Philips TEA1654 User Manual

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INTEGRATED CIRCUITS

DATA SH EET

TEA1654

GreenChipII SMPS control IC

Product speciﬁcation 2003 May 12

Page 2

Philips Semiconductors Product speciﬁcation

GreenChipII SMPS control IC TEA1654

FEATURES Distinctive features

• Universal mains supply operation (70 to 276 V AC)

• High level of integration, giving a very low external

component count.

Green features

• Valley or zero voltage switching for minimum switching losses

• Efficient quasi-resonant operation at high power levels

• Frequency reductionat low power standby for improved

system efficiency (<3 W)

• Cycle skipping mode at very low loads; Pi< 300 mW at no-load operation for a typical adapter application

• On-chip start-up current source

• Standby indication pin to indicate low output power

consumption.

Protection features

• Safe restart mode for system fault conditions

• Continuous mode protection by means of

demagnetization detection (zero switch-on current)

• Accurate and adjustable overvoltage protection (latched)

• Short winding protection

• Undervoltage protection (foldback during overload)

• Overtemperature protection (latched)

• Low and adjustable overcurrent protection trip level

• Soft (re)start

• Mains voltage-dependent operation-enabling level

• General purpose input for lock protection.

APPLICATIONS

Typical application areas are adapters and chargers (e.g. for laptops, camcorders and printers) and all applications that demand an efficient and cost-effective solution up to 250 W.

GENERAL DESCRIPTION

The GreenChip

(1)

II is the second generation of green Switched Mode Power Supply (SMPS) control ICs operatingdirectly from the rectified universalmains.A high level of integration leads to a cost effective power supply with a very low number of external components.

The special built-in green functions allow the efficiency to be optimum at all power levels. This holds for quasi-resonant operation at high power levels, as well as fixed frequency operation with valley switching at medium power levels. At low power (standby) levels, the system operates at reduced frequency and with valley detection.

The proprietary high voltage BCD800 process makes direct start-up possible from the rectified mains voltage in an effective and green way. A second low voltage BICMOS IC is used for accurate, high speed protection functions and control.

Highly efficient, reliable supplies can easily be designed using the GreenChipII control IC.

(1) GreenChip is a trademark of Koninklijke Philips

Electronics N.V.

2003 May 12 2

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Philips Semiconductors Product speciﬁcation

GreenChipII SMPS control IC TEA1654

handbook, full pagewidth

VCOadj

sense

STDBY

DRIVER

HVS HVS

DRAIN

1 2 3 4

TEA1654T

5 6 7

DEM

CTRL

LOCK

CC(5V)

GND

n.c.

MDB218

Fig.1 Basic application.

ORDERING INFORMATION

TYPE

NUMBER

NAME DESCRIPTION VERSION

PACKAGE

TEA1654T SO14 plastic small outline package; 14 leads; body width 3.9 mm SOT108-1

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Philips Semiconductors Product speciﬁcation

GreenChipII SMPS control IC TEA1654

BLOCK DIAGRAM

handbook, full pagewidth

GND

STDBY

VCOadj

CTRL

LOCK

300 Ω

5.6 V

TEA1654T

2.5 V

M-level

lock detect

FREQUENCY

CONTROL

−1

SUPPLY

MANAGEMENT

internal

supply

VOLTAGE

CONTROLLED

OSCILLATOR

POWER-ON

TEMPERATURE

PROTECTION

UVLO start

RESET

OVER-

LOGIC

UVLO

MAXIMUM

ON-TIME

PROTECTION

< 4.5 V

n.c.

LOGIC

START-UP

CURRENT SOURCE

VALLEY

100 mV

short

winding

OVER-POWER

PROTECTION

OVER-

VOLTAGE

PROTECTION

DRIVER

LEB

blank

OCP

0.88 V

clamp

soft

start

5 V/1 mA

(max)

DRAIN

5, 6

HVS

DEM

DRIVER

0.5 V

sense

CC(5V)

MDB213

Fig.2 Block diagram.

