Philips TFA9843AJ User Manual

TFA9843AJ

20 W stereo power ampliﬁer with volume control

Rev. 01 — 28 April 2006 Preliminary data sheet

1. General description

The TFA9843AJ contains two identical audio power ampliﬁers. The TFA9843AJ can be used as two Single-Ended (SE) channels with a volume control. The maximum gain is 26 dB.

The TFA9843AJcomes in a 9-pin DIL-bent-SIL (DBS9P) power package.The TFA9843AJ is pin compatible with the TFA9842AJ, TFA9843(B)J, TFA9842(B)J and TFA9841J. The difference between the TFA9843AJ and the TFA9843(B)J, TFA9842(B)J, TFA9841Jis the functionality of pin 7. The TFA9843AJ has a volume control on pin 7 (VC). The TFA9843(B)J, TFA9842(B)J and TFA9841J have a mode select on pin 7 (MODE).

The TFA9843AJ contains a unique protection circuit that is solely based on multiple temperature measurements inside the chip. This gives maximum output power for all supply voltages and load conditions with no unnecessary audio holes. Almost any supply voltage and load impedance combination can be made as long as thermal boundary conditions (number of channels used, external heatsink and ambient temperature) allow it.

2. Features

n 2 channel SE: 1 W to 20 W operation possibility n Soft clipping n Input clamps n Volume control n Standby and Mute mode n No on or off switching plops n Low standby current n High supply voltage ripple rejection n Outputs short-circuit protected to ground, supply and across the load n Thermally protected n Pin compatible with the TFA9842AJ, TFA9843(B)J, TFA9842(B)J, TFA9841J

3. Applications

n CRT TV and LCD TV n Monitors n PC speakers n Boom box n Mini and micro audio receivers

Philips Semiconductors

4. Quick reference data

Table 1. Quick reference data

VCC =18V; T unless otherwise speciﬁed.

Symbol Parameter Conditions Min Typ Max Unit

CC(stb)

THD total harmonic

v(max)

∆G

SVRR supply voltage ripple

amb

supply voltage operating quiescent current VCC=18V; RL= ∞ - 60 100 mA standby supply current VCC=18V;

output power THD = 10 %; RL=4Ω;

distortion maximum voltage gain V voltage gain range 1.5 V < V

rejection

=25°C; RL=4Ω; V

TFA9843AJ

20 W stereo power ampliﬁer with volume control

I(VC)=VCC

I(VC)

THD = 10 %; R V

I(VC)

f=1kHz

; Vi= 0 V; measured in test circuit of Figure 11;

[1]

9 1828V

- - 150 µA

< 0.8 V

7 8.5 - W

=18V

=4Ω;

-14-W

=22V

= 1 W - 0.1 0.5 %

> 5.0V 25 26 27 dB

< 5.0 V - 80 - dB

I(VC)

[2]

-60-dB

[1] A minimum load of 3 Ω is allowed at supply voltages > 22 V. [2] Supply voltage ripple rejection is measured at the output, with a source impedance ZS=0Ω at the input

and with a frequency range from 20 Hz to 22 kHz (unweighted). The ripple voltage is a sine wave with a frequency f

5. Ordering information

Table 2. Ordering information

Type number

TFA9843AJ DBS9P plastic DIL-bent-SIL power package; 9 leads (lead length

and an amplitude of 300 mV (RMS), which is applied to the positive supply rail.

