12.2.10Read mode: data byte 0
13TEST AND APPLICATION INFORMATION
14INTERNAL CIRCUITRY
15PACKAGE OUTLINE
16SOLDERING
16.1Introduction to soldering surface mount
packages
16.2Reflow soldering
16.3Wave soldering
)
16.4Manual soldering
16.5Suitability of surface mount IC packages for
wave and reflow soldering methods
17DATA SHEET STATUS
18DEFINITIONS
19DISCLAIMERS
20PURCHASE OF PHILIPS I2C COMPONENTS
TEA6849H
2003 Dec 192
Page 3
Philips SemiconductorsProduct specification
New In Car Entertainment car radio tuner IC with
Precision Adjacent Channel Suppression (NICE-PACS)
1FEATURES
• FM mixer 1 for conversion of FM RF (65 to 108 MHz
and US weather band) to IF of 10.7 MHz; the mixer
provides inherent image rejection; for European and
US FMband/WB (weather band)themixer is drivenwith
a ‘high’ injection Local Oscillator (LO); in Japan
FM band and East Europe FM band the mixer is driven
with a ‘low’ injection LO
• AM mixer 1 for conversion of AM RF to AM IF1 of
10.7 MHz
• LC tuner oscillator providing mixer frequencies for
FM mixer and AM mixer 1
• AM mixer 2 for conversion of AM IF1 to AM IF2 of
450 kHz
• Crystal oscillator providing mixer frequencies for
AM mixer 2 and FM mixer 2 and reference for
synthesizerPLL, IF count, timingfor Radio DataSystem
(RDS) update and reference frequency for car audio
signal processor ICs
• Fastsynthesizer PLL tuningsystem with localcontrol for
inaudible RDS updating
• Timing function for RDS update algorithm and control
signal output for car audio signal processor ICs
(TEA688x, SAA77xx, TEF689x)
• I2C-bus adjustable FM MPX soft mute
• Digital alignment circuit for bus controlled matching of
oscillator tuning voltage to FM antenna tank circuit
tuning voltage
• AGC PIN diode drive circuit for FM RF AGC; AGC
detection at FM mixer input; the AGC PIN diode drive
can be activated by the I2C-bus as a local function for
search tuning; AGC threshold is a programmable and
keyed function switchable via the I2C-bus
• FM IF linear amplifier with high dynamic input range
• FM mixer 2 for conversion of FM IF1 to FM IF2 of
450 kHz with inherent image rejection
• Fully integrated dynamic selectivity and
FM demodulator at IF2; improved sensitivity with
dynamic threshold extension; centre frequency of IF2
selectivity alignment via the I2C-bus
• Level detector for AM and FM with temperature
compensated output voltage; starting point and slope of
level output is programmable via the I2C-bus
• AM cascode AGCstage and RF PIN diode drive circuit;
AGC threshold detection at AM mixer 1 and IF2 AGC
input; threshold for detection at mixer 1 input is
programmable via the I2C-bus
• AM IF2 AGC and demodulator
• AM AF output switchable to provide AM IF2 for
AM stereo decoder
• AM noise blanker with detection at IF1 and blanking at
AM IF2
• Software controlled flag output
• Buffer output for weather band flag
• Adjacent channel detector and modulation detector for
instantaneous bandwidth control of the integrated filter
• Flag and voltage output indicating the actual bandwidth.
2GENERAL DESCRIPTION
The TEA6849H is a single IC with car radio tuner for AM,
FM and Weather Band (WB) intended for microcontroller
tuning with the I2C-bus. It provides the following functions:
• AM double conversion receiver for LW, MW and SW
(31 m, 41 m and 49 m bands) with IF1 = 10.7 MHz and
IF2 = 450 kHz
• FM double conversion receiver with integrated image
rejection for IF1and forIF2 capable of selecting US FM,
US weather, Europe FM, East Europe FM and
Japan FM bands; fully integrated dynamic selectivity at
450 kHz FM IF2; FM demodulator with dynamic
threshold extension; centre frequency alignment of IF2
selectivity via the I2C-bus
• The tuning system includes VCO, crystal oscillator and
PLL synthesizer on one chip.
