Philips TEA1111A User Manual

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INTEGRATED CIRCUITS

DATA SH EET

TEA1111A

Speech circuit with dialler interface,
regulated supply and earpiece
volume control

Product specification
Supersedes data of 1999 Sep 28
File under Integrated Circuits, IC03

1999 Nov 22

Philips Semiconductors Product specification

Speech circuit with dialler interface, regulated
supply and earpiece volume control

FEATURES

• Low DC linevoltage; operates down to 1.5 V (excluding
voltage drop across external polarity guard)

• Line voltage regulator with adjustable DC voltage

• 3.25 V regulated strong supply point for peripheral

circuits compatible with:
– Speech mode
– Ringer mode
– Trickle mode.

• Transmit stage with:
– Microphone amplifier with symmetrical high

impedance inputs

– DTMF amplifier with confidence tone on earpiece.

• Receive stage with:
– Earpiece amplifier with adjustable gain and volume

control.

• MUTE input for pulse or DTMF dialling

• AGC line loss compensation for microphone and

earpiece

• LED control output.

APPLICATIONS

• Line powered telephone sets with LCD module

• Cordless telephones

• Fax machines

• Answering machines.

GENERAL DESCRIPTION

The TEA1111A is a bipolar integrated circuit that performs
all speech and line interface functions required in fully
electronic telephone sets. It performs electronic switching
between speech and dialling. The IC operates at a line
voltage down to 1.5 V DC (with reduced performance) to
facilitate the use of telephone sets connected in parallel.

When the line current is high enough, a fixed amount of
current is derived from the LN pin in order to create a
strong supply point at pin VDD. The voltage at pin VDD is
regulated to 3.25 V to supply peripherals such as dialler,
LCD module and microcontroller.

TEA1111A

QUICK REFERENCE DATA

I

= 15 mA; VEE=0V; V

line

according to test circuits given in Figs 14, 15 and 16; T

VCI

=0V; R

=20Ω; AGC pin connected to VEE; Z

SLPE

=25°C; unless otherwise specified.

amb

= 600 Ω; f = 1 kHz; measured

line

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

I

line

line current operating range normal operation 11 − 140 mA

with reduced

1 − 11 mA

performance

V

LN

I

CC

V

CC

V

DD

I

DD

G

v(TX)

G

v(QR)

∆G

v(QR)

∆G

v(trx)

∆G

v(trx)(m)

DC line voltage 3.7 4.0 4.3 V
internal current consumption VCC= 3.3 V − 1.15 1.4 mA
supply voltage for internal circuitry (unregulated) IP=0mA − 3.3 − V
regulated supply voltage for peripherals

speech mode I
ringer mode I

= −3 mA 2.95 3.25 3.55 V

DD

= 75 mA 3.0 3.3 3.6 V

DD

available supply current for peripherals −−−3mA
typical voltage gain for microphone amplifier V

= 4 mV (RMS) 43.2 44.2 45.2 dB

MIC

typical voltage gain for earpiece amplifier VIR= 4 mV (RMS) 26.4 27.4 28.4 dB
volume control range for earpiece amplifier 0 14.5 − dB
gain control range for microphone and earpiece

amplifiers with respect to I

=15mA

line

gain reduction for microphone and earpiece

I

=85mA − 6.0 − dB

line

MUTE = LOW − 80 − dB

amplifiers

1999 Nov 22 2

Philips Semiconductors Product specification

Speech circuit withdialler interface,regulated

TEA1111A

supply and earpiece volume control

ORDERING INFORMATION

TYPE

NUMBER

NAME DESCRIPTION VERSION

TEA1111AT SO16 plastic small outline package; 16 leads; body width 3.9 mm SOT109-1

BLOCK DIAGRAM

handbook, full pagewidth

receive

amplifier

VI

MUTE

4

IR

8

PACKAGE

VOLUME

CONTROL

GARVCI

129

earpiece
amplifier

11

QR

DTMF

MIC+
MIC−

V

EE

AGC

6

ATTENUATOR

13
14

microphone

amplifier

10

5

VI

VI

VI

TEA1111A

AGC

CIRCUIT

0.5V

CC

CURRENT AND

VOLTAGE

REFERENCE

V

DD

REGULATOR

LOW VOLTAGE

CIRCUIT

LED CONTROL

153

16

V

CC

7

V

DD

1

LN

2

FCA051

Fig.1 Block diagram.

