15.1Introduction to soldering surface mount
packages
15.2Reflow soldering
15.3Wave soldering
15.4Manual soldering
15.5Suitability of surface mount IC packages for
wave and reflow soldering methods
16DATA SHEET STATUS
17DEFINITIONS
18DISCLAIMERS
19PURCHASE OF PHILIPS I2C COMPONENTS
2003 Feb 042
Page 3
Philips SemiconductorsProduct specification
Up-level Car radio Analog Signal
Processor (CASP)
1FEATURES
1.1General
• I2C-bus compatible
• Digital alignment/adjustment via I2C-bus:
– FM noise blanker sensitivity
– FM stereo noise canceller
– FM High Cut Control (HCC)
– FM stereo separation.
• FM audio processing hold for RDS updating; holds the
detectors for the FM weak signal processing in their
present state
• FM bandwidth limiting; limits the bandwidth of the FM
audio signal with external capacitors
• AM stereo input; AM stereo audio can be fed in at the
pins for the de-emphasis capacitors; this will provide
8 dB of gain to the AM audio.
1.2Stereo decoder and noise blanking
• FM stereo decoder
• Accepts FM multiplex signal and AM audio at input
• Pilot detector and pilot canceller
• De-emphasis selectable between 75 and 50 µs
• AM noise blanker: impulse noise detectorand an audio
hold.
1.3Weak signal processing
TEA6886HL
• Volume 1 control from +20 to −56 dB in 1 dB steps;
programmable 20 dB loudness control included
• Volume 2 control from 0 to −56 dB in 1 dB steps,
−56, −58.5, −62, −68 dB and mute
• Programmable loudness control with bass boost as well
as bass and treble boost
• Treble control from −14 to +14 dB in 2 dB steps
• Bass control from −18 to +18 dB in 2 dB steps with
selectable characteristic
• Analog Step Interpolation (ASI) minimizes pops by
smoothing out the transitions in the audio signal when a
switch is made
• Audio Blend Control (ABC) minimizes pops by
automatically incrementing the volume and loudness
controls through each step between their present
settings and the new settings
• Rear Seat Audio (RSA) can select different sources for
the front and rear speakers
• Chime input: can be sent to any audio output, at any
volume level
• Chime adder circuit: chime input can also be summed
with left front and/or right front audio, or be turned off.
• FM weak signal processing: six signal condition
detectors, soft mute, stereo noise canceller (blend) and
high cut control (roll-off).
1.4Audio pre-amplifier
• Source selector for 6 sources: 2 stereo inputs external
(A and B),1 symmetrical stereoinput(C),1 symmetrical
mono input (D), 1 internal stereo input (AM or FM) and
1 chime/diagnostic mono input
The TEA6886HL is a monolithic bipolar integrated circuit
providing the stereo decoder function and ignition noise
blanking facility combined with source selector and
tone/volume control for AM/FM car radio applications. The
device operates with a power supply voltage range from
7.8 to 9.2 V and a typical current consumption of 40 mA.
(S+N)/Nsignal-plus-noise to noise ratioVo= 2.0 V; Gv= 0 dB;
THDtotal harmonic distortionV
RR
100
CMRRcommon mode rejection ratio
supply voltage7.88.59.2V
supply current324048mA
channel separation40−−dB
output voltage level at pins ROPO
and LOPO (RMS value)
maximum output voltage level at
FM: 91% modulation;
8409501060mV
AM: 100% modulation;
f
= 400 Hz
mod
VCC= 8.5 V; THD ≤ 0.1%2000−−mV
pins LF, LR, RF and RR (RMS value)
voltage gain1 dB steps−112−+20dB
step resolution (volume)−1−dB
bass control−18−+18dB
treble control−14−+14dB
step resolution (bass and treble)−2−dB
−107−dB
unweighted
= 1.0 V; Gv=0dB −0.01−%
o(rms)
ripple rejectionV
ripple(rms)
< 200 mV;
−70−dB
f = 100 Hz; Gv=0dB
4853−dB
differential stereo input
2003 Feb 044
Page 5
Philips SemiconductorsProduct specification
Up-level Car radio Analog Signal
Processor (CASP)
5BLOCK DIAGRAM
handbook, full pagewidth
from
NICE
(FMHOLD)
33 nF
AM
mono
input
MPX
input
220
nF
RIN 182 kΩ
33 pF
2
C-bus
I
to NICE
220 kΩ
220 nF
10 nF
10 µF
10 nF
3.3 nF
3.3 nF
2.7 nF
2.7 nF
4.7 nF
4.7 nF
82 kΩ100 kΩ
FMHOLD
AMHIN
AMNBIN
TMUTE
MPXRDS
TSNC
MPXIN
FMNCAP
DEEML
DEEMR
FMLBUF
FMRBUF
TWBAM1
TUSN1
SDAQ
63
64
65
66
67
68
69
70
71
72
73
74
75
76
77
from
NICE
(AFSAMPLE)
470 kΩ
AFSAMPLE
5958 57 56
120 kHz
HIGH-PASS
AMPLIFIER
AGC
PULSE
SEPARATOR
60 kHz
HIGH-PASS
AND
USN
DETECTOR
sensitivity
INPUT BUFFER
AND
80 kHz
LOW-PASS
sep.adj.
mute slope
mute start
bus controls
CONTROL LOGIC
2
I
C-bus
to NICE
3
SCLQ
level detector
4
LEVEL
from AM/FM
I2C-BUS
f
ref
(75.4 kHz)
100
nF
FM NB-GATES
DE-EMPHASIS
AM STEREO INPUT
AND
5
2
I
C-bus
10
68 kΩ
nF
100 nF
PILOT
FREF
PHASE
trigger sensitivity
NOISE
AND
INTERFERENCE
DETECTOR
pilot
STEREO
DECODER
PLL
V/I
CONVERTER
MATRIX
AND
SOFT-MUTE
FM BUFFER
AND
50/75 µs
AND
6
SCL
SDA
ind.
19 kHz
38 kHz
de-emphasis
switch
detector hold
detector reset
test
78
DGND
22 kΩ
22 kΩ
V
DD(5 V)
38 kHz
start/
slope
SNC
HCC
STEREO
DECODER
OUTPUT
FM
PULSE
FORMER
TEA6886HL
start/
slope
LEVEL
ADC
(6-BIT)
LEVEL
INPUT
BUFFER
BUS
sensitivity
20 kHz
BAND-PASS
AND
AMWB
DETECTOR
6.8 nF
TUSN2
55
TEA6886HL
100
6.8 nF
TWBAM2
54
AVERAGE
DETECTOR
(MUTE/HCC)
DETECTOR
DETECTOR
(WBAM2)
DETECTOR
AVERAGE
DETECTOR
(WBAM1)
AVERAGE
DETECTOR
TBL
10 nF
AM
GATE
PEAK
(SNC)
PEAK
PEAK
(USN2)
(USN1)
100
nF
kΩ
IREF
53
test
detector
hold
detector
reset
detector
hold
MHB818
22
nF
AMHCAP
52
A
B
C
D
E
F
G
H
Fig.1 Block diagram (continued in Fig.2).