ripple

Package Name Description Version

SOT523 -1

12/11 mm); exposed die pad

Preliminary data sheet Rev. 01 — 28 April 2006 2 of 19

Philips Semiconductors

6. Block diagram

IN1

TFA9843AJ

20 W stereo power ampliﬁer with volume control

60 kΩ

OUT1

Fig 1. Block diagram

7. Pinning information

7.1 Pinning

IN2

CIV

60 kΩ

REF

VOLUME

CONTROL

SHORT-CIRCUIT

AND

TEMPERATURE

PROTECTION

0.5V

TFA9843AJ

GND

001aae428

OUT2

SVR

IN2

OUT2

CIV

IN1

GND

SVR

OUT1

TFA9843AJ

6 7 8 9

001aae429

Fig 2. Pin conﬁguration

Preliminary data sheet Rev. 01 — 28 April 2006 3 of 19

Philips Semiconductors

7.2 Pin description

Table 3. Pin description

Symbol Pin Description

IN2 1 input 2 OUT2 2 loudspeaker terminal 2 CIV 3 common input voltage decoupling IN1 4 input 1 GND 5 ground SVR 6 half supply voltage decoupling (ripple rejection) VC 7 volume control input (standby, mute and volume control) OUT1 8 loudspeaker terminal 1 V

8. Functional description

TFA9843AJ

20 W stereo power ampliﬁer with volume control

9 supply voltage

8.1 Input conﬁguration

The input cut-off frequency is as follows:

i3dB–()

---------------------------- -

2π R

×()

iCi

Single-ended application: Ri=60kΩ and Ci= 220 nF:

i3dB–()

---------------------------------------------------------------- -

2π 60 10

× 220× 109–×()

12 Hz==

As shown in Equation 2, large capacitor values for the inputs are not necessary; therefore switch-on delay during charging of the input capacitors can be minimized. This results in a good low frequency response and good switch-on behavior.

The TFA9843AJ has clamps on the inputs. In Standby mode the voltage on the input pins is clamped for voltages lower than −0.1 V. When the TFA9843AJ is in Mute, Volume control or Operating mode (maximum gain) the input clamp voltage is 1 V (RMS).

8.2 Power ampliﬁer

The power ampliﬁer is a single-ended ampliﬁer with an all NPN output stage, capable of delivering a peak output current of 4 A.

(1)

(2)

8.2.1 Output power measurement

The output power as a function of the supply voltage is measured on the output pins at THD=10%;seeFigure 7. The maximum output power is limited by the supply voltage of 26 V and the maximum availableoutput current is 4 A repetitive peak current. A minimum load of 3 Ω is required for supply voltages > 22 V; see Figure 4. The output power is measured with one channel driven.

Preliminary data sheet Rev. 01 — 28 April 2006 4 of 19

Philips Semiconductors

8.2.2 Headroom

Typical CD music requires at least 12 dB (factor 15.85) dynamic headroom, compared to the average power output, for transferring the loudest parts without distortion. At VCC= 18 V and Po= 6.5 W (SE with RL=4Ω) at THD < 0.5 % (see Figure 5), the Average Listening Level (ALL) music power without any distortion yields:

TFA9843AJ

20 W stereo power ampliﬁer with volume control

oALLSE,()

6.5

-------------

15.85

410 mW==

The power dissipation can be derived from Figure 8 (SE) for 0 dB respectively 12 dB headroom; see Table 4.

For the average listening level a power dissipation of 4.2 W can be used for a heatsink calculation.

Table 4. Power rating as function of headroom

Headroom Power output (THD < 0.5 %)

(SE)

0dB P 12 dB P

= 6.5 W 8.2 W

= 410 mW 4.2 W

o(ALL)

Power dissipation (P); both channels driven

8.3 Mode selection

The TFA9843AJ has four functional modes, which can be selected by applying the proper DC voltage to pin VC; see Table 5.

Table 5. Mode selection

I(VC)

0 V to 0.8 V Standby

1.2 V to 1.5 V Mute in this mode the ampliﬁer is DC-biased but not

1.5 V to 5.0 V Volume control in this mode the volume of the ampliﬁer can be

5.0 V to V

Status Deﬁnition

in this mode the current consumption is very low and the outputs are ﬂoating; the device is in Standby mode when V

I(VC)

< 0.8 V

operational (no audio output); this allows the input coupling capacitors to be charged to avoid plop noise; the device is in Mute mode when

1.2V<V

I(VC)

< 1.5 V

controlled; the gain can be adjusted between the range of 1.5V<V

On (maximum gain) in this mode the ampliﬁer has its maximum gain; the

Operating mode is activated at V

I(VC)

< 5.0 V

I(VC)

> 5.0 V

(3)

8.4 Supply voltage ripple rejection

The supply voltage ripple rejection (SVRR) is measured with an electrolytic capacitor of 150 µF connected to pin SVR with a bandwidth of 20 Hz to 22 kHz. The SVRR as a function of the frequency is illustrated in Figure 10. A larger capacitor value on pin SVR improves the ripple rejection behavior at the lower frequencies.