1999 Nov 22 3

SLPELEDCREG

Philips Semiconductors Product specification

Speech circuit withdialler interface,regulated
supply and earpiece volume control

PINNING

SYMBOL PIN DESCRIPTION

LN 1 positive line terminal
SLPE 2 slope (DC resistance) adjustment
REG 3 line voltage regulator decoupling
IR 4 receive amplifier input
AGC 5 automatic gain control/

line loss compensation
DTMF 6 dual-tone multi-frequency input
V

DD

7 regulated supply for peripherals

MUTE 8 mute input to select speech or

dialling mode (active LOW)
VCI 9 volume control input
V

EE

10 negative line terminal
QR 11 earpiece amplifier output
GAR 12 earpiece amplifier gain adjustment
MIC+ 13 non-inverting microphone amplifier

input
MIC− 14 inverting microphone amplifier input
LEDC 15 LED control output
V

CC

16 supply voltage for internal circuit

handbook, halfpage

LN

1

SLPE

2
3

REG

IR

4

TEA1111A

5

AGC

DTMF

6

V

7

DD

8

MUTE

FCA052

Fig.2 Pin configuration.

TEA1111A

V

16

CC

LEDC

15
14

MIC−

13

MIC+

12

GAR

11

QR
V

10

EE

VCI

9

FUNCTIONAL DESCRIPTION

All data given in this chapter concerns typical values,
except when otherwise specified.

Supply (pins LN, SLPE, REG, VCCand VDD)

The supply for the TEA1111A and its peripherals is
obtained from the telephone line (see Fig.3).

HE LINE INTERFACE (PINS LN, SLPE AND REG)

T
The IC generates a stabilized reference voltage (V

across pins LN and SLPE. V

is temperature

ref

ref

)

compensated and can be adjusted by using an external
resistor (RVA). V

equals 3.8 V and can be increased by

ref

connecting RVA between pins REG and SLPE or
decreased by connecting R

between pins REG and LN.

VA

The voltage at pin REG is used by the internal regulator to
generate V

and is decoupled by C

ref

, which is

REG

connected to VEE. This capacitor, converted to an
equivalent inductance, (see Section “Set impedance”)
determines the set impedance conversion from its DC
value (R

) to its AC value (RCCin the audio-frequency

SLPE

range). The voltage at pin SLPE is proportional to the line
current.

The voltage at pin LN is:
V

LN=Vref+RSLPE

I

SLPE=Iline

− ICC− IP− I

× I

SLPE

SUP

− I

LEDC

where:

I

= line current

line

ICC= current consumption of the IC
IP= supply current for external circuits
I

= current consumed between LN and VEE by the

SUP

VDD regulator
I

= supply current for external LED circuitry.

LEDC

Thepreferredvaluefor R

is 20 Ω.ChangingR

SLPE

SLPE

will
affect more than the DC characteristics; it also influences
the microphone and DTMF gains, the gain control
characteristics, the sidetone level and the maximum
output swing on the line.

The DC line current flowing into the set is determined by
the exchange supply voltage (V
resistance (R
line (R

) and the reference voltage (V

line

currents below I
(generatingV

), the DC resistance of the telephone

EXCH

(9 mA), the internal reference voltage

low

)isautomaticallyadjusted to a lower value.

ref

), the feeding bridge

EXCH

). With line

ref

1999 Nov 22 4

Philips Semiconductors Product specification

Speech circuit withdialler interface,regulated
supply and earpiece volume control

This means that several sets can operate in parallel with
DC line voltages (excluding the polarity guard) down to an
absolute minimum voltage of 1.5 V. At line currents below
I

, the circuit has limited sending and receiving levels.

low

This is called the low voltage area.

THE INTERNAL SUPPLY POINT (PIN VCC)
The internal circuitry of the TEA1111A is supplied from

pin V

. This voltage supply is derived from the line

CC

voltage by means of a resistor (RCC) and must be
decoupled by a capacitor C

. It may also be used to

VCC

supply some external circuits.