2003 Feb 045
Page 6
Philips SemiconductorsProduct specification
Up-level Car radio Analog Signal
Processor (CASP)
handbook, full pagewidth
3.3
kΩ
330
10
pF
nF
AMHOLD
AMPCAP
LTC
51 50
A
B
AM
PULSE
FORMER
PEAK
TO
AVERAGE
DETECTOR
49
220
nF
LBI
4847
220
nF
LBO
CHIME ADDER
(G = −20 dB)
AND
SWITCH
VOLUME 2
LEFT
FRONT
LF
46
BUS
15 nF
LR
ASICAP
45
4443
BUS
BUSBUS
VOLUME 2
LEFT
REAR
BUS
REAR
SEAT
AUDIO
SWITCH
RR
BUS
VOLUME 2
RIGHT
REAR
CHIME ADDER
(G = −20 dB)
AND
SWITCH
BUS
VOLUME 2
RIGHT
FRONT
TEA6886HL
RF
37
220 nF
220 nF
10 nF
68 nF
C
KVR
100
C
VHS
47 µF
nF
100 nF
100 nF
1 µF
1 µF
3.3 kΩ
4.7 kΩ
43 kΩ
680 nF
220 nF
C
KIL
220 nF
C
KIR
220 nF
36
BUS
BUS
BUS
35
34
33
32
31
30
29
28
27
26
25
24
23
RBO
RBI
RTC
RLN
ROPI
ROPO
ALI
AMNCAP
ARI
VHS
MONOP
MONOC
CLIP
CCOM
MHB819
12
LLN
4.7 kΩ
43 kΩ
LEFT
BASS
BAND
LEFT
TREBLE
BAND
VOLUME 1
LEFT
LOUDNESS
LEFT
BUS
680 pF
LOPI
C
220 nF
KVL
ASI
ABC
INTERPOLATION
BLEND CONTROL
TEA6886HL
14
LOPO
ANALOG STEP
(ASI)
AUDIO
(ABC)
ASI/ABC
control
BUS
SOURCE SELECTOR
REAR SEAT AUDIO SELECTOR
16
1513
BRI
ADR
220nF
AND
17
BLI
220
nF
C
WBAM
INTERNAL
POWER
SUPPLY
V
CC
(+8.5 V)
ADC
(3-bit)
BUS
USN
ADC
(3-bit)
BUS
9
V
100 nF
10
CC
D
E
F
G
H
CHIME
11
AGND
68
nF
BUS
BUS
BUS
ASI
18
C
22 µF
ABC
SCAP
ELFI
RIGHT
BASS
BAND
RIGHT
TREBLE
BAND
VOLUME 1
RIGHT
LOUDNESS
RIGHT
BUS
19
CRIP
1 µF
Fig.2 Block diagram (continued from Fig.1).
2003 Feb 046
Page 7
Philips SemiconductorsProduct specification
Up-level Car radio Analog Signal
TEA6886HL
Processor (CASP)
6PINNING
SYMBOLPINDESCRIPTION
n.c.1not connected
n.c.2not connected
SCLQ3clock output (to TEA6840H)
LEVEL4FM and AM level input (from TEA6840H)
SCL5I2C-bus clock input
SDA6I2C-bus data input/output
DGND7digital ground
TBL8time constant for FM modulation detector
V
CC
CHIME10chime tone input
AGND11analog ground
LLN12loudness left network
LOPI13left option port input (terminal impedance typical 100 kΩ)
LOPO14left option port output
BRI15channel B right stereo input (terminal impedance typical 100 kΩ)
ADR16address select input
BLI17channel B left stereo input (terminal impedance typical 100 kΩ)
SCAP18supply filter capacitor
CRIP19channel C right symmetrical input (terminal impedance typical 30 kΩ)
n.c.20not connected
n.c.21not connected
n.c.22not connected
CCOM23channel C common input (terminal impedance typical 30 kΩ)
CLIP24channel C left symmetrical input (terminal impedance typical 30 kΩ)
MONOC25mono common input (terminal impedance typical 30 kΩ)
MONOP26mono symmetrical input (terminal impedance typical 30 kΩ)
VHS27half supply filter capacitor
ARI28channel A right stereo input (terminal impedance typical 100 kΩ)
AMNCAP29peak-to-average detector capacitor for AM noise blanker
ALI30channel A left stereo input (terminal impedance typical 100 kΩ)
ROPO31right option port output
ROPI32right option port input (terminal impedance typical 100 kΩ)
RLN33loudness right network
RTC34right treble capacitor
RBI35right bass network input
RBO36right bass network output
RF37right front output
n.c.38not connected
n.c.39not connected
n.c.40not connected
9supply voltage
2003 Feb 047
Page 8
Philips SemiconductorsProduct specification
Up-level Car radio Analog Signal
TEA6886HL
Processor (CASP)
SYMBOLPINDESCRIPTION
n.c.41not connected
n.c.42not connected
RR43right rear output
ASICAP44analog step interpolate capacitor
LR45left rear output
LF46left front output
LBO47left bass network output
LBI48left bass network input
LTC49left treble capacitor
AMPCAP50AM blanking time capacitor
AMHOLD51AM noise blanker flag
AMHCAP52AM noise blanker hold capacitor
IREF53temperature independent reference current
TWBAM254time constant for AM wideband peak detector
TUSN255time constant for ultrasonic noise peak detector
PHASE56phase detector
FREF57frequency reference input (75.4 kHz from TEA6840H)
PILOT58pilot on/off output
AFSAMPLE59reset for multipath detector (from TEA6840H for RDS update)
n.c.60not connected
n.c.61not connected
n.c.62not connected
FMHOLD63FM audio processing hold input (from TEA6840H for RDS update)
AMHIN64AM signal input (from TEA6840H)
AMNBIN65AM noise blanker input (from TEA6840H)
TMUTE66time constant for soft mute
MPXRDS67unmuted MPX input (from TEA6840H for RDS update)
TSNC68time constant for stereo noise canceller
MPXIN69MPX input (from TEA6840H)
FMNCAP70FM noise detector capacitor
DEEML71left de-emphasis capacitor
DEEMR72right de-emphasis capacitor
FMLBUF73left AM/FM audio buffer capacitor
FMRBUF74right AM/FM audio buffer capacitor
TWBAM175time constant for AM wideband average detector
TUSN176time constant for ultrasonic noise average detector
SDAQ77data input/output (to TEA6840H)
n.c.78not connected
n.c.79not connected
n.c.80not connected
2003 Feb 048
Page 9
Philips SemiconductorsProduct specification
Up-level Car radio Analog Signal
Processor (CASP)
n.c.
n.c.
n.c.
SDAQ
TUSN1
TWBAM1
75
FMRBUF
74
handbook, full pagewidth
n.c.
n.c.
SCLQ
LEVEL
SCL
SDA
DGND
TBL
V
CC
CHIME
AGND
LLN
LOPI
LOPO
BRI
ADR
BLI
SCAP
CRIP
n.c.
80
79
78
77
76
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
FMLBUF
DEEMR
73
72
TEA6886HL
DEEML
71
FMNCAP
MPXIN
70
69
TSNC
68
MPXRDS
TMUTE
67
66
AMNBIN
AMHIN
65
64
TEA6886HL
FMHOLD
n.c.
n.c.
63
62
61
n.c.
60
AFSAMPLE
59
PILOT
58
FREF
57
PHASE
56
TUSN2
55
TWBAM2
54
IREF
53
AMHCAP
52
AMHOLD
51
AMPCAP
50
LTC
49
LBI
48
LBO
47
LF
46
LR
45
ASICAP
44
RR
43
n.c.
42
n.c.
41
21
22
23
24
25
26
27
28
29
n.c.
n.c.
CCOM
CLIP
MONOP
MONOC
VHS
ARI
AMNCAP
Fig.3 Pin configuration.
2003 Feb 049
30
ALI
31
ROPO
32
ROPI
33
RLN
34
RTC
35
RBI
36
RBO
37
RF
38
n.c.
39
n.c.
40
n.c.
MHB817
Page 10
Philips SemiconductorsProduct specification
Up-level Car radio Analog Signal
Processor (CASP)
7FUNCTIONAL DESCRIPTION
7.1Stereo decoder
The MPX input is the null-node of an operational amplifier
with internal feedback resistor. Adapting the stereo
decoder input to the level of the MPX signal, coming from
the FM demodulator output, is realized by the value of the
input series resistor RIN. To this input a second source
(AM detector output) can be fed by current addition.
The input amplifier is followed by an integrated 4th-order
Bessel low-pass filter with a cut-off frequency of 80 kHz.
It provides the necessary signal delay for FM noise
blanking and damping of high frequency interference at
the stereo decoder input.
