Philips TJA1041A User Manual

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TJA1041A

High speed CAN transceiver

Product specification
Supersedes data of 2003 Sep 29

2004 Feb 20

Philips Semiconductors Product specification

High speed CAN transceiver TJA1041A

FEATURES
Optimized for in-vehicle high speed communication

• Fully compatible with the ISO 11898 standard

• Communication speed up to 1 Mbit/s

• Very low ElectroMagnetic Emission (EME)

• Differential receiver with wide common-mode range,

offering high ElectroMagnetic Immunity (EMI)

• Passive behaviour when supply voltage is off

• Automatic I/O-level adaptation to the host controller

supply voltage

• Recessive bus DC voltage stabilization for further
improvement of EME behaviour

• Listen-only mode for node diagnosis and failure
containment

• Allows implementation of large networks (more than
110 nodes).

Low-power management

• Very low-current in standby and sleep mode, with local
and remote wake-up

• Capability to power down the entire node, still allowing
local and remote wake-up

• Wake-up source recognition.

Protection and diagnosis (detection and signalling)

• TXD dominant clamping handler with diagnosis

• RXD recessive clamping handler with diagnosis

• TXD-to-RXD short-circuit handler with diagnosis

• Over-temperature protection with diagnosis

• Undervoltage detection on pins VCC, V

and V

I/O

BAT

• Automotive environment transient protected bus pins
and pin V

BAT

• Short-circuit proof bus pins and pin SPLIT (to battery
and to ground)

• Bus line short-circuit diagnosis

• Bus dominant clamping diagnosis

• Cold start diagnosis (first battery connection).

GENERAL DESCRIPTION

The TJA1041A provides an advanced interface between
the protocol controllerand the physical bus in a Controller
Area Network (CAN) node. The TJA1041A is primarily
intended for automotive high-speed CAN applications (up
to 1 Mbit/s). The transceiver provides differential transmit
capability to the bus and differential receive capability to
the CAN controller. The TJA1041A is fully compatible to
the ISO 11898 standard, and offers excellent EMC
performance, very low power consumption, and passive
behaviour when supply voltage is off. The advanced
features include:

• Low-power management, supporting local and remote
wake-up with wake-up source recognition and the
capability to control the power supply in the rest of the
node

• Several protection and diagnosis functions including
short circuits of the bus lines and first battery connection

• Automatic adaptation of the I/O-levels, in line with the
supply voltage of the controller.

ORDERING INFORMATION

TYPE

NUMBER

NAME DESCRIPTION VERSION

PACKAGE

TJA1041AT SO14 plastic small outline package; 14 leads; body width 3.9 mm SOT108-1
TJA1041AU − bare die; 1920 × 3190 × 380 µm −

2004 Feb 20 2

Philips Semiconductors Product specification

High speed CAN transceiver TJA1041A

QUICK REFERENCE DATA

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

V

CC

V

I/O

V

BAT

I

BAT

V

CANH

V

CANL

V

SPLIT

V

esd

t

PD(TXD-RXD)

T

vj

DC voltage on pin V
DC voltage on pin V
DC voltage on pin V
V

input current V

BAT

CC
I/O
BAT

operating range 4.75 5.25 V
operating range 2.8 5.25 V
operating range 5 27 V

= 12 V 10 30 µA

BAT

DC voltage on pin CANH 0 < VCC< 5.25 V; no time limit −27 +40 V
DC voltage on pin CANL 0 < VCC< 5.25 V; no time limit −27 +40 V
DC voltage on pin SPLIT 0 < VCC< 5.25 V; no time limit −27 +40 V
electrostatic discharge voltage Human Body Model (HBM)

pins CANH, CANL and SPLIT −6+6kV
all other pins −4+4kV

propagation delay TXD to RXD V

= 0 V 40 255 ns

STB

virtual junction temperature −40 +150 °C

2004 Feb 20 3

Philips Semiconductors Product specification

High speed CAN transceiver TJA1041A

BLOCK DIAGRAM

handbook, full pagewidth

TXD

EN

STB

WAKE

ERR

RXD

V

I/O

5

V

CCVBAT

310

TJA1041A

1

TIME-OUT

6

14

V

BAT

9

8

4

LEVEL

ADAPTOR

WAKE

COMPARATOR

V

I/O

V

I/O

MODE

CONTROL

+

FAILURE

DETECTOR

+

WAKE-UP

DETECTOR

RXD
RECESSIVE
DETECTION

TEMPERATURE

PROTECTION

DRIVER

V

CC

SPLIT

V

BAT

LOW POWER

RECEIVER

V

CC

NORMAL

RECEIVER

7

INH

13

CANH
CANL

12

11

SPLIT

2

GND

Fig.1 Block diagram.

2004 Feb 20 4

MNB115

Philips Semiconductors Product specification

High speed CAN transceiver TJA1041A

PINNING

SYMBOL PIN DESCRIPTION

TXD 1 transmit data input
GND 2 ground
V

CC

RXD 4 receive data output; reads out data

V

I/O

EN 6 enable control input
INH 7 inhibit output for switching external

ERR 8 error and power-on indication output

WAKE 9 local wake-up input
V

BAT

SPLIT 11 common-mode stabilization output
CANL 12 LOW-level CAN bus line
CANH 13 HIGH-level CAN bus line
STB 14 standby control input (active LOW)

3 transceiver supply voltage input

from the bus lines

5 I/O-level adapter voltage input

voltage regulators

(active LOW)

10 battery voltage input

handbook, halfpage

TXD

GND

V

CC

RXD
V

I/O

EN

INH

1
2
3
4
5
6
7

TJA1041AT

MDB635

STB

14

CANH

13

CANL

12

SPLIT

11

V

10

BAT

WAKE

9

ERR

8

Fig.2 Pinning configuration.