FMLIMDCFDB11decoupling in-phase FM limiter
FMLIMDCFDB22decoupling quadrature phase FM limiter
AMIF2DEC3decoupling for AM IF2 input
IREFFMIF24reference current for FM IF2
AMNBHOLD5AM noise blanker threshold
AMIF2IN6AM IF2 input (450 kHz) for demodulator AGC and AM level detector
IF1GND7AM IF1 ground
FMMIX2IN8FM mixer 2 input
COFFSET9DC feedback for offset compensation RDS mute
FMMIX2DEC10FM mixer 2 decoupling
IFCDAATEST11test pin for IF centre DAA
IFAMPOUT12IF amplifier output (10.7 MHz)
V
DDA1
IFAMPIN14FM IFamplifier and AM mixer 2 input (10.7 MHz)
IFAMPDEC15FM IF amplifier and AM mixer 2 decoupling
IF2FILQ16test output quadrature phase FM IF2 filter; time constant FM soft mute
IF2FILI17test output in-phase FM IF2 filter
MIX1OUT118FM mixer and AM mixer 1 IF output 1 (10.7 MHz)
MIX1OUT219FM mixer and AM mixer 1 IF output 2 (10.7 MHz)
V
DDA2
SWFLAG21output software programmable flag
AMMIX1DEC22AM mixer 1 decoupling
AMMIX1IN23AM mixer 1 input
VAMCASFB24feedback for cascode AM AGC
VAMCAS25cascode AM AGC
TAFAMAGC26AF time constant of AM front-end AGC
THFAMAGC27HF time constant of AM front-end AGC
IAMAGC28PIN diode drive current output of AM front-end AGC
V
ref(MIX)
FMMIXIN130FM RF mixer input 1
RFGND31RF ground
i.c.32internal connection
FMMIXIN233FM RF mixer input 2
WBFLAG34buffered weather band flag output
IFMAGC35PIN diode drive current output of FM front-end AGC
TFMAGC36time constant of FM front-end AGC
TKEYEDAGC37time constant of keyed FM front-end AGC
DAAOUT38output of digital auto alignment circuit for antenna tank circuit
DAATD39temperature compensation diode for digital auto alignment circuit for antenna tank circuit
DAAIN40input of digital auto alignment circuit for antenna tank circuit
13analog supply voltage 1 (8.5 V) for FM IF amplifier
20analog supply voltage 2 (8.5 V) for FM and AM RF
FREF45reference frequency output for signal processor IC
V
DDD
DGND47digital ground
VCOGND48VCO ground
OSCFDB49VCO feedback
OSCTNK50VCO tank circuit
V
DDA4
MPXDCFDB52DC feedback for FM MPX signal path
AFSAMPLE53AF sample flag output for car audio signal processor IC
AFHOLD54AF hold flag output for car audio signal processor IC
TRDSMUTE55time constant for RDS update mute
AMAFIF256AM demodulator AF output or IF2 output for AM stereo (multiplexed by I2C-bus)
RDSMPX57MPX output for RDS decoder and signal processor (not muted)
FMMPX58FM demodulator MPX output
V
DDA5
MODDET60modulation detector input
V
DDA6
IFBWFLAG62FM IF2 bandwidth flag output
SDA63I2C-bus data line input and output
SCL64I2C-bus clock line input
V
IFBW
IF2GND66AM IF2 ground
CINT67demodulator loop filter
MODETOUT68modulation detector output
TACD69adjacent channel detector time constant
V
level(AMFM)
XTAL171crystal oscillator 1
XTALGND72crystal oscillator ground
XTAL273crystal oscillator 2
V
level(ACD)
ACDTHRES75adjacent channel detector threshold
IREF76reference current for power supply
AMMIX2OUT177AM mixer 2 output 1 (450 kHz)
AMMIX2OUT278AM mixer 2 output 2 (450 kHz)
CAGC79AM IF AGC capacitor
V
ref(lim)
42tuning voltage
44analog supply voltage 3 (8.5 V) for tuning PLL
46digital supply voltage (5 V)
51analog supply voltage 4 (8.5 V) for VCO
59analog supply voltage 5 (5 V) for on-chip power supply
61analog supply voltage 6 (8.5 V) for on-chip power supply
65monitor voltage for FM IF2 bandwidth
70level voltage output for AM and FM
74level voltage output for adjacent channel detector
80limiter reference voltage
2003 Dec 197
Page 8
Philips SemiconductorsProduct specification
New In Car Entertainment car radio tuner IC with
Precision Adjacent Channel Suppression (NICE-PACS)
handbook, full pagewidth
FMLIMDCFDB1
FMLIMDCFDB2
AMIF2DEC
IREFFMIF2
AMNBHOLD
AMIF2IN
IF1GND
FMMIX2IN
COFFSET
FMMIX2DEC
IFCDAATEST
IFAMPOUT
V
DDA1
IFAMPIN
IFAMPDEC
IF2FILQ
IF2FILI
MIX1OUT1
MIX1OUT2
V
DDA2
ref(lim)
V
80
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
AMMIX2OUT2
CAGC
79
78
AMMIX2OUT1
IREF
77
76
level(ACD)
ACDTHRES
V
75
74
XTAL2
73
XTALGND
XTAL1
72
71
TEA6849H
level(AMFM)
V
70
TACD
69
MODETOUT
CINT
68
67
IF2GND
66
IFBW
V
65
SCL
64
SDA
63
TEA6849H
DDA6
V
IFBWFLAG
62
61
60
MODDET
V
59
FMMPX
58
RDSMPX
57
AMAFIF2
56
TRDSMUTE
55
AFHOLD
54
AFSAMPLE
53
MPXDCFDB
52
V
51
OSCTNK
50
OSCFDB
49
VCOGND
48
DGND
47
V
46
45
FREF
V
44
CPOUT
43
V
42
FMMUTE
41
DDA5
DDA4
DDD
DDA3
tune
21
22
23
24
25
26
27
28
29
ref(MIX)
SWFLAG
AMMIX1DEC
AMMIX1IN
VAMCASFB
VAMCAS
TAFAMAGC
IAMAGC
THFAMAGC
V
Fig.2 Pin configuration.
2003 Dec 198
30
31
RFGND
FMMIXIN1
32
i.c.
33
34
WBFLAG
FMMIXIN2
35
36
IFMAGC
TFMAGC
37
38
39
DAATD
DAAOUT
TKEYEDAGC
40
DAAIN
MHC426
Page 9
Philips SemiconductorsProduct specification
New In Car Entertainment car radio tuner IC with
Precision Adjacent Channel Suppression (NICE-PACS)
7FUNCTIONAL DESCRIPTION
7.1Oscillators
7.1.1VCO
Thevaractortuned VCO providesthelocaloscillator signal
for both FM and AM mixer 1. It has a frequency range of
162.9 to 248.2 MHz.