The V
current consumed by the IC and the peripheral circuits as:

V

CC0=VLN

VCC=V
Where I

the earpiece amplifier.

TEA1111A

voltage (see also Figs 4 and 5) depends on the

CC

− RCC× I

− RCC× (IP+I

CC0

is the current consumed by the output stage of

rec

CC

rec

)

handbook, full pagewidth

LED

CIRCUIT

R

EXCH

V

EXCH

R

line

LEDC

CONTROL

LED

I

SLPE

I

LEDC

R

20 Ω

SLPE

I

line

from preamplifier

I

LN

LN

I

SUP

REGSLPE

C

4.7 µF

R

CC

V

DD

REGULATOR

V

REG

internal

circuitry

TEA1111A

EE

I

CC

V

V

CC

DD

I

DD

peripherals

C

VCC

100 µF

C

VDD

220 µF

external

circuits

FCA053

I

P

Fig.3 Supply configuration.

1999 Nov 22 5

Philips Semiconductors Product specification

Speech circuit with dialler interface, regulated
supply and earpiece volume control

V

R

CC0

handbook, halfpage

Fig.4 VCC used as supply voltage for external circuits.

CC

V

CC

I

rec

V

EE

EXTERNAL

CIRCUITS

I

P

MGK806

TEA1111A

handbook, halfpage

VCC≥ 2.2 V; VLN= 4 V at I
(1) Curve 1 is valid when the earpiece amplifier is driven: V
(2) Curve 2 is valid when the earpiece amplifier is not loaded.

= 15 mA; RCC= 619 Ω; R

line

2

I

P

(mA)

1.6

1.2

0.8

0.4

0

2.2 2.6 3.4

SLPE

(1) (2)

=20Ω.

= 150 mV; RL= 150 Ω.

QR(rms)

3.0

FCA054

VCC (V)

Fig.5 Typical current IP available from VCC for peripheral circuitry.

1999 Nov 22 6

Philips Semiconductors Product specification

Speech circuit with dialler interface, regulated
supply and earpiece volume control

THE REGULATED SUPPLY POINT (PIN VDD)
The V

regulator delivers a stabilized voltage for the

DD

peripherals in transmission mode (nominal VLN) as well as
in ringer mode (VLN= 0 V). The regulator (see Fig.6)
consists of a sense input circuit fed by pin LN, a current
switch and a V

output stabilizer.

DD

Theregulatorfunctiondependsonthetransmission,ringer
and trickle modes as follows:

• Transmissionmode:Theregulatoroperatesasacurrent
source at the LN input; it takes a constant current of

= 4.3 mA (at nominal conditions) from pin LN.

I

SUP

The current switch reduces the distortion on the line at
large signal swings. Output V

follows the DC voltage

DD

at pin LN (with typically 0.35 V difference) up to
VDD= 3.25 V. The input current of the regulator is
constant while the output (source) current is determined
by the consumption of the peripherals. The difference
between input and output currents is shunted by the
internal VDD stabilizer.

• Ringer mode: The regulator operates as a shunt

• Trickle mode: When VDD is below 2 V, the regulator is

TEA1111A

stabilizer to keep V
VLNequals 0 V while the input current into pin VDD is
delivered by the ringingsignal. VDDhas to be decoupled
by a capacitor C

inhibited. The current consumption of the VDDregulator
in trickle mode is very low to save most of the trickle
current for memory retention of a dialler.

at 3.3 V. The input voltage

DD

.

VDD

handbook, full pagewidth

R

EXCH

V

EXCH

R

line

TEA1111A

I

line

LN

I

SUP

R

CC

I

LN

SENSE

I

CC

V

CC

SWITCH

VDD regulator

V

EE

C

V

DD

I

DD

peripherals

C

VDD

220 µF

FCA055

VCC

100 µF

Fig.6 VDD regulator configuration.

1999 Nov 22 7

Philips Semiconductors Product specification

Speech circuit with dialler interface, regulated
supply and earpiece volume control

LED control (pin LEDC)

The TEA1111A gives an on-hook/off-hook status
indication. This is achieved by a current made available at
pin LEDC to drive an external LED circuit connected
between pins SLPE and LN (see Fig.7). In the low voltage
area, which corresponds to low line current conditions, no
current is available for this LED. For line currents higher
than a threshold, the LEDC current increases
proportionally to the line current (with a ratio of 1:150).
The LEDC current is internally limited to 470 µA
(see Fig.8).

