Philips TJA1040 User Manual

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TJA1040

High speed CAN transceiver

Product specification
Supersedes data of 2003 Feb 19

2003 Oct 14

Philips Semiconductors Product specification

High speed CAN transceiver TJA1040

FEATURES

• Fully compatible with the ISO 11898 standard

• High speed (up to 1 MBaud)

• Very low-current standby mode with remote wake-up

capability via the bus

• Very low ElectroMagnetic Emission (EME)

• Differential receiver with high common-mode range for

ElectroMagnetic Immunity (EMI)

• Transceiver in unpowered state disengages from the
bus (zero load)

• Input levels compatible with 3.3 V and 5 V devices

• Voltage source for stabilizing the recessive bus level if

split termination is used (further improvement of EME)

• At least 110 nodes can be connected

• Transmit Data (TXD) dominant time-out function

• Bus pins protected against transients in automotive

environments

• Buspinsandpin SPLIT short-circuitproofto batteryand
ground

• Thermally protected.

GENERAL DESCRIPTION

The TJA1040 isthe interface between theController Area
Network (CAN) protocol controller and the physical bus.
It is primarily intended for high speed applications, up to
1 MBaud, in passenger cars. The device provides
differential transmit capability to the bus and differential
receive capability to the CAN controller.

The TJA1040 is the next step up from the TJA1050 high
speed CANtransceiver. Beingpin compatible andoffering
the same excellent EMC performance, the TJA1040 also
features:

• An ideal passive behaviour when supply voltage is off

• A very low-current standby mode with remote wake-up

capability via the bus.

This makes the TJA1040 an excellent choice in nodes
which can be in power-down or standby mode in partially
powered networks.

QUICK REFERENCE DATA

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

V

CC

I

CC

V

CANH

V

CANL

V

SPLIT

V

esd

supply voltage operating range 4.75 5.25 V
supply current standby mode 5 15 µA
DC voltage on pin CANH 0 < VCC< 5.25 V; no time limit −27 +40 V
DC voltage on pin CANL 0 < VCC< 5.25 V; no time limit −27 +40 V
DC voltage on pin SPLIT 0 < VCC< 5.25 V; no time limit −27 +40 V
electrostatic discharge voltage Human Body Model (HBM)

pins CANH, CANL and SPLIT −6+6kV
all other pins −4+4kV

t

PD(TXD-RXD)

T

vj

propagation delay TXD to RXD V
virtual junction temperature −40 +150 °C

= 0 V 40 255 ns

STB

ORDERING INFORMATION

TYPE

NUMBER

NAME DESCRIPTION VERSION

PACKAGE

TJA1040T SO8 plastic small outline package; 8 leads; body width 3.9 mm SOT96-1
TJA1040U − bare die; die dimensions 1840 × 1440 × 380 µm −

2003 Oct 14 2

Philips Semiconductors Product specification

High speed CAN transceiver TJA1040

BLOCK DIAGRAM

handbook, full pagewidth

TXD

STB

RXD

GND

1

V

CC

8

4

2

TIME-OUT &

SLOPE

WAKE-UP

MODE CONTROL

MUX

TJA1040

TEMPERATURE

PROTECTION

DRIVER

WAKE-UP

FILTER

Fig.1 Block diagram.

V

CC

3

MGU161

5

SPLIT

7

CANH

6

CANL

V SPLIT

PINNING

SYMBOL PIN DESCRIPTION

TXD 1 transmit data input
GND 2 ground supply
V

CC

3 supply voltage

RXD 4 receive data output; reads out data

from the bus lines
SPLIT 5 common-mode stabilization output
CANL 6 LOW-level CAN bus line
CANH 7 HIGH-level CAN bus line
STB 8 standby mode control input

2003 Oct 14 3

handbook, halfpage

TXD

GND

V

CC

RXD

1
2
3
4

TJA1040T

8
7
6
5

MGU160

Fig.2 Pin configuration.

STB
CANH
CANL
SPLIT

Philips Semiconductors Product specification

High speed CAN transceiver TJA1040

FUNCTIONAL DESCRIPTION
Operating modes

The TJA1040 provides two modes of operation which are
selectablevia pin STB.See Table 1for adescriptionof the
modes of operation.

