will be set to HIGH again. In case of an interrupted open bus wire, this failure will be detected and signalled only if there is an open wire between the transmittingand receiving node(s). Thus, during open wire failures, pin ERR typically toggles.

During all single-wire transmissions, EMC performance (both immunity and emission) is worse than in the differential mode. The integrated receiver filters suppress any HF noise induced into the bus wires. The cut-off frequency of these filters is a compromise between propagation delay and HF suppression. In single-wire mode, LF noise cannot be distinguished from the required signal.

Low power modes

The transceiver provides three low power modes which can be entered and exited via STB and EN (see Table 2 and Fig.3).

The sleep mode is the mode with the lowest power consumption. Pin INH is switched to HIGH-impedance for deactivation of the external voltage regulator. Pin CANL is biased to the battery voltage via pin RTL. If the supply voltage is provided, pins RXD and ERR will signal the wake-up interrupt.

The standby mode operates in the same way as the sleep mode but with a HIGH level on pin INH.

The power-on standby mode is the same as the standby mode, however, in this mode the battery power-on flag is shown on pin ERR instead of the wake-up interrupt signal. The output on pin RXD will show the wake-up interrupt. This mode is only for reading out the power-on flag.

Table 2 Normal operating and low power modes

MODE

Goto-sleep

STB

PIN EN

LOW HIGH wake-up

command Sleep LOW LOW

interruptsignal;

(4)

notes 1 2 and 3

PIN ERR PIN RXD PIN RTL

LOW HIGH LOW HIGH

wake-up interruptsignal; notes 1 2 and 3

Standby LOW LOW Power-on

standby

Normal operating

HIGH LOW V

power-on

BAT

ﬂag; notes 1 and 5

wake-up interruptsignal; notes 1 2 and 3

HIGH HIGH error ﬂag no error ﬂag dominant

received data

Notes

1. If the supply voltage VCC is present.

2. Wake-up interrupts are released when entering normal operating mode.

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recessive received data

SWITCHED

BAT

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Philips Semiconductors Product speciﬁcation

Fault-tolerant CAN transceiver TJA1054A

3. A local or remote wake-up event will be signalled at the transceiver pins RXD and NERR if V

=5.3Vto27V.

BAT

4. In case the goto-sleep command was used before. When VCC drops, pin EN will become LOW, but due to the fail-safe functionality this does not effect the internal functions.

5. V

Wake-up requests are recognized by the transceiver through two possible channels:

• The bus lines for remote wake-up

• Pin WAKE for local wake-up.

In order to wake-up the transceiver remotely through the bus lines, a filter mechanism is integrated. This mechanism makes sure that noise and any present bus failure conditions do not result into an erroneous wake-up. Because of this mechanism it is not sufficient to simply pull the CANH or CANL bus lines to a dominant level for a certain time. To guarantee a successful remote wake-up under all conditions, a message frame with a dominant phase of at least the maximum specified t it is required.

A local wake-up through pin WAKE is detected by a rising or falling edge with a consecutive level with the maximum specified t

Onawake-uprequestthetransceiverwillsetthe output on

power-on flag will be reset when entering normal operating mode.

BAT

Pin INH will be set to a HIGH level again by the following events only:

• V

BAT

• Rising or falling edge on pin WAKE

• A message frame with a dominant phase of at least the

maximum specified t pin STB is at a LOW level

• Pin STB goes to a HIGH level with VCC active. To provide fail-safe functionality, the signals on pins STB

and EN will internally be set to LOW when VCCis below a certain threshold voltage (V

CANH

or t

CANL

Power-on

After power-on (V willbecome HIGH and an internal power-onflagwill be set.

WAKE

This flag can be read in the power-on standby mode through pin ERR (STB = 1; EN = 0) and will be reset by entering the normal operating mode.

power-on (cold start)

CANH

switched on) the signal on pin INH

BAT

or t

CANL

CC(stb)

, while pin EN or

pin INHtoHIGH which can be used to activate the external supply voltage regulator.