The output signal of this filter is fed to the soft mute control
circuitry, the output is voltage-to-current converted and
then fed to the phase detector, pilot detector and pilot
canceller circuits, contained in the stereo decoder PLL
block. A PLL is used for regeneration of the 38 kHz
subcarrier. The fully integrated oscillator is adjusted by
means of a digital auxiliary PLL into the capture range of
the main PLL. The auxiliary PLL needs an external
reference frequency (75.4 kHz) which is provided by the
TEA6840H. The required 19 and 38 kHz signals are
generated by division of the oscillator output signal in a
logic circuit. The 19 kHz quadrature phase signal is fed to
the 19 kHz phase detector, where it is compared with the
incoming pilot tone. The DC output signal of the phase
detector controls the oscillator (PLL).
The pilot present detector is driven by an internally
generated in-phase 19 kHz signal. Its pilot dependent DC
output voltage is fed to a threshold switch, which activates
the pilot indicator bit and switches the stereo decoder to
stereo operation. The same DC voltage is used to control
theamplitudeofananti-phaseinternallygenerated 19 kHz
signal. The pilot tone is compensated by this anti-phase
19 kHz signal in the pilot canceller.
The pilot cancelled signal is fed to the matrix. There, the
side signal is demodulated and combined with the main
signal to the left and right audio channels. Compensation
for roll-off in the incoming MPX signal caused by the IF
filters and the FM demodulator is typically realized by an
external compensation network at pin MPXIN, individual
alignment is achieved by I2C-bus controlled amplification
of the side signal (DAA). A smooth mono-to-stereo
takeover is achieved by controlling the efficiency of the
matrix with the help of the SNC peak detector.
The matrix is followed by the FM noise suppression gates,
which are combined with FM single poles and High Cut
Control (HCC).
TEA6886HL
Thesinglepoleisdefinedbyinternal resistors and external
capacitors. Audio is fed from the gate circuits to the
switchable de-emphasis, where the demodulated AM
stereo signal can be fed in. After de-emphasis the signal
passes to the output buffers and is fed to the radio input of
the source selector. For HCC, the time constant of the
single pole contained in the output buffer can be changed
to higher values. This function is controlled by an average
detector contained in the multipath and fading detector.
7.2FM noise blanker
The input of the ignition noise blanker is coupled to the
MPXRDS input signal and to the LEVEL input. Both
signalsarefedviaseparate120 kHz filters and rectifiers to
anaddercircuit.Theoutputsignalof the adder circuit is fed
in parallel to the noise detector and the interference
detector. The noise detector is a negative peak detector.
Its output controls the trigger sensitivity (prevention of
false triggering at noisy input signals) and the gain of the
MPX high-pass filter. The output of the interference
detector, when receiving a steep pulse, fires a single-shot
trigger circuit, contained in the pulse former circuitry. The
time constant of the single-shot trigger circuit is defined by
an internal capacitor, and its output activates the blanking
gates in the audio.
7.3AM noise blanker
The AM noise blanking pulse is derived from the AM audio
signal which is fed into pin AMNBIN with the help of a
peak-to-averagecomparator. The blanking time is set by a
pulse former with external capacitor. The blanking pulse is
fed to the gate in the AM audio path and out at
pin AMHOLD to operate the gate built into the external
AM stereo processor.
7.4Multipath/fading detection and weak signal
control
For FM signal quality dependent controls there is a built-in
combination of six detectors. These detectors are driven
by the level information direct, by the AC components on
thelevelviaa20 kHz band-pass filter (AM wideband) or by
the high notes present at the FM demodulator output via a
60 kHz high-pass filter (ultrasonic noise). The relationship
between the DC level and the AC components is
programmable by the I2C-bus (2 bits each). The output of
the level buffer, AM wideband detector and ultrasonic
noise detector are analog-to-digital converted and
readable by the I2C-bus.
2003 Feb 0410
Page 11
Philips SemiconductorsProduct specification
Up-level Car radio Analog Signal
Processor (CASP)
For the period of fast RDS updating soft mute, SNC and
HCC can be put on hold. The AM wideband peak detector
and the ultrasonic noise peak detector are reset by a
switch signal delivered from the TEA6840H via pin
FMHOLD.
The six separate detecting circuits are as follows:
1. The AM wideband noise peak detector is driven from
a 20 kHz band-pass filter connected to the level buffer
output. The time constant is defined by an external
capacitor connected to pin TWBAM2. The output
voltage of the detector is analog-to-digital converted
by a 3-bit ADC.
2. The AM wideband noise average detector is driven
from a 20 kHz band-pass filter connected to the level
buffer output. The time constant is defined by an
external capacitor connected to pin TWBAM1. The
outputofthe detector is connected to the Stereo Noise
Control (SNC) circuit.
3. The ultrasonic noise peak detector is driven from a
60 kHz high-pass filter connected to the MPX signal
from pin MPXRDS. The time constant is defined by an
external capacitor connected to pin TUSN2. The
output voltage of the detector is analog-to-digital
converted by a 3-bit ADC.
4. The ultrasonic noise average detector is driven from a
60 kHz high-pass filter connected to the MPX signal
from pin MPXRDS. The time constant is defined by an
external capacitor connected to pin TUSN1. The
output of the detector is connected to soft mute control
and stereo noise control circuits.
5. For soft mute and high cut control purposes an
average detector with an externally defined time
constant (TMUTE) is provided. The detector is driven
byleveloutputonly.Softmuteandhighcutcontrolcan
be switched off via the I2C-bus.
6. The stereo noise control peak detector with an
externally defined time constant (TSNC) is driven by
DC level output, AM wideband and ultrasonic noise
outputs.Itprovidesthestereo blend facility (SNC).The
starting point and slope of the stereo blend can be
chosen via the I2C-bus controlled reference voltage.
TEA6886HL
7.5Tone/volume control
The tone/volume control part consists of the following
functions:
• Source selector
• Loudness
• Volume 1
• Treble
• Bass
• Volume 2
• Rear Seat Audio (RSA) selector
• Chime adder
• Analog step interpolation
• Audio blend control.
The stages loudness, volume 1, bass and volume 2
include the Analog Step Interpolation (ASI) function. This
minimizes pops by smoothing out the transitions in the
audio signal during switching. The transition time is
I2C-bus programmable in a range of 1 : 24 in four steps.
The stages loudness, volume 1 and volume 2 also have
the Audio Blend Control (ABC) function. This minimizes
pops by automatically incrementing the volume and
loudnesscontrolsthrougheach step between theirpresent
settings and the new settings. The speed of the ABC
function is correlated with the transition time of the ASI
function.
All stages are controlled via the I2C-bus.
2003 Feb 0411
Page 12
Philips SemiconductorsProduct specification
Up-level Car radio Analog Signal
Processor (CASP)
7.5.1SOURCE SELECTOR
The source selector allows the selection between
6 sources:
• 2 external stereo inputs (ALI, ARI, BLI and BRI)
• 1 external symmetrical stereo input (CLIP, CRIP and
CCOM)
• 1 external symmetrical mono input (MONOP and
MONON)
• 1 internal stereo input (AM/FM)
• 1 chime/diagnostic mono input (CHIME).
A chime input signal can be sent to any audio output, at
any volume level, via the chime/diagnostic mono input.
7.5.2LOUDNESS
The output of the source selector is fed into the loudness
circuitviatheexternalcapacitorC
and LOPI) and C
Depending on the external circuits for the left and the right
channel, only a bass boost or bass and treble boost is
available.Theexternalcircuits illustrated in Figs 13and 15
will produce the curves illustrated in Figs 14 and 16
(without the influence of C
(between pins ROPO and ROPI).
KVR
and C
KVL
(betweenpinsLOPO
KVL
respectively).
KVR
TEA6886HL
7.5.5BASS
Thebasscontrolisthenext stage. The characteristic ofthe
bass curves depends upon the external circuits connected
to pins LBO and LBI (left channel) and pins RBO and RBI
(rightchannel)andalsouponthe setting of bit BSYM(MSB
of the bass control byte). When BSYM = 1, an equalizer
characteristic is obtained and when BSYM = 0, a shelving
characteristic is obtained.