I

12–

For 12 mA < I

< 82 mA:

line

I

LEDC

This LED circuit is referenced to SLPE. Consequently, all
theLEDsupply current will flow through the R
and does not affect the behaviour of the AGC.

Set impedance

line

=

--------------------­150

SLPE

resistor,

BC858B

TEA1111A

LN

24

Ω

2.4
kΩ

LEDC

SLPE

FCA056

In the audio frequency range, the dynamic impedance is
mainly determined by the RCC resistor. The equivalent
impedance of the circuit is illustrated in Fig.9.

500

handbook, halfpage

I

LEDC

(µA)

400

300

200

100

FCA057

handbook, halfpage

Fig.7 LED circuit configuration.

LN

R

CC

619 Ω

CC

C

VCC

100 µF

MBE788

V

EE

SLPE

L

EQ

V

R

SLPE

20 Ω

ref

R

P

REG V

C

REG

4.7 µF

0

0 20 40 100

60 80

I

line

(mA)

Fig.8 LEDC current versus line current.

1999 Nov 22 8

LEQ=C
RP= internal resistance.
RP= 17.5 kΩ.

REG

× R

SLPE

× RP.

Fig.9 Equivalent impedance between LN and VEE.

Philips Semiconductors Product specification

Speech circuit with dialler interface, regulated
supply and earpiece volume control

Transmit stage (pins MIC+, MIC− and DTMF)

MICROPHONE AMPLIFIER (PINS MIC+ AND MIC−)
The TEA1111A has symmetrical microphone inputs.

The input impedance between pins MIC+ and MIC− is
68 kΩ (2 × 34 kΩ). The voltage gain from pins MIC+/MIC−
to pin LN is set at 44.2 dB (typical) at 600 Ω line load.

Automatic gain control is provided on this amplifier for line
loss compensation.

DTMF AMPLIFIER (PIN DTMF)
When the DTMF amplifier is enabled, dialling tones may

be sent on line. These tones are also sent to the receive
output QR at a low level (confidence tone), the level is
controlled by pin VCI.

The TEA1111A has an asymmetrical DTMF input.
The input impedance between DTMF and VEE is 20 kΩ
and it is biased at VEE. The voltage gain from pin DTMF to
pin LN is set at 25.9 dB.

Automatic gain control has no effect on the DTMF
amplifier.

Receiving stage (pins IR, GAR, QR and VCI)

The receive part consists of an earpiece amplifier and a
volume control block.

EARPIECE AMPLIFIER
The earpiece amplifier has one input (IR) and one output

(QR). The input impedance between pin IR and pin VEEis
22 kΩ. When pin VCI is tied to VEE, the voltage gain from
pin IR to pin QR is set at 27.4 dB (typical) which reduces
the attenuation of the receive signal by the anti-sidetone
network from 32 dB to 4.6 dB. The gain can be decreased
by connecting an external resistor R

GARext

between
pins GAR and QR; the adjustment range is 6 dB.
Two external capacitors C
pins GAR and QR) and C
pins GAR and VEE) ensure stability. Capacitor C

(connected between

GAR

(connected between

GARS

GAR

provides a first-order low-pass filter. The cut-off frequency
corresponds to the time constant C
R

is the internal resistor (123 kΩ typical) which sets

GARint

the gain. The relationship C

GARS

× R

GAR

=10×C

GARint

GAR

. Where

must be

complied with to ensure stability.
Theoutput voltage of the earpiece amplifier is specified for

continuous wave drive. The maximum output swing
depends on the DC line voltage, the RCC resistor, the I
current consumption of the circuit, the IP current
consumption of the peripheral circuits and the load
impedance.

Automatic gain control is provided on this amplifier for line
loss compensation.