If VCCis provided the wake-up request can be read on the ERR or RXD outputs, so the external microcontroller can activate the transceiver (switch to normal operating mode) via pins STB and EN.

To prevent a false remote wake-up due to transients or RF fields, the wake-up voltage levels have to be maintained for a certain period of time. In the low power modes the failure detection circuit remains partly active to prevent an increased power consumption in the event of failures 3, 3a, 4 and 7.

To prevent a false local wake-up during an open wire at

Protections

A current limiting circuit protects the transmitter output stages against short-circuit to positive and negative battery voltage.

If the junction temperature exceeds the typical value of 165 °C, the transmitter output stages are disabled. Becausethetransmitteris responsible for the major part of the power dissipation, this will result in a reduced power dissipation and hence a lower chip temperature. All other parts of the device will continue to operate.

Thepins CANHand CANL are protected against electrical transients which may occur in an automotive environment.

pin WAKE, this pin has a weak pull-up current source towards V

. However, in order to prevent EMC issues, it

BAT

is recommended to connect a not used pin WAKE to pin BAT. Pin INH is set to floating only if the goto-sleep command is entered successfully. To enter a successful goto-sleep command under all conditions, this command must be kept stable for the maximum specified t

h(sleep)

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Philips Semiconductors Product speciﬁcation

Fault-tolerant CAN transceiver TJA1054A

handbook, full pagewidth

POWER-ON

STANDBY

NORMAL

(1) (2) (3)

Mode 10 stands for: Pin STB = HIGH and pin EN = LOW. (1) Mode change via input pins STB and EN. (2) Mode change via input pins STB and EN; it should be noted that in the sleep mode pin INH is inactive and possibly there is no

. Mode control is only possible if VCC of the transceiver is active.

(3) Pin INH is activated after wake-up via bus or input pin WAKE. (4) Transitions to normal mode clear the internal wake-up: interrupt and battery fail flag are cleared. (5) Transitions to sleep mode: pin INH is deactivated.

(4)

STANDBY

GOTO

SLEEP

(5)

SLEEP

MBK949

Fig.3 Mode control.

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Philips Semiconductors Product speciﬁcation

Fault-tolerant CAN transceiver TJA1054A

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 60134); note 1.

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

BAT

CANH

CANL

trt(n)

WAKE

INH

RTH

RTL

RTH

RTL

stg

esd

supply voltage on pin V

−0.3 +6 V battery voltage on pin BAT −0.3 +40 V DC voltage on pins TXD, RXD,

−0.3 VCC+ 0.3 V ERR, STB and EN

CANH bus line voltage −27 +40 V CANL bus line voltage −27 +40 V transient voltage on pins CANH

see Fig.6 −150 +100 V

and CANL DC input voltage on pin WAKE − V

+ 0.3 V

BAT

DC input current on pin WAKE note 2 −15 − mA DC output voltage on pin INH −0.3 V DC voltage on pin RTH −0.3 V DC voltage on pin RTL −0.3 V

+ 0.3 V

BAT

+ 1.2 V

BAT

+ 1.2 V

BAT

termination resistance on pin RTH 500 16000 Ω termination resistance on pin RTL 500 16000 Ω virtual junction temperature note 3 −40 +150 °C storage temperature −55 +150 °C electrostatic discharge voltage human body model; note 4

pins RTH, RTL, CANH and CANL −4+4 kV all other pins −2+2 kV

machine model; note 5

any pin −300 +300 V

Notes

1. All voltages are defined with respect to pin GND. Positive current flows into the device.

2. Only relevant if V

WAKE<VGND

3. Junction temperature in accordance with R

is a fixed value to be used for the calculation of Tvj. The rating for Tvj limits the allowable combinations of

th(vj-a)

power dissipation (P) and operating ambient temperature (T

− 0.3 V; current will flow into pin GND.