FUNCTIONAL DESCRIPTION

Theprimary function of a CAN transceiver is to provide the
CAN physical layer as described in the ISO 11898
standard. In the TJA1041A this primary function is
complemented with a number of operating modes,
fail-safe features and diagnosis features, which offer
enhanced system reliability and advanced power
management functionality.

Operating modes

The TJA1041A can be operated in five modes, each with
specific features. Control pins STB and EN select the
operating mode. Changing between modes also gives
access to a number of diagnostics flags, available via
pin ERR. The following sections describe the five
operating modes. Table 1 shows the conditions for
selecting these modes. Figure 3 illustrates the mode
transitions when VCC, V

and V

I/O

are present.

BAT

2004 Feb 20 5

Philips Semiconductors Product specification

High speed CAN transceiver TJA1041A

Table 1 Operating mode selection

CONTROL PINS INTERNAL FLAGS

OPERATING MODE PIN INH

STB EN UV

NOM

X X set X X

UV

pwon, wake-up

BAT

(1)

sleep mode; note 2 floating

cleared set one or both set standby mode H

both cleared no change from sleep mode floating

standby mode from any other mode H

L L cleared cleared one or both set standby mode H

both cleared no change from sleep mode floating

standby mode from any other mode H

L H cleared cleared one or both set standby mode H

both cleared no change from sleep mode floating

go-to-sleep command mode from any

(3)

H

other mode; note 3
H L cleared cleared X pwon/listen-only mode H
H H cleared cleared X normal mode; note 4 H

Notes

1. Setting the pwon flag or the wake-up flag will clear the UV

2. The transceiver directly enters sleep mode and pin INH is set floating when the UV
undervoltage detection time on either VCC or V

has elapsed before that voltage level has recovered).

I/O

NOM

flag.

flag is set (so after the

NOM

3. When go-to-sleep command mode is selected for longer than the minimum hold time of the go-to-sleep command,
the transceiver will enter sleep mode and pin INH is set floating.

4. On entering normal mode the pwon flag and the wake-up flag will be cleared.

2004 Feb 20 6

Philips Semiconductors Product specification

High speed CAN transceiver TJA1041A

handbook, full pagewidth

PWON/LISTEN-

ONLY MODE

STB = H

and

EN = L

(EN = L or flag set)

STANDBY

STB = H and EN = L

and

UV

cleared

NOM

STB = L

and

MODE

STB = H

and

EN = L

STB = L

and

flag set

STB = H

and

EN = H

STB = H

and

EN = L

STB = L

and

EN = L

STB = L and EN = H

and

flags cleared

STB = L

and

(EN = L or flag set)

SLEEP

MODE

STB = H

and

EN = H

STB = L and EN = H

and

flags cleared

flags cleared

t > t

GO-TO-SLEEP

and

h(min)

NORMAL

MODE

STB = H

and

EN = H

COMMAND

MODE

STB = L

and

EN = H

STB = H and EN = H

and

UV

cleared

NOM

LEGEND:

= H, = L
flag set

flags cleared

logical state of pin
setting pwon and/or wake-up flag

pwon and wake-up flag both cleared

Fig.3 Mode transitions when VCC, V

NORMAL MODE
Normal mode is the mode for normal bi-directional CAN

communication. The receiver will convert the differential
analog bus signal on pins CANH and CANL into digital
data, available for output to pin RXD. The transmitter will
convert digital data on pin TXD into a differential analog
signal, available for output to the bus pins. The bus pins
are biased at 0.5VCC (via R

). Pin INH is active, so

i(cm)

voltage regulators controlled by pin INH (see Fig.4) will be
active too.

PWON/LISTEN-ONLY MODE
In pwon/listen-only mode the transmitter of the transceiver

is disabled, effectively providing a transceiver listen-only

MGU983

and V

I/O

are present.

BAT

behaviour. The receiver will still convert the analog bus
signal on pins CANH and CANL into digital data, available
for output to pin RXD. As in normal mode the bus pins are
biased at 0.5VCC, and pin INH remains active.

STANDBY MODE
The standby mode is the first-level power saving mode of

the transceiver, offering reduced current consumption.
In standby mode the transceiver is not able to transmit or
receive data and the low-power receiver is activated to
monitor bus activity. The bus pins are biased at ground
level (via R

). Pin INH is still active, so voltage

i(cm)

regulators controlled by this pin INH will be active too.

2004 Feb 20 7

Philips Semiconductors Product specification

High speed CAN transceiver TJA1041A

Pins RXD and ERR will reflect any wake-up requests
(provided that V

and VCC are present).

I/O

command mode, and also when the undervoltage
detection time on either VCC or V
voltagelevel has recovered. In sleep modethe transceiver

GO-TO-SLEEP COMMAND MODE
The go-to-sleep command mode is the controlled route for

entering sleep mode. In go-to-sleep command mode the
transceiver behaves as if in standby mode, plus a
go-to-sleep command is issued to the transceiver. After
remaining in go-to-sleep command mode for the minimum
hold time (t

), the transceiver will enter sleep mode.

h(min)

The transceiver will not enter the sleep mode if the state of
pins STB or EN is changed or the UV
wake-up flag is set before t

has expired.

h(min)

, pwon or

BAT

still behaves as described for standby mode, but now
pin INH is set floating. Voltage regulators controlled by
pin INH will be switched off, and the current into pin V
is reduced to a minimum. Waking up a node from sleep
mode is possible via the wake-up flag and (as long as the
UV

NOM

Internal flags

The TJA1041A makes use of seven internal flags for its
fail-safe fallback mode control and system diagnosis
support. Table 1 shows the relation between flags and

SLEEP MODE
The sleep mode is the second-level power saving mode of

the transceiver. Sleep mode is entered via the go-to-sleep

operating modes of the transceiver. Five of the internal
flags can be made available to the controller via pin ERR.
Table 2 shows the details on how to access these flags.
The following sections describe the seven internal flags.