2003 May 12 4

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Philips Semiconductors Product speciﬁcation

GreenChipII SMPS control IC TEA1654

PINNING FUNCTIONAL DESCRIPTION

SYMBOL PIN DESCRIPTION

VCOadj 1 VCO adjustment input I

sense

2 programmable current sense input STDBY 3 standby indication or control output DRIVER 4 gate driver output HVS 5 high voltage safety spacer, not

connected

HVS 6 high voltage safety spacer, not

connected

DRAIN 7 drain of external MOS switch, input for

start-up current and valley sensing

8 supply voltage n.c. 9 not connected GND 10 ground V

CC(5V)

11 5 V output LOCK 12 lock input CTRL 13 control input DEM 14 input from auxiliary winding for

demagnetization timing, OVP and OPP

The TEA1654 is the controller of a compact flyback converter, with the IC situated at the primary side. An auxiliary winding of the transformer provides demagnetization detection and powers the IC after start-up.

The TEA1654 operates in multi modes (see Fig.4). The next converter stroke is started only after

demagnetization of the transformer current (zero current switching), while the drain voltage has reached the lowest voltage to prevent switching losses (green function). The primary resonant circuit of primary inductance and drain capacitor ensures this quasi-resonant operation. The design can be optimized in such a way that zero voltage switching can be reached over almost the complete universal mains range.

To prevent very high frequency operation at lower loads, the quasi-resonant operation changes smoothly in fixed frequency PWM control.

At very low power (standby) levels, the frequency is controlled down, via the VCO, to a minimum frequency of approximately 24 kHz.

Start-up, mains enabling operation level and undervoltage lock-out (see Figs 11 and 12)

handbook, halfpage

sense

HVS HVS

DRAIN

1 2 3 4

TEA1654T

5 6 7

VCOadj

STDBY

DRIVER

Fig.3 Pin configuration.

MDB216

Initially, the IC is self supplying from the rectified mains voltage via pin DRAIN. Supply capacitor C

is charged

VCC

by the internal start-up current source to a level of approximately 4 V (or higher, this is dependent on the drainvoltage/M-level). Once the drainvoltageexceeds the

DEM

M-level (mains-dependent operation-enabling level), the start-up current source will continue charging

CTRL

LOCK

CC(5V)

GND

n.c.

capacitor C

(switch S1 will be opened); see Fig.2.

VCC

The IC will activate the power converter as soon as the voltage on pin VCC passes the level V

CC(start)

. The IC supplyistaken over by the auxiliarywindingassoon as the outputvoltage reaches its intendedlevel and the IC supply from the mains voltage is subsequently stopped for high efficiency operation (green function).

The moment the voltage on pin VCC drops below the undervoltage lock-out level V

, the IC stops switching

UVLO

and enters a safe restart from the rectified mains voltage. Inhibiting the auxiliary supply by external means causes the converter to operate in a stable safe restart mode.

Supply management

All (internal) reference voltages are derived from a temperature compensated, on-chip band gap circuit.

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Philips Semiconductors Product speciﬁcation

GreenChipII SMPS control IC TEA1654

The maximum fixed frequency of the oscillator isset by an internal current source and capacitor. The maximum frequency is reduced once the control voltage enters the VCO control window. Then, the maximum frequency changeslinearly with thecontrol voltage untilthe minimum frequency is reached (see Figs 5 and 6).

handbook, halfpage

(kHz)

VCO fixed quasi resonant

MDB217

P (W)

Fig.4 Multi mode operation.

Current mode control

Current mode control is used for its good line regulation behaviour.

The ‘on-time’ iscontrolled by theinternally inverted control pin voltage, which is compared with the primary current information. The primary current is sensed across an external resistor. The driver output is latched in the logic, preventing multiple switch-on.

The internal control voltage is inverselyproportional to the external control pin voltage, with an offset of 1.5 V. This means that a voltage range from 1 to 1.5 V on pin CTRL will result in an internal control voltage range from

0.5 to 0 V (a high external control voltage results in a low duty cycle).

Oscillator

handbook, halfpage

(kHz)

VCO

level

Fig.6 VCO frequency as a function of V

MCE407

sense(max) (V)

sense(max)

VCO adjustment

The VCOadj pin can be used to set the VCO operation point. As soon as the peak voltageon thesense resistoris controlledbelow half thevoltage on the VCOadjpin (VCO level), frequency reduction will start. The actual peak voltageonsense will be somewhat higherduetoswitch-off delay (see Fig.7). The frequency reduction will stop approximately 25 mV lower (VCO2 level), when the minimum frequency is reached.