“IEC 60747-1”

. An alternative definition is: Tvj=T

amb

+P× R

th(vj-a)

4. Equivalent to discharging a 100 pF capacitor through a 1.5 kΩ resistor.

5. Equivalent to discharging a 200 pF capacitor through a 10 Ω resistor and a 0.75 µH coil.

THERMAL CHARACTERISTICS

SYMBOL PARAMETER CONDITIONS VALUE UNIT

R R

th(j-a) th(j-s)

thermal resistance from junction to ambient in free air 120 K/W thermal resistance from junction to substrate bare die in free air 40 K/W

QUALITY SPECIFICATION

Quality specification in accordance with

“AEC-Q100”

2004 Mar 23 10

where

Page 11

Philips Semiconductors Product speciﬁcation

Fault-tolerant CAN transceiver TJA1054A

DC CHARACTERISTICS

VCC= 4.75 to 5.25 V; V ground; positive currents ﬂow into the device; unless otherwise speciﬁed; notes 1 2 and 3

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

= 5.0 to 27 V; V

BAT

STB=VCC

; Tvj= −40 to +150 °C; all voltages are deﬁned with respect to

Supplies (pins V

CC(stb)

and BAT)

supply voltage on pin V supply voltage for forced

standby mode (fail-safe)

BAT

BAT(Pwon)

supply current normal operating mode;

battery voltage on pin BAT no time limit −0.3 − +40 V

battery current on pin BAT all modes and in low power

power-on ﬂag voltage on pin BAT

tot

supply current plus battery current

Pins STB, EN and TXD

HIGH-level input voltage 0.7V LOW-level input voltage −0.3 − 0.3V HIGH-level input current VI=4V

pins STB and EN − 920µA pin TXD −200 −80 −25 µA

LOW-level input current VI=1V

pins STB and EN 4 8 −µA pin TXD −800 −320 −100 µA

4.75 − 5.25 V

2.75 − 4.5 V

4711mA

TXD=VCC

normal operating mode; V

TXD

(recessive)

10 17 27 mA

= 0 V (dominant);

no load low power modes;

TXD=VCC

0010µA

operating mode 5.0 − 27 V load dump −−40 V

modes at V

RTL=VWAKE=VINH=VBAT

= 12 V 10 30 50 µA

BAT

= 5.0 to 27 V 5 30 125 µA

BAT

= 3.5 V 5 20 30 µA

BAT

=1V 0010µA

BAT

low power modes

power-on flag set −−1V power-on flag not set 3.5 −−V

low power modes;

− 30 60 µA VCC=5V; V

BAT=VWAKE=VINH

=12V

− VCC+ 0.3 V

2004 Mar 23 11

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Philips Semiconductors Product speciﬁcation

Fault-tolerant CAN transceiver TJA1054A

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Pins RXD and ERR

Pin WAKE

th(wake)

Pin INH

∆V

IL leakage current sleep mode; V

Pins CANH and CANL

th(dif)

O(reces)

O(dom)

O(CANH)

O(CANL)

d(CANH)(sc)

d(CANL)(sc)

th(wake)

HIGH-level output voltage

on pin ERR lO= −100 µAV on pin RXD IO= −1mA VCC− 0.9 − V

LOW-level output voltage on pins ERR and RXD

LOW-level input current V wake-up threshold voltage V

HIGH-level voltage drop I

differential receiver threshold voltage

IO= 1.6 mA 0 − 0.4 V IO= 7.5 mA 0 − 1.5 V

=0V; V

WAKE

= 0 V 2.5 3.2 3.9 V

STB

= −0.18 mA −−0.8 V

INH

=27V −10 −4 −1 µA

BAT

=0V −−5 µA

INH

no failures and bus failures 1, 2, 5 and 6a;

− 0.9 − V

CC CC

see Fig.4

VCC=5V −3.5 −3.2 −2.9 V VCC= 4.75 to 5.25 V −0.70VCC−0.64V

recessive output voltage V

on pin CANH R on pin CANL R

dominant output voltage V

on pin CANH I on pin CANL I

TXD=VCC

<4kΩ−−0.2 V

RTH

<4kΩ VCC− 0.2 −−V

RTL

=0V; VEN=V

TXD

= −40 mA VCC− 1.4 −−V

CANH

=40mA −−1.4 V

CANL

output current on pin CANH normal operating mode;