Preliminary data sheet Rev. 01 — 28 April 2006 5 of 19

Philips Semiconductors

8.5 Built-in protection circuits

The TFA9843AJ contains two types of temperature sensors; one measures the local temperatures of the power stages and one measures the global chip temperature. At a local temperature of the power stage of approximately 185 °C or a global temperature of approximately 150 °C this detection circuit switches off the power stages for 2 ms. When the outputs are switched off the voltage is measured on the outputs. In the event of a short-circuit to ground or to VCC the device will remain in Protection mode. In all other cases the power stages switch-on automatically and the detection will take place again; however a too high temperature will switch-off the power stages immediately. This can result in repetitive switching during too high junction temperature. This protects the TFA9843AJ against short-circuits to ground, to the supply voltage, across the load and too high chip temperatures.

The protection will only be activated when necessary, so even during a short-circuit condition, a certain amount of (pulsed) current will still ﬂow through the short-circuit (as much as the power stage can handle without exceeding the critical temperature level).

9. Limiting values

TFA9843AJ

20 W stereo power ampliﬁer with volume control

Table 6. Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol Parameter Conditions Min Max Unit

ORM

stg

amb

tot

CC(scp)

supply voltage operating −0.3 +28 V input voltage −0.3 VCC+ 0.3 V repetitive peak output current - 4 A storage temperature non-operating −55 +150 °C ambient temperature operating −40 +85 °C total power dissipation - 35 W short-circuit protection supply

voltage

10. Thermal characteristics

Table 7. Thermal characteristics

Symbol Parameter Conditions Value Unit

th(j-a)

th(j-c)

thermal resistance from junction to ambient

thermal resistance from junction to case

-26 V

in free air 40 K/W

both channels driven

2.0 K/W

Preliminary data sheet Rev. 01 — 28 April 2006 6 of 19

Philips Semiconductors

11. Static characteristics

Table 8. Static characteristics

VCC =18V; T unless otherwise speciﬁed.

Symbol Parameter Conditions Min Typ Max Unit

CC(stb)

I(VC)

[1] A minimum load of 3 Ω is allowed at supply voltages > 22 V. [2] The DC output voltage with respect to ground is approximately 0.5VCC.

amb

supply voltage operating quiescent current RL= ∞ - 60 100 mA standby supply current VCC = 18 V;

output voltage input voltage on pin VC On mode (maximum

input current on pin VC 0V < V

=25°C; RL=4Ω; V

TFA9843AJ

20 W stereo power ampliﬁer with volume control

I(VC)=VCC

I(VC)

gain) Volume control mode 1.5 - 5.0 V Mute mode 1.2 - 1.5 V Standby mode 0 - 0.8 V

; Vi= 0 V; measured in test circuit of Figure 11;

[1]

9 1828V

- - 150 µA

< 0.8 V

[2]

-9-V

5.0 - V

I(VC)<VCC

--20µA

12. Dynamic characteristics

Table 9. Dynamic characteristics SE

VCC =18V; T unless otherwise speciﬁed.

