7. Circuit Diagrams and PWB LayoutsDiagram PWB
Power Supply Panel(A)1617
Main Board: HDMI & DVI-I Input(B1) 1826
Main Board: DVD & DTT Input(B2) 1926
Main Board: Scaler MST96889LD(B3) 2026
Main Board: SCART Input(B4) 2126
Main Board: LVDS Output(B5) 2226
Main Board: Audio Amplifier & MUX(B6) 2326
Main Board: Tuner & AV(B7) 2426
Main Board: Power(B8) 2526
Side I/O Panel(D) 27(NA)
Keyboard & Control Panel(E) 27(NA)
IR & LED Panel(J) 28(NA)
8. Alignments29
9. Circuit Descriptions, Abbreviation List, and IC Data
Sheets30
Abbreviation List30
IC Data Sheets31
Copyright 2007 Philips Consumer Electronics B.V. Eindhoven, The Netherlands.
All rights reserved. No part of this publication may be reproduced, stored in a
retrieval system or transmitted, in any form or by any means, electronic,
mechanical, photocopying, or otherwise without the prior permission of Philips.
Published by JH 0771 BU CD Customer ServicePrinted in the NetherlandsSubject to modificationEN 3122 785 17491
Page 2
EN 2TES2.0E LA1.
Technical Specifications, Connections, and Chassis Overview
1.Technical Specifications, Connections, and Chassis Overview
Index of this chapter:
1.1 Technical Specifications
1.2 Connection Overview
1.3 Chassis Overview
Notes:
•Figures can deviate due to the different set executions.
•Specifications are indicative (subject to change).
: 42" (107 cm), 16 : 9
Resolution: 1366 × 768p
Viewing angle: 176 / 176
Brightness: 500 cd/m
Contrast ratio: 2000 : 1
Response time: 8 ms
Tuning system: PLL
TV Colour systems: PAL B/G, D/K, I
: SECAM B/G, D/K, L/L’
: DVB-T
Video playback: NTSC, SECAM, PAL
Presets/channels: 99 presets
Tuner bands: VHF
: UHF
: Hyper-band (S1-S41)
1.1.2Sound
Sound systems: A2/NICAM/
A2+NICAM
Sound effects: SRS TrusurroundXT
®
: 3D Mono
: 3D Stereo
Maximum power (W
):2 × 12
RMS
1.1.3Miscellaneous
Power supply:
- Mains voltage (V
- Mains frequency (Hz): 50 - 60
): 175 - 265
AC
Ambient conditions:
2
- Temperature range (°C): 5 to +40
- Maximum humidity: 99% R.H.
Power consumption (values are indicative):
- Normal operation (W): 155 (32"), 229 (42")
- Stand-by (W): < 1
Dimensions incl. stand (W × H × D, in mm):
- 32PFL2302/62 : 827 × 597 × 100
- 42PFL2302/62: 1135 × 800 × 101
1.2Connection Overview
Note: The following connector colour abbreviations are used
(acc. to DIN/IEC 757): Bk= Black, Bu= Blue, Gn= Green, Gy=
Grey, Rd= Red, Wh= White, and Ye= Yellow.
Figure 1-1 Connection overview
H_17490_010.eps
291007
1.2.1Side Connections
Mini Jack: Audio Head phone - Out
Bk - Head phone 32 - 600 ohm / 10 mW ot
Cinch: Video CVBS - In, Audio - In
Ye - Video CVBS 1 V
Wh - Audio L 0.5 V
Rd - Audio R 0.5 V
/ 75 ohm jq
PP
/ 10 kohm jq
RMS
/ 10 kohm jq
RMS
S-Video (Hosiden): Video Y/C - In
1-Ground Y Gnd H
2-Ground C Gnd H
3 - Video Y 1 V
4 - Video C 0.3 V
/ 75 ohm j
PP
P / 75 ohm j
PP
Page 3
Technical Specifications, Connections, and Chassis Overview
EN 3TES2.0E LA1.
1.2.2Rear Connections
Aerial - In
-- IEC-type Coax, 75 ohm D
EXT1: AV + RGB
21
20
E_06532_001.eps
2
1
050404
Figure 1-2 SCART connector EXT1
1 - Audio R 0.5 V
2 - Audio R 0.5 V
3 - Audio L 0.5 V
4 - Ground Gnd (audio) H
/ 1 kohm k
RMS
/ 10 kohm j
RMS
/ 1 kohm k
RMS
5 - Ground Gnd H
6 - Audio L 0.5 V
7 - Video Blue 0.7 V
8 - Function Select 0 - 2 V: INT
/ 10 kohm j
RMS
/ 75 ohm j
PP
4.5 - 12 V: EXT 4:3 j
9 - Ground Gnd H
10 - Res. Clock signals
11 - Video Green 0.7 V
12 - Res. Remote control
/ 75 ohm j
PP
13 - Ground Gnd H
14 - Ground Gnd (switch RGB) H
15 - Video Red 0.7 V
16 - Switch RGB j
/ 75 ohm j
PP
17 - Ground Gnd (video) H
18 - Ground Gnd (video out) H
19 - Video out 1 V
20 - Video in 1 V
21 - Shield Gnd H
/ 75 ohm k
PP
/ 75 ohm j
PP
EXT2: AV + S-Video
1 - Audio R 0.5 V
2 - Audio R 0.5 V
3 - Audio L 0.5 V
/ 1 kohm k
RMS
/ 10 kohm j
RMS
/ 1 kohm k
RMS
4 - Ground Gnd (audio) H
5 - Ground Gnd H
6 - Audio L 0.5 V
7 - Video Blue 0.7 V
8 - Function Select 0 - 2 V: INT
/ 10 kohm j
RMS
/ 75 ohm j
PP
4.5 - 12 V: EXT 4:3 j
9 - Ground Gnd H
10 - Res. Clock signals
11 - Video Green 0.7 V
/ 75 ohm j
PP
12 - Res. Remote control
13 - Ground Gnd H
14 - Ground Gnd (switch RGB) H
15 - Video Red 0.7 V
16 - Switch RGB j
/ 75 ohm j
PP
17 - Ground Gnd (video) H
18 - Ground Gnd (video out) H
19 - Video out 1 V
20 - Video in 1 V
/ 75 ohm k
PP
/ 75 ohm j
PP
21 - Shield Gnd H
Cinch: S/PDIF - Out
Bk - Coaxial 0.4 - 0.6V
/ 75 ohm kq
PP
Cinch: Video CVBS - Out, Audio - Out
Ye - Video CVBS 1 V
Wh - Audio L 0.5 V
Rd - Audio R 0.5 V
/ 75 ohm kq
PP
/10 kohm kq
RMS
/ 10 kohm kq
RMS
Cinch: Video YPbPr - In, Audio - In
Gn - Video Y 1 V
/ 75 ohm jq
PP
Bu - Video Pb 0.7 V
Rd - Video Pr 0.7 V
Wh - Audio L 0.5 V
Rd - Audio R 0.5 V
/ 75 ohm jq
PP
/ 75 ohm jq
PP
/ 10 kohm jq
RMS
/ 10 kohm jq
RMS
HDMI: Digital Video, Digital Audio - In
19
182
1
E_06532_017.eps
250505
Figure 1-3 HDMI (type A) connector
1 - D2+ Data channel j
2 - Shield Gnd H
3 - D2- Data channel j
4 - D1+ Data channel j
5 - Shield Gnd H
6 - D1- Data channel j
7 - D0+ Data channel j
8 - Shield Gnd H
9 - D0- Data channel j
10 - CLK+ Data channel j
11 - Shield Gnd H
12 - CLK- Data channel j
13 - n.c.