Figures 17 and 18 show the bass curves with an external
circuit of 2 × 220 nF capacitors and a resistor of 3.3 kΩ for
each channel with different values for BSYM. Figure 19
shows the bass curves with an external capacitor of 47 nF
for each channel and BSYM = 0, for boost and cut.
7.5.6VOLUME 2
The four volume 2 blocks are located at the end of the
tone/volume control. In addition to volume control (same
settings as volume 2) the balance and fader functions are
alsoperformedbyindividualattenuation offsets for the four
attenuators. The control range of these attenuators is
56 dB in steps of 1 dB and the additional steps of
−58.5 dB, −62 dB, −68 dB and a mute step.
7.5.7RSA SELECTOR
7.5.3VOLUME 1
The volume 1 control circuit follows the loudness circuit.
The control range of volume 1 is between +20 and −36 dB
in steps of 1 dB.
7.5.4TREBLE
The output signal of the volume 1 control circuit is fed into
the treble control stage. The control range is between
+14 and −14 dB in steps of 2 dB. Fig.20 shows the control
characteristic with external capacitors of 10 nF.
The RSA selector provides the possibility to select an
alternative source for the rear channels. In this event rear
channels are only controlled by the volume 2 function.
7.5.8CHIME ADDER
The chime adder circuit enables the chime input signal to
be summed with the left front and/or right front audio, or be
turned off.
2003 Feb 0412
Page 13
Philips SemiconductorsProduct specification
Up-level Car radio Analog Signal
TEA6886HL
Processor (CASP)
8LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
SYMBOLPARAMETERCONDITIONSMIN.MAX.UNIT
V
CC
V
i
P
tot
T
stg
T
amb
V
es
Notes
1. Machine model (R = 0 Ω, C = 200 pF).
2. Human body model (R = 1.5 kΩ, C = 100 pF).
9THERMAL CHARACTERISTICS
supply voltage−0.3+10V
voltage at all pins (except SCL and SDA)VCC≤ 10 VVSS− 0.3 V
CC
voltage at pins SCL and SDAVSS− 0.3 9.7V
total power dissipation−480mW
storage temperature−65+150°C
ambient temperature−40+85°C
electrostatic handling voltage for all pinsnote 1−200+200V
note 2−2000+2000V
V
SYMBOLPARAMETERCONDITIONSVALUEUNIT
R
th(j-a)
thermal resistance from junction to ambient in free air54K/W
2003 Feb 0413
Page 14
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2003 Feb 0414
10 CHARACTERISTICS
FM part: input signal V
i(MPX)(p-p)
= 1.89 V; m = 100% (∆f=±75 kHz, f
= 400 Hz); de-emphasis of 75 µs and series resistor at input RIN= 182 kΩ;
mod
FM audio measurements are taken at pins LOPO and ROPO.
Tone part: R
= 600 Ω; RL=10kΩ, AC-coupled; CL= 2.5 nF; CLK = square wave (5 to 0 V) at 100 kHz; stereo source = A channel input; volume 1
S
attenuator = 0 dB; loudness=0dB, off; volume 2 attenuators = 0 dB; bass linear; treble linear; input voltage = 1 V, f = 1 kHz. Tone part audio
measurements are taken at pins RF and LF. V
= 8.3 to 8.7 V; VSS=0V; T
CC
=25°C; unless otherwise specified.
amb
This IC shall not radiate noise in the audio system such that it disturbs any other circuit. This IC shall also not be susceptible to the radiation of any
other circuit.
MPX input signal (peak-to-peak value)Ri= 182 kΩ−1.89−V
overdrive margin of MPX input signalTHD = 1%6−−dB
AF input current−3.66−µA
maximum AF input currentTHD = 1%7.32−−µA
AF mono output signal (RMS value)91% modulation without pilot89010001110mV
AF mono channel balancewithout pilot; V
LOPO/VROPO
−1−+1dB
channel separationaligned setting of data byte 1, bit 0 to bit 3;
m = 30% modulation plus 9% pilot
L=1; R=0404770dB
L=0; R=1404770dB
THDtotal harmonic distortionV
i(MPX)(p-p)
V
i(MPX)(p-p)
= 1.89 V; f
= 1.89 V; f
= 1 kHz without pilot−0.10.3%
mod
= 5 kHz
mod
L=1; R=0−0.10.3%
L=0; R=1−0.10.3%
S/Nsignal-to-noise ratiof = 20 Hz to 15 kHz7578−dB
α
19
α
38
α
57
α
76
pilot signal suppressionf = 19 kHz4050−dB
subcarrier suppressionf = 38 kHz3550−dB
f = 57 kHz40−−dB
f = 76 kHz5060−dB
Philips SemiconductorsProduct specification
Up-level Car radio Analog Signal
Processor (CASP)
TEA6886HL
Page 15
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2003 Feb 0415
SYMBOLPARAMETERCONDITIONSMIN.TYP.MAX.UNIT
IM2second order intermodulation for
f
= 1 kHz
spur
IM3third order intermodulation for f
α
57(RDS)
α
67
traffic radio (RDS)f = 57 kHz; note 2−70−dB
Subsidiary Communication Authorization
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2003 Feb 0428
SYMBOLPARAMETERCONDITIONSMIN.TYP.MAX.UNIT
Source selector
Z
i(stereo)
Z
i(sym)
stereo input impedance (A and B input)80100120kΩ
symmetrical input impedance
243036kΩ
(C and mono input)
Z
i(CHIME)
Z
o
R
L
C
L
CHIME input impedance (chime input)80100120kΩ
output impedance at ROPO and LOPO−80100Ω
output load resistance at ROPO and LOPO10−−kΩ
output load capacitance at ROPO and
0−2500pF
LOPO
G
v
α
S
source selector voltage gain−0.20+0.2dB
input isolation of one selected source to
any other input
f = 1 kHz90105−dB
f = 12.5 kHz8095−dB
f=20Hzto20kHz7590−dB
V
i(rms)
maximum input voltage (RMS value)THD < 0.5%; VCC= 8.5 V2.02.15−V
THD < 0.5%; VCC= 7.8 V1.81.9−V
Loudness control
Z
i
G
loudness
input impedance at ROPI and LOPI80100120kΩ
loudness control, maximum gainf = 1 kHz; loudness on/off−0.20+0.2dB
f = 60 Hz; cut; BSYC = 0−2−dB
f = 60 Hz; cut; BSYC = 11.21.61.9dB
step error between any adjoining stepf = 60 Hz−−0.5dB
f
c
Q
EQ
e
bow
centre frequencyC
equalizer quality factorV
equalizer bowingV
=2× 220 nF; R
bass
= 200 mV; boost = 12 dB0.80.91.1
i(rms)
= 200 mV; bass and treble boost = 12 dB;
i(rms)
= 3.3 kΩ506070Hz
bass
−2.13.3dB
reference flat frequency response
Volume 2 control
G
v
G
step
voltage gain−68−0dB
step resolutionGv=0to−56 dB−1−dB
step error between any adjoining stepGv=0to−56 dB−−0.5dB
additional steps−−58.5−dB
−−62−dB
−−68−dB
Philips SemiconductorsProduct specification
Up-level Car radio Analog Signal
Processor (CASP)
TEA6886HL
Page 30
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2003 Feb 0430
SYMBOLPARAMETERCONDITIONSMIN.TYP.MAX.UNIT
α
mute
mute attenuation100110−dB
f=20Hzto20kHz7585−dB
∆G
a
attenuator gain set errorGv=0to−32 dB−1−+1dB
Gv= −32 to −68 dB−2−+2dB
∆G
Z
R
C
R
track
o
L
o(L)
o(L)
gain tracking errorGv=0to−56 dB−01dB
output impedance−80120Ω
output load resistance2−−kΩ
output load capacitance0−10nF
DC load resistance at output to ground4.7−−kΩ
Chime adder
G
v(CHIME)
V
i(CHIME)(rms)
chime adder voltage gainV
= 1 V; chime input; chime adder on−21−20−19dB
i(rms)
maximum chime input voltage (sine wave)main output voltage V
< 1.5 V; chime input;
o(rms)
2.0−−V
chime adder on
kfactor for V
to avoid internal clipping k × V
i(CHIME)
i(CHIME)(p-p)
< 5.7 V − V
o(p-p)
0.220.250.28
Digital part (SDA, SDAQ, SCL, SCLQ, FMHOLD, AFSAMPLE); note 18
V
11.1Read mode: 1st data byte
Table 4 Format of 1st data byte
7654321 0
STINRDSULVL5LVL4LVL3LVL2LVL1LVL0
Table 5 Description of 1st data byte bits
BITSYMBOLDESCRIPTION
7STINStereo indicator. This bit indicates if a pilot signal has been detected. If STIN = 0, then
no pilot signal has been detected. If STIN = 1, then a pilot signal has been detected.