CANH

=0V; V

TXD

=0V

low power modes; V

=0V; VCC=5V

CANH

output current on pin CANL normal operating mode;

CANL

=14V; V

TXD

=0V

low power modes; V

detection voltage for short-circuit to battery voltage

=12V; V

CANL

normal operating mode 1.5 1.7 1.85 V low power modes 1.1 1.8 2.5 V

BAT

=12V

−110 −80 −45 mA

−−0.25 −µA

45 70 100 mA

− 0 −µA

−0.58VCCV

on pin CANH detection voltage for

short-circuit to battery voltage on pin CANL

normal operating mode

VCC= 5 V 6.6 7.2 7.8 V VCC= 4.75 to 5.25 V 1.32V

1.44V

1.56V

wake-up threshold voltage

on pin CANL low power modes 2.5 3.2 3.9 V on pin CANH low power modes 1.1 1.8 2.5 V

V V

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Philips Semiconductors Product speciﬁcation

Fault-tolerant CAN transceiver TJA1054A

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

∆V

th(wake)

th(CANH)(se)

th(CANL)(se)

i(CANH)(se)

i(CANL)(se)

i(dif)

Pins RTH and RTL

sw(RTL)

sw(RTH)

O(RTH)

O(RTL)

pu(RTL)

pd(RTH)

Thermal shutdown

j(sd)

difference of wake-up

low power modes 0.8 1.4 − V

threshold voltages single-ended receiver

threshold voltage on pin CANH

single-ended receiver threshold voltage on pin CANL

normal operating mode and failures 4, 6 and 7

VCC= 5 V 1.5 1.7 1.85 V VCC= 4.75 to 5.25 V 0.30V

0.34V

0.37V

normal operating mode and failures 3 and 3a

VCC= 5 V 3.15 3.3 3.45 V

single-ended input resistance

VCC= 4.75 to 5.25 V 0.63V

normal operating mode 110 165 270 kΩ

0.66V

0.69V

on pin CANH single-ended input resistance

normal operating mode 110 165 270 kΩ

on pin CANL differential input resistance normal operating mode 220 330 540 kΩ

switch-on resistance between pin RTL and V

switch-on resistance between pin RTH and ground

normal operating mode; IO <10mA

normal operating mode;

IO <10mA

− 50 100 Ω

output voltage on pin RTH low power modes; IO=1mA − 0.7 1.0 V output current on pin RTL low power modes;

=0V

RTL

pull-up current on pin RTL normal operating mode and

−1.25 −0.65 −0.3 mA

− 75 −µA

failures 4, 6 and 7

pull-down current on pin RTH normal operating mode and

− 75 −µA failures 3 and 3a

junction temperature for

155 165 180 °C

shutdown

Notes

1. All parameters are guaranteed over the virtual junction temperature range by design, but only 100% tested at T

= 125 °C for dies on wafer level, and above this for cased products 100% tested at T

amb

=25°C, unless

amb

otherwise specified.

2. For bare die, all parameters are only guaranteed if the back side of the die is connected to ground.

3. A local or remote wake-up event will be signalled at the transceiver pins RXD and NERR if V

=5.3Vto27V

BAT

(see Table 2).

2004 Mar 23 13

Page 14

Philips Semiconductors Product speciﬁcation

Fault-tolerant CAN transceiver TJA1054A

TIMING CHARACTERISTICS

VCC= 4.75 to 5.25 V; V ground; unless otherwise speciﬁed; notes 1 2 and 3

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

t(r-d)

CANLandCANHoutputtransition time for recessive to dominant

t(d-r)

CANLandCANHoutputtransition time for dominant to recessive

PD(L)

propagation delay TXD (LOW) to RXD (LOW)