Symbol Parameter Conditions Min Typ Max Unit

THD total harmonic

v(max)

∆G

n(o)

SVRR supply voltage ripple

o(mute)

|∆G

| maximum voltage gain

v(max)

=25°C; RL=4Ω; f = 1 kHz; V

amb

output power THD = 10 %; RL=4Ω 7 8.5 - W

distortion maximum voltage gain V voltage gain range 1.5 V < V input voltage gain = 0 dB;

input impedance 40 60 - kΩ noise output voltage

rejection

mute output voltage channel separation ZS=0Ω 50 60 - dB

difference

I(VC)=VCC

THD = 0.5 %; R

=22V;

THD = 10 %; R

= 1 W - 0.1 0.5 %

> 5.0 V 25 26 27 dB

I(VC)

; measured in test circuit of Figure 11;

=4Ω - 6.5 - W

-14-W

=4Ω

< 5.0 V - 80 - dB

1.0 - V

THD < 1 %

[1]

- 150 - µV

ripple

= 1 kHz = 100 Hz to

[2]

-60-dB

[2]

-60-dB

20 kHz

[3]

- - 150 µV

--1dB

Preliminary data sheet Rev. 01 — 28 April 2006 7 of 19

Philips Semiconductors

[1] The noise output voltage is measured at the output in a frequency range from 20 Hz to 22 kHz

(unweighted), with a source impedance ZS=0Ω at the input.

[2] Supply voltage ripple rejection is measured at the output, with a source impedance ZS=0Ω at the input

and with a frequency range from 20 Hz to 22 kHz (unweighted). The ripple voltage is a sine wave with a frequency f

[3] Output voltage inMutemode(V

to 22 kHz, including noise.

TFA9843AJ

20 W stereo power ampliﬁer with volume control

and an amplitude of 300 mV (RMS), which is applied to the positive supply rail.

ripple

= 1.35 V) and an input voltage of 1 V (RMS) in a bandwidth from 20 Hz

I(VC)

001aae340

(V)

(dB)

−50

−100

−150

0 6.04.02.0

VCC = 18 V THD = 10 %

Fig 3. Voltage gain as a function of volume control

voltage

THD + N

(%)

mce488

3 Ω2 Ω

4 Ω

8 Ω

mce485

(V)

(W)

RL = 1 Ω

12 28

16 20

Fig 4. Output power (one channel) as a function of

supply voltage for various loads

THD+N

(%)

001aaa446

−1

−2

−1

110

(W)

−2

f (Hz)

VCC = 18 V; f = 1 kHz; RL = 4 Ω VCC = 18 V; Po = 1 W; RL = 4 Ω

Fig 5. Total harmonic distortion-plus-noise as a

function of output power

Fig 6. Total harmonic distortion-plus-noise as a

function of frequency

Preliminary data sheet Rev. 01 — 28 April 2006 8 of 19

Philips Semiconductors

TFA9843AJ

20 W stereo power ampliﬁer with volume control

mce491

(V)

tot

(W)

020

(W)

828

16 20 24

81216

mce507

(W)

THD = 10 %; RL = 4 Ω; f = 1 kHz VCC = 18 V; RL = 4 Ω

Fig 7. Output power as a function of supply voltage Fig 8. Total powerdissipationasafunctionofchannel

output power per channel (worst case, both channels driven)

mce497

(dB)

−20

mce495

SVRR

(dB)

−20

−40

−60

−80

−100

f (Hz)

VCC = 18 V; RL = 4 Ω VCC = 18 V; ZS = 0 Ω; V

−60

−80

ripple

= 300 mV (RMS); a

f (Hz)

bandpass ﬁlter of 20 Hz to 22 kHz has been applied; inputs short-circuited.

Fig 9. Channel separation as a function of frequency

(no bandpass ﬁlter applied)

Fig 10. Supply voltage ripple rejection as a function of

frequency

Preliminary data sheet Rev. 01 — 28 April 2006 9 of 19

Philips Semiconductors

13. Application information

13.1 Application diagrams

13.1.1 Single-ended application

220 nF

IN1

TFA9843AJ

20 W stereo power ampliﬁer with volume control

60 kΩ

100 nF

OUT1

1000 µF

−

1000 µF

4 Ω

220 nF

MICRO-

CONTROLLER

22 µF 10 µF

IN2

CIV

60 kΩ

REF

VOLUME

CONTROL

TFA9843AJ

GND

SHORT-CIRCUIT

AND

TEMPERATURE

PROTECTION

0.5V

OUT2

SVR

001aae430

1000 µF

150 µF

−

4 Ω

−

Fig 11. SE application diagram

Remark: By switching inductive loads, the output voltage can rise beyond the maximum

supply voltage of 28 V. At high supply voltage it is recommended to use (Schottky) diodes between the supply voltage and ground.