Table 2 Accessing internal flags via pin ERR

Internal flag Flag is available on pin ERR

UV
UV

NOM
BAT

no by setting the pwon or wake-up flag
no when V

(1)

pwon in pwon/listen-only mode (coming from standby

mode, go-to-sleep command mode, or sleep mode)

wake-up in standby mode, go-to-sleep command mode, and

sleep mode (provided that V

and VCCare present)

I/O

wake-up source in normal mode (before the fourth dominant to

recessive edge on pin TXD; note 2)

bus failure in normal mode (after the fourth dominant to

recessive edge on pin TXD; note 2)

local failure in pwon/listen-only mode (coming from normal

mode)

elapses before that

I/O

flag is not set) via pin STB.

Flag is cleared

has recovered

BAT

on entering normal mode

on entering normal mode, or by setting the
pwon or UV

NOM

flag

on leaving normal mode, or by setting the
pwon flag

on re-entering normal mode

on entering normal mode or when RXD is
dominant while TXD is recessive (provided
that all local failures are resolved)

BAT

Notes

1. Pin ERRis an active-LOW output, so aLOW level indicates a set flaganda HIGH level indicates a clearedflag. Allow
pin ERR to stabilize for at least 8 µs after changing operating modes.

2. Allow for a TXD dominant time of at least 4 µs per dominant-recessive cycle.

2004 Feb 20 8

Philips Semiconductors Product specification

High speed CAN transceiver TJA1041A

UV
UV

FLAG

NOM

is the VCC and V

NOM

undervoltage detection flag.

I/O

The flag is set when the voltage on pin VCC drops below
V

CC(sleep)

pin V
When the UV

for longer than t

drops below V

I/O

NOM

or when the voltage on

UV(VCC)

I/O(sleep)

for longer than t

UV(VI/O)

flag is set, the transceiver will enter

.

sleepmodetosavepowerandnotdisturbthebus.In sleep
mode the voltage regulators connected to pin INH are
disabled, avoiding the extra power consumption in case of
a short-circuit condition. After a waiting time (fixed by the
sametimers used for setting UV
or setting of the pwon flag will clear UV

)any wake-up request

NOM

and the timers,

NOM

allowing the voltage regulators to be reactivated at least
until UV

UV

BAT

UV

BAT

set when the voltage on pin V
WhenUV
mode to save power and not disturb the bus. UV
cleared when the voltage on pin V

is set again.

NOM

FLAG

is the V

BAT

undervoltage detection flag. The flag is

BAT

drops below V

BAT

isset, the transceiver will tryto enter standby

has recovered. The

BAT

BAT(stb)

is

BAT

.

transceiver will then return to the operating mode
determined by the logic state of pins STB and EN.

PWON FLAG
Pwon is the V

voltage on pin V
V

BAT(pwon)

, particularly after the transceiver was

power-on flag. This flag is set when the

BAT

has recovered after it dropped below

BAT

disconnected from the battery. By setting the pwon flag,
the UV

flag and timers are cleared and the transceiver

NOM

cannot enter sleep mode. This ensures that any voltage
regulator connected to pin INH is activated when the node
isreconnectedto the battery. In pwon/listen-only mode the
pwon flag can be made available on pin ERR. The flag is
cleared when the transceiver enters normal mode.

WAKE-UP FLAG
The wake-up flag is set when the transceiver detects a

local or a remote wake-up request. A local wake-up
request is detected when a logic state change on
pin WAKE remains stable for at least t

. A remote

wake

wake-uprequest is detected after two busdominant states
of at least t

BUSdom

recessive state of at least t

(with each dominant state followed by a

). The wake-up flag can

BUSrec

only be set in standby mode, go-to-sleep command mode
or sleep mode. Setting of the flag is blocked during the
UV

flag waiting time. By setting the wake-up flag, the

NOM

UV

flag and timers are cleared. The wake-up flag is

NOM

immediately available on pins ERR and RXD (provided

that V
power-on, or when theUV

and VCC are present). The flag is cleared at

I/O

flag is set orthe transceiver

NOM

enters normal mode.

WAKE-UP SOURCE FLAG
Wake-up source recognition is provided via the wake-up

source flag, which is set when the wake-up flag is set by a
local wake-up request via pin WAKE.The wake-up source
flag can only be set after the pwon flag is cleared.
In normal mode the wake-up source flag can be made
available on pin ERR. The flag is cleared at power-on or
when the transceiver leaves normal mode.

BUS FAILURE FLAG
The bus failure flag is set if the transceiver detects a bus

line short-circuit condition to V

BAT,VCC

or GND during four
consecutive dominant-recessive cycles on pin TXD, when
trying to drive the bus lines dominant. In normal mode the
bus failure flag can be made available on pin ERR. The
flag is cleared when the transceiver re-enters normal
mode.

LOCAL FAILURE FLAG
In normal mode or pwon/listen-only mode the transceiver

can recognize five different local failures, and will combine
them into one local failure flag. The five local failures are:
TXD dominant clamping, RXD recessive clamping, a
TXD-to-RXD short circuit, bus dominant clamping, and
over-temperature. Nature and detection of these local
failures is described in Section “Local failures”.
In pwon/listen-onlymodethelocalfailureflagcanbemade
available on pin ERR. The flag is cleared when entering
normal mode or when RXD is dominant while TXD is
recessive, provided that all local failures are resolved.

Local failures

The TJA1041A can detect five different local failure
conditions. Any of these failures will set the local failure
flag, and in most cases the transmitter of the transceiver
will be disabled. The following sections give the details.

TXD DOMINANT CLAMPING DETECTION
A permanent LOW level on pin TXD (due to a hardware or

software application failure) would drive the CAN bus into
a permanent dominant state, blocking all network
communication. The TXD dominant time-out function
prevents such a network lock-up by disabling the
transmitter of the transceiver if pin TXD remains at a LOW
level for longer than the TXD dominant time-out t

dom(TXD)

.