14 - n.c.
15 - DDC_SCL DDC clock j
16 - DDC_SDA DDC data jk
17 - Ground Gnd H
18 - +5V j
19 - HPD Hot Plug Detect j
20 - Ground Gnd H
PC: Mini Jack: PC/DVI Audio - In
Wh - Audio L 0.5 V
Rd - Audio R 0.5 V
/ 10 kohm jq
RMS
/ 10 kohm jq
RMS
PC: DVI-I: Digital/Analogue Video - In
18
916
17
C1 C2
C5
24
C3 C4
E_06532_004.eps
050404
Figure 1-4 DVI-I connector
1-D2- j
2-D2+ j
3 - Shield Gnd H
4-D4- j
5-D4+ j
6 - DDC_SCL DDC clock k
7 - DDC_SDA DDC data jk
8 - V-sync 0 - 5 V j
9-D1- j
10 - D1+ j
11 - Shield Gnd H
12 - D3- j
13 - D3+ j
14 - +5V j
15 - Ground Gnd H
16 - HPD Hot Plug Detect j
17 - D0- j
18 - D0+ j
19 - Shield Gnd H
20 - D5- j
21 - D5+ j
22 - Shield Gnd H
23 - CLK+ j
24 - CLK- j
C1 - Video Red 0.7 V
C2 - Video Green 0.7 V
C3 - Video Blue 0.7 V
/ 75 ohm j
PP
/ 75 ohm j
PP
/ 75 ohm j
PP
C4 - H-sync 0 - 5 V j
Page 4
EN 4TES2.0E LA1.
C5 - Ground Gnd H
1.3Chassis Overview
Technical Specifications, Connections, and Chassis Overview
CONTROL BOARD
E
SIDE I/O PANEL
D
LED PANEL
J
MAIN BOARD
B
(incl ext. I/O)
Figure 1-5 PWB locations 32"
H_17490_012.eps
291007
POWER SUPPLY
BOARD
POWER SUPPLY
BOARD
A
A
CONTROL BOARD
E
SIDE I/O PANEL
D
LED PANEL
J
MAIN BOARD
B
(incl ext. I/O)
Figure 1-6 PWB locations 42"
H_17490_014.eps
291007
Page 5
Safety Instructions, Warnings, and Notes
2.Safety Instructions, Warnings, and Notes
EN 5TES2.0E LA2.
Index of this chapter:
2.1 Safety Instructions
2.2 Warnings
2.3 Notes
2.1Safety Instructions
Safety regulations require the following during a repair:
•Connect the set to the Mains/AC Power via an isolation
transformer (> 800 VA).
•Replace safety components, indicated by the symbol h,
only by components identical to the original ones. Any
other component substitution (other than original type) may
increase risk of fire or electrical shock hazard.
Safety regulations require that after a repair, the set must be
returned in its original condition. Pay in particular attention to
the following points:
•Route the wire trees correctly and fix them with the
mounted cable clamps.
•Check the insulation of the Mains/AC Power lead for
external damage.
•Check the strain relief of the Mains/AC Power cord for
proper function.
•Check the electrical DC resistance between the Mains/AC
Power plug and the secondary side (only for sets that have
a Mains/AC Power isolated power supply):
1. Unplug the Mains/AC Power cord and connect a wire
between the two pins of the Mains/AC Power plug.
2. Set the Mains/AC Power switch to the “on” position
(keep the Mains/AC Power cord unplugged!).
3. Measure the resistance value between the pins of the
Mains/AC Power plug and the metal shielding of the
tuner or the aerial connection on the set. The reading
should be between 4.5 Mohm and 12 Mohm.
4. Switch “off” the set, and remove the wire between the
two pins of the Mains/AC Power plug.
•Check the cabinet for defects, to prevent touching of any
inner parts by the customer.
2.2Warnings
•All ICs and many other semiconductors are susceptible to
electrostatic discharges (ESD w). Careless handling
during repair can reduce life drastically. Make sure that,
during repair, you are connected with the same potential as
the mass of the set by a wristband with resistance. Keep
components and tools also at this same potential.
•Be careful during measurements in the high voltage
section.
•Never replace modules or other components while the unit
is switched “on”.
•When you align the set, use plastic rather than metal tools.
This will prevent any short circuits and the danger of a
circuit becoming unstable.
2.3Notes
2.3.1General
•Measure the voltages and waveforms with regard to the
chassis (= tuner) ground (H), or hot ground (I), depending
on the tested area of circuitry. The voltages and waveforms
shown in the diagrams are indicative. Measure them in the
Service Default Mode (see chapter 5) with a colour bar
signal and stereo sound (L: 3 kHz, R: 1 kHz unless stated
otherwise) and picture carrier at 475.25 MHz for PAL, or
61.25 MHz for NTSC (channel 3).
•Where necessary, measure the waveforms and voltages
with (D) and without (E) aerial signal. Measure the
voltages in the power supply section both in normal
operation (G) and in stand-by (F). These values are
indicated by means of the appropriate symbols.