VOLUME CONTROL (PIN VCI)
A positive DC voltage applied to pin VCI allows the gain of

the earpiece amplifier to be increased in steps of 4.85 dB.
The volume control range is 27.4 to 41.9 dB (14.5 dB
typical). A proportional voltage decoder at pin VCI defines
a gain of 27.4 dB when V

41.9 dB when V

The intermediate steps correspond to:

and .

Automatic gain control (pin AGC)

The TEA1111A performs automatic line loss
compensation. The automatic gain control varies the gain
of the microphone amplifier and the gain of the receive
amplifier in accordance with the DC line current.

The control range is 6.0 dB (which corresponds
approximately to a line length of 5 km for a 0.5 mm
diametertwisted-paircopper cable with a DC resistance of
176 Ω/km and an average attenuation of 1.2 dB/km).

The ICcan be used with differentconfigurations of feeding
bridge (supply voltage and bridge resistance) by
connecting an external resistor R
pins AGC and VEE. This resistor enables the I
line currents to be increased (the ratio between I
I

stop

disabled when pin AGC is left open circuit.

Mute function (pin MUTE)

The mute function performs the switching between the
speech mode and the dialling mode.

When MUTE is LOW, the DTMF input is enabled and the
microphone and receive amplifier inputs are disabled.
In this mode, the DTMF tones are sent to the receive
output at a low level (confidence tone).

When MUTE is HIGH, the microphone and receiving
amplifiers inputs are enabled while the DTMF input is
disabled. The MUTE input is provided with an internal
pull-up current source to VDD.

CC

TEA1111A

equals VEE and a gain of

VCI

equals VDD.

VCI

1

=

start

-- ­3

V

DD

and I

start

and

V

VCI

VCI

2

=

V

-- -

DD

3

between

AGC

V

is not affected by the resistor). The AGC function is

stop

1999 Nov 22 9

Philips Semiconductors Product specification

Speech circuit with dialler interface, regulated
supply and earpiece volume control

Sidetone suppression

The TEA1111A anti-sidetone network comprising
RCC// Z

line,Rast1,Rast2,Rast3,RSLPE

and Z

(see Fig.10)

bal

suppresses the transmitted signal in the earpiece.
Maximum compensation is obtained when the following
conditions are fulfilled:

× R

R

SLPERast1

R

k

=

------------------------------------------------------------

Z

bal

R

ast2

kZ

ast3RSLPE

R

×

ast1RSLPE

×=

line

CC

+()×

R

( R

ast2

ast3

)+×=

The scale factor k is chosen to meet the compatibility with
a standard capacitor from the E6 or E12 range for Z

In practice, Z
thelinelength.Therefore, the value of Z

varies considerably with the line type and

line

shouldbeforan

bal

bal

average line length, which gives satisfactory sidetone
suppression with short and long lines. The suppression
also depends on the accuracy of the match between Z
and the impedance of the average line.

The anti-sidetone network for the TEA1111A attenuates
the receive signal from the line by 32 dB before it enters
the receive stage. The attenuation is almost constant over
the whole audio frequency range.

A Wheatstone bridge configuration (see Fig.11) may also
be used.

More information on the balancing of an anti-sidetone
bridgecan be obtained in our publication

for Wired Telecom Systems; Applications Handbook
IC03b”

For ordering information, please contact the Philips
Semiconductors sales office.

.

bal

TEA1111A

“Semiconductors

.

handbook, full pagewidth

R

R

CC

SLPE

Z

line

V

EE

LN

SLPE

I

m

R

Fig.10 Equivalent circuit of TEA1111A anti-sidetone bridge.

1999 Nov 22 10

ast3

R

ast1

IR

Z

R

ast2

Z

bal

ir

MBE787

Philips Semiconductors Product specification

Speech circuit with dialler interface, regulated
supply and earpiece volume control

handbook, full pagewidth

R

R

SLPE

CC

Z

line

V

EE

LN

SLPE

Z

bal

I

m

R

ast1

TEA1111A

IR

Z

ir

R

A

MBE786

Fig.11 Equivalent circuit of an anti-sidetone network in a Wheatstone bridge configuration.

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 134).