2004 Feb 20 9

Philips Semiconductors Product specification

High speed CAN transceiver TJA1041A

The t

dom(TXD)

timer defines the minimum possible bit rate
of 40 kbit/s. The transmitter remains disabled until the
local failure flag is cleared.

RXD RECESSIVE CLAMPING DETECTION
An RXD pin clamped to HIGH level will prevent the

controller connected to this pin from recognizing a bus
dominant state. So the controller can start messages at
any time, which is likely to disturb all bus communication.
RXD recessive clamping detection prevents this effect by
disabling the transmitter when the bus is in dominant state
without RXD reflecting this. The transmitter remains
disabled until the local failure flag is cleared.

TXD-TO-RXD SHORT-CIRCUIT DETECTION
Ashort-circuitbetweenpins RXDand TXDwouldkeepthe

bus in a permanent dominant state once the bus is driven
dominant, because the low-side driver of RXD is typically
stronger than the high-side driver of the controller
connected to TXD. The TXD-to-RXD short-circuit
detectionpreventssuch a network lock-up by disabling the
transmitter.Thetransmitterremainsdisableduntilthe local
failure flag is cleared.

BUS DOMINANT CLAMPING DETECTION
A CAN bus short circuit (to V

BAT,VCC

or GND) or a failure
in one of the other network nodes could result in a
differential voltage on the bus high enough to represent a
bus dominant state. Because a node will not start
transmission if the bus is dominant, the normal bus failure
detection will not detect this failure, but the bus dominant
clamping detection will. The local failure flag is set if the
dominantstate on the bus persists for longer thant

dom(bus)

By checking this flag, the controller can determine if a
clamped bus is blocking network communication. There is
no need to disable the transmitter. Note that the local
failure flag does not retain a bus dominant clamping
failure, and is released as soon as the bus returns to
recessive state.

OVER-TEMPERATURE DETECTION
To protect the output drivers of the transceiver against

overheating, the transmitter will be disabled if the virtual

junction temperature exceeds the shutdown junction
temperature T

. The transmitter remains disabled until

j(sd)

the local failure flag is cleared.

Recessive bus voltage stabilization

In recessive state the output impedance of transceivers is
relatively high. In a partially powered network (supply
voltage is off in some of the nodes) any deactivated
transceiver with a significant leakage current is likely to
load the recessive bus to ground. This will cause a
common-modevoltagestepeachtimetransmissionstarts,
resulting in increased ElectroMagnetic Emission (EME).
Using pin SPLIT of the TJA1041A in combination with split
termination (see Fig.5) will reduce this step effect. In
normal mode and pwon/listen-only mode pin SPLIT
providesastabilized0.5VCCDC voltage.Instandbymode,
go-to-sleep command mode and sleep mode pin SPLIT is
set floating.

I/O level adapter

The TJA1041A is equipped with a built-in I/O-level
adapter.Byusingthesupplyvoltageofthecontroller(tobe
supplied at pin V

) the level adapter ratio-metrically

I/O

scalestheI/O-levels of the transceiver. For pins TXD, STB
and EN the digital input threshold level is adjusted, and for
pins RXD and ERR the HIGH-level output voltage is
adjusted. This allows the transceiver to be directly
interfaced with controllers on supply voltages between

2.8 V and 5.25 V, without the need for glue logic.

Pin WAKE

Pin WAKE of the TJA1041A allows local wake-up

.

triggering by a LOW to HIGH state change as well as a
HIGHto LOW state change. This gives maximum flexibility
when designing a local wake-up circuit. To keep current
consumption at a minimum, after a t

delay the internal

wake

bias voltage of pin WAKE will follow the logic state of this
pin. A HIGH level on pin WAKE is followed by an internal
pull-up to V

. A LOW level on pin WAKE is followed by

BAT

an internal pull-down towards GND. To ensure EMI
performance in applications not using local wake-up it is
recommended to connect pin WAKE to pin V

BAT

GND.

or to pin

2004 Feb 20 10

Philips Semiconductors Product specification

High speed CAN transceiver TJA1041A

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 60134).

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

V

CC

V

I/O

V

BAT

V

TXD

V

RXD

V

STB

V

EN

V

ERR

V

INH

V

WAKE

I

WAKE

V

CANH

V

CANL

V

SPLIT

V

trt

V

esd

T

vj

T

stg

DC voltage on pin V

CC

no time limit −0.3 +6 V
operating range 4.75 5.25 V

DC voltage on pin V

I/O

no time limit −0.3 +6 V
operating range 2.8 5.25 V

DC voltage on pin V

BAT

no time limit −0.3 +40 V
operating range 5 27 V

load dump − 40 V
DC voltage on pin TXD −0.3 V
DC voltage on pin RXD −0.3 V
DC voltage on pin STB −0.3 V
DC voltage on pin EN −0.3 V
DC voltage on pin ERR −0.3 V
DC voltage on pin INH −0.3 V
DC voltage on pin WAKE −0.3 V

+ 0.3 V

I/O

+ 0.3 V

I/O

+ 0.3 V

I/O

+ 0.3 V

I/O

+ 0.3 V

I/O

+ 0.3 V

BAT

+ 0.3 V

BAT

DC current on pin WAKE −−15 mA
DC voltage on pin CANH 0 < VCC< 5.25 V; no time limit −27 +40 V
DC voltage on pin CANL 0 < VCC< 5.25 V; no time limit −27 +40 V
DC voltage on pin SPLIT 0 < VCC< 5.25 V; no time limit −27 +40 V
transient voltages on pins CANH,

CANL, SPLIT and V

BAT

according to ISO 7637; see Fig.6 −200 +200 V

electrostatic discharge voltage Human Body Model (HBM);

note 1

pins CANH, CANL and SPLIT −6+6kV
all other pins −4+4kV

Machine Model (MM); note 2 −200 +200 V
virtual junction temperature note 3 −40 +150 °C
storage temperature −55 +150 °C

Notes

1. Equivalent to discharging a 100 pF capacitor via a 1.5 kΩ series resistor (6 kV level with pin GND connected to
ground).