•Manufactured under license from Dolby Laboratories.
“Dolby”, “Pro Logic” and the “double-D symbol”, are
trademarks of Dolby Laboratories.
2.3.2Schematic Notes
•All resistor values are in ohms, and the value multiplier is
often used to indicate the decimal point location (e.g. 2K2
indicates 2.2 kohm).
•Resistor values with no multiplier may be indicated with
either an “E” or an “R” (e.g. 220E or 220R indicates 220
ohm).
•All capacitor values are given in micro-farads (μ=× 10
nano-farads (n= × 10
•Capacitor values may also use the value multiplier as the
decimal point indication (e.g. 2p2 indicates 2.2 pF).
•An “asterisk” (*) indicates component usage varies. Refer
to the diversity tables for the correct values.
•The correct component values are listed in the Spare Parts
List. Therefore, always check this list when there is any
doubt.
2.3.3BGA (Ball Grid Array) ICs
Introduction
For more information on how to handle BGA devices, visit this
URL: www.atyourservice.ce.philips.com (needs subscription,
not available for all regions). After login, select “Magazine”,
then go to “Repair downloads”. Here you will find Information
on how to deal with BGA-ICs.
BGA Temperature Profiles
For BGA-ICs, you must use the correct temperature-profile,
which is coupled to the 12NC. For an overview of these profiles,
visit the website www.atyourservice.ce.philips.com (needs
subscription, but is not available for all regions)
You will find this and more technical information within the
“Magazine”, chapter “Repair downloads”.
For additional questions please contact your local repair help
desk.
2.3.4Lead-free Soldering
Due to lead-free technology some rules have to be respected
by the workshop during a repair:
•Use only lead-free soldering tin Philips SAC305 with order
code 0622 149 00106. If lead-free solder paste is required,
please contact the manufacturer of your soldering
equipment. In general, use of solder paste within
workshops should be avoided because paste is not easy to
store and to handle.
•Use only adequate solder tools applicable for lead-free
soldering tin. The solder tool must be able:
– To reach a solder-tip temperature of at least 400°C.
– To stabilize the adjusted temperature at the solder-tip.
– To exchange solder-tips for different applications.
•Adjust your solder tool so that a temperature of around
360°C - 380°C is reached and stabilized at the solder joint.
Heating time of the solder-joint should not exceed ~ 4 sec.
Avoid temperatures above 400°C, otherwise wear-out of
tips will increase drastically and flux-fluid will be destroyed.
To avoid wear-out of tips, switch “off” unused equipment or
reduce heat.
•Mix of lead-free soldering tin/parts with leaded soldering
tin/parts is possible but PHILIPS recommends strongly to
-9
), or pico-farads (p= × 10
-12
-6
),
).
Page 6
EN 6TES2.0E LA3.
Directions for Use
avoid mixed regimes. If this cannot be avoided, carefully
clear the solder-joint from old tin and re-solder with new tin.
2.3.5Alternative BOM identification
The third digit in the serial number (example:
AG2B0335000001) indicates the number of the alternative
B.O.M. (Bill Of Materials) that has been used for producing the
specific TV set. In general, it is possible that the same TV
model on the market is produced with e.g. two different types
of displays, coming from two different suppliers. This will then
result in sets which have the same CTN (Commercial Type
Number; e.g. 28PW9515/12) but which have a different B.O.M.
number.
By looking at the third digit of the serial number, one can
identify which B.O.M. is used for the TV set he is working with.
If the third digit of the serial number contains the number “1”
(example: AG1B033500001), then the TV set has been
manufactured according to B.O.M. number 1. If the third digit is
a “2” (example: AG2B0335000001), then the set has been
produced according to B.O.M. no. 2. This is important for
ordering the correct spare parts!
For the third digit, the numbers 1...9 and the characters A...Z
can be used, so in total: 9 plus 26= 35 different B.O.M.s can be
indicated by the third digit of the serial number.
Identification: The bottom line of a type plate gives a 14-digit
serial number. Digits 1 and 2 refer to the production center (e.g.
AG is Bruges), digit 3 refers to the B.O.M. code, digit 4 refers
to the Service version change code, digits 5 and 6 refer to the
production year, and digits 7 and 8 refer to production week (in
example below it is 2006 week 17). The 6 last digits contain the
serial number.
3.Directions for Use
You can download this information from the following websites:
http://www.philips.com/support
http://www.p4c.philips.com
MODEL :
PROD.NO:
2.3.6Board Level Repair (BLR) or Component Level Repair
(CLR)
If a board is defective, consult your repair procedure to decide
if the board has to be exchanged or if it should be repaired on
component level.
If your repair procedure says the board should be exchanged
completely, do not solder on the defective board. Otherwise, it
cannot be returned to the O.E.M. supplier for back charging!
2.3.7 Practical Service Precautions
•It makes sense to avoid exposure to electrical shock.
•Always respect voltages. While some may not be
32PF9968/10
AG 1A0617 000001
Figure 2-1 Serial number (example)
While some sources are expected to have a possible
dangerous impact, others of quite high potential are of
limited current and are sometimes held in less regard.
dangerous in themselves, they can cause unexpected
reactions that are best avoided. Before reaching into a
powered TV set, it is best to test the high voltage insulation.
It is easy to do, and is a good service precaution.
MADE IN BELGIUM
220-240V 50/60Hz
~
VHF+S+H+UHF
BJ3.0E LA
S
E_06532_024.eps
128W
130606
Page 7
4.Mechanical Instructions
Index of this chapter:
4.1 Cable Dressing
4.2 Set Dis-assembly
4.3 Set Re-assembly
4.1Cable Dressing
Mechanical Instructions
Notes:
•Figures below can deviate slightly from the actual situation,
due to the different set executions.
EN 7TES2.0E LA4.
Figure 4-1 Cable Dressing 32" sets
H_17490_011.eps
291007
Page 8
EN 8TES2.0E LA4.