Cycle skipping

handbook, halfpage

sense(max)

Fig.5 V

0.52 V

1 V

(typ)

sense(max)

1.5 V (typ)

as a function of V

MGU233

CTRL

2003 May 12 6

At very low power levels, a cycle skipping mode will be activated. A high control voltage will reduce the switching frequency to a minimum of 24 kHz. If the voltage on the controlpin has raisedeven more, switch-onof the external power MOSFET will be inhibited until the voltage on the control pin has dropped to a lower value again (see Fig.7).

For system accuracy, it is not the absolute voltage on the control pin that will trigger the cycle skipping mode, but a signal derived from the internal VCO will be used.

Remark: If the no-load requirement of the system is such that the output voltage can be regulated to its intended level at a switching frequency of 24 kHz or above, the cycle skipping mode will not be activated.

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Philips Semiconductors Product speciﬁcation

GreenChipII SMPS control IC TEA1654

handbook, full pagewidth

1.5 V − V

CTRL

CC(5V)

VCOadj

MDB219

The voltage levels dV1,dV2,dV3and dV4are fixed in the IC to typically 50 mV, 18 mV, 40 mV and 15 mV respectively. The level at which VCO mode of operation starts or ends can be controlled externally with the VCOadj pin.

5 V

current

comparator

DRIVER

OSCILLATOR

DRIVER

sense

osc

max

min

STDBY

(V)

cycle

skipping

VCOadj

Vx (mV)

Fig.7 A functional implementation of the standby and cycle skipping circuitry.

Standby output

TheSTDBY output pin (V

= 5 V)can be used to drive

STDBY

an external NPN transistor or FET in order to e.g. switch-off a PFCcircuit. The STDBY output is activated by the internal VCO: as soon as the VCO has reduced the switching frequency to (almost) the minimum frequency of 24 kHz, the STDBY output will be activated (see Fig.7). The STDBY output will go low again as soon as the VCO allows a switching frequency close to the maximum frequency of 65 kHz.

Demagnetization

The system will be in discontinuous conduction mode all the time. The oscillator will not start a new primary stroke until the secondary stroke has ended.

Demagnetization features a cycle-by-cycle output short-circuit protection by immediately lowering the frequency (longer off-time), thereby reducing the power level.

Demagnetizationrecognition is suppressedduringthe first time (t

). This suppression may be necessary in

suppr

applications where the transformer has a large leakage inductance and at low output voltages/start-up.

OverVoltage Protection (OVP)

An OVP mode is implemented in the GreenChip series. For the TEA1654, this works by sensing the auxiliary voltage via the current flowing into pin DEM during the secondary stroke. The auxiliary winding voltage is a well-defined replica of the output voltage. Any voltage spikes are averaged by an internal filter.

If the output voltage exceeds the OVP trip level, the OVP circuit switches off the power MOSFET. The controller then waits until the UVLO level is reached on pin VCC. When VCC drops to UVLO, capacitor C recharged to the V

level, however the IC will not start

start

VCC

will be

switching again. Subsequently, VCC will drop again to the UVLO level, etc.

2003 May 12 7

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Philips Semiconductors Product speciﬁcation

GreenChipII SMPS control IC TEA1654

Operation only recommenceswhen the VCCvoltage drops below a level of approximately 4.5 V (practically when the V

has been disconnected for a short period).

mains

The output voltage (V can be set by the demagnetization resistor R

OVP

where N

-----------N

is the number of secondary turnsand N

aux

) at which the OVP function trips,

OVP

OVP DEM()

+×[]×=

DEMVclamp DEM()pos()

DEM

aux

is the

number of auxiliary turns of the transformer. Current I

OVP(DEM)

The value of the demagnetization resistor (R

is internally trimmed.

DEM

) can be adjusted to the turns ratio of the transformer, thus making an accurate OVP possible.

handbook, full pagewidth

primary

stroke

secondary

stroke

Valley switching (see Fig.8) A new cycle starts when the power switch is switched on.

After the ‘on-time’ (which is determined by the ‘sense’ voltage and the internal control voltage), the switch is opened and the secondary stroke starts.

After the secondary stroke, the drain voltage shows an oscillation with a frequency of approximately

-----------------------------------------2π×L

where L

××

is the primary self inductance of the transformer

and Cd is the capacitance on the drain node.

secondary

ringing

drain

valley

secondary

stroke

oscillator

A: Start of new cycle at lowest drain voltage. B: Start of new cycle in a classical PWM system at high drain voltage.

Fig.8 Signals for valley switching.