Table 1 Operating modes

MODE

PIN

STB

LOW HIGH

PIN RXD

normal LOW bus dominant bus recessive
standby HIGH wake-uprequest

detected

no wake-up
request detected

NORMAL MODE
In thismode thetransceiver is ableto transmitand receive

data via the bus lines CANH andCANL. See Fig.1 for the
block diagram. The differential receiver converts the
analog data on the bus lines into digital data which is
output to pin RXD viathe multiplexer (MUX). The slope of
the output signals on the bus lines is fixed and optimized
in a way that lowest ElectroMagnetic Emission (EME) is
guaranteed.

STANDBY MODE
In this modethe transmitter and receiver are switched off,

and thelow-power differentialreceiver will monitorthe bus
lines. A HIGH level on pin STB activates this low-power
receiver and the wake-up filter, and after t

the state of

BUS

the CAN bus is reflected on pin RXD.
The supply current on VCC is reduced to a minimum in

such a way that ElectroMagnetic Immunity (EMI) is
guaranteed and a wake-up event on the bus lines will be
recognized.

In this mode the bus lines are terminated to ground to
reduce the supply current (ICC) to a minimum. A diode is
added inseries withthe high-side driverof RXDto prevent
areverse currentfrom RXDto VCCinthe unpoweredstate.
In normal mode this diode is bypassed. This diode is not
bypassed instandby modeto reducecurrent consumption.

Split circuit

Pin SPLIT providesa DC stabilizedvoltage of 0.5VCC.Itis
turnedon onlyinnormal mode.Instandby modepin SPLIT
is floating. The V

circuit can be used to stabilize the

SPLIT

recessivecommon-mode voltagebyconnecting pin SPLIT

tothe centretap ofthe splittermination (seeFig.4). Incase
of arecessive bus voltage<0.5VCCdue tothe presence of
an unsupplied transceiverin the network witha significant
leakage current from the bus lines to ground, the split
circuit will stabilize this recessive voltage to 0.5VCC. So a
start of transmission does not cause a step in the
common-mode signal which would lead to poor
ElectroMagnetic Emission (EME) behaviour.

Wake-up

In the standby mode the bus lines are monitored via a
low-power differential comparator. Once the low-power
differential comparator has detecteda dominant bus level
for more than t

, pin RXD will become LOW.

BUS

Over-temperature detection

The outputdrivers areprotected againstover-temperature
conditions. If the virtual junction temperature exceeds the
shutdownjunction temperatureT

,the outputdriverswill

j(sd)

be disableduntil the virtualjunction temperature becomes
lower than T

and TXD becomes recessive again.

j(sd)

By including the TXD condition, the occurrence of output
driver oscillation due to temperature drifts is avoided.

TXD dominant time-out function

A ‘TXD dominant time-out’ timer circuit prevents the bus
lines from being driven to a permanent dominant state
(blocking all network communication) if pin TXD is forced
permanently LOW by a hardware and/or software
application failure. The timer is triggered by a negative
edge on pin TXD.

If the duration of the LOW level on pin TXD exceeds the
internal timer value (t

), the transmitter is disabled,

dom

driving the bus lines into a recessive state. The timer is
reset by a positive edge on pin TXD. The TXD dominant
time-out timet

defines theminimum possible bitrate of

dom

40 kBaud.

Fail-safe features

Pin TXD providesa pull-uptowards VCCin orderto forcea
recessive level in case pin TXD is unsupplied.

Pin STB provides a pull-up towards VCC in order to force
the transceiver into standby mode in case pin STB is
unsupplied.

In the event that the VCC is lost, pins TXD, STB and RXD
will become floating to prevent reverse supplying
conditions via these pins.

2003 Oct 14 4

Philips Semiconductors Product specification

High speed CAN transceiver TJA1040

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 60134).