7.1.2PLL
Fast synthesizer PLL tuning system with local control for
inaudible RDS updating.
7.1.3CRYSTAL OSCILLATOR
The crystal oscillator provides a 20.5 MHz signal that is
used for:
• Reference frequency for frequency synthesizer PLL
audio signal processor - CASP) or TEF689x (car radio
integrated signal processor - CRISP).
7.2DAA
To reduce the numberof manual alignments in production
the following I2C-bus controlled Digital Auto Alignment
(DAA) functions are included:
• FM RF DAA
– 7-bit DAA circuitry for the conversion of the VCO
tuning voltage to a controlled alignment voltage for
the FM antenna tank circuit
• FM and AM level DAA
– Level DAA circuitry for alignment of slope (3-bit) and
starting point (5-bit) of the level curve
• IF2 centre DAA
– Centre frequency alignment (7-bit) of integrated
FM IF2 dynamic selectivity.
7.3FM signal channel
7.3.1FM MIXER 1
FM quadraturemixer converts FM RF (65 to 108 MHzand
weather band) to IF of 10.7 MHz. The FM mixer provides
inherent image rejection and high RF sensitivity.
It is capable of tuning the US FM, US weather,
Europe FM, Japan FM and East Europe FM bands:
• US FM = 87.9 to 107.9 MHz
• US weather FM = 162.4 to 162.55 MHz
• Europe FM = 87.5 to 108 MHz
• Japan FM = 76 to 91 MHz
• East Europe FM = 65 to 74 MHz.
7.3.2BUFFER OUTPUT FOR WEATHER BAND FLAG
(PIN WBFLAG)
The buffer output on pin WBFLAG is HIGH for weather
band mode.
7.3.3FM KEYED AGC
The AGC threshold is programmable and the keyed AGC
function is switchable via the I2C-bus. AGC detection
occurs at the input of the first FM mixer. If the keyed AGC
function is activated, the AGC is keyed only by the narrow
band level. The AGC PIN diode drive can be activated via
the I2C-bus as a local function forsearch tuning.The AGC
sourcesa constant10 mA current intothe FMPIN diode in
AM mode.
7.3.4FM IF AMPLIFIER
The FM IF amplifier provides 18 dB amplification withhigh
linearity over a wide dynamic range.
7.3.5FM MIXER 2
The FM mixer 2 converts 10.7 MHz FM IF1 to 450 kHz
FM IF2 in I and Q phase to achieve image rejection in the
demodulator.
TEA6849H
2003 Dec 199
Page 10
Philips SemiconductorsProduct specification
New In Car Entertainment car radio tuner IC with
Precision Adjacent Channel Suppression (NICE-PACS)
7.3.6FM IF2 DYNAMIC SELECTIVITY
The IF bandwidth of the FM IF2 is automatically adjusted
depending on modulation and reception conditions. The
centre frequency of the selectivity is adjusted by a 7-bit
instruction via the I2C-bus. The dynamic selectivity mode
and three fixed bandwidths (60, 90 and 130 kHz) can be
selected via the I2C-bus. The IF2 bandwidth is set to
13 kHz in weather band mode.
7.3.7FM QUADRATURE DEMODULATOR
The FM quadrature demodulator is adjustment free.
7.3.8FM MPX SOFT MUTE
Muting depth and start of muting are adjustable via the
I2C-bus (see Figs 8 and 9).
7.3.9ADJACENT CHANNEL DETECTOR AND THRESHOLD
EXTENSION
In the event of breakthrough of a strong neighbouring
transmitter, the IF2 bandwidth is reduced dynamically.
At lowRF inputvoltages and lowmodulation levels theIF2
bandwidth is reduced to achieve improved sensitivity by
demodulator threshold extension.
7.4.2AM RF AGC
The AM wideband AGC in front of the first AM mixer is
realized first bya cascadedNPN transistor, whichcontrols
the transconductance of theRF amplifier JFET with 10 dB
of AGC range. Second, an AM PIN diode stage with
antenna type and frequency dependent AGC range is
available. The minimum JFET drain source voltage is
controlled by a DC feedback loop (pin VAMCASFB) in
order to limit the cascode AGC range to 10 dB. If the
cascode AGC is not required, a simple RF AGC loop is
possible by using only a PIN diode. In this event
pins VAMCASFB and VAMCAS have to be open-circuit.
In FM mode, the cascade switches off the JFET bias
current to reduce totalpower consumption. The PIN diode
is biased by 1 mA in FM mode.
The AGC detection points for AM AGC are at the first AM
mixer input (threshold programmable via the I
the IF2 AGC input (fixed threshold).
7.4.3AM DETECTOR
The AM output provides either a detected AM AF or the
corresponding AM IF2 signal. The IF2 signal can be used
for AM stereo decoder processing. Soft mute function is
controlled by the I2C-bus in AM mono mode.
TEA6849H
2
C-bus) and
7.3.10BANDWIDTH CONTROL ‘ACTIVE’ FLAG
(PIN IFBWFLAG)
Flag output IBFW = 1 from pin IFBWFLAG indicates that
the IF2 bandwidth is reduced.