2. Equivalent to discharging a 200 pF capacitor via a 0.75 µH series inductor and a 10 Ω series resistor.

3. Junction temperature in accordance with IEC 60747-1. An alternative definition is: Tvj=T
R

th(vj-amb)

temperature (T

is a fixed value. The rating for Tvj limits the allowable combinations of power dissipation (P) and ambient

).

amb

amb

+P× R

th(vj-amb)

, where

THERMAL CHARACTERISTICS

SYMBOL PARAMETER CONDITIONS VALUE UNIT

R
R

th(j-a)
th(j-s)

thermal resistance from junction to ambient in SO14 package in free air 120 K/W
thermal resistance from junction to substrate of bare die in free air 40 K/W

2004 Feb 20 11

Philips Semiconductors Product specification

High speed CAN transceiver TJA1041A

QUALITY SPECIFICATION

Quality specification in accordance with

“AEC-Q100”

.

CHARACTERISTICS

VCC= 4.75 V to 5.25 V; V

= 2.8 V to VCC; V

I/O

=5Vto27V; RL=60Ω; Tvj= −40 °C to +150 °C; unless specified

BAT

otherwise; all voltages are defined with respect to ground; positive currents flow into the device; note 1.

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Supplies (pins V

V

CC(sleep)

, VCC and V

BAT

VCC undervoltage detection

I/O

)

V

= 12 V (fail-safe) 2.75 3.3 4.5 V

BAT

level for forced sleep mode

V

I/O(sleep)

V

undervoltage detection

I/O

0.5 1.5 2 V

level for forced sleep mode

V

BAT(stb)

V

voltage levelforfail-safe

BAT

VCC= 5 V (fail-safe) 2.75 3.3 4.5 V

fallback mode

V

BAT(pwon)

V

voltage level for setting

BAT

VCC= 0 V 2.5 3.3 4.1 V

pwon flag

I

CC

VCC input current normal mode; V

TXD

=0V

25 55 80 mA

(dominant)
normal or pwon/listen-only

mode; V

TXD=VI/O

2 6 10 mA

(recessive)
standby or sleep mode − 110µA

I

I/O

V

input current normal mode; V

I/O

TXD

=0V

100 350 1000 µA

(dominant)
normal or pwon/listen-only

mode; V

TXD=VI/O

15 80 200 µA

(recessive)
standby or sleep mode − 05µA

I

BAT

V

input current normal or pwon/listen-only

BAT

15 30 40 µA

mode
standby mode;

VCC> 4.75 V; V
V

INH=VWAKE=VBAT

sleep mode;
V

INH=VCC=VI/O

V

WAKE=VBAT

=12V

= 2.8 V;

I/O

=0V;

=12V

10 20 30 µA

10 20 30 µA

Transmitter data input (pin TXD)

V

IH

V

IL

I

IH

I

IL

C

i

HIGH-level input voltage 0.7V
LOW-level input voltage −0.3 − 0.3V
HIGH-level input current normal or pwon/listen-only

mode; V

TXD=VI/O

LOW-level input current normal or pwon/listen-only

mode; V

TXD

= 0.3V

I/O

−50 +5 µA

−70 −250 −500 µA

− VCC+ 0.3 V

I/O

I/O

input capacitance not tested − 510pF

V

2004 Feb 20 12

Philips Semiconductors Product specification

High speed CAN transceiver TJA1041A

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Receiver data output (pin RXD)

I

OH

I

OL

Standby and enable control inputs (pins STB and EN)

V

IH

V

IL

I

IH

I

IL

Error and power-on indication output (pin ERR)

I

OH

I

OL

Local wake-up input (pin WAKE)

I

IH

I

IL

V

th

Inhibit output (pin INH)

∆V

H

IL leakage current sleep mode − 05µA

Bus lines (pins CANH and CANL)

V

O(dom)

V

O(dom)(m)

V

O(dif)(bus)

V

O(reces)

I

O(sc)

I

O(reces)

HIGH-level output current V

LOW-level output current V

RXD=VI/O

V

I/O=VCC
RXD

− 0.4 V;

= 0.4 V; V

TXD=VI/O

−1 −3 −6mA

;

2 5 12 mA

bus dominant

HIGH-level input voltage 0.7V

− VCC+ 0.3 V

I/O

LOW-level input voltage −0.3 − 0.3V
HIGH-level input current V
LOW-level input current V

HIGH-level output current V

LOW-level output current V

HIGH-level input current V
LOW-level input current V
threshold voltage V

HIGH-level voltage drop I

dominant output voltage V

STB=VEN
STB=VEN

ERR=VI/O

V

I/O=VCC
ERR

WAKE=VBAT
WAKE=VBAT
STB

= −0.18 mA 0.05 0.2 0.8 V

INH

TXD

= 0.7V

I/O

14 10µA

=0V − 0 −1 µA

− 0.4 V;

−4 −20 −50 µA

= 0.4 V 0.1 0.2 0.35 mA

− 1.9 V −1 −5 −10 µA

− 3.1 V 1 5 10 µA

=0V V

BAT

− 3V

BAT

− 2.5 V

BAT

=0V
pin CANH 3 3.6 4.25 V
pin CANL 0.5 1.4 1.75 V

matching of dominant output

−0.1 − +0.15 V
voltage
(VCC− V

differentialbusoutputvoltage
(V

CANH

CANH

− V

CANL

− V

)

CANL

)

V

= 0 V (dominant);