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

V

CC

V

TXD

V

RXD

V

STB

V

CANH

V

CANL

V

SPLIT

V

trt

V

esd

T

vj

T

stg

supply voltage no time limit −0.3 +6 V

operating range 4.75 5.25 V
DC voltage on pin TXD −0.3 VCC+ 0.3 V
DC voltage on pin RXD −0.3 VCC+ 0.3 V
DC voltage on pins STB −0.3 VCC+ 0.3 V
DC voltage on pin CANH 0 < VCC< 5.25 V; no time limit −27 +40 V
DC voltage on pin CANL 0 < VCC< 5.25 V; no time limit −27 +40 V
DC voltage on pin SPLIT 0 < VCC< 5.25 V; no time limit −27 +40 V
transient voltages on pins CANH,

according to ISO 7637; see Fig.5 −200 +200 V
CANL and SPLIT

electrostatic discharge voltage Human Body Model (HBM); note 1

pins CANH and CANL

−6+6kV

and SPLIT
all other pins −4+4kV

Machine Model (MM); note 2 −200 +200 V
virtual junction temperature note 3 −40 +150 °C
storage temperature −55 +150 °C

Notes

1. Equivalent to discharging a 100 pF capacitor via a 1.5 kΩ series resistor.

2. Equivalent to discharging a 200 pF capacitor via a 0.75 µH series inductor and a 10 Ω series resistor.

3. Junction temperature in accordance with IEC 60747-1. An alternative definition of Tvjis: Tvj=T
where R

th(vj-amb)

combinations of power dissipation (P) and ambient temperature (T

is a fixed value to be used for the calculating of Tvj. The rating for Tvj limits the allowable

).

amb

amb

+P×R

THERMAL CHARACTERISTICS

In accordance with IEC 60747-1.

SYMBOL PARAMETER CONDITIONS VALUE UNIT

R

th(vj-a)

thermal resistance from virtual junction

in free air 145 K/W

to ambient in SO8 package

R

th(vj-s)

thermal resistance from virtual junction

in free air 50 K/W

to substrate of bare die

QUALITY SPECIFICATION

Quality specification in accordance with

“AEC-Q100”

.

th(vj-amb)

,

2003 Oct 14 5

Philips Semiconductors Product specification

High speed CAN transceiver TJA1040

CHARACTERISTICS

VCC= 4.75 to 5.25 V, Tvj= −40 to +150 °C and RL=60Ω unless specified otherwise; all voltages are defined with
respect to ground; positive currents flow into the IC; note 1.

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Supply (pin V

I

CC

)

CC

supply current standby mode 5 10 15 µA

normal mode

recessive; V
dominant; V

Transmit data input (pin TXD)

V

IH

V

IL

I

IH

I

IL

C

i

HIGH-level input voltage 2 − VCC+ 0.3 V
LOW-level input voltage −0.3 − +0.8 V
HIGH-level input current V

TXD=VCC

LOW-level input current normal mode; V
input capacitance not tested − 510pF

Standby mode control input (pin STB)

V

IH

V

IL

I

IH

I

IL

HIGH-level input voltage 2 − VCC+ 0.3 V
LOW-level input voltage −0.3 − +0.8 V
HIGH-level input current V
LOW-level input current V

STB=VCC

=0V −1 −4 −10 µA

STB

Receive data output (pin RXD)

V

OH

I

OH

I

OL

HIGH-level output voltage standby mode;

I

= −100 µA

RXD

HIGH-level output current normal mode;

V

RXD=VCC

LOW-level output current V

= 0.4 V 2 6 12 mA

RXD

Common-mode stabilization output (pin SPLIT)

V

O

output voltage normal mode;

−500 µA<IO< +500 µA

I

 leakage current standby mode;

L

−22V<V

Bus lines (pins CANH and CANL)

V

O(dom)

dominant output voltage V

TXD

=0V
pin CANH 3 3.6 4.25 V
pin CANL 0.5 1.4 1.75 V

V

O(dom)(m)

V

O(dif)(bus)

matching of dominant output
voltage (VCC-V

CANH-VCANL

differential bus output voltage
(V

CANH

− V

CANL

)

)

V

= 0 V; dominant;

TXD

45 Ω <RL<65Ω
V

TXD=VCC

no load

TXD=VCC

TXD

TXD

− 0.4 V

< +35 V

SPLIT

; recessive;