MGU235

2003 May 12 8

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Philips Semiconductors Product speciﬁcation

GreenChipII SMPS control IC TEA1654

As soon as the oscillator voltage is high again and the secondary stroke has ended, the circuit waits for the lowest drain voltage before starting a new primary stroke. This method is called valley detection. Figure 8 shows the drain voltage together with the valley signal, the signal indicating the secondary stroke and the oscillator signal.

In an optimum design, the reflected secondary voltage on the primary side will force the drain voltage to zero. Thus, zero voltage switching is very possible, preventing large

capacitive switching losses , and



-- -



f×××=

allowing high frequency operation, which results in small and cost effective inductors.

MCE406

handbook, halfpage

−100 µA (typ)

DEM

−24 µA (typ)

sense(max)

0.52 V (typ)

0.3 V (typ)

OverCurrent Protection (OCP)

The cycle-by-cycle peak drain current limit circuit uses the externalsource resistor to measurethecurrent accurately. This allows optimum size determination of the transformer core (cost issue). The circuit is activated after the leading edge blanking time t

. The OCP protection circuit limits

leb

the ‘sense’ voltage to an internal level.

OverPower Protection (OPP)

Duringthe primary stroke,the rectified mainsinput voltage is measured by sensing the current drawn from pin DEM. This current is dependent on the mains voltage, according

to the following formula:

where:

-----------N

aux

≈≈

-------------- -

DEM

mains

-------------------------R

DEM

The current information is used to adjust the peak drain current, which is measured via pin I

. The internal

sense

compensation is such that an almost mains independent maximum output power can be realized.

The OPP curve is given in Fig.9.

Fig.9 OPP correction curve.

Minimum and maximum ‘on-time’

The minimum ‘on-time’ of the SMPS is determined by the Leading Edge Blanking (LEB) time. The IC limits the ‘on-time’ to 50 µs. When the system desires an ‘on-time’ longer than 50 µs,a fault condition is assumed,and the IC will stop switching and enter the safe restart mode.

Short winding protection

After the leading edge blanking time, the short winding protection circuit is also activated. If the ‘sense’ voltage exceeds the short winding protection voltage V

swp

, the converter will stop switching. Once VCC drops below the UVLO level, capacitor C

will be recharged and the

VCC

supply will restart again. This cycle will be repeated until the short-circuit is removed (safe restart mode).

The short winding protection will also protect in case of a secondary diode short-circuit.

2003 May 12 9

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Philips Semiconductors Product speciﬁcation

GreenChipII SMPS control IC TEA1654

LOCK input

Pin LOCK is a general purpose (high-impedance) input pin, which can be used to switch off the IC. As soon as the voltageonthis pin is raised above 2.5 V,switchingwillstop immediately.Thevoltage on the VCCpinwillcycle between V

CC(start)

and V

CC(UVLO)

, but the IC will not start switching again until the latch function is reset. The latch is reset as soon as the VCC drops below 4.5 V (typical value). The internal OVP and OTP will also trigger this latch (see Fig.2).

The detection levelof this inputis related to the V voltage in the following way: 0.5 × V

CC(5V)

± 4%.

CC(5V)

An internal Zener diode clamp of 5.6 V will protect this pin from excessive voltages. No internal filtering is done on this input.

OverTemperature Protection (OTP)

An accurate temperature protection is provided in the circuit. When the junction temperature exceeds the thermal shutdown temperature, the IC will stop switching. When VCC drops to UVLO, capacitor C recharged to the V

level, however the IC will not start

start

VCC

will be

switching again. Subsequently, VCC will drop again to the UVLO level, etc.

Operation only recommences when theVCCvoltage drops below a level of approximately 4.5 V (practically when the V

has been disconnected for a short period).

mains

Since the soft start current I

is subtracted from pin V

chargingcurrent, the RSSvaluewill affect the VCCcharging current level by a maximum of 60 µA (typical value).

handbook, halfpage

0.5 V

start-up

ocp

sense

MCE405

Fig.10 Soft start-up.

5 V output

Pin V

can be used for supplying external circuitry.

CC(5V)

The maximum output current must be limited to 1 mA. If higher peak currents are required, an external RC combination should limit the current drawn from this pin to 1 mA maximum.

Soft start-up

To prevent transformer rattle during hiccup, the transformer peak current is slowly increased by the soft start function. This can be achieved by inserting a resistor and a capacitor between pin I

and the sense resistor

sense

(see Fig.10). An internal current source charges the capacitor to V = ISS× RSS, with a maximum of approximately 0.5 V.