TXD

1.5 − 3.0 V

45 Ω <RL<65Ω
V

TXD=VI/O

(recessive); no

−50 − +50 mV

load

recessive output voltage normal or pwon/listen-only

mode; V

TXD=VI/O

; no load

standby or sleep mode; no

2 0.5V

CC

3V

−0.1 0 +0.1 V

load

short-circuit output current V

recessive output current −27V<V

= 0 V (dominant)

TXD

pin CANH; V
pin CANL; V

CAN

=0 −40 −70 −95 mA

CANH

= 40 V 40 70 95 mA

CANL

<32V −2.5 − +2.5 mA

V

I/O

− 2V

2004 Feb 20 13

Philips Semiconductors Product specification

High speed CAN transceiver TJA1041A

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

V

dif(th)

V

hys(dif)

I

LI

R

i(cm)

R

i(cm)(m)

R

i(dif)

C

i(cm)

C

i(dif)

R

sc(bus)

Common-mode stabilization output (pin SPLIT)

V

o

IL leakage current standby or sleep mode;

Timing characteristics; see Figs 8 and 9
t

d(TXD-BUSon)

t

d(TXD-BUSoff)

t

d(BUSon-RXD)

t

d(BUSoff-RXD)

t

PD(TXD-RXD)

t
t

t
t

UV(VCC)
UV(VI/O)

dom(TXD)
dom(bus)

,

differential receiver threshold
voltage

differential receiver
hysteresis voltage

input leakage current VCC=0V

common-mode input

normal or pwon/listen-only
mode (see Fig.7);

−12V<V

−12V<V

CANH
CANL

<12V;

<12V

standby or sleep mode;

−12V<V

−12V<V

CANH
CANL

<12V;

<12V

normal or pwon/listen-only
mode (see Fig.7);

−12V<V

−12V<V

V

CANH=VCANL

CANH
CANL

<12V;

<12V

=5V

0.5 0.7 0.9 V

0.4 0.7 1.15 V

50 70 100 mV

100 170 250 µA

15 25 35 kΩ

resistance
common-mode input

V

CANH=VCANL

−3 0 +3 %
resistance matching

differential input resistance 25 50 75 kΩ
common-mode input

V

TXD=VCC

; not tested −− 20 pF

capacitance
differential input capacitance V
detectable short-circuit

TXD=VCC

normal mode 0 − 50 Ω

; not tested −− 10 pF

resistance between bus lines
and V

output voltage normal or pwon/listen-only

, VCC and GND

BAT

0.3V

CC

0.5V

CC

0.7V

CC

V

mode;

−500 µA<I

SPLIT

< 500 µA

− 05µA

−22V<V

SPLIT

<35V

delay TXD to bus active normal mode 25 70 110 ns
delay TXD to bus inactive normal mode 10 50 95 ns
delay bus active to RXD normal or pwon/listen-only

15 65 115 ns

mode

delay bus inactive to RXD normal or pwon/listen-only

35 100 160 ns

mode

propagation delay TXD to

V

=0V 40 − 255 ns

STB

RXD
undervoltage detection time

on VCC and V

I/O

TXD dominant time-out V
bus dominant time-out V

= 0 V 300 600 1000 µs

TXD

> 0.9 V 300 600 1000 µs

dif

5 10 12.5 ms

2004 Feb 20 14

Philips Semiconductors Product specification

High speed CAN transceiver TJA1041A

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

t

h(min)

t

BUSdom

t

BUSrec

t

wake

Thermal shutdown

T

j(sd)

Note

1. All parameters are guaranteed over the virtual junction temperature range by design, but only 100 % tested at
T

= 125 °Cfordieson waferleveland in additionto this,100 % tested at T

amb

specified otherwise. For bare dies, all parameters are only guaranteed with the reverse side of the die connected to
ground.

minimum hold time of
go-to-sleep command

dominant time for wake-up
via bus

recessive time for wake-up
via bus

minimum wake-up time after
receiving a falling or rising
edge

shutdown junction
temperature

standby or sleep mode;
V

=12V

BAT

standby or sleep mode;
V

=12V

BAT

standby or sleep mode;
V

=12V

BAT

20 35 50 µs

0.75 1.75 5 µs

0.75 1.75 5 µs

52550µs

155 165 180 °C

= 125 °Cforcasedproducts,unless

amb

TEST AND APPLICATION INFORMATION

handbook, full pagewidth

BAT

WAKE

GND

V

BAT

TJA1041A

CAN bus wires

5 V

INH

SPLIT

3 V

V

CC

V

I/O

V

STB
EN

ERR

RXD
TXD

CANLCANH

CC

Port x, y, z

MICRO-

CONTROLLER

RXD
TXD

MNB116

Fig.4 Typical application with 3 V microcontroller.

2004 Feb 20 15

Philips Semiconductors Product specification

High speed CAN transceiver TJA1041A

handbook, full pagewidth

handbook, full pagewidth

V

= 0.5V

SPLIT
in normal mode

and pwon/listen-only

otherwise floating

CC

mode;

Fig.5 Stabilization circuitry and application.

V

CC

R

R

GND

TJA1041A

+

12 V

CANH

SPLIT

CANL

60 Ω

60 Ω

V

SPLIT

MNB117

+

5 V

100 nF47 µF

5

TXD

1

EN

6

STB

14

WAKE

9

500 kHz

The waveforms of the applied transients will be in accordance with ISO 7637 part 1, test pulses 1, 2, 3a, 3b, 5, 6 and 7.

VCCV

V

I/O

310

TJA1041A

2

GND

BAT

13

12

11

8
7
4

CANH

CANL

SPLIT
ERR
INH
RXD

10 µF

1 nF

1 nF

MNB118

Fig.6 Test circuit for automotive transients.

2004 Feb 20 16

TRANSIENT

GENERATOR

Philips Semiconductors Product specification

High speed CAN transceiver TJA1041A

handbook, full pagewidth

handbook, full pagewidth

V

RXD

hysteresis

0.5 0.9

Fig.7 Hysteresis of the receiver.