2.5 5 10 mA

=0V305070mA

−50 +5µA

=0V −100 −200 −300 µA

− 0 −µA

VCC− 1.1 VCC− 0.7 VCC− 0.4 V

−0.1 −0.4 −1mA

0.3V

CC

0.5V

CC

0.7V

CC

V

− 05µA

−100 0 +150 mV

1.5 − 3.0 V

−50 − +50 mV

2003 Oct 14 6

Philips Semiconductors Product specification

High speed CAN transceiver TJA1040

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

V

O(reces)

I

O(sc)

I

O(reces)

V

dif(th)

V

hys(dif)

I

LI

R

i(cm)

R

i(cm)(m)

R

i(dif)

C

i(cm)

C

i(dif)

Timing characteristics; see Fig.8
t

d(TXD-BUSon)

t

d(TXD-BUSoff)

t

d(BUSon-RXD)

t

d(BUSoff-RXD)

t

PD(TXD-RXD)

t

dom(TXD)

t

BUS

t

d(stb-norm)

Thermal shutdown

T

j(sd)

Note

1. All parametersare guaranteedover thevirtualjunction temperaturerange bydesign, but only100% testedat 125 °C
ambient temperature for dies on wafer level, and in addition to this 100% tested at 25 °C ambient temperature for
cased products; unless specified otherwise. For bare dies, all parameters are only guaranteedwith the backside of
the die connected to ground.

recessive output voltage normal mode;V

TXD=VCC

;

2 0.5V

3V

CC

no load
standby mode; no load −0.1 0 +0.1 V

short-circuit output current V

recessive output current −27V<V
differential receiver threshold

voltage

=0V

TXD

pin CANH; V
pin CANL; V

−12V<V

−12V<V

=0V −40 −70 −95 mA

CANH

= 40 V 40 70 100 mA

CANL

< +32 V −2.5 − +2.5 mA

CAN

< +12 V;

CANL

< +12 V

CANH

normal mode(see Fig.6) 0.5 0.7 0.9 V
standby mode 0.4 0.7 1.15 V

differential receiver hysteresis
voltage

input leakage current VCC=0V;

common-mode input

normal mode;

−12V<V

−12V<V

CANL
CANH

< +12 V;

< +12 V

50 70 100 mV

−50 +5µA

V

CANH=VCANL

=5V

standby or normal mode 15 25 35 kΩ

resistance
common-mode input

V

CANH=VCANL

−3 0 +3 %

resistance matching
differential input resistance standby or normal mode 25 50 75 kΩ
common-mode input

V

TXD=VCC

; not tested −−20 pF

capacitance
differential input capacitance V

TXD=VCC

; not tested −−10 pF

delay TXD to bus active normal mode 25 70 110 ns
delay TXD to bus inactive 10 50 95 ns
delay bus active to RXD 15 65 115 ns
delay bus inactive to RXD 35 100 160 ns
propagation delay TXDto RXD V
TXD dominant time-out V
dominant time for wake-up via

=0V 40 − 255 ns

STB

= 0 V 300 600 1000 µs

TXD

standby mode 0.75 1.75 5 µs

bus
delay standby mode to normal

normal mode 5 7.5 10 µs

mode

shutdown junction temperature 155 165 180 °C

2003 Oct 14 7

Philips Semiconductors Product specification

High speed CAN transceiver TJA1040

APPLICATION AND TEST INFORMATION

handbook, full pagewidth

BAT

More application information isavailable in aseparateapplication note.

5 V

CANH

SPLIT

CANL

Fig.3 Typical application for 5 V microcontroller.

7

TJA1040

5

6

V

CC

STB

3

8 Port x

RXD

4

TXD

1

2

V

CC

MICROCONTROLLER

RXD
TXD

MGU164

V

handbook, full pagewidth

CC

TJA1040

V

= 0.5V

SPLIT

in normal mode;

otherwise floating

CC

R

R

GND

Fig.4 Stabilization circuitry and application.

2003 Oct 14 8

CANH

60 Ω

SPLIT

60 Ω

CANL

MGU162

Philips Semiconductors Product specification

High speed CAN transceiver TJA1040

+

handbook, full pagewidth

5 V

500 kHz

TXD

RXD

15 pF

100 nF47 µF

1

TJA1040

4

V

CC

3

82

GND STB

7

6

5

CANH

CANL

SPLIT

MGW336

1 nF

1 nF

TRANSIENT

GENERATOR

The waveforms of the applied transients will be in accordance with ISO 7637 part 1, test pulses 1, 2, 3a, 3b, 5, 6 and 7.