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

V

LN

positive continuous line voltage VEE− 0.4 12 V
repetitive line voltage during switch-on or

V

− 0.4 13.2 V

EE

line interruption

I

DD

V

CC

V

MUTE,VVCI

V

n(max)

maximum input current at pin V

DD

supply voltage VEE− 0.4 12 V
maximum voltage on pins MUTE and VCI VEE− 0.4 VDD+ 0.4 V
maximum voltage on all pins except

− 75 mA

VEE− 0.4 VCC+ 0.4 V

pins VDD, MUTE and VCI
I
P
T
T
T

line

tot
stg
amb
j

line current R

TEA1111AT total power dissipation T

=20Ω;see Fig.12 − 140 mA

SLPE

=75°C; see Fig.12 − 416 mW

amb

storage temperature −40 +125 °C

ambient temperature −25 +75 °C

junction temperature − +125 °C

1999 Nov 22 11

Philips Semiconductors Product specification

Speech circuit with dialler interface, regulated

TEA1111A

supply and earpiece volume control

THERMAL CHARACTERISTICS

SYMBOL PARAMETER CONDITIONS VALUE UNIT

R

th(j-a)

Note

1. Mounted on epoxy board 40.1 × 19.1 × 1.5 mm.

handbook, full pagewidth

thermal resistance from junction to ambient in free air; note 1 110 K/W

150

FCA058

130

I

LN

(mA)

110

90

70

50

30

24365981110

(4) (3) (2) (1)

7

12

V

LN

− V

SLPE

(V)

(1) T
(2) T
(3) T
(4) T

=45°C; P

amb

=55°C; P

amb

=65°C; P

amb

=75°C; P

amb

= 0.666 W.

tot

= 0.583 W.

tot

= 0.500 W.

tot

= 0.416 W.

tot

Fig.12 SO16 safe operating area (TEA1111AT).

1999 Nov 22 12

Philips Semiconductors Product specification

Speech circuit with dialler interface, regulated

TEA1111A

supply and earpiece volume control

CHARACTERISTICS

I

= 15 mA; VEE=0V; V

line

according to test circuits given in Figs 14, 15 and 16; T

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Supply (pins LN, V

T

HE LINE INTERFACE (PINS LN, SLPE AND REG)

V

ref

CC

stabilized reference voltage
between pins LN and SLPE

V

LN

V

LN(Rext)

DC line voltage I

DC line voltage with an
external resistor R

∆V

LN(T)

DC line voltage variation with
temperature referenced to

25 °C
THE INTERNAL SUPPLY POINT (PIN VCC)
I

CC

V

CC

internal current consumption VCC= 3.3 V − 1.15 1.4 mA

supply voltage for internal

circuitry
THE REGULATED SUPPLY POINT (PIN VDD)
I

SUP

input current of the V

regulator (current from pin LN

not flowing through pin SLPE)
V

DD

regulated supply voltage in:

speech mode I

speech mode at reduced
performance

ringer mode I

I

DD

regulated supply current

available in:

speech mode I
speech mode at reduced

performance
trickle mode I

VCI

=0V; R

=20Ω; pin AGC connected to VEE; Z

SLPE

, SLPE, REG and VDD)

VA

DD

= 600 Ω; f = 1 kHz; measured

line

=25°C; unless otherwise specified.

amb

3.5 3.8 4.1 V

=1mA − 1.5 − V

line

I

=4mA − 2.5 − V

line

I

= 15 mA 3.7 4.0 4.3 V

line

= 140 mA − 6.7 7.2 V

I

line

RVA=90kΩ (between

− 3.6 − V

pins LN and REG)
T

= −25 to +75 °C −±40 − mV

amb

IP=0mA − 3.3 − V

I

=1mA − 0 − mA

line

=4mA − 1.2 − mA

I

line

I

≥ 11 mA − 4.3 − mA

line

= −3 mA;

DD

2.95 3.25 3.55 V
VLN> 3.6 V + 0.28 V (typ.);
I

≥ 11 mA

line

I

=4mA − VLN− 0.35 − V

line

= 0 mA; IDD= 75 mA 3.0 3.3 3.6 V

line

≥ 11 mA −− −3mA

line

I

=4mA −−1−mA

line

line

= 0 mA;