Mechanical Instructions
4.2Set Dis-assembly
Following figures (“exploded view”) indicate the mechanical
construction of the sets.
Figure 4-2 Cable Dressing 42" sets
H_17490_013.eps
291007
Page 9
Mechanical Instructions
EN 9TES2.0E LA4.
291007
H_17490_015.eps
Figure 4-3 Exploded View 32" sets
Page 10
EN 10TES2.0E LA4.
Mechanical Instructions
291007
H_17490_016.eps
Figure 4-4 Exploded View 42" sets
Page 11
4.3Set Re-assembly
Note:
While re-assembling, make sure that all cables are placed and
connected in their original position. See figures “Cable
dressing”.
Mechanical Instructions
EN 11TES2.0E LA4.
Page 12
EN 12TES2.0E LA5.
Service Modes, Error Codes, and Fault Finding
5.Service Modes, Error Codes, and Fault Finding
Index of this chapter:
5.1 Service Mode
5.2 Error Codes
5.3 Fault Finding and Repair Tips
5.1Service Mode
The Service Mode is activated by pressing ‘1923’ on the
Remote Control, while the set is in the Main User Menu.
The software provides menu flexibility and full control to the
software. Service persons can adjust the TV in all manners. In
the Service Menu (see chapter 8), you find a list of parameters.
All functions of the Service Mode, and the default parameter
settings, are listed in Chapter “Alignments”.
FAULT TRACING DIAGRAM FOR POWER SUPPLY
Check 220 V AC Mains
YES
Check C 020 Voltage
NO
NO
5.2Error Codes
These sets do not generate Error Codes.
5.3Fault Finding and Repair Tips
Notes:
•It is assumed that the components are mounted correctly
with correct values and no bad solder joints.
•Before any fault finding actions, check if the correct options
are set.
•The Service Menu (see chapter 8), contains some useful
tests, that generates patterns.
Check AC Power Cable is Plugged
Check X102 Fuse
YES
Check 5VSTBY
YES
Check 5V_OFF
YES
Check 24V,33V,12V
8V
YES
Check 3.3V,2.5V and 1.8V
YES
NO
NO
NO
NO
Check T530 and Peripheral
Components
Check P_CTRL Pin
LOWHIGH
StandBy
Mode
Normal Mode
Check Components
For 5V
Check Related Components for
Defective Outputs
POWER IS OK
Check Related Components
Figure 5-1 Fault finding power supply
H_17490_017.eps
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Page 13
Block Diagrams, Test Point Overviews, and Waveforms
6.Block Diagrams, Test Point Overviews, and Waveforms
Block Diagram Main
EN 13TES2.0E LA6.
H_17490_018.eps
291007
Page 14
Block Diagrams, Test Point Overviews, and Waveforms
Block Diagram ASSOS Chassis
220 V AC
POWER BOARD
EN 14TES2.0E LA6.
IDTV CHASSIS DIAGRAM
24 V
S300
CN16
CN15
CN17
CN19
*
*
*
*
5V
5V STD
12V
STD BY
Back light On/Off
Back light Dimm
CN7
MAIN BOARD ASSOS
CN20CN21
CN5
Speaker
CN4
CN18
LVDS
J7
Dyn. Cont.
CN24
24 V
Back light Dimm
LCD
PANEL
Back light On/Off
*
Service
IR
MULTI
BUTTON
CN15-16-17-19 are for optional DVB connections
SIDE
AV
H_17490_019.eps
291007
Page 15
Block Diagrams, Test Point Overviews, and Waveforms
Thu.26.Dec
Paulo1: R588(NU), R589(0R)
Paulo adv: R588(100),
R589(100K)
2
VO
4
TAB
GND
C283
100uF/16V
FB54
UPB201209T-500Y-S
FB57
UPB201209T-500Y-S
12VSC
5VSC
FB42UPB201209T-500Y-S
FB38UPB201209T-500Y-S
D12??(NU)
R587 0R[DO201AD]
U20
AMS1086-1.8V_TO252
3
VI
C269
100nF
R589
100K(NU)
3.3AVDDVSS3V
12
+
C284
100nF
VDDP_3.3VSS3V
C308
C307
100nF
10uF_2012
VDDC_18/12VD_18/12
C322
C321
100nF
10uF_2012
4
R3810R
R3820R
FB35UPB201209T-500Y-S
S5V/3V
VO
TAP
GND
1
R588
100(NU)
C294
100nF
C309
C310
100nF
100nF
C323
C324
100nF
100nF
5VD
C259100nF
C257 220uF/25V
12
+
2
4
C266
100uF/16V
U24
AP1117_3.3V-SOT223
3
VI
GND
1
C312
C311
100nF
100nF
C325
C326
100nF
100nF
DIMMING_PANEL
VSS5
BLK
VSS5
C256 100uF/16V
C258100nF
12
+
FB45
UPB201209T-500Y-S
VD_18/12
+
C270
100nF
2
VO
4
TAB