7.3.11BANDWIDTH CONTROL MONITOR VOLTAGE
(PIN V
Theactual bandwidth isindicated by a voltageat pin V
that is proportional, not linear, to the IF bandwidth.
7.4AM signal channel
7.4.1AM TUNER INCLUDING MIXER 1 AND MIXER 2
The AM tuner is realized in a doubleconversion technique
and is capable of selecting LW, MW and SW bands.
AM mixer 1 converts AM RF to IF1 of 10.7 MHz, while
AM mixer 2 converts IF1 of 10.7 MHz to IF2 of 450 kHz:
• LW = 144 to 288 kHz
• MW = 530 to 1710 kHz (US AM band)
• SW = 5.73 to 9.99 MHz (including the 31 m, 41 m and
49 m bands).
IFBW
)
IFBW
7.4.4AM NOISE BLANKER
The detection point for the AM noise blanker is the output
stage of AM mixer 1, while blanking is realized at the
output of the mixer 2.
Trigger sensitivity can be modified by adding an external
resistor at pin AMNBHOLD.
7.5FM and AM level detector
FM and AM level detectors provide the temperature
compensated output voltage. The starting points and
slopes of the level detector outputs are programmable via
the I2C-bus.
In accordance with the Absolute Maximum Rating System (IEC 60134).
SYMBOLPARAMETERCONDITIONSMIN.MAX.UNIT
V
DDA1
V
DDA2
V
DDA3
V
DDA4
V
DDA5
V
DDA6
V
DDD
∆V
DD8.5-DD5
T
stg
T
amb
V
es
analog supply voltage 1 for FM IF amplifier−0.3+10V
analog supply voltage 2 for FM and AM RF−0.3+10V
analog supply voltage 3 for tuning PLL−0.3+10V
analog supply voltage 4 for voltage controlled
−0.3+10V
oscillator
analog supply voltage 5 for on-chip power supply−0.3+6.5V
analog supply voltage 6 for on-chip power supply−0.3+10V
digital supply voltage−0.3+6.5V
difference between any 8.5 V supply voltage and
note 1−0.3−V
any 5 V supply voltage
storage temperature−55+150°C
ambient temperature−40+85°C
electrostatic handling voltagenote 2−200+200V
note 3−2000+2000V
Notes
1. To avoiddamage and wrong operation it is necessary to keep all 8.5 Vsupply voltagesat a higher level than any 5 V
supply voltage. This is also necessary during power-on and power-down sequences. Precautions have to be
provided in such a way that interference cannot pull down the 8.5 V supply below the 5 V supply.
2. Machine model (R = 0 Ω, C = 200 pF).
3. Human body model (R = 1.5 kΩ, C = 100 pF).
9THERMAL CHARACTERISTICS
SYMBOLPARAMETERCONDITIONSVALUEUNIT
R
R
th(j-a)
th(j-c)
thermal resistance from junction to ambientin free air54K/W
thermal resistance from junction to case9K/W
On-chip power supply reference current generator: pin IREF
V
o(ref)
R
o
I
o(max)
DDA5
=5V; V
DDD
=5V; T
=25°C; tested in the circuit of Figs 12 and 13; unless otherwise
amb
analog supply voltages 1 to 4 and 688.59V
analog supply voltage 54.7555.25V
digital supply voltage4.7555.25V
digital supply currentEurope/US band212631mA
Japan/East Europe band26.53339.5mA
analog supply current 1 for FM IF
5.57.38.8mA
amplifier
analog supply current 2 for FM RF4.25.26.2mA
analog supply current 3 for tuning PLL3.244.8mA
analog supply current 4 for VCO5.26.57.8mA
analog supply current 5 for on-chip
power supply
analog supply current 6 for on-chip
Europe/US band−3.8−mA
Japan/East Europe band−7.4−mA
21.52732.5mA
power supply
bias current of FM mixer output 14.867.2mA
bias current of FM mixer output 24.867.2mA
digital supply current222732mA
analog supply current 1 for
100120140µA
AM mixer 2
analog supply current 2 for RF1.41.82.2mA
analog supply current 3 for tuning PLL1.82.22.6mA
analog supply current 4 for VCO56.58mA
analog supply current 5 for on-chip
−11−mA
power supply
analog supply current 6 for on-chip
1417.521mA
power supply
bias current of AM mixer 1 output 14.867.2mA
bias current of AM mixer 1 output 24.867.2mA
bias current of AM mixer 2 output 13.64.55.4mA
bias current of AM mixer 2 output 23.64.55.4mA
output reference voltageR
output resistanceR
maximum output currentR
New In Car Entertainment car radio tuner IC with
Precision Adjacent Channel Suppression (NICE-PACS)
10
handbook, full pagewidth
V
FMMPX;
V
RDSMPX
(dB)
−10
−20
−30
−40
−50
−60
−70
−80
0
−3
10
(1)
(2)
(3)
(4)
(5)
−2
10
−1
10
11010
TEA6849H
2
V
FMMIX2IN
MHC442
9
V
level(AMFM)
(V)
8
7
6
5
4
3
2
1
0
3
10
(mV)
THD
(%)
(1) Output voltage for FMMPX and RDSMPX: fIF= 10.7 MHz; ∆f = 22.5 kHz; f
(2) Noise: unweighted B = 250 Hz to 15 kHz with de-emphasis 50 µs for FMMPX.