The start level and the time constant of the increasing primary current level can be adjusted externally by changing the values of RSS and CSS.

primary(max)

τ R

SSCSS

ocpISSRSS

---------------------------------------------- -

×=

The charging currentI pin I pin I

is below approximately 0.5 V. If the voltage on

sense

exceeds 0.5 V, the soft start current source will

sense

start limiting the current ISS. At the V

×()–

sense

will flow aslong as the voltage on

level, the I

CC(start)

current source is completely switched off.

2003 May 12 10

The 5 V output voltage will be available as soon as the start-upvoltage is reached.As the highvoltage supply can not supply the 5 V pin during start-up and/or shutdown, during latched shutdown (via pin LOCK or other latched protection such as OVP or OTP), the voltage is switched to zero.

Driver

The driver circuit to the gate of the power MOSFET has a current sourcing capability of typically 170 mA and a current sink capability of typically 700 mA. This permits fast turn-on andturn-off of thepower MOSFET for efficient operation. A low driver source current has been chosen to limit the ∆V/∆t at switch-on. Thisreduces Electro Magnetic Interference (EMI) and also limits the current spikes across R

sense

Page 11

Philips Semiconductors Product speciﬁcation

GreenChipII SMPS control IC TEA1654

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 60134); note 1.

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

Voltages

VCOadj

sense

DRAIN

LOCK

CTRL

DEM

Currents

sense

STDBY

DRIVER

DRAIN

CC(5V)

CTRL

DEM

General

tot

stg

ESD

esd

voltage on pin VCOadj continuous −0.4 +5 V voltage on pin I

sense

current limited −0.4 − V voltage on pin DRAIN −0.4 +650 V supply voltage continuous −0.4 +20 V voltage on pin LOCK continuous −0.4 +7 V voltage on pin CTRL −0.4 +5 V voltage on pin DEM current limited −0.4 − V

current on pin I

sense

−1 +10 mA current on pin STDBY −1 − mA current on pin DRIVER d < 10% −0.8 +2 A current on pin DRAIN − +5 mA current on pin V

CC(5V)

−10 mA current on pin CTRL − +5 mA current on pin DEM −250 +250 µA

total power dissipation T

<70°C − 0.75 W

amb

storage temperature −55 +150 °C junction temperature −20 +145 °C

electrostatic discharge voltage

pins 1 to 6 and pins 9 to 14 HBM class 1; note 2 − 2000 V pin 7 HBM class 1; note 2 − 1500 V any other pin MM; note 3 − 400 V

Notes

1. All voltages are measured with respect to ground; positive currents flow into the chip; pin VCC must not be current driven. The voltage ratings are valid provided other ratings are not violated; current ratings are valid provided the maximum power rating is not violated.

2. Human Body Model (HBM): equivalent to discharging a 100 pF capacitor through a 1.5 kΩ series resistor.

3. Machine Model (MM): equivalent to discharging a 200 pF capacitor through a 0.75 µH coil and a 10 Ω resistor.

THERMAL CHARACTERISTICS

SYMBOL PARAMETER CONDITIONS VALUE UNIT

th(j-a)

thermal resistance from junction to ambient in free air; note 1 100 K/W

Note

1. With pin GND connected to sufficient copper area on the printed-circuit board.

2003 May 12 11

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Philips Semiconductors Product speciﬁcation

GreenChipII SMPS control IC TEA1654

QUALITY SPECIFICATION

In accordance with

“SNW-FQ-611D”

CHARACTERISTICS

=25°C; VCC= 15 V; all voltages are measured with respect to ground; currents are positive when ﬂowing into

amb

the IC; unless otherwise speciﬁed.