C295
100uF/16V
C313
C314
100nF
100nF
C249100nF
+
C315
100nF
12VD
C250 220uF/25V
12
+
S5V
12
C296
100nF
3
(FSP199-4M02)
12V_AMP12VSC
FB32UPB201209T-500Y-S
R371 0R(NU)C247
R372 0R(NU)
VSS5
C260
100nF
FB46600 Ohm 0.5A 2012
FB48600 Ohm 0.5A 2012
FB50 600 Ohm 0.5A 2012
FB51600 Ohm 0.5A 2012
FB53600 Ohm 0.5A 2012
FB56600 Ohm 0.5A 2012
R373
4.7K(NU)
32
Q20
1
MMBT3904(NU)
C291
10uF_2012
C318
10uF_2012
VS_ON
C267
10uF_2012
C280
10uF_2012
C297
10uF_2012
C304
10uF_2012
C319
100nF
C246
100nF
PWR_ON
R374 0R
R375 0R(NU)
12
C261
+
22uF/16V(NU)
AVDD_AU_3.33.3AVDD
C268
100nF
AVDD_ADC_3.3
C281
100nF
AVDD_DVI_3.3
C293
C292
100nF
100nF
AVDD_SIF_3.3
C298
100nF
AVDD_MEMPLL_3.3
C305
100nF
AVDD_MPLL_3.3
C320
100nF
12
C245
+
220uF/25V
MAIN POWER
CN8
1
D6V
2
RTN
3
D3.3V
4
D3.3V
5
RTN
6
RTN
7
D12V
8
DS-ON
9
RTN
10
STB-5V
11
THER-DE
SMW250-11P(NU)
POWER_ON/OFF 4
12VDA33V
4.7mH(RFB1010-472 or DS1608C-475)
21
+
C274
C277
33uF/25V
100nF
R385
3.3K
3
4
Q11B
5
6
R563
10K
IRF7314
BLK
L6
5VD
C306
100nF
32
TP10
1
2
3
45
R3861K
1
Q21
MMBT3904
U22
DRIVE
NC
NC
VINGND
BA6161F-SOP8(LG)
R562
200R(NU)
2
SAMSUNG PDP POWER
D6V
UPB201209T-500Y-S(NU)
12
C242
0.1uF(NU)
PWR_ON
12
C251
100nF(NU)
D9
RB160L=60(LG)
8
FB
7
NC
6
NC
BLK_ON 4
FB31
21
21
UPB201209T-500Y-S(NU)
5VD
12
12
+
C243
C244
100uF/16V(NU)
100nF(NU)
UPB201209T-500Y-S(NU)
12
VSS5
C248
R378 1.2K
+
C271
4.7uF/50V
C301
100nF
100nF(NU)
+
4.7uF/50V
U25
AP1117_3.3V-SOT223
3
VI
GND
1
FB36
5VDA3.3V
FB34
21
600 Ohm 0.5A 2012
C272
VO
TAB
A3.3V
FB47
R379
100K(2012)
2
4
100uF/16V
C302
VT
C278
100nF
12
+
1
SUB POWER
CN9
1
A6V
2
RTN
3
A12V
4
RTN
5
12VAM
6
12VAM
7
RTN-A
8
RTN-A
9
VT
10
RTN
SMW250-10P(NU)
S5V
C275
C279
1uF
OP : 0.3mA
ST : 0.1mA
under
100nF
MVDD_2.5VDDM_2.5
600 Ohm 0.5A 2012
DTT_MODULE_PWR
5VD
FB52UPB201209T-500Y-S
12VD
C303
100nF
FB55UPB201209T-500Y-S(NU)
FB49
C285
10uF_2012
12
+
100uF/16V
12
+
100uF/16V(NU)
DTT_POWER.
SILK
1) SPEAKER : BLUE ==> CN4
2) IDTV POWER : RED ==> CN19
3) IR : WHITE ==> CN20
4) IDTV DOWNLOAD : BLACK ==> CN15
A6V
21
UPB201209T-500Y-S(NU)
12
C240
100nF(NU)
21
UPB201209T-500Y-S(NU)
12
100nF(NU)
21
UPB201209T-500Y-S(NU)
12
C252
100nF(NU)
21
UPB201209T-500Y-S(NU)
12
C255
100nF(NU)
U21
AP1117-2.5V_SOT223
3
VI
GND
1
C286
100nF
C299
C316
TAP
C287
100nF
DTT_5V
DTT_12V
FB30
FB33
FB37
FB40
VO
C288
100nF
C300
100nF
C317
100nF(NU)
2
4
100uF/16V
C289
100nF
12
C241
100nF(NU)
12VD
12V_AMP
VT
C273
C290
100nF
DTT_5V
12
+
C239
100uF/16V(NU)
MVDD_2.5
+
CN19
1
+5V_DVB
2
GND
3
GND
4
+12V_DVB
JST250-4P
C276
100nF
D5
EDS914
2
1
12
R2220(NU)
A3.3V
R212
10K
12
23
Q6
MMBT3904
1
12
R22110K
TP11
1
Dimming_PWM 4
H_17490_008.eps
161007
12VSC
C330
0.1uF(NU)
4
C327
1uF(NU)
5VSC
VSS5
VS_ON
C328
0.1uF(NU)
VSS5
ACD4
5VD_14
23
CN11
1
5VSC
2
5VSC
3
5VSC
4
GND
5
GND
6
GND
7
12VSC
8
12VSC
9
GND
10
GND
11
NC
12
NC
SMW250-12P(NU)
CN13
1
ACD1
2
RLY_ON1
3
5VST
4
GND
5
VS_ON1
AA
5
5VD1
NC
SMW250-7P(NU)
6
7
C329
1uF(NU)
R38822(NU)
R38922(NU)
FB62UPB201209T-500Y-S(NU)
R39022(NU)
R39122(NU)
LG_PDP_POWER_OPTION
CN12
1
R387
4.7K(NU)
1
Q22
MMBT3904(NU)
R392 1K(NU)
RLY_ON4
24V&30V
24V&30V
SMW250-4P(NU)
3
GND
GND
2
3
4
24V_or_30V
24V_or_30V
C332
0.1uF(NU)
Input Current Max
5VSC : 4.5A
12VSC : 1A
Input Current Max
5VST_BY : 1A
C333
1nF(NU)
+
C331
220uF/50V(NU)
U26
AP1501-12(NU)
TAO
IN
OUT
GND
FEEDBACK
12345
L7
47uH,3A(NU)
D10
SS34(NU)
S/W
Input Current Max
9VSC : 2A
Input Current Max
24V : 1.25A
30V : 1A
2
6
12V_AMP
C334
1uF(NU)
C335
0.1uF(NU)
DIMMING_PANEL
+
10uF/16V
3
12
R22047K
C130
C129
100nF
1
Page 26
Circuit Diagrams and PWB Layouts
Layout Main Board (Top Side)
EN 26TES2.0E LA7.
H_17490_009.eps
161007
Page 27
Circuit Diagrams and PWB Layouts
EN 27TES2.0E LA7.
