Philips Thermal Design User Manual
Thermal Design Guide V2.3!
Fortimo LED SLM platform!
• Thermal specifications"
• How to measure T
case
at its critical temperature point Tc?"
• Thermal interface materials (TIM)"
• Designing a passive cooled luminaire"
• Designing an active cooled luminaire"
• Complementary partners for thermal solutions "
(passive/ active)!
Contents!
Thermal specifications Fortimo SLM platform
Fortimo SLM Platform!
Electrical power (typical)"
Dissipated thermal power (typical)!
Max.Tcase of module!
Max. ambient temperature!
Thermal impedance requirement Tcase to Tambient!
800 Lm!
11 W!
9 W!
!
!
<3.33 °C/W!
!
1100 Lm!
17 W!
14 W!
!
!
<2.14 °C/W!
!
!
1500 Lm!
20 W!
17 W!
"
"
<1.76 °C/W!
!
!
2000 Lm!
32 W!
27 W"
65 °C!
35 °C!
<1.11 °C/W!
!
3000 Lm!
43 W!
36 W!
!
!
<0.83 °C/W!
!
!
Minimum performance requirement for total cooling solution including TIM, better performance is always preferred and recommended!
Lexel TW!
22 W!
18 W!
!
!
<1.67 °C/W!
!
Lexel RGB!
25 W!
20 W!
!
!
<1.50 °C/W!
!
Fortimo SLM thermal specifications :"
• Tcase maximum +30°C above ambient"
• Max ambient 35°C"
• Maximum 65°C Tcase at 35°C ambient"
!
Thermal specifications Fortimo SLM platform!
Spot module ø 50mm •
Aluminum thermal interface ø 47mm •
Tcase 65°C •
Cooling solution i.e. heat sink •
Thermal Interface Material (TIM) •
SLM 800lm 9W => Rth case to ambient ≤ 3.33 (°C/W)
SLM 1100lm 14W => Rth case to ambient ≤ 2.14 (°C/W)
SLM 1500lm 17W => Rth case to ambient ≤ 1.76 (°C/W)
SLM 2000lm 27W => Rth case to ambient ≤ 1.11 (°C/W)
SLM 3000lm 36W => Rth case to ambient ≤ 0.83 (°C/W)
SLM LX TW 18W => Rth case to ambient ≤ 1.67 (°C/W)
SLM LX RGB 20W => Rth case to ambient ≤ 1.50 (°C/W)
Note: this includes the TIM
Simplified model! Thermal network!
35oC!
65oC!
Rth heat sink!
Rth TIM!
Rth case to
ambient!
• A maximum surface temperature of 65°C to be guaranteed on the interface between "
the ‘Module’ and the ‘TIM + cooling solution’ at maximum ambient of 35°C"
"
• All types of Fortimo SLM drivers will dim when a temperature over 65°C is sensed by the SLM module!
Thermal specifications Fortimo SLM platform!
Max. Tcase 65°C
Specification on surface
Aluminum thermal
interface ø47 mm
3 screw holes for attachment of module
onto heatsink (M3, bolt circle ø42mm)
• The Tcase should be measured at its critical temperature point, centre point at the bottom of the module"
"
• This can be done by making a thin v-groove in the heat sink or a small drill hole in the heat sink to reach "
bottom of the module at its critical temperature point, make sure to measure the bottom of the module and not the TIM!
How to measure critical temperature point Tc?!
Critical temperature point Tc Thin v-groove in the heatsink
to embed a thermocouple
Tip of thermocouple sticking
out on top of the thermal pad
(TIM)
• Function is to reduce thermal impedance between two solid surfaced"
"
• Replaces air (thermal insulator c=0.024W/mK) by filling the gaps with "
better conductive thermal interface material (order c=1W/mK)!
Thermal Interface Materials (TIM)!
• In general:!
- Thermal pastes performs better than thermal pads!
- The higher the thermal conductivity the better!
- The thinner the TIM the better!
• In practice:!
- Actual thermal impedance [°C/W] of TIM in "
application is more important than conductivity "
of material!
- Each thermal interface can have a significant "
contribution to the total thermal impedance "
of module to ambient!
- Limiting the # of thermal interfaces from "
module to ambient is strongly recommended)!
• The Bergquist Company"
www.bergquistcompany.com!
Contact information complementary partners"
Thermal interface materials (TIM)
North American Headquarters"
18930 W. 78th Street "
Chanhassen, MN 55317 USA !!
Contact person for Europe"
Nico Bruijnis!
Phone: +31 35 538 0684!
Cell: +31 6 5316 0688!
E-mail: n.bruijnis@bergquist-europe.com
!!
• Chomerics"
www.chomerics.com!
Chomerics North America"
Parker Hannifin Corp."
77 Dragon Court"
Woburn, MA 01801USA !!
Contact person for Europe"
Luc Coupet!
Phone: +33 134323900!
Cell: +33 670765480!
E-mail: luc.coupet@parker.com !!
• Laird Technologies"
www.lairdtech.com!
Corporate Headquarters"
Laird Technologies (Corporate)
16401 Swingley Ridge Road"
Suite 700!
Chesterfield, MO 63017!!
Contact person for Europe"
Philip Blazdell!
Phone: +49 803124600!
Cell: +44 7595710316!
E-mail: philip.blazdell@lairdtech.com !!
Design based on Fortimo SLM 1100lm:"
• Performance requirement cooling Rth< 2.14 °C/W!
Designing a passive cooled luminaire!
• Assuming a conservative heat transfer coefficient (htc) = 5 W/m2K and!
the contribution of the thermal interface material R
thTIM
= 0.1 °C/W!
a first estimate of the required cooling surface can be calculated!
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