Fig.5 Test circuit for automotive transients.

handbook, full pagewidth

V

RXD

hysteresis

0.5 0.9

V

i(dif)(bus)

MGS378

HIGH

LOW

(V)

Fig.6 Hysteresis of the receiver.

2003 Oct 14 9

Philips Semiconductors Product specification

High speed CAN transceiver TJA1040

+

handbook, full pagewidth

5 V

TXD

SPLIT

RXD

15 pF

100 nF47 µF

1

5

TJA1040

4

V

CC

3

82

GND STB

7

6

CANH

CANL

MGW335

R

L

60 Ω

C

L

100 pF

handbook, full pagewidth

TXD

CANH

CANL

V

i(dif)(bus)

RXD

t

d(TXD-BUSon)

t

d(BUSon-RXD)

Fig.7 Test circuit for timing characteristics.

0.9 V

(1)

0.5 V

0.7V

t

d(TXD-BUSoff)

)

t

PD(TXD-RXD

0.3V

)

CC

t

PD(TXD-RXD

HIGH
LOW

dominant
(BUS on)

recessive
(BUS off)

HIGH

CC

LOW

t

d(BUSoff-RXD)

MGS377

(1) V

i(dif)(bus)=VCANH

− V

CANL

.

Fig.8 Timing diagram.

2003 Oct 14 10

Philips Semiconductors Product specification

High speed CAN transceiver TJA1040

BONDING PAD LOCATIONS

COORDINATES

(1)

SYMBOL PAD

xy

TXD 1 119.5 114.5
GND 2 648.5 85
V

CC

3 1214.25 114.5
RXD 4 1635.25 114.5
SPLIT 5 1516.5 1275
CANL 6 990.5 1273.75
CANH 7 530.25 1273.75
STB 8 113.75 1246

Note

1. All x/y coordinatesrepresent the positionof the centre
of each pad (in µm) with respect to the left hand
bottom corner of the top aluminium layer (see Fig.9).

8

handbook, halfpage

x

0

0

y

The backside of the bare die must be connected to ground.

76 5

TJA1040U

1

234

Fig.9 Bonding pad locations.

test pad 1

test pad 2

MBL584

2003 Oct 14 11

Philips Semiconductors Product specification

High speed CAN transceiver TJA1040

PACKAGE OUTLINE

SO8: plastic small outline package; 8 leads; body width 3.9 mm

SOT96-1

y

Z

8

pin 1 index

1

D

c

5

A

2

A

1

4

e

w M

b

p

E

H

E

detail X

A

X

v M

A

Q

(A )

L

p

L

A

3

θ

0 2.5 5 mm

scale

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

mm

OUTLINE
VERSION

SOT96-1

A

max.

1.75

0.069

A1A2A

0.25

1.45

0.10

1.25

0.010

0.057

0.004

0.049

IEC JEDEC JEITA

076E03 MS-012

0.25

0.01

b

3

p

0.49

0.25

0.36

0.19

0.019

0.0100

0.014

0.0075

UNIT

inches

Notes

1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.

2. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.

(1)E(2)

cD

5.0

4.8

0.20

0.19

REFERENCES

eHELLpQZywv θ

4.0

1.27

3.8

0.16

0.05

0.15

2003 Oct 14 12

6.2

5.8

0.244

0.228

1.05

1.0

0.4

0.039

0.016

0.7

0.6

0.028

0.024

0.25 0.10.25

0.010.010.041 0.004

EUROPEAN

PROJECTION

(1)

0.7

0.3

0.028

0.012

ISSUE DATE

99-12-27
03-02-18

o

8

o

0

Philips Semiconductors Product specification

High speed CAN transceiver TJA1040

SOLDERING
Introduction to soldering surface mount packages

Thistext givesa verybriefinsight toa complextechnology.
A more in-depth account of soldering ICs can be found in
our

“Data Handbook IC26; Integrated Circuit Packages”

(document order number 9398 652 90011).
There is no soldering method that is ideal for all surface

mount IC packages. Wave soldering can still be used for
certainsurface mountICs, butitis notsuitable forfinepitch
SMDs. In these situations reflow soldering is
recommended.