Side I/O Panel
1
3
SIDE I/O PANEL
DD
C
B
S102
V
S104
L
S105
R
1
2
1
2
1
2
AGND
S100
HEADPHONE 7P
L107
BEAD
L110
BEAD
C109
1nF
AGNDAGNDAGND
L111
BEAD
C110
1nF
AGND
AGND
AGND
AGND
C111
10pF
C113
1nF
C114
1nF
1
2
L
4
R
5
8
7
3
AGND
R102
15K
R103
15K
AGND
C100
220nF
C115
1nF
C116
1nF
AGND
L100
22uH
L101
22uH
C101
220nF
AV_CVBS
AV_L
AGND
C102
100nF
AV_R
AGND
C103
100nF
AGND
R100
4.7R
C104
10nF
AGND
R101
4.7R
C105
10nF
AGND
AGND
AGND
Keyboard & Control Panel
42
KEYBOARD & CONTROL PANEL
EE
S002
To infra pcb
S103
12
11
10
9
8
7
6
5
4
3
2
1
CON5
C
B
S001
To main pcb
2
1
C002
100nF
R002
2.2K 1/6W
R003
330R 1/6W
R004
3.3K 1/6W
R005
6.8K 1/6W
R006
560R 1/6W
R007
1K 1/6W
2
C001
1
100nF
SW02
MENU
SW03
SOURCE
SW04
V(-)
SW05
V(+)
SW06
P(-)
GND
H_17490_025.eps
SW07
P(+)
291007
1
23
S106
5
6
A
AGND
S_VHS
4
1
R104
75R
AGNDAGND
R105
75R
AGNDAGND
C100
47pF
C101
47pF
A
H_17490_024.eps
2
3
161007
4
Page 28
IR & LED Panel
Circuit Diagrams and PWB Layouts
EN 28TES2.0E LA7.
JJ
IR & LED PANEL
IR01
IR
IR
VCC2GND
S001
1
R001
3
1
33R 1/4W
2
C001
3
INFRA RED
4
GND
R003
100uF
470R
Personal Notes:
S002
2
1
To mbutton pcb
C002
100nF
R004
15K 1/6W
SW01
STBY
LED1
LED
H_17490_026.eps
161007
E_06532_012.eps
131004
Page 29
8.Alignments
Alignments
EN 29TES2.0E LA8.
Index of this chapter:
8.1 Options
8.2 General Alignment Conditions
8.3 Hardware Alignments
8.4 Software Alignments
8.1Options
8.1.1 Introduction
Options are used to control the presence/absence of certain
features and hardware.
How to Change an Option
Different from other Philips TV sets, the options are not
represented as bits and bytes, but with clear text.
The option settings are a part of the Service Menu. The method
of entering the Service Menu and the structure of the Service
Menu are described in “Software Alignments” below.
8.2General Alignment Conditions
Perform all electrical adjustments under the following
conditions:
•AC voltage and frequency: 230 V / 50 Hz.
•Connect the set to the mains voltage via an isolation
transformer with a low internal resistance.
•Allow the set to warm up for approximately 20 minutes.
•Measure the voltages and waveforms in relation to chassis
ground (with the exception of the voltages on the primary
side of the power supply). Never use the cooling fins /
plates as ground.
•Test probe: Ri > 10 Mohm; Ci < 2.5 pF.
•Use an isolated trimmer / screwdriver to perform the
alignments.
8.3Hardware Alignments
Table 8-1 Service Menu
Service MenuSubmenuSublevelParameters / Remarks
Auto Inspect
Auto Tune Menu
Input SourceSCART1
SCART2
SCART_2SV
AV
IDTV
COMPONENT
PC
DVI
HDMI1
HDMI2
TV
ADC ADJR Off129 (default)
Color
Temperature
DCR ENOn/Off(350 steps)
SRS Punch Level20 (default) (63 steps)
Welcome Reactive On/Off
Test PatternOn/Off
Power ModeEvery Stand-by
OEM OptionsPanel Type
Version
G Off139 (default)
B Off143 (default)
R Gain95 (default)
G Gain97 (default)
B Gain105 (default)
R50 (default) (100 steps)
G50 (default)( 100 steps)
B50 (default) (100 steps)
Every Switch-on
Latest Status
IDTVEnable/Disable
S-VideoEnable/Disable
R/C TypeR C5302/
RC4901
PresetD efault
PH32
PH42
There are no hardware alignments present in the sets.
8.4Software Alignments
8.4.1 Service Menu
The Service Menu enables a large number of settings. You can
activate and deactivate options, or change parameters that
influence the quality of the displayed image. Activate the
Service Menu as follows:
•Press the “Menu” button on the remote control: the screen
will display the Customer Menu.
•Press “1923” on the remote control: the screen will now
display the top level of the Service Menu:
– General Setup
– Video Setup
– Audio Setup
–Scaler Setup
– Options Setup
– Display Setup
–More
Every item in the service menu top level gives you access to a
sublevel, that contains several items. Navigate with the cursor
buttons on the remote control, increase a value with “>”,
decrease with “<“:
Page 30
EN 30TES2.0E LA9.
Circuit Descriptions, Abbreviation List, and IC Data Sheets
9.Circuit Descriptions, Abbreviation List, and IC Data Sheets
Index of this chapter:
9.1 Introduction
9.2 Block Diagrams
9.3 Abbreviation List
9.4 IC Data Sheets
9.1Introduction
The “TES2.0E LA” chassis is an LCD TV chassis, only
marketed in Turkey, that is used for TV sets with a 32 inch and
a 42 inch diameter, and an aspect ratio of 16 : 9.
9.2Block Diagrams
For Block Diagrams refer to chapter 6.
9.3Abbreviation List
2CS2 Carrier Sound. Analog stereo sound
system used, e.g., in Germany.
4.43NTSC 4.43; Sound carrier is on 5.5
MHz.
A/VAudio / Video. Video is CVBS.
ADEScaler chip manufacturer.
AFCAutomatic Frequency Control.
AGCAutomatic Gain Control: algorithm that
controls the video input of the feature
box.
AMAmplitude Modulation.
B/GMonochrome TV system. Sound
carrier = 5.5 MHz. Also system H
(Belgium) is included.
BCLBeam Current Limitation.
Black StretchThe lowest value of the video signal is
measured during the scanning time.
The black stretch shifts this level to the
nominal black level within limits.
BLRBoard Level Repair.
BTSCBroadcast Television Systems
Committee. Multiplex FM stereo sound
system. Originating from USA and
used, e.g., in LATAM and AP-NTSC
countries.