−− 100 nA
VCCdischarging;
VDD= 1.2 V

1999 Nov 22 13

Philips Semiconductors Product specification

Speech circuit with dialler interface, regulated

TEA1111A

supply and earpiece volume control

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

LED control (pin LEDC)

I

line(h)

I

line(l)

I

LEDC(max)

highest line current for
I

<5µA

LEDC

lowest line current for
maximum I

LEDC

maximum available output
current from pin LEDC

Transmit stage (pins MIC+, MIC− and DTMF)

MICROPHONE AMPLIFIER (PINS MIC+ AND MIC−)
Z

 input impedance

i

differential between
pins MIC+ and MIC−

single-ended between

G

v(TX)

pins MIC+/MIC− and V

voltage gain from

EE

V

= 4 mV (RMS) 43.2 44.2 45.2 dB

MIC

pins MIC+/MIC− to pin LN

∆G

v(TX)(f)

voltage gain variation with

f = 300 to 3400 Hz −±0.2 − dB

frequency referenced to 1 kHz

∆G

v(TX)(T)

voltage gain variation with

T

= −25 to +75 °C −±0.3 − dB

amb

temperature referenced to

25 °C
CMRR common mode rejection ratio − 80 − dB
V

LN(max)(rms)

V

no(LN)

maximum sending signal

(RMS value)

I

= 15 mA; THD = 2% 1.8 2 − V

line

I

= 4 mA; THD = 10% − 0.45 − V

line

noise output voltage at pin LN psophometrically weighted

(P53 curve);
pins MIC+/MIC− short
circuited through 200 Ω

DTMF AMPLIFIER (PIN DTMF)

 input impedance − 20 − kΩ

Z

i

G

v(DTMF)

∆G

v(DTMF)(f)

voltage gain from pin DTMF to

pin LN

voltage gain variation with

V

= 20 mV (RMS);

DTMF

MUTE = LOW
f = 300 to 3400 Hz −±0.2 − dB

frequency referenced to 1 kHz
∆G

v(DTMF)(T)

voltage gain variation with

T

= −25 to +75 °C −±0.4 − dB

amb

temperature referenced

to 25 °C
G

v(ct)

voltage gain from pin DTMF to

pin QR (confidence tone)

V

= 20 mV (RMS);

DTMF

RL= 150 Ω;
MUTE = LOW; V

VCI

=0V

− 13 − mA

− 82 − mA

− 470 −µA

− 68 − kΩ

− 34 − kΩ

−−77 − dBmp

24.9 25.9 26.9 dB

−−15.6 − dB

1999 Nov 22 14

Philips Semiconductors Product specification

Speech circuit with dialler interface, regulated

TEA1111A

supply and earpiece volume control

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Receive stage (pins IR, GAR, QR and VCI)

THE EARPIECE AMPLIFIER (PINS IR AND QR)

 input impedance − 22 − kΩ

Z

i

G

v(QR)

∆G

v(QR)(f)

∆G

v(QR)(T)

∆G

v(QR)

V

QR(max)(rms)

V

no(QR)(rms)

VOLUME CONTROL (PIN VCI)
∆G

v(QR)max

∆G

v(QR)step

Automatic gain control (pin AGC)

∆G

v(trx)

I

start

I

stop

Mute function (pin MUTE)

V

IL

V

IH

I

MUTE

∆G

v(trx)(m)

voltage gain from pin IR to

pin QR

voltage gain variation with

VIR= 4 mV (RMS);
V

=0 V

VCI

26.4 27.4 28.4 dB

f = 300 to 3400 Hz −±0.2 − dB

frequency referenced to 1 kHz

voltage gain variation with

T

= −25 to +75 °C −±0.3 − dB

amb

temperature referenced to

25 °C

voltage gain reduction range externalresistorconnected

−− 6dB
between
pins GAR and QR

maximum receiving signal on
pin QR (RMS value)

IP= 0 mA; sine wavedrive;
RL= 150 Ω; THD = 2%;
V

VCI=VDD

I

= 0 mA; sine wavedrive;

P

0.5 0.6 − V

0.8 0.9 − V
RL= 450 Ω; THD = 2%;
V

VCI=VDD

noise output voltage at pin QR
(RMS value)

IR open circuit;
RL= 150 Ω; V

VCI

−−90 − dBVp

=0V;
psophometrically weighted
(P53 curve)