PD(H)

propagation delay TXD (HIGH) to RXD (HIGH)

react(sleep)

reaction time of goto-sleep command

dis(TxD)

disable time of TxD permanent dominant timer

CANH

dominanttimeforremote wake-up on pin CANH

CANL

dominanttimeforremote wake-up on pin CANL

WAKE

required time on pin WAKE for local wake-up

det

failure detection time normal operating mode

= 5.0 to 27 V; V

BAT

STB=VCC

between 10% and 90%; R1 = 100 Ω; C1 = 10 nF; C2 = not present; see Fig.5

between 10% and 90%; R1 = 100 Ω; C1 = 1 nF; C2 = not present; see Fig.5

no failures and failures 1, 2, 5 and 6a; R1 = 100 Ω; see Figs 4 and 5

failures 3, 3a, 4, 6 and 7; R1 = 100 Ω; see Figs 4 and 5

no failures and failures 1, 2, 5 and 6a; R1 = 100 Ω; see Figs 4 and 5

failures 3, 3a, 4, 6 and 7; R1 = 100 Ω; see Figs 4 and 5

note 4 5 − 50 µs

normal operating mode; V

low power modes; V note 4

low power modes; V for wake-up after receiving a falling or rising edge; note 4

low power modes; V

; Tvj= −40 to +150 °C; all voltages are deﬁned with respect to

0.35 0.60 −µs

0.2 0.3 −µs

C1 = 1 nF; C2 = not present − 0.75 1.5 µs C1 = C2 = 3.3 nF − 1 1.75 µs

C1 = 1 nF; C2 = not present − 0.85 1.4 µs C1 = C2 = 3.3 nF − 1.1 1.7 µs

C1 = 1 nF; C2 = not present − 1.2 1.9 µs C1 = C2 = 3.3 nF − 2.5 3.3 µs

C1 = 1 nF; C2 = not present − 1.1 1.7 µs C1 = C2 = 3.3 nF − 1.5 2.2 µs

0.75 − 4ms

=0V

TXD

BAT

=12V;

7 − 38 µs

failures 3 and 3a 1.6 − 8.0 ms failures 4, 6 and 7 0.3 − 1.6 ms

=12V

BAT

failures 3 and 3a 1.6 − 8.0 ms failures 4 and 7 0.1 − 1.6 ms

2004 Mar 23 14

Page 15

Philips Semiconductors Product speciﬁcation

Fault-tolerant CAN transceiver TJA1054A

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

rec

det

rec

Notes

1. All parameters are guaranteed over the virtual junction temperature range by design, but only 100% tested at T

amb

otherwise specified.

2. For bare die, all parameters are only guaranteed if the back side of the die is connected to ground.

3. A local or remote wake-up event will be signalled at the transceiver pins RXD and NERR if V (see Table 2).

4. To guarantee a successful mode transition under all conditions, the maximum specified time must be applied.

failure recovery time normal operating mode

failures 3 and 3a 0.3 − 1.6 ms failures 4 and 7 7 − 38 µs failure 6 125 − 750 µs

low power modes; V

BAT

=12V

failures 3, 3a, 4 and 7 0.3 − 1.6 ms

pulse-count difference between CANH and CANL for failure detection

number of consecutive pulses on

normal operating mode and

− 4 − failures 1, 2, 5 and 6a; pin ERR becomes LOW

failures 1, 2, 5 and 6a − 4 −

CANH and CANL simultaneously for failure recovery

= 125 °C for dies on wafer level, and above this for cased products 100% tested at T

=25°C, unless

amb

=5.3Vto27V

BAT

handbook, full pagewidth

diff=VCANH

− V

CANL

TXD

CANL

CANH

diff

RXD

PD(L)

PD(H)

Fig.4 Timing diagram for dynamic characteristics.

MGL424

0 V

5 V

3.6 V

1.4 V 0 V

2.2 V

−3.2 V

−5 V

0.7V

0.3V

CC CC

2004 Mar 23 15

Page 16

Philips Semiconductors Product speciﬁcation

Fault-tolerant CAN transceiver TJA1054A

TEST AND APPLICATION INFORMATION

handbook, full pagewidth

5 V

20 pF

WAKE

TXD

STB

RXD

INH BAT

11410

TJA1054A

13 4

GND ERR

RTH

CANL

CANH

RTL

R1 C1

MGU381

Termination resistors R1 (100 Ω) are not connected to pin RTH or pin RTL for testing purposes because the minimum load allowed on the CAN bus lines is 500 Ω per transceiver.