(3) Noise: unweighted B = 250 Hz to 15 kHz with de-emphasis 50 µs for RDSMPX.
(4) THD for FMMPX and RDSMPX.
(5) Level for standard setting of level DAA, byte 5 = 84H.
mod
= 1 kHz.
Fig.7 (S+N)/N, THD and level voltage for FM mode as a function of FM demodulator input voltage.
2003 Dec 1931
Page 32
Philips SemiconductorsProduct specification
New In Car Entertainment car radio tuner IC with
Precision Adjacent Channel Suppression (NICE-PACS)
New In Car Entertainment car radio tuner IC with
Precision Adjacent Channel Suppression (NICE-PACS)
12 I2C-BUS PROTOCOL
2
12.1I
Informationaboutthe I2C-buscanbe found inthebrochure
“The I2C-bus and how to use it”
9398 393 40011).
The standard I2C-bus specification is expanded by the
following definitions.
IC addresses:
• 1st IC address C2H: 1100001 R/W
• 2nd IC address C0H: 1100000 R/
Structure of the I
increment.
Subaddresses are not used.
A second I2C-bus address can be selected by connecting
pin FREF via a 68 kΩ resistor to GND.
Exception to the standard I2C-bus specification:
• The data hold time t
12.1.1DATA TRANSFER
C-bus specification
2
C-bus logic: slave transceiver with auto
HD;DAT
(order number
W.
must be at least 1 µs.
12.1.2I
When the IC is used together with the TEA688x or
TEF689x and both SCL and SDA lines are connected via
the I2C-bus to the TEA688x or TEF689x, the pull-up
resistors ofthe tuner IC should be connected to the digital
supply voltage of the TEA688x or TEF689x. Otherwise an
I2C-bus pull-down can occur switching off the tuner IC
supply when the I2C-bus buffer interface of the TEA688x
or TEF689x is enabled for data transfer to the tuner IC.
12.1.3FREQUENCY SETTING
For new frequency setting, in both AM and FM mode, the
programmable divider is enabled by setting bit MUTE = 1.
To select anFM frequency, twoI2C-bus transmissions are
necessary:
• First: bit MUTE = 1
• Second: bit MUTE = 0.
12.1.4DEFAULT SETTINGSNo default settings at power-on reset. One I2C-bus
transmission is required to program the IC.
2
C-BUS PULL-UP RESISTORS
TEA6849H
Data sequence: address, byte 0, byte 1, byte 2, byte 3,
byte 4, byte 5, byte 6, andbyte 7. The data transfer has to
be in this order. The LSB = 0 indicates a WRITE operation
to the TEA6849H.
Bit 7 of each byte is considered the MSB and has to be
transferred as the first bit of the byte.
The data becomes valid at the output of the internal
latches with the acknowledge of each byte. A STOP
condition after any byte can shorten transmission times.
When writing to the transceiver by using the STOP
condition before completion of the whole transfer:
• The remaining bytes will contain the old information
• If thetransfer of a byte is not completed, this byte is lost
and the previous information is available.
2003 Dec 1933
Page 34
Philips SemiconductorsProduct specification
New In Car Entertainment car radio tuner IC with
Precision Adjacent Channel Suppression (NICE-PACS)
12.2I2C-bus protocol
12.2.1DATA TRANSFER MODE AND IC ADDRESS
Table 1 Write mode
(1)
S
Notes
1. S = START condition.
2. A = acknowledge.
3. P = STOP condition.
Table 2 Read mode
(1)
S
Notes
1. S = START condition.
2. A = acknowledge.
Table 3 IC address byte
address (write)A
address (read)A
(2)
(2)
data byte(s)A
TEA6849H
(2)
data byte 1
(3)
P
IC ADDRESSMODE
1100000/1
(1)
Notes
1. Defined by address pin FREF:
a) 1 = 1st IC address
b) 0 = 2nd IC address.
2. Read or write mode:
a) 0 = write operation to TEA6849H
b) 1 = read operation from TEA6849H.
12.2.2WRITE MODE: DATA BYTE 0
Table 4 Format of data byte 0
BIT 7BIT 6BIT 5BIT 4BIT 3BIT 2BIT 1BIT 0
AFPLL14PLL13PLL12PLL11PLL10PLL9PLL8
Table 5 Description of data byte 0 bits
BITSYMBOLDESCRIPTION
7AFAlternative frequency. If AF = 0, then normal operation. If AF = 1, then AF (RDS)
update mode.
6 to 0PLL[14:8]Setting of programmable counter of synthesizer PLL. Upper byte of PLL divider
7 to 3LST[4:0]Setting of level DAA starting point. These 5 bits determine the offset of the level
detector output voltage.
2 to 0LSL[2:0]Setting of level DAA slope. These 3 bits determine the steepness of the level detector
output voltage.
Table 22 Standard setting of data byte 5 bits
SETTING OF LEVEL DAA STARTING POINTSETTING OF LEVEL DAA SLOPE
LST4LST3LST2LST1LST0LSL2LSL1LSL0
10000100
12.2.8WRITE MODE: DATA BYTE 6
Table 23 Format of data byte 6
BIT 7BIT 6BIT 5BIT 4BIT 3BIT 2BIT 1BIT 0
TECF6CF5CF4CF3CF2CF1CF0
Table 24 Description of data byte 6 bits
BITSYMBOLDESCRIPTION
7TEThreshold extension. If TE = 0, then threshold extension is off. If TE = 1, then
threshold extension is on.