CCClosed Caption.
CLRComponent Level Repair.
ComPairComputer aided rePair.
CRTCathode Ray Tube or picture tube.
CVBSComposite Video Blanking and
Synchronization.
CVIComponent Video Input.
D/KMonochrome TV system. Sound
carrier = 6.5 MHz.
EEPROMElectrically Erasable and
Programmable Read Only Memory.
EWEast West, related to horizontal
deflection of the set.
EXTExternal (source), entering the set via
SCART or Cinch.
FMFrequency Modulation.
IMonochrome TV system. Sound
carrier = 6.0 MHz.
I2CIntegrated IC bus.
I.F.Intermediate Frequency.
LEDLight Emitting Diode.
L/L'Monochrome TV system, Sound
carrier=6.5MHz (France), L' is Band I,
L is all bands except for Band I.
LSLoudspeaker.
M/NMonochrome TV system. Sound.
carrier = 4.5 MHz.
MCUMain Control Unit.
NCNot Connected.
NICAMNear Instantaneous Compounded
Audio Multiplexing. This is a digital
sound system, mainly used in Europe.
NTSCNational Television Standard
Committee. Colour system mainly
used in North America and Japan.
Colour carrier NTSC M/N = 3.579545
MHz, NTSC 4.43 = 4.433619 MHz
(this is a VCR norm, it is not
transmitted off-air).
NVMNon Volatile Memory: IC containing
TV related data e.g. alignments.
OCOpen Circuit.
OSDOn Screen Display.
PALPhase Alternate Line. Colour system
used mainly in Western Europe (PAL
= 4.43361875 MHz) and South
America. (PAL M = 3.57561175 MHz;
PAL N = 3.58205625 MHz).
PBPlay Back. Some colour systems
cannot be received on air. The sound
carrier is on a different frequency.
However via External (PB) the sound
is offered in base-band, so via Ext. the
picture and sound are O.K.
PCBPrinted Circuit board.
PFCPower Factor Correction.
PLLPhase Locked Loop. Used for e.g.
FST tuning systems. The customer
can give directly the desired
frequency.
QSSQuasi Split Sound. Sound IF
application used for stereo sound.
RAMRandom Access Memory.
RCRemote Control handset.
RC5Remote Control code standard.
RGBRed, Green, and Blue video signals.
ROMRead Only Memory.
S/CShort Circuit.
ScartPeri television interconnection 42-pin
or 21-pin euro connector.
SCLSerial Clock.
SECAMColour system used e.g. in France.
Colour carriers: F0R = 4.40625 MHz;
F0B = 4.25000 MHz.
SIFSound Intermediate Frequency.
SRGBA Standard RGB (Red Green Blue)
colour space, created by Hewlett-
Packard and MicroSoft.
TBFTo Be Fixed.
TintBy the user selectable white tones for
different colour temperatures.
TRTurkey.
TXTTeletext.
uPMicroprocessor.
XTALQuartz crystal.
YCLuminance (Y) and Chrominance (C)
signal.
Page 31
Circuit Descriptions, Abbreviation List, and IC Data Sheets
9.4IC Data Sheets
This section shows the internal block diagrams and pin layouts
of ICs that are drawn as “black boxes” in the electrical diagrams
(with the exception of “memory” and “logic” ICs).
9.4.1 3-to-1 DVI/HDMI Switch, TMDS341A (U3)
EN 31TES2.0E LA9.
BLOCK DIAGRAM TMDS341A
VCC (3.3 V)
A24
B24
V
CC
R
A23
B23
V
CC
R
A22
B22
V
CC
R
A21
B21
VCC (3.3 V)
A34
B34
V
CC
A33
B33
V
CC
A32
B32
V
CC
A31
B31
HPD1
HPD2
HPD3
SCL1
SDA1
SCL2
SDA2
SCL3
SDA3
R
Rx w/
EQ
Rx w/
EQ
Rx w/
EQ
Rx w/
EQ
R
R
R
R
Rx w/
EQ
INT
INT
INT
INT
INT
Rx w/
EQ
INT
Rx w/
EQ
INT
Rx w/
EQ
INT
A11
B11
A12
B12
R
EQ
Rx w/
INT
A13
B13
R
Rx w/
EQ
INT
A14
B14
R
EQ
Rx w/
EQ
Rx w/
INT
V
CC
R
(3.3 V)
INT
PRE
VSADJ
Y4
3−to−1 MUX
Control Logic
TMDS
Drive
TMDS
Drive
TMDS
Drive
TMDS
Drive
Z4
Y3
Z3
Y2
Z2
Y1
Z1
OE
S1
S2
S3
HPD_SINK
SCL_SINK
SDA_SINK
PIN CONFIGURATION
3
L3
C
E
C
V
NC
O
HPD3
SDA
SC
GND
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
22
21
4
C
E
1
14
C
NC
B
R
A
V
P
GND
VSADJ
HPD2
SDA2
SCL2
HPD1
C
3
4
4
3
3
C
C
A
B
A3
GND
N
V
V
CC
GND
GND
B21
A21
V
CC
B22
A22
GND
B23
A23
V
CC
B24
A24
GND
V
CC
59 58 57 56 550515254506534948 47464544 4342 41
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
76
77
78
79
80
2345 6789101112131141516 171819 20
1
1
1
ND
NC
A1
B1
CL1
DA
G
S
S
C
3
32
3
C
B31
A31
B32
A
GND
B
V
2
CC
B1
V
C
2
C
13
1
V
A
B13
A
GND
Figure 9-1 Internal block diagram and pin configuration
HPD_SINK
SDA_SINK
SCL_SINK
GND
GND
Z1
Y1
V
CC
Z2
Y2
GND
Z3
Y3
V
CC
Z4
Y4
GND
S3
S2
S1
H_17490_027.eps
291007
Page 32
EN 32TES2.0E LA9.