6RDSUMeasure mode. This bit selects the measure mode forthe RDS flags. If RDSU = 0, then
continuous mode is selected. If RDSU = 1, then RDS update mode is selected.
5 to 0LVL[5:0]ADC voltage level. These 6 bits determine the ADC voltage level; see Table 6.
Table 6 Level setting ADC
V
(V)LVL5LVL4LVL3LVL2LVL1LVL0
LEVEL
3.600111111
3.553111110
3.506111101
3.460111100
3.413111011
3.366111010
3.319111001
3.272111000
3.225110111
3.179110110
3.132110101
3.085110100
3.038110011
2.991110010
2.944110001
2.898110000
2.851101111
2.804101110
2.757101101
2.710101100
2.663101011
2.617101010
2.570101001
2.523101000
2.476100111
2.429100110
2.383100101
2003 Feb 0434
Page 35
Philips SemiconductorsProduct specification
Up-level Car radio Analog Signal
Processor (CASP)
V
(V)LVL5LVL4LVL3LVL2LVL1LVL0
LEVEL
2.336100100
2.289100011
2.242100010
2.195100001
2.148100000
2.102011111
2.055011110
2.008011101
1.961011100
1.914011011
1.867011010
1.821011001
1.774011000
1.727010111
1.680010110
1.633010101
1.587010100
1.540010011
1.493010010
1.446010001
1.399010000
1.352001111
1.306001110
1.259001101
1.212001100
1.165001011
1.118001010
1.071001001
1.025001000
0.978000111
0.931000110
0.884000101
0.837000100
0.790000011
0.744000010
0.697000001
0.650000000
TEA6886HL
2003 Feb 0435
Page 36
Philips SemiconductorsProduct specification
Up-level Car radio Analog Signal
TEA6886HL
Processor (CASP)
11.2Read mode: 2nd data byte
Table 7 Format of 2nd data byte
76543210
−USN2USN1USN0−WBA2WBA1WBA0
Table 8 Description of 2nd data byte
BITSYMBOLDESCRIPTION
7−This bit is not used and must be set to logic 1.
6USN2Ultrasonic noise ADC. These 3 bits select the voltage level for the ultrasonic noise
5USN1
4USN0
3−This bit is not used and must be set to logic 1.
2WBA2AM wideband noise ADC. These 3 bits select the voltage level for the AM wideband
1WBA1
0WBA0
ADC; see Table 9.
ADC; see Table 10.
Table 9 Ultrasonic noise ADC
V
Table 10 AM wideband noise ADC
V
(V)USN2USN1USN0
TUSN2
4.500111
4.157110
3.814101
3.471100
3.129011
2.786010
2.443001
2.100000
TWBAM2
(V)WBA2WBA1WBA0
4.500111
4.157110
3.814101
3.471100
3.129011
2.786010
2.443001
2.100000
2003 Feb 0436
Page 37
Philips SemiconductorsProduct specification
Up-level Car radio Analog Signal
TEA6886HL
Processor (CASP)
11.3Subaddress byte for write
Table 11 Format for subaddress byte
76543210
AIOFBOUT−−SAD3SAD2SAD1SAD0
Table 12 Description of subaddress byte
BITSYMBOLDESCRIPTION
7AIOFAuto-increment control. This bit controls the auto-increment function. If AIOF = 0, then
the auto-increment is on. If AIOF = 1, then auto-increment is off.
6BOUTI2C-bus output control. This bit enables/disables the I2C-bus output SDAQ and SCLQ
to the TEA6840H. If BOUT = 0, then the I2C-bus output is disabled. If BOUT = 1, then
the I2C-bus output is enabled.
5−These 2 bits are not used; both must be set to logic 0.
4−
3SAD3Data byte select. These 4 bits select which data byte is to be addressed; see Table 13.
2SAD2
1SAD1
0SAD0
Table 13 Selection of data byte
ADDRESSED DATA BYTEMNEMONICSAD3SAD2SAD1SAD0
Alignment 0ALGN00000
Alignment 1ALGN10001
Alignment 2ALGN20010
Alignment 3ALGN30011
ASI time source selectorSSEL0100
Bass controlBASS0101
Treble control TRBL0110
Loudness controlLOUD0111
Volume 1VOLU11000
Volume 2, left frontVOL2_LF1001
Volume 2, right frontVOL2_RF1010
Volume 2, left rearVOL2_LR1011
Volume 2, right rearVOL2_RR1100
Not used
Not used
Not used
Note
1. Not tested; function not guaranteed.
(1)
(1)
(1)
−1101
−1110
−1111
2003 Feb 0437
Page 38
Philips SemiconductorsProduct specification
Up-level Car radio Analog Signal
TEA6886HL
Processor (CASP)
11.4Write mode: subaddress 0H
Table 14 Format of data byte Alignment 0 (ALGN0)
76543210
AMONAMSTSEARSMUTMMUTMONOMST1MST0
Table 15 Description of ALGN0 bits
BITSYMBOLDESCRIPTION
7AMONAM/FM mode selection. These 2 bits select the AM/FM mode and source; see
6AMST
5SEARSearch mode selection. If SEAR = 0, then mute and SNC detectors normal. If
4SMUTSoft mute enable. If SMUT = 0, then soft mute off. If SMUT = 1, then soft mute
3MMUTMuting of MPX output. If MMUT = 0, then MPX output not muted. If MMUT = 1, then
2MONOStereo decoder mode selection. If MONO = 0, then Stereo mode selected. If
1MST1Start of muting. These 2 bits determine the value of V
0MST0
Table 16.
SEAR = 1, then mute and SNC detectors fast.
enabled.
MPX output muted.
MONO = 1, then Mono mode selected.
; see Table 17 and Fig.4.
TMUTE
Table 16 Setting of AM/FM mode
SELECTED MODEAMONAMST
AM stereo mode, note 111
AM mode, active input AMHIN10
Not allowed01
FM mode, active input MPXIN00
Note
1. MPX input (MPXIN) and AM input (AMHIN) muted, stereo decoder in mono mode and de-emphasis terminals
(DEEML and DEEMR) are audio signal inputs.
Table 17 Setting of start of muting (α
V
(V)MST1MST0
TMUTE
2.4511
2.3010
2.1501
2.0000
MUTE
= 6 dB)
2003 Feb 0438
Page 39
Philips SemiconductorsProduct specification
Up-level Car radio Analog Signal
Processor (CASP)
α
MUTE
(dB)
0
10
handbook, full pagewidth
TEA6886HL
MHB413
(1)
(2)
(3)
(4)
20
1.01.5
Data byte ALGN2: MSL0 = 1, MSL1 = 1
Data byte ALGN0
CURVEMST1MST0
(1)00
(2)01
(3)10
(4)11
Fig.4 Soft mute attenuation as a function of V
2.0
TMUTE
2.53.03.5
and V
input voltage (fixed slope).