Preliminary data sheet Rev. 01 — 28 April 2006 10 of 19

Philips Semiconductors

13.1.2 Volume control drive options

Fig 12. Volume control drive circuit with 3.3 V PWM

GND

PWM

3.3 V

R1 10 kΩ

5.6 V

1 kΩ

TFA9843AJ

20 W stereo power ampliﬁer with volume control

5 V

R2 1 kΩ

R3 1 kΩ

1 kΩ

C1 10 µF

001aae337

PWM

5 V

1 kΩ

C1 10 µF

Fig 13. Volume control drive circuit with 5 V PWM

R1 10 kΩ

D1 10 V

16 kΩ

R6 16 kΩ

Fig 14. Volume control drive circuit with potentiometer

001aae338

C1 10 µF

001aae339

Preliminary data sheet Rev. 01 — 28 April 2006 11 of 19

Philips Semiconductors

13.2 Printed-circuit board

13.2.1 Layout and grounding

To obtain a high-level system performance, certain grounding techniques are essential. The input reference grounds have to be tied with their respective source grounds and must have separate tracks from the power ground tracks; this will prevent the large output signal currents from interfering with the small AC input signals. The small-signal ground tracks should be physically located as far as possible from the power ground tracks. Supply and output tracks should be as wide as possible for delivering maximum output power.

TFA9843AJ

20 W stereo power ampliﬁer with volume control

BTL1/2

1000 µF

−SE2+

CIV

22 µF

CIV

Fig 15. Printed-circuit board layout (single-sided); components view

13.2.2 Power supply decoupling

AUDIO POWER CS NIJMEGEN

TVA

TFA9843J

100 nF

220

SGND

IN2+ IN1+

220 nF

27 Jan. 2003 / FP

1000 µF

SVR

1000 µF

150 µF

kΩ

−SE1+

SVR

MODE

10 kΩ

SB ON

MUTE

mce506

Proper supply bypassing is critical for low-noise performance and high supply voltage ripple rejection. The respective capacitor location should be as close as possible to the deviceand connected to the power ground. Proper power supply decoupling also prevents unwanted oscillations.

For suppressing higher frequency transients (spikes) on the supply rail a capacitor with low ESR (typical 100 nF) has to be placed as close as possible to the device. For suppressing lower frequency noise and ripple signals, a large electrolytic capacitor (e.g. 1000 µF or greater) must be placed close to the device.

The bypass capacitor connected to pin SVR reduces the noise and ripple on the mid rail voltage. For good THD and noise performance, a low ESR capacitor is recommended.

Preliminary data sheet Rev. 01 — 28 April 2006 12 of 19

Philips Semiconductors

13.3 Thermal behavior and heatsink calculation

TFA9843AJ

20 W stereo power ampliﬁer with volume control

The measured maximum thermal resistance of the IC package, R

th(j-mb)

, is 2.0 K/W.