+

12 V

V

i(dif)(bus)

MGS378

HIGH

LOW

(V)

+

5 V

100 nF47 µF

TXD

EN

STB

WAKE

1
6

14

9

V

I/O

5

TJA1041A

Fig.8 Test circuit for timing characteristics.

2004 Feb 20 17

V

CCVBAT

310

13

12
11

8
7
4

2

GND

CANH

CANL
SPLIT
ERR
INH
RXD

10 µF

15 pF

R

L

60 Ω

MNB119

C

L

100 pF

Philips Semiconductors Product specification

High speed CAN transceiver TJA1041A

handbook, full pagewidth

(1) V

i(dif)(bus)=VCANH

− V

CANL

.

TXD

CANH

CANL

V

i(dif)(bus)

RXD

t

d(TXD-BUSon)

t

d(BUSon-RXD)

(1)

t

PD(TXD-RXD

0.3V

CC

)

t

PD(TXD-RXD

Fig.9 Timing diagram.

0.9 V

0.5 V

0.7V

t

d(TXD-BUSoff)

t

d(BUSoff-RXD)

)

HIGH
LOW

dominant
(BUS on)

recessive
(BUS off)

HIGH

CC

LOW

MGS377

BONDING PAD LOCATIONS

COORDINATES

(1)

SYMBOL PAD

xy

TXD 1 664.25 3004.5
GND 2 75.75 3044.25
V

CC

3 115.5 2573
RXD 4 115.5 1862.75
V

I/O

5 115.5 115.5
EN 6 264.5 114
INH 7 667.75 85
ERR 8 1076.75 115.5
WAKE 9 1765 85
V

BAT

10 1765 792.5
SPLIT 11 1765 1442.25
CANL 12 1765 2115
CANH 13 1751 3002.5
STB 14 940.75 3004.5

Note

1. All x/y coordinates represent the position of the centre
ofeachpad(inµm)withrespecttothelefthandbottom
corner of the top aluminium layer.

handbook, halfpage

The reverse side of the bare die must be connected to ground.

2

3

4

5

x

0

678

0

y

141

TJA1041AU

13

12

11

10

9

MDB634

Fig.10 Bonding pad locations.

2004 Feb 20 18

Philips Semiconductors Product specification

High speed CAN transceiver TJA1041A

PACKAGE OUTLINE

SO14: plastic small outline package; 14 leads; body width 3.9 mm

D

c

y

Z

14

pin 1 index

1

e

8

A

2

7

w

b

p

M

SOT108-1

E

H

E

A

1

detail X

A

X

v

M

A

Q

(A )

L

p

L

A

3

θ

0 2.5 5 mm

scale

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

mm

OUTLINE
VERSION

SOT108-1

A

max.

1.75

0.069

A1A2A

0.25

1.45

0.10

1.25

0.010

0.057

0.004

0.049

IEC JEDEC JEITA

076E06 MS-012

0.25

0.01

b

3

p

0.49

0.36

0.019

0.0100

0.014

0.0075

UNIT

inches

Note

1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.

cD

0.25

8.75

0.19

8.55

0.35

0.34

REFERENCES

(1)E(1)

4.0

3.8

0.16

0.15

eHELLpQZywv θ

1.27

0.05

2004 Feb 20 19

6.2

5.8

0.244

0.228

1.05

0.041

1.0

0.4

0.039

0.016

0.7

0.25

0.6

0.028

0.01 0.004

0.024

EUROPEAN

PROJECTION

0.25 0.1

0.01

(1)

0.7

0.3

0.028

0.012

ISSUE DATE

99-12-27
03-02-19

o

8

o

0

Philips Semiconductors Product specification

High speed CAN transceiver TJA1041A

SOLDERING
Introduction to soldering surface mount packages

Thistextgivesaverybriefinsighttoacomplextechnology.
A more in-depth account of soldering ICs can be found in
our

“Data Handbook IC26; Integrated Circuit Packages”

(document order number 9398 652 90011).
There is no soldering method that is ideal for all surface

mount IC packages. Wave soldering can still be used for
certainsurfacemountICs,butitisnotsuitableforfinepitch
SMDs. In these situations reflow soldering is
recommended.

Reflow soldering

Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
totheprinted-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
Driven by legislation and environmental forces the
worldwide use of lead-free solder pastes is increasing.

Several methods exist for reflowing; for example,
convection or convection/infrared heating in a conveyor
type oven. Throughput times (preheating, soldering and
cooling) vary between 100 and 200 seconds depending
on heating method.

Typical reflow peak temperatures range from
215 to 270 °C depending on solder paste material. The
top-surface temperature of the packages should
preferably be kept:

• below 225 °C (SnPb process) or below 245 °C (Pb-free

process)
– for all BGA, HTSSON-T and SSOP-T packages
– for packages with a thickness ≥ 2.5 mm
– for packages with a thickness < 2.5 mm and a

volume ≥ 350 mm3 so called thick/large packages.

• below 240 °C (SnPb process) or below 260 °C (Pb-free

process) for packages with a thickness < 2.5 mm and a
volume < 350 mm3 so called small/thin packages.

Moisture sensitivity precautions, as indicated on packing,
must be respected at all times.

If wave soldering is used the following conditions must be
observed for optimal results:

• Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.

• For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27 mm, the footprint

longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;

– smaller than 1.27 mm, the footprint longitudinal axis

must be parallel to the transport direction of the
printed-circuit board.

The footprint must incorporate solder thieves at the
downstream end.

• Forpackageswithleadsonfoursides,thefootprintmust
be placed at a 45° angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.

During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.

Typical dwell time of the leads in the wave ranges from
3 to 4 seconds at 250 °C or 265 °C, depending on solder
material applied, SnPb or Pb-free respectively.