TUSN1
V
V
TMUTE
TUSN1
(V)
(V)
2003 Feb 0439
Page 40
Philips SemiconductorsProduct specification
Up-level Car radio Analog Signal
TEA6886HL
Processor (CASP)
11.5Write mode: subaddress 1H
Table 18 Format of data byte Alignment 1 (ALGN1)
76543210
USS1USS0AWS1AWS0CHS3CHS2CHS1CHS0
Table 19 Description of ALGN1 bits
BITSYMBOLDESCRIPTION
7USS1Ultrasonic noise sensitivity. These 2 bits determine the ultrasonic noise sensitivity
6USS0
5AWS1AM wideband sensitivity. These 2 bits determine the AM wideband sensitivity levels;
4AWS0
3CHS3Channel separation alignment. These 4 bits select the channel separation alignment;
2CHS2
1CHS1
0CHS0
levels; see Table 20 and Fig.5.
see Table 21 and Fig.6.
see Table 22.
Table 20 Setting of ultrasonic noise sensitivity (V
SLOPE (V/V)USS1USS0
−2.111
−2.910
−4.401
−6.800
MPXRDS(AC)
= 350 mV)
2003 Feb 0440
Page 41
Philips SemiconductorsProduct specification
Up-level Car radio Analog Signal
Processor (CASP)
V
TUSN2
V
TUSN1
V
TSNC
(V)
6
5
4
3
2
1
(1)
(2)
(3)
(4)
handbook, full pagewidth
TEA6886HL
MHB411
0
00.2
0.40.6
0.8
1.01.21.4
V
MPXRDS (80kHz)
(V)
Data byte ALGN1
CURVEUSS1USS0
(1)11
(2)10
(3)01
(4)00
Fig.5Ultrasonic noise peak and average detector output voltage as a function of MPX signal input, and stereo
noise control peak detector output voltage as a function of MPX signal input.
2003 Feb 0441
Page 42
Philips SemiconductorsProduct specification
Up-level Car radio Analog Signal
Processor (CASP)
Table 21 Setting of AM wideband sensitivity (V
SLOPE (V/V)AWS1AWS0
−2.211
−3.310
−4.901
−6.500
TWBAM2
TWBAM1
V
TSNC
(V)
6
5
4
handbook, full pagewidth
V
V
LEVEL(AC)
TEA6886HL
= 400 mV)
MHB410
(1)
(2)
3
2
1
0
0200
Data byte ALGN1
CURVEAWS1AWS0
(1)11
(2)10
(3)01
(4)00
(3)
(4)
400600
800
V
LEVELAC(24kHz)p-p
1000
(mV)
Fig.6AM wideband peak and average detector output voltage as a function of level AC signal input, and stereo
noise control peak detector output voltage as a function of level AC signal input.
2003 Feb 0442
Page 43
Philips SemiconductorsProduct specification
Up-level Car radio Analog Signal
TEA6886HL
Processor (CASP)
Table 22 Setting of channel separation alignment
CHANNEL SEPARATION ALIGNMENTCHS3CHS2CHS1CHS0
Not used
Not used
Not used
Not used
Not used
Not used
Setting 9, minimum gain of side signal1001
Setting 81000
Setting 70111
Setting 60110
Setting 50101
Setting 40100
Setting 30011
Setting 20010
Setting 10001
Setting 0, maximum gain of side signal0000
(1)
(1)
(1)
(1)
(1)
(1)
1111
1110
1101
1100
1011
1010
Note
1. Not tested; function not guaranteed.
11.6Write mode: subaddress 2H
Table 23 Format of data byte Alignment 2 (ALGN2)
76543210
MSL1MSL0SSL1SSL0SST3SST2SST1SST0
Table 24 Description of ALGN2 bits
BITSYMBOLDESCRIPTION
7MSL1Soft mute slope alignment. These 2 bits determine the value of V
6MSL0
see Table 25 and Fig.7.
TMUTE(DC)
;
5SSL1Stereo noise control slope alignment. These 2 bits determine the value of αcs;
4SSL0
see Table 26 and Fig.8.
3SST3Stereo noise control start alignment. These 4 bits determine the stereo noise control
2SST2
start alignment; see Table 27 and Fig.9.
1SST1
0SST0
2003 Feb 0443
Page 44
Philips SemiconductorsProduct specification
Up-level Car radio Analog Signal
Processor (CASP)
Table 25 Setting of soft mute slope alignment
V
TMUTE(DC)
0.395V
0.390V
0.380V
0.350V
α
MUTE
(dB)
0
10
handbook, full pagewidth
without AC11
TUSN1
without AC10
TUSN1
without AC01
TUSN1
without AC00
TUSN1
(1)
(2)
TEA6886HL
MSL1MSL0
MHB412
20
30
40
1.01.5
(3)
(4)
Data byte ALGN0: MST0 = 0, MST1 = 0
Data byte ALGN2
CURVEMSL1MSL0
(1)00
(2)01
(3)10
(4)11
2.0
2.53.03.5
V
TUSN1
V
TMUTE
(V)
(V)
Fig.7 Soft mute attenuation as a function of input voltages V
2003 Feb 0444
TUSN1
and V
TMUTE
(fixed start).
Page 45
Philips SemiconductorsProduct specification
Up-level Car radio Analog Signal
Processor (CASP)
Table 26 Setting of stereo noise control slope alignment (V
(dB)SSL1SSL0
α
cs
Not defined11
1310
701
500
50
handbook, full pagewidth
α
cs
(dB)
40
30
TSNC
= 0.72V
TUSN1
TEA6886HL
without AC)
MHB414
20
10
0
2.5
Data byte ALGN2: SST = 1000
Data byte ALGN2
CURVESSL0SSL1
(1)01
(2)10
(3)00
3.0
(2)(3)
(1)
3.54.04.5
V
TSNC
(V)
Fig.8 Channel separation as a function of voltage at pins TSNC, TWBAM1 and TUSN1 (fixed start).
2003 Feb 0445
Page 46
Philips SemiconductorsProduct specification
Up-level Car radio Analog Signal
Processor (CASP)
Table 27 Setting of stereo noise control start alignment (αcs= 6 dB)
Fig.9 Channel separation as a function of voltage at pins TSNC, TWBAM1 and TUSN1 (fixed slope).
(V)
2003 Feb 0447
Page 48
Philips SemiconductorsProduct specification
Up-level Car radio Analog Signal
TEA6886HL
Processor (CASP)
11.7Write mode: subaddress 3H
Table 28 Format of data byte Alignment 3 (ALGN3)
76543210
NBS1NBS0DE75HCCSHST1HST0HSL1HSL0
Table 29 Description of ALGN3 bits
BITSYMBOLDESCRIPTION
7NBS1Noise blanker sensitivity. These 2 bits determine the noise blanker sensitivity levels;
6NBS0
5DE75De-emphasis. If DE75 = 1, then de-emphasis is 75 µs. If DE75 = 0, then de-emphasis
4HCCSHCC control switch. With static roll-off: HCCS = 1, C
3HST1HCC start alignment. These 2 bits determine the alignment for the start of high cut
2HST0
1HSL1HCC slope alignment. These 2 bits determine the alignment for the slope of high cut
0HSL0
see Table 30.
is 50 µs.
Without static roll-off: HCCS = 0, C
control; see Table 31 and Fig.10.
control; see Table 32 and Fig.11.
FMLBUF=CFMRBUF
FMLBUF=CFMRBUF
= 680 pF.
= 2.7 nF.
Table 30 Setting of noise blanker sensitivity
V
pulse(p)(MPX)
(mV)V
pulse(p)(level)
(mV)NBS1NBS0
1211011
2412010
6015001
12020000
Table 31 Setting of alignment for start of high cut control (α
V
LEVEL(DC)
(V)HST1HST0
1.3011
1.4510
1.9001
2.1000
10kHz
= 3 dB)
2003 Feb 0448
Page 49
Philips SemiconductorsProduct specification
Up-level Car radio Analog Signal
Processor (CASP)
α
10kHz
(dB)
0
−2
−4
−6
−8
−10
handbook, full pagewidth
TEA6886HL
MHB417
(1)(2)(3)(4)
−12
14
Data byte ALGN3: HSL1 = 1, HSL0 = 0
Data byte ALGN3
CURVEHST1HST0
(1)11
(2)10
(3)01
(4)00
Fig.10 High cut control as a function of V
2
TMUTE
3
(fixed slope).