6 to 0CF[6:0]Setting of FM IF2 centre frequency DAA. The content of CF6 to CF0 determines the
centre frequency of the 450 kHz filter.
12.2.9WRITE MODE: DATA BYTE 7
Table 25 Format of data byte 7
BIT 7BIT 6BIT 5BIT 4BIT 3BIT 2BIT 1BIT 0
0FMSMSSL2SSL1SSL0SST2SST1SST0
Table 26 Description of data byte 7 bits
BITSYMBOLDESCRIPTION
7−This bit is not used and must be set to logic 0.
6FMSMFM soft mute. If FMSM = 0,then FM soft muteis off.If FMSM = 1, then FM soft mute is
on.
5 to 3SSL[2:0]Setting of FM soft mute slope; 000 is flattest setting; see Fig.8
2 to 0SST[2:0]Setting of soft mute start; 000 is lowest setting; see Fig.9
SWFLAG21open-collector
AMMIX1DEC222.32.753.1floating
AMMIX1IN23 2.32.753.1floating
VAMCASFB243.74.34.900.10.2
VAMCAS25 4.555.500.11
TAFAMAGC2602.84.60 (no WB)0.3 (no WB)0.5 (no WB)
THFAMAGC272.52.83.1floating
IAMAGC288.5 (external biasing)123
V
New In Car Entertainment car radio tuner IC with
Precision Adjacent Channel Suppression (NICE-PACS)
PINSYMBOLEQUIVALENT CIRCUIT
4IREFFMIF2
4
MDB089
5AMNBHOLD
80 kΩ
5
MHC377
TEA6849H
7IF1GND
8FMMIX2IN
10FMMIX2DEC
9COFFSET
11IFCDAATEST
4 kΩ4 kΩ
10
350 Ω
8
MDB090
1 MΩ
9
MHC379
2003 Dec 1947
MHC453
11
Page 48
Philips SemiconductorsProduct specification
New In Car Entertainment car radio tuner IC with
Precision Adjacent Channel Suppression (NICE-PACS)
PINSYMBOLEQUIVALENT CIRCUIT
12IFAMPOUT
330 Ω
12
13V
14IFAMPIN
15IFAMPDEC
DDA1
kΩ
5
5
kΩ
14
MHC381
330 Ω
15
TEA6849H
MDB091
16IF2FILQ
17IF2FILI
16
MHC455
17
MHC454
2003 Dec 1948
Page 49
Philips SemiconductorsProduct specification
New In Car Entertainment car radio tuner IC with
Precision Adjacent Channel Suppression (NICE-PACS)
PINSYMBOLEQUIVALENT CIRCUIT
18MIX1OUT1
19MIX1OUT2
20V
21SWFLAG
DDA2
21
MHC384
TEA6849H
1918
MHC383
22AMMIX1DEC
23AMMIX1IN
24VAMCASFB
25VAMCAS
400 Ω
23
22
MHC385
10 kΩ
24
MHC447
1 kΩ
25
MHC448
2003 Dec 1949
Page 50
Philips SemiconductorsProduct specification
New In Car Entertainment car radio tuner IC with
Precision Adjacent Channel Suppression (NICE-PACS)
PINSYMBOLEQUIVALENT CIRCUIT
26TAFAMAGC
26
MDB100
27THFAMAGC
27
TEA6849H
28IAMAGC
29V
ref(MIX)
30FMMIXIN1
33FMMIXIN2
MDB101
28
MHC388
29
MHC389
10
kΩ
10
kΩ
2003 Dec 1950
3330
MHC390
Page 51
Philips SemiconductorsProduct specification
New In Car Entertainment car radio tuner IC with
Precision Adjacent Channel Suppression (NICE-PACS)
PINSYMBOLEQUIVALENT CIRCUIT
31RFGND
32i.c.