9.4.2Quad SPDT Wide-bandwidth Video Switch, TS5V330DR (U6)
Circuit Descriptions, Abbreviation List, and IC Data Sheets
PIN CONFIGURATION TS5V330
D, DBQ, OR PW PACKAGE
IN
S1
A
S2
A
D
A
S1
B
S2
B
D
B
GND
S1
2
A
S2
3
A
D
4
A
S1
5
B
S2
6
B
D
7
B
(TOP VIEW)
1
16
V
2
15
EN
3
14
S1
4
13
S2
5
12
D
6
11
S1
7
10
S2
8
9
D
RGY PACKAGE
(TOP VIEW)
CC
IN
116
89
V
C
D
GND
CC
D
D
D
C
C
C
15
EN
14
S2
D
13
S2
D
12
D
D
11
S1
C
10
S2
C
H_17490_028.eps
291007
Figure 9-2 Internal block diagram and pin configuration
Page 33
Circuit Descriptions, Abbreviation List, and IC Data Sheets
L
9.4.3SXGA LCD TV Controller with Video Decoder and 8-bit Dual LVDS Transmitter, MST9WxxLD (U7)
PIN CONFIGURATION MST9W55
P
0
A
V
GND
VDDP
LVA0M
L
LVA1M
LVA1P
211
207
206
205
DDM
V
204
208
5
7
3
114
11
11
116
11
[7]
A[5]
TA
T
TA[4]
A
DA
MDATA[6]
MDA
MD
M
210
209
0
11
112
111
GND
TA[8]
A
MD
RXCKN
RXCKP
GND
RX0N
RX0P
AVDD_DVI
RX1N
RX1P
GND
RX2N
RX2P
AVDD_DVI
REXT
DDCD_DA
DDCD_CK
HSYNC1
VSYNC1
RMID
VCLAMP
REFP
REFM
BIN1P
BIN1M
SOGIN1
GIN1P
GIN1M
RIN1P
RIN1M
BIN0M
BIN0P
GIN0M
GIN0P
SOGIN0
RIN0M
RIN0P
AVDD_ADC
GND
HSYNC0
VSYNC0
VSYNC2
BIN2P
BIN2M
SOGIN2
GIN2P
GIN2M
RIN2P
RIN2M
VCOM2
CVBS3
CVBS2
CVBS1
VCOM1
CVBS0
VCOM0
CVBSOUT
GND
SIF0M
SIF0P
AVDD_SIF
SIF1P
CKM
LVB1M
220
101102
MDATA[15]
B
LVB1P
LVB2M
LVB2P
LVBCKP
LVB3M
LVB3PNCNC
LV
17
216
219
215
218
214
2
213
212
103
105
107
104
106108109
GND
A[13]
T
MDATA[14]
MDA
A[9]
T
VDDM
TA[10]
A
DA
M
MDATA[12]
MDATA[11]
MD
XIN
XOUT
HWRESET
5
3
5
5
2
254
2
Pin 1
66676869
P
N
GND
VRADN
U
AUVRA
A
DI[15]
VDDP
DI[14]
0
1
5
25
2
252
0
71
7
EF
_AU
VR
AUL0
D
U
A
VD
A
AVDD_MPLL
256
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
C1
49
Y1
50
C0
51
Y0
52
53
54
55
56
57
58
59
60
61
62
63
64
65
1M
SIF
DI[9]
DI[10]
DI[13]
DI[12]
DI[11]
DI[8]
GNDVDDC
247
4
7
1
R
AU
245
246
5
7
76
AUL2
AUCOM
43
244
2
777881
L3
AU
AUR2
48
249
2
73
72
1
L
AU
AUR0
DI[4]
DI[6]
DI[5]
DI[7]
240
239
242
238
241
0
3
9
8
7
82
8
NC
BPSL
BPSR
AUR3
AUMONO
VDDP
237
84
C
N
DI[0]
IVSYNCIHSYNC
DI[3]
DI[2]
DI[1]
234
235
233
236
232
87
85
899192
86
88
L
S
T
NC
NC
U
OUT
O
U
UOUTR
A
AU
A
IDE
30
231
2
90
NCNCNC
GPIOE[1]
GPIOE[2]
ICLK
GPIOE[0]
229
227
228
226
MS T9W55L
XXXXXXXXXXX
XXXXX
94
93
95
NC
NC
NC
LVB0P
GPIOE[3]
GND
VDDP
LVB0M
221
224
222
225
223
96
97
98
99
100
DC
NC
D
GND
VDDP
V
QS[1]
D
EN 33TES2.0E LA9.
P
2
A
V
LVA2M
M
D
D
V
LVA3P
L
LVACKM
LVACKP
LVA3M
203
202
201200
199
118
119120
122
121
A[3]
TA[0]
T
A
MDATA[2]
MDATA[1]
MD
MDA
NC
198
123
QM
D
QS[0]
D
VDD_MPLL
NC
VDDP
VDDC
A
94
1
197
196
195
125
12412612
127
KF
L
VREF
MCLK
MC
MCLKZ
M
PWM3
193
8
ADR[1]
B
192
PWM2
191
DIGO[8]
190
DIGO[7]
189
DIGO[6]
188
DIGO[5]
187
DIGO[4]
186
DIGO[3]
DIGO[2]
185
184
DIGO[1]
183
DIGO[0]
182
VDDC
181
GND
180
VDDP
179
IRIN
178
INT
177
DDCA_CK
176
DDCA_DA
175
DDCR_CK
174
DDCR_DA
173
PWM1
172
PWM0
171
SAR3
170
SAR2
169
SAR1
168
SAR0
167
SDO
166
CSZ
165
SDI
164
SCK
163
GND
162
VDDP
161
ALE
160
RDZ
159
WRZ
158
AD[7]
157
AD[6]
156
AD[5]
155
AD[4]
154
AD[3]
153
AD[2]
152
AD[1]
151
AD[0]
150
MADR[11]
149
MADR[10]
148
MADR[9]
147
MADR[8]
146
VDDC
145
GND
144
VDDM
143
MADR[7]
142
MADR[6]
141
MADR[5]
140
MADR[4]
139
MADR[3]
138
MADR[2]
137
MADR[1]
136
MADR[0]
135
WEZ
134
CASZ
133
AVDD_MEMPL
132
VDDM
131
GND
130
RASZ
129
BADR[0]
Figure 9-3 Internal block diagram and pin configuration
H_17490_029.eps
291007
Page 34
EN 34TES2.0E LA9.
Circuit Descriptions, Abbreviation List, and IC Data Sheets