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Start-up current source (pin DRAIN)

DRAIN

DSS

supply current from pin DRAIN VCC=0V; V

breakdown voltage 650 −−V

M-level mains-dependent

with auxiliary supply; V

DRAIN

> 100 V

> 100 V 1.0 1.2 1.4 mA

DRAIN

− 100 300 µA

60 − 100 V

operation-enabling level

Supply voltage management (pin V

CC(start)

CC(UVLO)

CC(hys)

CC(h)

CC(l)

CC(restart)

CC(oper)

start-up voltage on V undervoltage lock-out on V hysteresis voltage on V pin VCC charging current (high) V pin VCC charging current (low) V

pin VCC restart current V

supply current under normal

)

10.3 11 11.7 V

8.1 8.7 9.3 V

CC(start) DRAIN DRAIN

3V<VCC<V

DRAIN

CC(UVLO)<VCC

− V

CC(UVLO)

2.0 2.3 2.6 V > 100 V; VCC<3V −1.2 −1 −0.8 mA > 100 V;

> 100 V;

CC(UVLO)

CC(start)

−1.2 −0.75 −0.45 mA

−650 −550 −450 µA

no load on pin DRIVER 1.1 1.3 1.5 mA

operation

Demagnetization management (pin DEM)

th(DEM)

demagnetization comparator

50 100 150 mV

threshold voltage on pin DEM

DEM

clamp(DEM)(neg)

clamp(DEM)(pos)

suppr

pin DEM current V negative clamp voltage on pin DEM I positive clamp voltage on pin DEM I suppression of transformer ringing

=50mV −50

DEM

= −150 µA −0.5 −0.25 −0.05 V

DEM

= 250 µA 0.5 0.7 0.9 V

DEM

(1)

− 0nA

1.1 1.5 1.9 µs

at start of secondary stroke

Pulse width modulator

on(min)

on(max)

minimum on-time − t

leb

maximum on-time latched 40 50 60 µs

− ns

Oscillator

osc(l)

osc(h)

VCO(start)

oscillator low ﬁxed frequency V oscillator high ﬁxed frequency V peak voltage on pin I

sense

, where

> 1.5 V 19 24 29 kHz

CTRL

< 1 V 50 63 75 kHz

CTRL

see Figs 6 and 7 − VCO

− mV

frequency reduction starts

2003 May 12 12

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Philips Semiconductors Product speciﬁcation

GreenChipII SMPS control IC TEA1654

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

VCO(max)

Duty cycle control (pin CTRL)

CTRL(min)

CTRL(max)

5 V output (pin V

CC(5V)

LOCK input (pin LOCK)

LOCK

CC(reset)

REL

LOCK,5V

Valley switch (pin DRAIN)

∆V/∆t

valley

valley-swon

Overcurrent and short winding protection (pin I

sense(max)

swp

leb

Overvoltage protection (pin DEM)

OVP(DEM)

Overpower protection (pin DEM)

OPP(DEM)

OPP50%(DEM)

peak voltage on pin I the frequency is equal to f

minimum voltage on pin CTRL for

sense

, where

osc(l)

− VCO1− 25 − mV

− 1.0 − V

maximum duty cycle maximum voltage on pin CTRL for

− 1.5 − V

minimum duty cycle

)

CC(5V)

output voltage IO= 1 mA 4.75 5.0 5.25 V current capability of pin V

CC(5V)

−1.0 −−mA

LOCK trip level 2.37 2.5 2.63 V voltage level on pin VCC which

< 2.3 V − 4.5 − V

LOCK

resets the latch relation to 5 V output (pin V

CC(5V)

LOCK

= 0.5 × V

CC(5V)

−4 − +4 %

valley recognition voltage change −85 −+85 V/µs delay from valley recognition to

− 150

(1)

− ns

switch-on

)

sense

maximum source voltage OCP ∆V/∆t = 0.1 V/µs 0.48 0.52 0.56 V propagation delay from detecting

sense(max)

to switch-off

∆V/∆t = 0.5 V/µs − 140 185 ns

short winding protection voltage 0.83 0.88 0.96 V blanking time for current and short

300 370 440 ns

winding protection soft start current V

OVP level on pin DEM set by resistor R

< 0.5 V 45 60 75 µA

sense

DEM

; see

54 60 66 µA Section “OverVoltage Protection (OVP)”

OPP current on pin DEM to start OPP correction

set by resistor R

DEM

Section “OverPower

; see

−−24 −µA

Protection (OPP)”

OPP current on pin DEM, where

−−100 −µA maximum source voltage is limited to 0.3 V

2003 May 12 13

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Philips Semiconductors Product speciﬁcation

GreenChipII SMPS control IC TEA1654

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Standby output (pin STDBY)

STDBY

source

sink

Driver (pin DRIVER)

source

sink

o(driver)(max)

Temperature protection

prot(max)

prot(hys)

standby output voltage 4.75 5.0 5.25 V source current capability V sink current capability V

source current capability of driver VCC= 9.5 V; V sink current capability of driver VCC= 9.5 V; V