A calculation for the heatsink can be made, with the following parameters:

amb(max)

=60°C (example) VCC= 18 V and RL=4Ω (SE) T

= 150 °C (speciﬁcation)

j(max)

is the total thermal resistance between the junction and the ambient including the

th(tot)

heatsink. This can be calculated using the maximum temperature increase divided by the power dissipation:

th(tot)

=(T

j(max)

− T

amb(max)

)/P

At VCC= 18 V and RL=4Ω (2 × SE) the measured worst case sine wave dissipation is

8.4 W; see Figure 8. For T

= 150 °C the temperature raise, caused by the power

j(max)

dissipation, is: 150 − 60=90°C:

P × R R

th(tot)

th(h-a)=Rth(tot)

=90°C

th(tot)

= 90/8.4 K/W = 10.7 K/W

− R

= 10.7 K/W − 2.0 K/W = 8.7 K/W

th(j-mb)

This calculation is for an application at worst case (stereo) sine wave output signals. In practice music signals will be applied, which decreases the maximum power dissipation to approximately half of the sine wave power dissipation; see Section 8.2.2. This allows the use of a smaller heatsink:

P × R R

th(tot)

th(h-a)=Rth(tot)

=90°C

th(tot)

= 90/4.2 K/W = 21.4 K/W

− R

= 21.4 K/W − 2.0 K/W = 19.4 K/W

th(j-mb)

Preliminary data sheet Rev. 01 — 28 April 2006 13 of 19

Philips Semiconductors

TFA9843AJ

20 W stereo power ampliﬁer with volume control

mce504

(5)

(1) RL = 2 Ω (2) RL = 4 Ω (3) RL = 6 Ω (4) RL = 8 Ω (5) RL = 16 Ω

2 × SE loads; T

150

(˚C)

100

=25°C; external heatsink of 10 K/W; music signals.

amb

(1) (2) (3) (4)

12 28

16 20 24

Fig 16. Junction temperature as a function of supply voltage

(V)

14. Test information

14.1 Quality information

The

General Quality Speciﬁcation for Integrated Circuits, SNW-FQ-611

is applicable.

Preliminary data sheet Rev. 01 — 28 April 2006 14 of 19

Philips Semiconductors

15. Package outline

TFA9843AJ

20 W stereo power ampliﬁer with volume control

DBS9P: plastic DIL-bent-SIL power package; 9 leads (lead length 12/11 mm); exposed die pad

non-concave

view B: mounting base side

SOT523-1

3.8

3.6

v M

0.8

0.3

ISSUE DATE

00-07-03 03-03-12

0.02

1.65

1.10

(1)

3.5

2.54

(1)

14.7

14.3

DIMENSIONS (mm are the original dimensions)

(2)

UNIT b

2.7

Notes

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

2. Plastic surface within circle area D1 may protrude 0.04 mm maximum.

0.80

2.3

0.65

OUTLINE

VERSION

SOT523-1

0.58

0.48

(1)

(2)

13.2

6.2

12.8

5.8

IEC JEDEC JEITA

w M

0 10 mm5

scale

1.27

5.08 4.85

REFERENCES

3212.4

11.0

11.4

10.0

2.8

3.4

3.1

6.7

4.5

5.5

3.7

1.15

17.5

0.85

16.3

EUROPEAN

PROJECTION

Fig 17. Package outline SOT523-1 (DBS9P)

Preliminary data sheet Rev. 01 — 28 April 2006 15 of 19

Philips Semiconductors

16. Soldering

16.1 Introduction to soldering through-hole mount packages

This text gives a brief insight to wave,dip and manual soldering. A more in-depth account of soldering ICs can be found in our (document order number 9398 652 90011).

Wave soldering is the preferred method for mounting of through-hole mount IC packages on a printed-circuit board.

16.2 Soldering by dipping or by solder wave

Driven by legislation and environmental forces the worldwide use of lead-free solder pastes is increasing. Typical dwell time of the leads in the wave ranges from 3 seconds to 4 seconds at 250 °C or 265 °C, depending on solder material applied, SnPb or Pb-free respectively.

The total contact time of successive solder waves must not exceed 5 seconds.

TFA9843AJ

20 W stereo power ampliﬁer with volume control

Data Handbook IC26; Integrated Circuit Packages

The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the speciﬁed maximum storage temperature (T printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit.

16.3 Manual soldering

Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the seating plane or not more than 2 mm aboveit. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 °C and 400 °C, contact may be up to 5 seconds.