34WBFLAG
200 Ω
34
35IFMAGC
35
TEA6849H
50 kΩ
MHC391
MHC392
36TFMAGC
37TKEYEDAGC
10 kΩ
36
5 kΩ
37
MHC394
10 kΩ
MHC393
2003 Dec 1951
Page 52
Philips SemiconductorsProduct specification
New In Car Entertainment car radio tuner IC with
Precision Adjacent Channel Suppression (NICE-PACS)
PINSYMBOLEQUIVALENT CIRCUIT
38DAAOUT
36
kΩ
38
39DAATD
39
MHC396
TEA6849H
MHC395
40DAAIN
41FMMUTE
39
43
40
2.5 kΩ
MHC397
41
MDB210
2003 Dec 1952
Page 53
Philips SemiconductorsProduct specification
New In Car Entertainment car radio tuner IC with
Precision Adjacent Channel Suppression (NICE-PACS)
PINSYMBOLEQUIVALENT CIRCUIT
42V
43CPOUT
tune
42
MHC398
39
40
TEA6849H
44V
DDA3
45FREF
46V
DDD
47DGND
48VCOGND
43
MHC399
1 kΩ
45
MHC400
2003 Dec 1953
Page 54
Philips SemiconductorsProduct specification
New In Car Entertainment car radio tuner IC with
Precision Adjacent Channel Suppression (NICE-PACS)
PINSYMBOLEQUIVALENT CIRCUIT
49OSCFDB
50OSCTNK
50
49
51V
52MPXDCFDB
DDA4
TEA6849H
3 kΩ
MHC401
53AFSAMPLE
54AFHOLD
52
MHC449
53
MHC402
54
MHC403
2003 Dec 1954
Page 55
Philips SemiconductorsProduct specification
New In Car Entertainment car radio tuner IC with
Precision Adjacent Channel Suppression (NICE-PACS)
PINSYMBOLEQUIVALENT CIRCUIT
55TRDSMUTE
55
56AMAFIF2
56
TEA6849H
MHC404
0.35 pF
201 kΩ
57RDSMPX
58FMMPX
MHC405
300 Ω
57
MDB102
280 Ω
58
59V
DDA5
2003 Dec 1955
MDB103
Page 56
Philips SemiconductorsProduct specification
New In Car Entertainment car radio tuner IC with
Precision Adjacent Channel Suppression (NICE-PACS)
PINSYMBOLEQUIVALENT CIRCUIT
60MODDET
60
61V
62IFBWFLAG
DDA6
62
MDB211
TEA6849H
MDB104
63SDA
64SCL
65V
IFBW
66IF2GND
63
64
65
1 kΩ
MHC410
1 kΩ
MHC411
MDB096
2003 Dec 1956
Page 57
Philips SemiconductorsProduct specification
New In Car Entertainment car radio tuner IC with
Precision Adjacent Channel Suppression (NICE-PACS)
PINSYMBOLEQUIVALENT CIRCUIT
67CINT
67
MDB097
68MODETOUT
68
TEA6849H
69TACD
70V
level(AMFM)
2 kΩ
70
MHC450
69
MHC451
150 Ω
MHC414
2003 Dec 1957
Page 58
Philips SemiconductorsProduct specification
New In Car Entertainment car radio tuner IC with
Precision Adjacent Channel Suppression (NICE-PACS)
PINSYMBOLEQUIVALENT CIRCUIT
71XTAL1
72XTALGND
73XTAL2
74V
level(ACD)
27.6 pF
71
20 kΩ
10 kΩ
72
20 kΩ
TEA6849H
27.6 pF
73
10 kΩ
MHC415
75ACDTHRES
76IREF
8 kΩ
74
MDB212
75
MDB099
10 kΩ
2003 Dec 1958
76
MHC418
Page 59
Philips SemiconductorsProduct specification
New In Car Entertainment car radio tuner IC with
Precision Adjacent Channel Suppression (NICE-PACS)
PINSYMBOLEQUIVALENT CIRCUIT
77AMMIX2OUT1
78AMMIX2OUT2
79CAGC
79
TEA6849H
7877
MHC419
80V
MHC420
ref(lim)
80
MHC452
2003 Dec 1959
Page 60
Philips SemiconductorsProduct specification
New In Car Entertainment car radio tuner IC with
Precision Adjacent Channel Suppression (NICE-PACS)
15 PACKAGE OUTLINE
LQFP80: plastic low profile quad flat package; 80 leads; body 12 x 12 x 1.4 mm
c
y
X
A
6041
61
Z
40
E
TEA6849H
SOT315-1
e
w
M
b
p
80
1
DIMENSIONS (mm are the original dimensions)
A
UNIT
max.
0.16
1.6
mm
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
0.04
pin 1 index
e
A1A2A3b
1.5
1.3
b
0.25
p
D
H
D
w
M
cE
0.18
0.12
D
12.1
11.9
p
0.27
0.13
21
20
Z
D
0510 mm
(1)
(1)(1)(1)
12.1
11.9
v
M
B
v
M
B
scale
eHELL
H
14.15
0.5
13.85
H
E
E
A
D
14.15
13.85
A
2
A
A
1
detail X
Z
1.45
1.05
D
0.75
0.30
p
0.150.10.21
L
p
L
Zywvθ
E
1.45
1.05
(A )
3
θ
o
7
o
0
OUTLINE
VERSION
SOT315-1136E15MS-026
IEC JEDEC JEITA
REFERENCES
2003 Dec 1960
EUROPEAN
PROJECTION
ISSUE DATE
00-01-19
03-02-25
Page 61
Philips SemiconductorsProduct specification
New In Car Entertainment car radio tuner IC with
Precision Adjacent Channel Suppression (NICE-PACS)
16 SOLDERING
16.1Introduction to soldering surface mount
packages
Thistext gives averybrief insight to acomplextechnology.
A more in-depth account of soldering ICs can be found in
our
“Data Handbook IC26; Integrated Circuit Packages”
(document order number 9398 652 90011).
There is no soldering method that is ideal for all surface
mount IC packages. Wave soldering can still be used for
certainsurface mount ICs, butitis not suitableforfinepitch
SMDs. In these situations reflow soldering is
recommended.
16.2Reflow soldering
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
tothe printed-circuit boardby screen printing,stencilling or
pressure-syringe dispensing before package placement.
Driven by legislation and environmental forces the
worldwide use of lead-free solder pastes is increasing.
Several methods exist for reflowing; for example,
convection or convection/infrared heating in a conveyor
type oven. Throughput times (preheating, soldering and
cooling) vary between 100 and 200 seconds depending
on heating method.
Typical reflow peak temperatures range from
215 to 270 °C depending on solder paste material. The
top-surface temperature of the packages should
preferably be kept:
• below 220 °C (SnPb process) or below 245 °C (Pb-free
process)
– for all BGA and SSOP-T packages
– for packages with a thickness ≥ 2.5 mm
– for packages with a thickness < 2.5 mm and a
volume ≥ 350 mm3 so called thick/large packages.