The capacitive bus load of 10 nF is split into 3 equal capacitors (3.3 nF) to simulate the bus cable.

Fig.5 Test circuit for dynamic characteristics.

handbook, full pagewidth

5 V

20 pF

WAKE

TXD

STB

RXD

11410

12 V

10 µF

INH BAT

TJA1054A

13 4

GND ERR

RTH

CANL

CANH

RTL

125 Ω

511 Ω

125 Ω

1 nF

MGU382

GENERATOR

The waveforms of the applied transients on pins CANH and CANL will be in accordance with

Fig.6 Test circuit for automotive transients.

2004 Mar 23 16

“ISO 7637 part 1”

: test pulses 1, 2, 3a and 3b.

Page 17

Philips Semiconductors Product speciﬁcation

Fault-tolerant CAN transceiver TJA1054A

handbook, full pagewidth

P8xC592/P8xCE598

CAN CONTROLLER

CTX0 CRXO Px.x Px.x Px.x

TXD RXD STB ERR EN INH

WAKE

35461

TJA1054A

CAN TRANSCEIVER

811129

CAN BUS LINE

For more information: please refer to the separate FTCAN information available from our web site.

Fig.7 Application diagram.

BAT

5 V

BAT

GND

RTLCANLCANHRTH

BATTERY

+5 V

100 nF

MGU380

2004 Mar 23 17

Page 18

Philips Semiconductors Product speciﬁcation

Fault-tolerant CAN transceiver TJA1054A

BONDING PAD LOCATIONS

COORDINATES

(1)

SYMBOL PAD

INH 1 106 317 TXD 2 111 168 RXD 3 750 111 ERR 4 1347 111 STB 5 2248 103 EN 6 2551 240 WAKE 7 2559 381 RTH 8 2463 1443 RTL 9 2389 1840 V

10 1886 1809 CANH 11 900 1698 CANL 12 401 1698 GND 13a 80 1356 GND 13b 80 1241 BAT 14 105 772

Note

1. All coordinates (µm) represent the position of the centre of each pad with respect to the bottom left-hand corner of the top aluminium layer (see Fig.8).

handbook, full pagewidth

1112

13a 13b

1990

µm

1 2

0 y

3 4

TJA1054AU

2730 µm

Fig.8 Bonding pad locations.

2004 Mar 23 18

7 6

MGU384

Page 19

Philips Semiconductors Product speciﬁcation

Fault-tolerant CAN transceiver TJA1054A

APPENDIX A Overview of differences between the TJA1054 and the TJA1054A Limiting values

SYMBOL PARAMETER CONDITIONS

TJA1054 TJA1054A

MIN. MAX. MIN. MAX.

CANH

CANL

esd

CANH bus line voltage −40 +40 −27 +40 V CANL bus line voltage −40 +40 −27 +40 V electrostatic discharge

voltage

human body model

pins RTH, RTL, CANH, and CANL −2+2−4+4kV all other pins −2+2−2+2kV

machine model

any pin −175 +175 −300 +300 V

Bare die

PARAMETER TJA1054 TJA1054A UNIT

Dimensions 1990 × 2700 1990 × 2730 µm Bonding pad coordinates note 1 note 1

Note

1. The bonding pad coordinates partly differ between the TJA1054 and the TJA1054A.

UNIT

2004 Mar 23 19

Page 20

Philips Semiconductors Product speciﬁcation

Fault-tolerant CAN transceiver TJA1054A

PACKAGE OUTLINE

SO14: plastic small outline package; 14 leads; body width 3.9 mm

pin 1 index

SOT108-1

detail X

(A )

0 2.5 5 mm

scale

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

OUTLINE

VERSION

SOT108-1

A1A2A3b

max.

0.25

1.75

0.10

0.010

0.069

0.004

1.45

1.25

0.057

0.049

IEC JEDEC JEITA

076E06 MS-012

0.25

0.01

0.49

0.36

0.019

0.014

0.0100

0.0075

UNIT

inches

Note

1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.