16.4 Package related soldering information

Table 10. Suitability of through-hole mount IC packages for dipping and wave soldering

methods

Package Soldering method

Dipping Wave

CPGA, HCPGA - suitable DBS, DIP, HDIP, RDBS, SDIP, SIL suitable suitable

[2]

PMFP

[1] For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit

board.

[2] For PMFP packages hot bar soldering or manual soldering is suitable.

- not suitable

stg(max)

[1]

). If the

Preliminary data sheet Rev. 01 — 28 April 2006 16 of 19

Philips Semiconductors

20 W stereo power ampliﬁer with volume control

TFA9843AJ

17. Revision history

Table 11. Revision history

Document ID Release date Data sheet status Change notice Supersedes

TFA9843AJ_1 20060428 Preliminary data sheet - -

Preliminary data sheet Rev. 01 — 28 April 2006 17 of 19

Philips Semiconductors

18. Legal information

18.1 Data sheet status

TFA9843AJ

20 W stereo power ampliﬁer with volume control

Document status

Objective [short] data sheet Development This document contains data from the objective speciﬁcation for product development. Preliminary [short] data sheet Qualiﬁcation This document contains data from the preliminary speciﬁcation. Product [short] data sheet Production This document contains the product speciﬁcation.

[1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Deﬁnitions”. [3] The product status of device(s)described in this document mayhave changedsince this document was publishedand maydiffer incase of multipledevices. Thelatest productstatus

information is available on the Internet at URL

[1][2]

Product status

18.2 Deﬁnitions

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in modiﬁcations or additions. Philips Semiconductors does not give any representations or warranties as to the accuracy or completeness of information includedherein and shall have noliability for theconsequences of use of such information.

Short data sheet — A short data sheet is an extract from a full data sheet with thesame product type number(s)and title. Ashort datasheet is intended for quickreference only and shouldnot be relied upon to containdetailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local Philips Semiconductors sales ofﬁce.Incase of any inconsistency orconﬂict with the short data sheet, the full data sheet shall prevail.

18.3 Disclaimers

General — Information in this document is believed to be accurate and

reliable. However, Philips Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information.

Right to make changes — Philips Semiconductors reserves the right to make changes to information published in this document, including without limitation speciﬁcations and product descriptions, at any time and without notice. Thisdocumentsupersedes and replaces all informationsupplied prior to the publication hereof.

Suitability for use — Philips Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or

[3]

http://www.semiconductors.philips.com.

Deﬁnition

malfunction ofaPhilips Semiconductors product canreasonably be expected to result in personal injury, death or severe property or environmental damage. Philips Semiconductors accepts no liability for inclusion and/or use of Philips Semiconductors products in such equipment or applications and therefore such inclusion and/or use is for the customer’s own risk.

Applications — Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors makes no representation or warranty that such applications will be suitable for the speciﬁed use without further testing or modiﬁcation.

Limiting values — Stress above one or more limiting values (as deﬁned in the Absolute MaximumRatings System of IEC 60134)may cause permanent damage tothedevice. Limiting values are stressratings only and operationof the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability.

Terms and conditions of sale — Philips Semiconductors products are sold subject to the general terms and conditions ofcommercialsale, as published at

http://www.semiconductors.philips.com/proﬁle/terms, including those

pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by Philips Semiconductors. Incaseof any inconsistency orconﬂictbetween information in this document and such terms and conditions, the latter will prevail.

No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implicationof any license under any copyrights,patents or other industrial or intellectual property rights.

18.4 Trademarks

Notice: Allreferenced brands,product names, service namesand trademarks are the property of their respective owners.