Reflow soldering

Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
tothe printed-circuitboard byscreen printing,stencilling or
pressure-syringe dispensing before package placement.
Driven by legislation and environmental forces the
worldwide use of lead-free solder pastes is increasing.

Several methods exist for reflowing; for example,
convection or convection/infrared heating in a conveyor
type oven. Throughput times (preheating, soldering and
cooling) vary between 100 and 200 seconds depending
on heating method.

Typical reflow peak temperatures range from
215 to 270 °C depending on solder paste material. The
top-surface temperature of the packages should
preferably be kept:

• below 220 °C (SnPbprocess) or below 245 °C (Pb-free

process)
– for all BGA and SSOP-T packages
– for packages with a thickness ≥ 2.5 mm
– for packages with a thickness < 2.5 mm and a

volume ≥ 350 mm3 so called thick/large packages.

• below 235 °C (SnPbprocess) or below 260 °C (Pb-free

process) for packages witha thickness < 2.5 mm and a
volume < 350 mm3 so called small/thin packages.

Moisture sensitivity precautions, as indicated on packing,
must be respected at all times.

Wave soldering

To overcome these problems the double-wave soldering
method was specifically developed.

If wave soldering isusedthe following conditions must be
observed for optimal results:

• Use a double-wave soldering method comprising a
turbulent wavewith high upward pressurefollowed by a
smooth laminar wave.

• For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27 mm, the footprint

longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;

– smaller than 1.27 mm, the footprint longitudinal axis

must be parallel to the transport direction of the
printed-circuit board.

The footprint must incorporate solder thieves at the
downstream end.

• Forpackages withleads onfoursides, thefootprint must
be placedat a 45° angle tothe transport direction ofthe
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.

During placementand beforesoldering, the packagemust
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.

Typical dwell time of the leads in the wave ranges from
3 to 4 seconds at 250 °C or 265 °C, depending on solder
material applied, SnPb or Pb-free respectively.

A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.

Manual soldering

Fix the component by first soldering two
diagonally-opposite end leads.Use a low voltage(24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300 °C.

When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320 °C.

Conventional single wave soldering is not recommended
forsurface mountdevices (SMDs)orprinted-circuit boards
with a high component density, as solder bridging and
non-wetting can present major problems.

2003 Oct 14 13

Philips Semiconductors Product specification

High speed CAN transceiver TJA1040

Suitability of surface mount IC packages for wave and reflow soldering methods

PACKAGE

BGA, LBGA, LFBGA, SQFP, SSOP-T

(1)

(3)

, TFBGA, VFBGA not suitable suitable

DHVQFN, HBCC, HBGA, HLQFP, HSQFP, HSOP, HTQFP,

not suitable

SOLDERING METHOD

WAVE REFLOW

(4)

suitable

(2)

HTSSOP, HVQFN, HVSON, SMS

(5)

PLCC
LQFP, QFP, TQFP not recommended
SSOP, TSSOP, VSO, VSSOP not recommended
PMFP

, SO, SOJ suitable suitable

(5)(6)

suitable

(7)

suitable

(8)

not suitable not suitable

Notes

1. Formore detailedinformation onthe BGApackages refertothe

“(LF)BGAApplication Note

”(AN01026); ordera copy

from your Philips Semiconductors sales office.

2. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporizationof the moisture in them (the so called popcorn effect). For details,refer to the
Drypack information in the

“Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”

.

3. These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no account
be processedthrough more thanone soldering cycleor subjected toinfrared reflow solderingwith peak temperature
exceeding 217 °C ± 10 °C measured in the atmosphere of the reflow oven. The package body peak temperature
must be kept as low as possible.

4. These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder
cannot penetrate between the printed-circuit boardandthe heatsink. On versions with the heatsink on the top side,
the solder might be deposited on the heatsink surface.

5. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.

6. Wave solderingis suitable forLQFP, TQFP andQFP packages witha pitch (e) largerthan 0.8 mm; itis definitely not
suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.

7. Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger than

0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.