0.25

8.75

0.19

8.55

0.35

0.34

REFERENCES

(1)E(1)

4.0

3.8

0.16

0.15

eHELLpQZywv θ

1.27

0.05

2004 Mar 23 20

6.2

5.8

0.244

0.228

1.05

0.041

1.0

0.4

0.039

0.016

0.7

0.25

0.6

0.028

0.01 0.004

0.024

EUROPEAN

PROJECTION

0.25 0.1

0.01

(1)

0.7

0.3

0.028

0.012

ISSUE DATE

99-12-27 03-02-19

Page 21

Philips Semiconductors Product speciﬁcation

Fault-tolerant CAN transceiver TJA1054A

SOLDERING Introduction to soldering surface mount packages

Thistextgives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our

“Data Handbook IC26; Integrated Circuit Packages”

(document order number 9398 652 90011). There is no soldering method that is ideal for all surface

mount IC packages. Wave soldering can still be used for certainsurface mount ICs, but it is not suitableforfinepitch SMDs. In these situations reflow soldering is recommended.

Reﬂow soldering

Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied totheprinted-circuitboardbyscreenprinting,stencillingor pressure-syringe dispensing before package placement. Driven by legislation and environmental forces the worldwide use of lead-free solder pastes is increasing.

Several methods exist for reflowing; for example, convection or convection/infrared heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method.

Typical reflow peak temperatures range from 215 to 270 °C depending on solder paste material. The top-surface temperature of the packages should preferably be kept:

• below 225 °C (SnPb process) or below 245 °C (Pb-free

process) – for all BGA, HTSSON-T and SSOP-T packages – for packages with a thickness ≥ 2.5 mm – for packages with a thickness < 2.5 mm and a

volume ≥ 350 mm3 so called thick/large packages.

• below 240 °C (SnPb process) or below 260 °C (Pb-free

process) for packages with a thickness < 2.5 mm and a volume < 350 mm3 so called small/thin packages.

Moisture sensitivity precautions, as indicated on packing, must be respected at all times.

If wave soldering is used the following conditions must be observed for optimal results:

• Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave.

• For packages with leads on two sides and a pitch (e): – larger than or equal to 1.27 mm, the footprint

longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board;

– smaller than 1.27 mm, the footprint longitudinal axis

must be parallel to the transport direction of the printed-circuit board.

The footprint must incorporate solder thieves at the downstream end.

• Forpackages with leads on four sides, the footprintmust be placed at a 45° angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners.

During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured.

Typical dwell time of the leads in the wave ranges from 3 to 4 seconds at 250 °C or 265 °C, depending on solder material applied, SnPb or Pb-free respectively.

A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications.

Manual soldering

Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C.

When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C.

Wave soldering

Conventional single wave soldering is not recommended forsurface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems.

To overcome these problems the double-wave soldering method was specifically developed.

2004 Mar 23 21

Page 22

Philips Semiconductors Product speciﬁcation

Fault-tolerant CAN transceiver TJA1054A

Suitability of surface mount IC packages for wave and reﬂow soldering methods

SOLDERING METHOD

WAVE REFLOW

(2)

BGA, HTSSON..T

PACKAGE

(3)

, LBGA, LFBGA, SQFP, SSOP..T

(1)

(3)

, TFBGA,

not suitable suitable

USON, VFBGA DHVQFN, HBCC, HBGA, HLQFP, HSO, HSOP, HSQFP, HSSON,

not suitable

(4)

suitable

HTQFP, HTSSOP, HVQFN, HVSON, SMS

(5)

PLCC LQFP, QFP, TQFP not recommended SSOP, TSSOP, VSO, VSSOP not recommended CWQCCN..L

, SO, SOJ suitable suitable

(5)(6)

suitable

(7)

suitable

(8)

, PMFP

(9)

, WQCCN..L

(8)

not suitable not suitable

Notes

1. FormoredetailedinformationontheBGApackagesrefertothe

“(LF)BGAApplicationNote

”(AN01026);orderacopy

from your Philips Semiconductors sales office.

2. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the

“Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”

3. These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no account be processed through more than one soldering cycle or subjected to infrared reflow soldering with peak temperature exceeding 217 °C ± 10 °C measured in the atmosphere of the reflow oven. The package body peak temperature must be kept as low as possible.

4. These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side, the solder might be deposited on the heatsink surface.

5. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners.

6. Wave soldering is suitable for LQFP, TQFP and QFP packages with a pitch (e) larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.

7. Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger than

0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.

8. Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex foil by using a hot bar soldering process. The appropriate soldering profile can be provided on request.

9. Hot bar or manual soldering is suitable for PMFP packages.

2004 Mar 23 22

Page 23

Philips Semiconductors Product speciﬁcation

Fault-tolerant CAN transceiver TJA1054A

REVISION HISTORY

REV DATE CPCN DESCRIPTION

3 20040323 200310013C Product speciﬁcation (9397 750 11722)

Modiﬁcation:

• AddV wake-up event at transceiver pins RXD and ERR.

• Mode control diagram, Fig.3, completed.

• Recommendation added, to connect a not used pin WAKE to pin BAT.

• Reference of bond pad coordinates changed from the bottom left-hand

corner of the die, to the bottom left-hand corner of the top aluminium layer.

• Change of bare die dimension.

• Add Chapter REVISION HISTORY.

2 20011120 − Product speciﬁcation (9397 750 08321)

= 5.3 V to 27 Vcondition for correct signalling oflocalor remote

BAT

DATA SHEET STATUS

LEVEL

DATA SHEET

STATUS

(1)

PRODUCT

STATUS

(2)(3)

DEFINITION

I Objective data Development This data sheet contains data from the objective speciﬁcation for product

development. Philips Semiconductors reserves the right to change the speciﬁcation in any manner without notice.

II Preliminary

data

Qualiﬁcation This data sheet contains data from the preliminary speciﬁcation.

Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the speciﬁcation without notice, in order to improve the design and supply the best possible product.

III Product data Production This data sheet contains data from the product speciﬁcation. Philips

Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Relevant changes will be communicated via a Customer Product/Process Change Notiﬁcation (CPCN).

Notes

1. Please consult the most recently issued data sheet before initiating or completing a design.

2. The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.

3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.

2004 Mar 23 23

Page 24

Philips Semiconductors Product speciﬁcation

Fault-tolerant CAN transceiver TJA1054A

DEFINITIONS Short-form specification  The data in a short-form

specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook.

Limiting values definition  Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device attheseor at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information  Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make norepresentation or warranty that suchapplicationswillbe suitable for the specified use without further testing or modification.

DISCLAIMERS Life support applications  These products are not

designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductorscustomers using or selling theseproducts for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application.

Right to make changes  Philips Semiconductors reserves the right to make changes in the products including circuits, standard cells, and/or software described or contained herein in order to improve design and/or performance. When the product is in full production (status ‘Production’), relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified.

Bare die  All die are tested and are guaranteed to comply with all data sheet limits up to the point of wafer sawing for a period of ninety (90) days from the date of Philips' delivery. If there are data sheet limits not guaranteed, these will be separately indicated in the data sheet. There are no post packing tests performed on individual die or wafer. Philips Semiconductors has no control of third party procedures in the sawing, handling, packing or assembly of the die. Accordingly, Philips Semiconductors assumes no liability for device functionality or performance of the die or systems after third party sawing, handling, packing or assembly of the die. It is the responsibility of the customer to test and qualify their application in which the die is used.

2004 Mar 23 24

Page 25

Philips Semiconductors – a w orldwide compan y

Contact information

For additional information please visit http://www.semiconductors.philips.com. Fax: +31 40 27 24825 For sales ofﬁces addresses send e-mail to: sales.addresses@www.semiconductors.philips.com.

The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.

Printed in The Netherlands R16/03/pp25 Date of release: 2004 Mar 23 Document order number: 9397 750 11722

SCA76