V
TMUTE
(V)
2003 Feb 0449
Page 50
Philips SemiconductorsProduct specification
Up-level Car radio Analog Signal
Processor (CASP)
Table 32 Setting of alignment for slope of high cut control (V
(dB)HSL1HSL0
α
10kHz
7.511
6.010
4.001
3.000
α
10kHz
(dB)
0
−2
−4
handbook, full pagewidth
TMUTE
TEA6886HL
= 2.4 V)
MHB416
−6
−8
−10
−12
14
(1)(2)(3) (4)
Data byte ALGN3: HST1 = 1, HST0 = 1
Data byte ALGN3
CURVEHSL1HSL0
(1)00
(2)01
(3)10
(4)11
2
3
V
TMUTE
(V)
Fig.11 High cut control as a function of V
2003 Feb 0450
TMUTE
(fixed start).
Page 51
Philips SemiconductorsProduct specification
Up-level Car radio Analog Signal
TEA6886HL
Processor (CASP)
11.8Write mode: subaddress 4H
Table 33 Format of data byte Source Selector (SSEL)
76543210
ASI1ASI0RSA2RSA1RSA0MSS2MSS1MSS0
Table 34 Description of SSEL bits
BITSYMBOLDESCRIPTION
7ASI1ASI/ABC speed selection. These 2 bits select the ASI/ABC speed (time per step);
6ASI0
5RSA2Rear seat audio selector. These 3 bits select the source for the rear outputs;
4RSA1
3RSA0
2MSS2Main source selector. These 3 bits select the source for the main control part;
1MSS1
0MSS0
see Table 35.
see Table 36.
see Table 37.
Table 35 ASI/ABC speed selection (C
ASI/ABC SPEED (ms)ASI1ASI0
2011
8.3310
3.3301
0.8300
Table 36 Selected source for rear outputs
SELECTED SOURCERSA2RSA1RSA0
Internal, main channel
Internal, main channel
Internal, main channel
Internal, main channel100
AM/FM (internal)011
Input A (stereo)010
Input B (stereo)001
Input C (stereo, symmetrical)000
Note
1. Not tested; function not guaranteed.
(1)
(1)
(1)
ASICAP
= 15 nF)
111
110
101
2003 Feb 0451
Page 52
Philips SemiconductorsProduct specification
Up-level Car radio Analog Signal
TEA6886HL
Processor (CASP)
Table 37 Selected source for main control part
SELECTED SOURCEMSS2MSS1MSS0
Chime input
Chime input
Chime input101
Input D (mono,
symmetrical)
AM/FM (internal)011
Input A (stereo)010
Input B (stereo)001
Input C (stereo,
symmetrical)
Note
1. Not tested; function not guaranteed.
11.9Write mode: subaddress 5H
Table 38 Format of data byte Bass control (BASS)
(1)
(1)
111
110
100
000
76543210
BSYC−BSYBBAS4BAS3BAS2BAS1BAS0
Table 39 Description of BASS bits
BITSYMBOLDESCRIPTION
7BSYCBass filter mode for cut. If BSYC = 0, then shelving characteristic selected.
If BSYC = 1, then band-pass filter characteristic selected.
6−This bit is not used and must be set to logic 0.
5BSYBBass filter mode for boost. If BSYB = 0, then shelving characteristic selected.
If BSYB = 1, then band-pass filter characteristic selected.
4BAS4Bass control. These 5 bits determine the bass control level; see Table 40.
3BAS3
2BAS2
1BAS1
0BAS0
2003 Feb 0452
Page 53
Philips SemiconductorsProduct specification
Up-level Car radio Analog Signal
Processor (CASP)
Table 40 Setting of bass control level
BASS CONTROL (dB)BAS4BAS3BAS2BAS1BAS0
(1)
+18
(1)
+18
(1)
+18
(1)
+18
(1)
+18
+18 11010
+16 11001
+14 11000
+12 10111
+10 10110
+810101
+610100
+410011
+210010
+010001
−010000
−2 (−1.8)01111
−4 (−3.6)01110
−6 (−5.4)01101
−8 (−7.1)01100
−10 (−8.7)01011
−12 (−10.3)01010
−14 (−11.7)01001
−16 (−13.1)01000
−18 (−14.4)00111
−18 (−14.4)
−18 (−14.4)
−18 (−14.4)
−18 (−14.4)
−18 (−14.4)
−18 (−14.4)
−18 (−14.4)
(1)
(1)
(1)
(1)
(1)
(1)
(1)
TEA6886HL
11111
11110
11101
11100
11011
00110
00101
00100
00011
00010
00001
00000
Note
1. Not tested; function not guaranteed.
2003 Feb 0453
Page 54
Philips SemiconductorsProduct specification
Up-level Car radio Analog Signal
TEA6886HL
Processor (CASP)
11.10 Write mode: subaddress 6H
Table 41 Format of data byte Treble control (TRBL)
76543210
HSTM−−−TRE3TRE2TRE1TRE0
Table 42 Description of TRBL bits
BITSYMBOLDESCRIPTION
7HSTMTest mode muting average and SNC peak detector. If HSTM = 0, then normal
operation. If HSTM = 1, then increased detector currents.
6−These 3 bits are not used; each must be set to logic 0.
5−
4−
3TRE3Treble control. These 4bits determine the treble control level; see Table 43.
2TRE2
1TRE1
0TRE0
Table 43 Setting of treble control level
TREBLE CONTROL (dB)TRE3TRE2TRE1TRE0
+14 1111
+12 1110
+10 1101
+81100
+61011
+41010
+21001
+01000
−00111
−20110
−40101
−60100
−80011
−10 0010
−12 0001
−14 0000
2003 Feb 0454
Page 55
Philips SemiconductorsProduct specification
Up-level Car radio Analog Signal
TEA6886HL
Processor (CASP)
11.11 Write mode: subaddress 7H
Table 44 Format of data byte Loudness control (LOUD)
76543210
LOFF−−LSN4LSN3LSN2LSN1LSN0
Table 45 Description of LOUD bits
BITSYMBOLDESCRIPTION
7LOFFLoudness switch control. If LOFF = 0, then the loudness switch is on. If LOFF = 1,
then loudness switch is off.
6−These 2 bits are not used, each must be set to logic 0.
5−
4LSN4Loudness control. These 5 bits determine the attenuation of the loudness block;
3LSN3
2LSN2
1LSN1
0LSN0
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2003 Feb 0484
coaxial connector (SMC)
test pin and STOCKO connector
jumper
FMHOLD
AMHIN
AMNBIN
TMUTE
MPXRDS
TSNC
MPXIN
1 µF
TWBAM1
TUSN1
SDAQ
to NICE
SDA
5 V
GND
SCL
SDA
5 V
GND
SCL
8.5 V
GND
5 V
10 nF
10 nF
10 nF
100 kΩ
3.3 nF
3.3 nF
2.7 nF
2.7 nF
220 kΩ
33 pF
220 nF
10 µF
4.7 nF
4.7 nF
AFSAMPLETUSN2 TWBAM2AMHOLD
6059 58575655 54535251 50494847 46454443 4241
61
62
63
64
65
66
67
68
82 kΩ
69
10 nF
70
71
72
73
74
75
76
77
78
79
80
1234567891011121314151617181920
10 kΩ
10 kΩ
330 µH
47
µF
f
ref
6.8
100
nF
10
68
nF
kΩ
470
100
100
kΩ
nF
nF
nF
100
DGND
nF
100
kΩ
10
nF
6.8
nF
book, full pagewidth
22
330
nF
pF
TEA6886HL
100
nF
AGND
CHIMESDASCLLEVELSCLQ
LF LR
3.3
kΩ
10
220
nF
nF
220
680
68
pF
nF
43 kΩ
4.7 kΩ
22
µF
220
nF
nF
100
100
nF
nF
LOPO BRIBLI
RR
22
µF
22
15
µF
nF
ASICAP
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
22
21
22
100
µF
nF
220 nF
100 nF
22 µF
220 nF
220 nF
10 nF
68 nF
680 pF
100 nF
100 nF
100 nF
47 µF
100 nF
100 nF
1 µF
1 µF
100 nF
1 µF
100 nF
ROPI
RF
3.3 kΩ
4.7 kΩ
43 kΩ
ROPO
ALI
ARI
MONOP
MONOC
CLIP
CCOM
LOPI
CRIP
MHB875
13 TEST CIRCUIT
Up-level Car radio Analog Signal
Processor (CASP)
TEA6886HL
Philips SemiconductorsProduct specification
Fig.21 Test circuit.