V V

= 1.5 V 20 22 24 µA

STDBY

= 1.5 V 2 −−mA

STDBY

=2V −−170 −88 mA

DRIVER

=2V − 300 − mA

DRIVER

= 9.5 V;

CC DRIVER

= 9.5 V

400 700 − mA

maximum output voltage of driver VCC>12V − 11.5 12 V

maximum temperature protection

130 140 150 °C

level hysteresis for the temperature

− 8

(1)

−°C

protection level

Note

1. Guaranteed by design.

2003 May 12 14

Page 15

Philips Semiconductors Product speciﬁcation

GreenChipII SMPS control IC TEA1654

APPLICATION INFORMATION

A converter with the TEA1654 consistsof an inputfilter, a transformerwith a thirdwinding (auxiliary), andan output stage with a feedback circuit.

Capacitor C

(at pin VCC) buffers the supply voltage of the IC, which is powered via the high voltage rectified mains

VCC

during start-up and via the auxiliary winding during operation. A sense resistor converts the primary current into a voltage at pin I

maximum primary peak current.

CC(5V)

LOCK

CTRL

n.c.

GND

DEM

mains

TEA1654T

DRAIN

HVS

DRIVER

STDBY

sense

VCOadj

PFC

handbook, full pagewidth

−

CTRL

VCC

. The value of this sense resistor defines the

sense

power

MOSFET

sense

DEM

The LOCKpinis used in this example foranadditional external overtemperature protection. If this pin is not used, it must be tied to ground.

Fig.11 Configuration with controlled PFC.

2003 May 12 15

aux

reg1

reg2

MDB214

Page 16

Philips Semiconductors Product speciﬁcation

GreenChipII SMPS control IC TEA1654

handbook, full pagewidth

(power

MOSFET)

gate

M-level

µC

start-up

sequence

normal

operation

overvoltage

protection

normal

operation

output

short-circuit

MBL505

Fig.12 Typical waveforms.

2003 May 12 16

Page 17

Philips Semiconductors Product speciﬁcation

GreenChipII SMPS control IC TEA1654

PACKAGE OUTLINE

SO14: plastic small outline package; 14 leads; body width 3.9 mm

SOT108-1

pin 1 index

w M

detail X

v M

(A )

0 2.5 5 mm

scale

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

OUTLINE VERSION

SOT108-1

max.

1.75

0.069

0.25

0.10

0.010

0.004

A2A

1.45

1.25

0.057

0.049

IEC JEDEC JEITA

076E06 MS-012

0.25

0.01

0.49

0.25

0.36

0.19

0.019

0.0100

0.014

0.0075

UNIT

inches

Note

1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.

(1)E(1)

8.75

8.55

0.35

0.34

REFERENCES

eHELLpQZywv θ

4.0

1.27

3.8

0.16

0.15

0.05

0.244

0.228

2003 May 12 17

6.2

5.8

1.05

0.041

1.0

0.4

0.039

0.016

0.7

0.25

0.6

0.028

0.01 0.004

0.024

EUROPEAN

PROJECTION

0.25 0.1

0.01

(1)

0.7

0.3

0.028

0.012

ISSUE DATE

99-12-27 03-02-19

Page 18

Philips Semiconductors Product speciﬁcation

GreenChipII SMPS control IC TEA1654

SOLDERING Introduction to soldering surface mount packages

Thistext gives a very briefinsightto a complex technology. A more in-depth account of soldering ICs can be found in our

“Data Handbook IC26; Integrated Circuit Packages”

(document order number 9398 652 90011). There is no soldering method that is ideal for all surface

mount IC packages. Wave soldering can still be used for certainsurfacemount ICs, but it isnotsuitablefor fine pitch SMDs. In these situations reflow soldering is recommended.

Reﬂow soldering

Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied tothe printed-circuit board byscreen printing, stencilling or pressure-syringe dispensing before package placement.

Several methods exist for reflowing; for example, convection or convection/infrared heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method.

Typical reflow peak temperatures range from 215 to 250 °C. The top-surface temperature of the packages should preferably be kept:

• below 220 °C for all the BGA packages and packages with a thickness ≥ 2.5mm and packages with a thickness <2.5 mm and a volume ≥350 mm3 so called thick/large packages

• below 235 °C for packages with a thickness <2.5 mm and a volume <350 mm3 so called small/thin packages.