A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.

Manual soldering

Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300 °C.

When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320 °C.

Wave soldering

Conventional single wave soldering is not recommended
forsurfacemountdevices(SMDs)orprinted-circuitboards
with a high component density, as solder bridging and
non-wetting can present major problems.

To overcome these problems the double-wave soldering
method was specifically developed.

2004 Feb 20 20

Philips Semiconductors Product specification

High speed CAN transceiver TJA1041A

Suitability of surface mount IC packages for wave and reflow soldering methods

SOLDERING METHOD

WAVE REFLOW

(2)

BGA, HTSSON..T

PACKAGE

(3)

, LBGA, LFBGA, SQFP, SSOP..T

(1)

(3)

, TFBGA,

not suitable suitable

USON, VFBGA
DHVQFN, HBCC, HBGA, HLQFP, HSO, HSOP, HSQFP, HSSON,

not suitable

(4)

suitable

HTQFP, HTSSOP, HVQFN, HVSON, SMS

(5)

PLCC
LQFP, QFP, TQFP not recommended
SSOP, TSSOP, VSO, VSSOP not recommended
CWQCCN..L

, SO, SOJ suitable suitable

(5)(6)

suitable

(7)

suitable

(8)

, PMFP

(9)

, WQCCN..L

(8)

not suitable not suitable

Notes

1. Formoredetailed information on the BGA packages refer to the

“(LF)BGAApplication Note

”(AN01026);order a copy

from your Philips Semiconductors sales office.

2. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the

“Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”

.

3. These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no account
be processed through more than one soldering cycle or subjected to infrared reflow soldering with peak temperature
exceeding 217 °C ± 10 °C measured in the atmosphere of the reflow oven. The package body peak temperature
must be kept as low as possible.

4. These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder
cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side,
the solder might be deposited on the heatsink surface.

5. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.

6. Wave soldering is suitable for LQFP, TQFP and QFP packages with a pitch (e) larger than 0.8 mm; it is definitely not
suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.

7. Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger than

0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.

8. Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered pre-mounted
on flex foil. However, the image sensor package can be mounted by the client on a flex foil by using a hot bar
soldering process. The appropriate soldering profile can be provided on request.

9. Hot bar or manual soldering is suitable for PMFP packages.

2004 Feb 20 21

Philips Semiconductors Product specification

High speed CAN transceiver TJA1041A

DATA SHEET STATUS

LEVEL

DATA SHEET

STATUS

(1)

PRODUCT

STATUS

(2)(3)

DEFINITION

I Objective data Development This data sheet contains data from the objective specification for product

development. Philips Semiconductors reserves the right to change the
specification in any manner without notice.

II Preliminary data Qualification This data sheet contains data from the preliminary specification.

Supplementary data will be published at a later date. Philips
Semiconductors reserves the right to change the specification without
notice, in order to improve the design and supply the best possible
product.

III Product data Production This data sheet contains data from the product specification. Philips

Semiconductors reserves the right to make changes at any time in order
to improve the design, manufacturing and supply. Relevant changes will
be communicated via a Customer Product/Process Change Notification
(CPCN).

Notes

1. Please consult the most recently issued data sheet before initiating or completing a design.

2. The product status of the device(s) described in this data sheet may have changed since this data sheet was
published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.

3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.

DEFINITIONS

DISCLAIMERS

Short-form specification  The data in a short-form

specification is extracted from a full data sheet with the
same type number and title. For detailed information see
the relevant data sheet or data handbook.

Limiting values definition  Limiting values given are in
accordance with the Absolute Maximum Rating System
(IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device.
These are stress ratings only and operation of the device
attheseoratanyother conditions above those given in the
Characteristics sections of the specification is not implied.
Exposure to limiting values for extended periods may
affect device reliability.

Application information  Applications that are
described herein for any of these products are for
illustrative purposes only. Philips Semiconductors make
norepresentationorwarrantythatsuchapplicationswillbe
suitable for the specified use without further testing or
modification.

Life support applications  These products are not
designed for use in life support appliances, devices, or
systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips
Semiconductorscustomersusingorsellingtheseproducts
for use in such applications do so at their own risk and
agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.

Right to make changes  Philips Semiconductors
reserves the right to make changes in the products ­including circuits, standard cells, and/or software ­described or contained herein in order to improve design
and/or performance. When the product is in full production
(status ‘Production’), relevant changes will be
communicated via a Customer Product/Process Change
Notification (CPCN). Philips Semiconductors assumes no
responsibility or liability for the use of any of these
products, conveys no licence or title under any patent,
copyright, or mask work right to these products, and
makes no representations or warranties that these
products are free from patent, copyright, or mask work
right infringement, unless otherwise specified.

2004 Feb 20 22

Philips Semiconductors Product specification

High speed CAN transceiver TJA1041A

Bare die  All die are tested and are guaranteed to
comply with all data sheet limits up to the point of wafer
sawing for a period of ninety (90) days from the date of
Philips' delivery. If there are data sheet limits not
guaranteed, these will be separately indicated in the data
sheet. There are no post packing tests performed on
individual die or wafer. Philips Semiconductors has no
control of third party procedures in the sawing, handling,
packing or assembly of the die. Accordingly, Philips
Semiconductors assumes no liability for device
functionality or performance of the die or systems after
third party sawing, handling, packing or assembly of the
die. It is the responsibility of the customer to test and
qualify their application in which the die is used.

2004 Feb 20 23

Philips Semiconductors – a w orldwide compan y

Contact information

For additional information please visit http://www.semiconductors.philips.com. Fax: [phone]
For sales offices addresses send e-mail to: [e-mail].

© Koninklijke Philips Electronics N.V. 2004
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.

Printed in The Netherlands R16/02/pp24 Date of release: 2004 Feb 20 Document order number: 9397 750 12824

SCA76