Page 85
Philips SemiconductorsProduct specification
Up-level Car radio Analog Signal
Processor (CASP)
14 PACKAGE OUTLINE
LQFP80: plastic low profile quad flat package; 80 leads; body 12 x 12 x 1.4 mm
c
y
X
A
6041
61
Z
40
E
TEA6886HL
SOT315-1
e
w M
b
p
80
1
DIMENSIONS (mm are the original dimensions)
mm
A
max.
1.6
0.16
0.04
UNIT
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
pin 1 index
e
A1A2A3b
1.5
1.3
b
0.25
p
D
H
D
w M
cE
0.18
0.12
D
12.1
11.9
p
0.27
0.13
21
20
Z
D
0510 mm
(1)
(1)(1)(1)
12.1
11.9
v M
B
v M
B
scale
eH
H
14.15
0.5
13.85
H
E
E
A
E
D
14.15
13.85
A
2
A
LL
p
0.75
0.30
(A )
L
p
Zywvθ
E
1.45
1.05
3
θ
o
7
o
0
A
1
L
detail X
Z
D
0.150.10.21.0
1.45
1.05
OUTLINE
VERSION
SOT315-1136E15MS-026
IEC JEDEC EIAJ
REFERENCES
2003 Feb 0485
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
00-01-19
Page 86
Philips SemiconductorsProduct specification
Up-level Car radio Analog Signal
Processor (CASP)
15 SOLDERING
15.1Introduction to soldering surface mount
packages
Thistextgivesaverybriefinsighttoa complex technology.
A more in-depth account of soldering ICs can be found in
our
“Data Handbook IC26; Integrated Circuit Packages”
(document order number 9398 652 90011).
There is no soldering method that is ideal for all surface
mount IC packages. Wave soldering can still be used for
certainsurfacemountICs,butitis not suitable for fine pitch
SMDs. In these situations reflow soldering is
recommended.
15.2Reflow soldering
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
totheprinted-circuitboardbyscreenprinting,stencillingor
pressure-syringe dispensing before package placement.
Several methods exist for reflowing; for example,
convection or convection/infrared heating in a conveyor
type oven. Throughput times (preheating, soldering and
cooling) vary between 100 and 200 seconds depending
on heating method.
Typical reflow peak temperatures range from
215 to 250 °C. The top-surface temperature of the
packages should preferable be kept below 220 °C for
thick/large packages, and below 235 °C for small/thin
packages.
15.3Wave soldering
Conventional single wave soldering is not recommended
forsurfacemountdevices(SMDs)orprinted-circuit boards
with a high component density, as solder bridging and
non-wetting can present major problems.
To overcome these problems the double-wave soldering
method was specifically developed.
TEA6886HL
If wave soldering is used the following conditions must be
observed for optimal results:
• Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.
• For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27 mm, the footprint
longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;
– smaller than 1.27 mm, the footprint longitudinal axis
must be parallel to the transport direction of the
printed-circuit board.
The footprint must incorporate solder thieves at the
downstream end.
• Forpackageswithleadsonfoursides, the footprint must
be placed at a 45° angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
15.4Manual soldering
Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300 °C.
When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320 °C.
2003 Feb 0486
Page 87
Philips SemiconductorsProduct specification
Up-level Car radio Analog Signal
TEA6886HL
Processor (CASP)
15.5Suitability of surface mount IC packages for wave and reflow soldering methods
2. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
3. These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder
4. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.
5. Wave soldering is suitable for LQFP, TQFP and QFP packages with a pitch (e) larger than 0.8 mm; it is definitely not
6. Wave soldering is suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
, SO, SOJsuitablesuitable
from your Philips Semiconductors sales office.
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the
cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side,
the solder might be deposited on the heatsink surface.
The package footprint must incorporate solder thieves downstream and at the side corners.
suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
IObjective dataDevelopmentThis data sheet contains data from the objective specification for product
IIPreliminary data QualificationThis data sheet contains data from the preliminary specification.
IIIProduct dataProductionThis data sheet contains data from the product specification. Philips
Notes
1. Please consult the most recently issued data sheet before initiating or completing a design.
2. The product status of the device(s) described in this data sheet may have changed since this data sheet was
published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.
3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
DATA SHEET
STATUS
(1)
PRODUCT
STATUS
(2)(3)
development. Philips Semiconductors reserves the right to change the
specification in any manner without notice.
Supplementary data will be published at a later date. Philips
Semiconductors reserves the right to change the specification without
notice, in order to improve the design and supply the best possible
product.
Semiconductors reserves the right to make changes at any time in order
to improve the design, manufacturing and supply. Relevant changes will
be communicated via a Customer Product/Process Change Notification
(CPCN).
DEFINITION
17 DEFINITIONS
Short-form specification The data in a short-form
specification is extracted from a full data sheet with the
same type number and title. For detailed information see
the relevant data sheet or data handbook.
Limiting values definition Limiting values given are in
accordance with the Absolute Maximum Rating System
(IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device.
These are stress ratings only and operation of the device
attheseoratanyotherconditionsabovethosegiveninthe
Characteristics sections of the specification is not implied.
Exposure to limiting values for extended periods may
affect device reliability.
Application information Applications that are
described herein for any of these products are for
illustrative purposes only. Philips Semiconductors make
norepresentationorwarrantythat such applications will be
suitable for the specified use without further testing or
modification.
18 DISCLAIMERS
Life support applications These products are not
designed for use in life support appliances, devices, or
systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips
Semiconductorscustomersusingorselling these products
for use in such applications do so at their own risk and
agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Right to make changes Philips Semiconductors
reserves the right to make changes in the products including circuits, standard cells, and/or software described or contained herein in order to improve design
and/or performance. When the product is in full production
(status ‘Production’), relevant changes will be
communicated via a Customer Product/Process Change
Notification (CPCN). Philips Semiconductors assumes no
responsibility or liability for the use of any of these
products, conveys no licence or title under any patent,
copyright, or mask work right to these products, and
makes no representations or warranties that these
products are free from patent, copyright, or mask work
right infringement, unless otherwise specified.
2003 Feb 0488
Page 89
Philips SemiconductorsProduct specification
Up-level Car radio Analog Signal
Processor (CASP)
19 PURCHASE OF PHILIPS I2C COMPONENTS
Purchase of Philips I2C components conveys a license under the Philips’ I2C patent to use the
components in the I2C system provided the system conforms to the I2C specification defined by
Philips. This specification can be ordered using the code 9398 393 40011.
TEA6886HL
2003 Feb 0489
Page 90
Philips SemiconductorsProduct specification
Up-level Car radio Analog Signal
Processor (CASP)
TEA6886HL
NOTES
2003 Feb 0490
Page 91
Philips SemiconductorsProduct specification
Up-level Car radio Analog Signal
Processor (CASP)
TEA6886HL
NOTES
2003 Feb 0491
Page 92
Philips Semiconductors – a w orldwide compan y
Contact information
For additional information please visit http://www.semiconductors.philips.com.Fax: +31 40 27 24825
For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable andmaybechanged
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Printed in The Netherlands753503/02/pp92 Date of release: 2003 Feb 04Document order number: 9397 75010542
SCA75
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