Wave soldering

Conventional single wave soldering is not recommended forsurfacemount devices (SMDs) or printed-circuitboards with a high component density, as solder bridging and non-wetting can present major problems.

If wave soldering is used the following conditions must be observed for optimal results:

• Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave.

• For packages with leads on two sides and a pitch (e): – larger than or equal to 1.27 mm, the footprint

longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board;

– smaller than 1.27 mm, the footprint longitudinal axis

must be parallel to the transport direction of the printed-circuit board.

The footprint must incorporate solder thieves at the downstream end.

• Forpackageswith leads on four sides,thefootprintmust be placed at a 45° angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners.

During placement andbefore soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured.

Typical dwell time is 4 seconds at 250 °C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications.

Manual soldering

Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C.

When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C.

To overcome these problems the double-wave soldering method was specifically developed.

2003 May 12 18

Page 19

Philips Semiconductors Product speciﬁcation

GreenChipII SMPS control IC TEA1654

Suitability of surface mount IC packages for wave and reﬂow soldering methods

PACKAGE

(1)

SOLDERING METHOD

WAVE REFLOW

(2)

BGA, LBGA, LFBGA, SQFP, TFBGA, VFBGA not suitable suitable DHVQFN, HBCC, HBGA, HLQFP, HSQFP, HSOP, HTQFP,

not suitable

(3)

suitable

HTSSOP, HVQFN, HVSON, SMS

(4)

PLCC LQFP, QFP, TQFP not recommended SSOP, TSSOP, VSO, VSSOP not recommended

, SO, SOJ suitable suitable

(4)(5)

suitable

(6)

suitable

Notes

1. Formore detailed information ontheBGA packages refertothe

“(LF)BGAApplication Note

”(AN01026); order a copy

from your Philips Semiconductors sales office.

2. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the

“Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”

3. These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side, the solder might be deposited on the heatsink surface.

4. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners.

5. Wave soldering is suitable for LQFP,TQFP and QFP packages with a pitch (e) larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.

6. Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger than

0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.

2003 May 12 19

Page 20

Philips Semiconductors Product speciﬁcation

GreenChipII SMPS control IC TEA1654

DATA SHEET STATUS

LEVEL

DATA SHEET

STATUS

(1)

PRODUCT

STATUS3

(3)

DEFINITION

I Objective data Development This data sheet contains data from the objective speciﬁcation for product

development. Philips Semiconductors reserves the right to change the speciﬁcation in any manner without notice.

II Preliminary data Qualiﬁcation This data sheet contains data from the preliminary speciﬁcation.

Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the speciﬁcation without notice, in order to improve the design and supply the best possible product.

III Product data Production This data sheet contains data from the product speciﬁcation. Philips

Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Relevant changes will be communicated via a Customer Product/Process Change Notiﬁcation (CPCN).

Notes

1. Please consult the most recently issued data sheet before initiating or completing a design.

2. The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.

3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.

DEFINITIONS

DISCLAIMERS

Short-form specification  The data in a short-form

specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook.

Limiting values definition  Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device atthese or at anyotherconditionsabove those given inthe Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information  Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make norepresentationorwarranty that such applications willbe suitable for the specified use without further testing or modification.

Life support applications  These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result inpersonal injury. Philips Semiconductorscustomersusingor selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application.

Right to make changes  Philips Semiconductors reserves the right to make changes in the products including circuits, standard cells, and/or software described or contained herein in order to improve design and/or performance. Whenthe product is in full production (status ‘Production’), relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified.

2003 May 12 20

Page 21

Philips Semiconductors Product speciﬁcation

GreenChipII SMPS control IC TEA1654

NOTES

2003 May 12 21

Page 22

Philips Semiconductors Product speciﬁcation

GreenChipII SMPS control IC TEA1654

NOTES

2003 May 12 22

Page 23

Philips Semiconductors Product speciﬁcation

GreenChipII SMPS control IC TEA1654

NOTES

2003 May 12 23

Page 24

Philips Semiconductors – a w orldwide compan y

Contact information

For additional information please visit http://www.semiconductors.philips.com. Fax: +31 40 27 24825 For sales ofﬁces addresses send e-mail to: [email protected].

The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.

Printed in The Netherlands 613502/01/pp24 Date of release: 2003 May 12 Document order number: 9397 750 11186

SCA75