8. Hot bar or manual soldering is suitable for PMFP packages.

REVISION HISTORY

REV DATE CPCN DESCRIPTION

6 20031014 200307014 Product specification (9397 750 11837)

Modification:

• Change ‘V

= 0.5 V’ in standby mode into ‘V

th(dif)

• Add Chapter REVISION HISTORY

5 20030219 − Product specification (9397 750 10887)

2003 Oct 14 14

dif(th)

= 0.4 V’

Philips Semiconductors Product specification

High speed CAN transceiver TJA1040

DATA SHEET STATUS

LEVEL

DATA SHEET

STATUS

(1)

PRODUCT

STATUS

(2)(3)

DEFINITION

I Objective data Development This data sheet contains data from the objective specification for product

development. Philips Semiconductors reserves the right to change the
specification in any manner without notice.

II Preliminary data Qualification This data sheet contains data from the preliminary specification.

Supplementary data will be published at a later date. Philips
Semiconductors reserves the right to change the specification without
notice, in order to improve the design and supply the best possible
product.

III Product data Production This data sheet contains data from the product specification. Philips

Semiconductors reserves the right to make changes at any time in order
to improve the design, manufacturing and supply. Relevant changes will
be communicated via a Customer Product/Process Change Notification
(CPCN).

Notes

1. Please consult the most recently issued data sheet before initiating or completing a design.

2. The product status of the device(s) described in this data sheet may have changed since this data sheet was
published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.

3. For datasheets describingmultipletype numbers,the highest-level productstatus determines thedata sheetstatus.

DEFINITIONS

DISCLAIMERS

Short-form specification  The data in a short-form

specification is extracted from a full data sheet with the
same type number and title. For detailed information see
the relevant data sheet or data handbook.

Limiting valuesdefinition  Limitingvalues givenare in
accordance with the Absolute Maximum Rating System
(IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device.
These are stress ratings only and operation of the device
atthese orat anyother conditionsabovethose givenin the
Characteristics sectionsof the specification isnot implied.
Exposure to limiting values for extended periods may
affect device reliability.

Application information  Applications that are
described herein for any of these products are for
illustrative purposes only. Philips Semiconductors make
norepresentation orwarrantythat suchapplications willbe
suitable for the specified use without further testing or
modification.

Life support applications  These products are not
designed for use in life support appliances, devices, or
systems where malfunction of these products can
reasonably beexpected toresult inpersonal injury.Philips
Semiconductorscustomers usingorselling theseproducts
for use in such applications do so at their own risk and
agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.

Right to make changes  Philips Semiconductors
reserves the right to make changes in the products ­including circuits, standard cells, and/or software ­described or contained herein in order to improve design
and/or performance.When theproduct is infull production
(status ‘Production’), relevant changes will be
communicated via a Customer Product/Process Change
Notification (CPCN). Philips Semiconductorsassumes no
responsibility or liability for the use of any of these
products, conveys no licence or title under any patent,
copyright, or mask work right to these products, and
makes no representations or warranties that these
products are free from patent, copyright, or mask work
right infringement, unless otherwise specified.

2003 Oct 14 15

Philips Semiconductors Product specification

High speed CAN transceiver TJA1040

Bare die  All die are tested and are guaranteed to
comply with all data sheet limits up to the point of wafer
sawing for a period of ninety (90) days from the date of
Philips' delivery. If there are data sheet limits not
guaranteed, these will be separately indicated in the data
sheet. There are no post packing tests performed on
individual die or wafer. Philips Semiconductors has no
control of third party procedures in the sawing, handling,
packing or assembly of the die. Accordingly, Philips
Semiconductors assumes no liability for device
functionality or performance of the die or systems after
third party sawing, handling, packing or assembly of the
die. It is the responsibility of the customer to test and
qualify their application in which the die is used.

2003 Oct 14 16

Philips Semiconductors – a w orldwide compan y

Contact information

For additional information please visit http://www.semiconductors.philips.com. Fax: [phone]
For sales offices addresses send e-mail to: [e-mail].

© Koninklijke Philips Electronics N.V. 2003
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information presented in this document doesnot formpart of any quotation or contract, isbelieved tobe accurate and reliable and may bechanged
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.

Printed in The Netherlands R16/06/pp17 Date of release: 2003 Oct 14 Document order number: 9397750 11837

SCA75