• below 235 °C (SnPb process) or below 260 °C (Pb-free
process) for packages with a thickness < 2.5 mm and a
volume < 350 mm3 so called small/thin packages.
Moisture sensitivity precautions, as indicated on packing,
must be respected at all times.
To overcome these problems the double-wave soldering
method was specifically developed.
If wave soldering is used the following conditions must be
observed for optimal results:
• Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.
• For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27 mm, the footprint
longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;
– smaller than 1.27 mm, the footprint longitudinal axis
must be parallel to the transport direction of the
printed-circuit board.
The footprint must incorporate solder thieves at the
downstream end.
• Forpackages with leads onfoursides, the footprintmust
be placedat a 45° angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.
During placement and before soldering,the packagemust
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Typical dwell time of the leads in the wave ranges from
3 to 4 seconds at 250 °C or 265 °C, depending on solder
material applied, SnPb or Pb-free respectively.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
16.4Manual soldering
Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300 °C.
When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320 °C.
TEA6849H
16.3Wave soldering
Conventional single wave soldering is not recommended
forsurface mount devices (SMDs)orprinted-circuit boards
with a high component density, as solder bridging and
non-wetting can present major problems.
1. For more detailedinformation on theBGApackages refer tothe
“(LF)BGAApplication Note
from your Philips Semiconductors sales office.
2. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the
3. These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no account
be processed through morethan one soldering cycle or subjected to infrared reflow soldering with peaktemperature
exceeding 217 °C ± 10 °C measured in the atmosphere of the reflow oven. The package body peak temperature
must be kept as low as possible.
4. These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder
cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side,
the solder might be deposited on the heatsink surface.
5. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
6. Wave soldering is suitable for LQFP, TQFP and QFP packages with apitch (e) larger than 0.8 mm;it is definitely not
suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
7. Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger than
0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
8. Hot bar or manual soldering is suitable for PMFP packages.
IObjective dataDevelopmentThis data sheet contains data from the objective specification for product
IIPreliminary data QualificationThis data sheet contains data from the preliminary specification.
IIIProduct dataProductionThis data sheet contains data from the product specification. Philips
Notes
1. Please consult the most recently issued data sheet before initiating or completing a design.
2. The product status of the device(s) described in this data sheet may have changed since this data sheet was
published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.
3. For datasheets describingmultiple type numbers, the highest-level product status determines the data sheet status.
DATA SHEET
STATUS
(1)
PRODUCT
STATUS
(2)(3)
DEFINITION
development. Philips Semiconductors reserves the right to change the
specification in any manner without notice.
Supplementary data will be published at a later date. Philips
Semiconductors reserves the right to change the specification without
notice, in order to improve the design and supply the best possible
product.
Semiconductors reserves the right to make changes at any time in order
to improve the design, manufacturing and supply. Relevant changes will
be communicated via a Customer Product/Process Change Notification
(CPCN).
18 DEFINITIONS
Short-form specification The data in a short-form
specification is extracted from a full data sheet with the
same type number and title. For detailed information see
the relevant data sheet or data handbook.
Limiting values definition Limiting valuesgiven arein
accordance with the Absolute Maximum Rating System
(IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device.
These are stress ratings only and operation of the device
atthese or atanyother conditions abovethosegiven in the
Characteristics sectionsof the specificationis not implied.
Exposure to limiting values for extended periods may
affect device reliability.
Application information Applications that are
described herein for any of these products are for
illustrative purposes only. Philips Semiconductors make
norepresentationor warranty thatsuchapplicationswill be
suitable for the specified use without further testing or
modification.
19 DISCLAIMERS
Life support applications These products are not
designed for use in life support appliances, devices, or
systems where malfunction of these products can
reasonably be expectedto resultin personal injury.Philips
Semiconductorscustomersusing or sellingtheseproducts
for use in such applications do so at their own risk and
agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Right to make changes Philips Semiconductors
reserves the right to make changes in the products including circuits, standard cells, and/or software described or contained herein in order to improve design
and/or performance. When the productis infull production
(status ‘Production’), relevant changes will be
communicated via a Customer Product/Process Change
Notification (CPCN). Philips Semiconductors assumes no
responsibility or liability for the use of any of these
products, conveys no licence or title under any patent,
copyright, or mask work right to these products, and
makes no representations or warranties that these
products are free from patent, copyright, or mask work
right infringement, unless otherwise specified.
2003 Dec 1963
Page 64
Philips SemiconductorsProduct specification
New In Car Entertainment car radio tuner IC with
Precision Adjacent Channel Suppression (NICE-PACS)
20 PURCHASE OF PHILIPS I2C COMPONENTS
Purchase of Philips I2C components conveys a license under the Philips’ I2C patent to use the
components in the I2C system provided the system conforms to the I2C specification defined by
Philips. This specification can be ordered using the code 9398 393 40011.
TEA6849H
2003 Dec 1964
Page 65
Philips Semiconductors – a w orldwide compan y
Contact information
For additional information please visit http://www.semiconductors.philips.com.Fax: +31 40 27 24825
For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Printed in The NetherlandsR32/01/pp65 Date of release: 2003 Dec 19Document order number: 9397 750 10607
SCA75
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