19. Contact information

For additional information, please visit: http://www.semiconductors.philips.com For sales ofﬁce addresses, send an email to: sales.addresses@www.semiconductors.philips.com

Preliminary data sheet Rev. 01 — 28 April 2006 18 of 19

Philips Semiconductors

20. Contents

TFA9843AJ

20 W stereo power ampliﬁer with volume control

1 General description. . . . . . . . . . . . . . . . . . . . . . 1

2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

4 Quick reference data . . . . . . . . . . . . . . . . . . . . . 2

5 Ordering information. . . . . . . . . . . . . . . . . . . . . 2

6 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3

7 Pinning information. . . . . . . . . . . . . . . . . . . . . . 3

7.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

7.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4

8 Functional description . . . . . . . . . . . . . . . . . . . 4

8.1 Input conﬁguration . . . . . . . . . . . . . . . . . . . . . . 4

8.2 Power ampliﬁer. . . . . . . . . . . . . . . . . . . . . . . . . 4

8.2.1 Output power measurement . . . . . . . . . . . . . . . 4

8.2.2 Headroom. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

8.3 Mode selection . . . . . . . . . . . . . . . . . . . . . . . . . 5

8.4 Supply voltage ripple rejection . . . . . . . . . . . . . 5

8.5 Built-in protection circuits . . . . . . . . . . . . . . . . . 6

9 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 6

10 Thermal characteristics. . . . . . . . . . . . . . . . . . . 6

11 Static characteristics. . . . . . . . . . . . . . . . . . . . . 7

12 Dynamic characteristics . . . . . . . . . . . . . . . . . . 7

13 Application information. . . . . . . . . . . . . . . . . . 10

13.1 Application diagrams . . . . . . . . . . . . . . . . . . . 10

13.1.1 Single-ended application . . . . . . . . . . . . . . . . 10

13.1.2 Volume control drive options. . . . . . . . . . . . . . 11

13.2 Printed-circuit board . . . . . . . . . . . . . . . . . . . . 12

13.2.1 Layout and grounding. . . . . . . . . . . . . . . . . . . 12

13.2.2 Power supply decoupling . . . . . . . . . . . . . . . . 12

13.3 Thermal behavior and heatsink calculation . . 13

14 Test information. . . . . . . . . . . . . . . . . . . . . . . . 14

14.1 Quality information . . . . . . . . . . . . . . . . . . . . . 14

15 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 15

16 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

16.1 Introduction to soldering through-hole mount

packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

16.2 Soldering by dipping or by solder wave . . . . . 16

16.3 Manual soldering . . . . . . . . . . . . . . . . . . . . . . 16

16.4 Package related soldering information . . . . . . 16

17 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 17

18 Legal information. . . . . . . . . . . . . . . . . . . . . . . 18

18.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 18

18.2 Deﬁnitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

18.3 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

18.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 18

19 Contact information . . . . . . . . . . . . . . . . . . . . 18

20 Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’.

For more information, please visit: http://www.semiconductors.philips.com. For sales office addresses, email to: sales.addresses@www.semiconductors.philips.com.

Date of release: 28 April 2006

Document identifier: TFA9843AJ_1

Philips TFA9843AJ User Manual

Specifications and Main Features

Frequently Asked Questions

User Manual

1. General description

2. Features

3. Applications

4. Quick reference data

5. Ordering information

6. Block diagram

7. Pinning information

7.1 Pinning

7.2 Pin description

8. Functional description

8.2.1 Output power measurement

8.2.2 Headroom

8.3 Mode selection

8.4 Supply voltage ripple rejection

8.5 Built-in protection circuits

9. Limiting values

10. Thermal characteristics

11. Static characteristics

12. Dynamic characteristics

13. Application information

13.1 Application diagrams

13.1.1 Single-ended application

13.1.2 Volume control drive options

13.2 Printed-circuit board

13.2.1 Layout and grounding

13.2.2 Power supply decoupling

13.3 Thermal behavior and heatsink calculation

14. Test information

14.1 Quality information

15. Package outline

16. Soldering

16.1 Introduction to soldering through-hole mount packages

16.2 Soldering by dipping or by solder wave

16.3 Manual soldering

16.4 Package related soldering information

17. Revision history

18. Legal information

18.1 Data sheet status

18.3 Disclaimers

18.4 Trademarks

19. Contact information

20. Contents