−−75 − dBVp

12 14.5 17 dB

maximum increase in voltage
gain

V

VCI=VDD

VIR= 4 mV (RMS);
V

VCI=VDD

step voltage gain VIR= 4 mV (RMS) 3.85 4.85 5.85 dB

voltage gain control range for

I

=85mA − 6.0 − dB

line

microphone and earpiece
amplifiers w.r.t. I

highest line current for

=15mA

line

− 23 − mA

maximum gain
lowest line current for min. gain − 59 − mA

LOW-level input voltage VEE− 0.4 − VEE+ 0.3 V
HIGH-level input voltage VEE+ 1.5 − VDD+ 0.4 V
input current −10 −2 −µA
voltage gain reduction for:

microphone amplifier
earpiece amplifier
DTMF amplifier

MUTE = LOW − 80 − dB
MUTE = LOW − 80 − dB
MUTE = HIGH − 80 − dB

1999 Nov 22 15

Philips Semiconductors Product specification

Speech circuit with dialler interface, regulated
supply and earpiece volume control

TEST AND APPLICATION INFORMATION

C

IR

ast3

R

prot

R
20 Ω

SLPE

Dz
V

d

10 V

DTMF

V

DD

peripheral

supply

V

EE

C

emc

10 nF

C

REG

4.7 µF

R

AGC

C

DTMF

220 nF

C
220 µF

VDD

LN

SLPE

REG

AGC

DTMF

V

DD

MUTE

IR

TEA1111A

MUTE

handbook, full pagewidth

AB

BA

C

bal

220 nF

D1 D2

1N4004

D3 D4

R

ast1

130 kΩ

100 nF

R

ast2

3.92 kΩ
R

392 Ω

R

bal1

130 Ω

R

bal2

820 Ω

Cz

Rz

R

CC

619 Ω

V

CC

LEDC

MIC−

MIC+

QR

GAR

V

EE

VCI

R

GARext

R

100 µF

TX3

C

VCC

2R

TEA1111A

2.4

24 Ω

kΩ

BC858

TX1

TX2

C
100 pF

GAR

VCI

VCI

1

0

C

MIC−

C

MIC+

C

10 µF

1 nF

C

GARS

MIC−

MIC+

EAR

earpiece

FCA059

R

R

R

Fig.13 Basic application diagram.

1999 Nov 22 16

Philips Semiconductors Product specification

Speech circuit with dialler interface, regulated
supply and earpiece volume control

handbook, full pagewidth

I

line

I

line

V

R

CC

619 Ω

24 Ω 2.4 kΩ

I

LN

V

DTMF

LEDC

IR

MIC−

MIC+

DTMF

BC858

100

µF

O

V

MIC

600 Ω

R

SLPE

20 Ω

LN

REG AGCSLPE

TEA1111A

C

REG

4.7 µF

TEA1111A

C

VCC

3 mA

S1

I

DD

V

DD

QR

R

GAR

VCIMUTE

GARext

I

CC

V

CC

V

EE

100 µF

C

VDD

220 µF

10 µF

C

GAR

C

R

GARS

L

V

Voltage gain defined as Gv= 20 log ; VI=V
Microphone gain: S1 = open.
DTMF gain: S1 = closed.
Inputs not being tested should be open circuit.

O

------­V

I

Fig.14 Test circuit for defining transmit gains.

MIC

or V

DTMF

FCA060

.

1999 Nov 22 17

Philips Semiconductors Product specification

Speech circuit with dialler interface, regulated
supply and earpiece volume control

I

handbook, full pagewidth

line

I

line

BC858

100

µF

600 Ω

24 Ω 2.4 kΩ

V

IR

220
nF

V

DTMF

LEDC

IR

MIC−

MIC+

DTMF

R

LN

REG AGCSLPE

SLPE
20 Ω

R

619 Ω

I

LN

TEA1111A

C

REG

4.7 µF

CC

TEA1111A

C

VCC

V

O

100 µF

C

VDD

220 µF

10 µF

C

GAR

C

GARS

R

L

3 mA

S1

I

DD

V

DD

QR

R

GARext

VCIMUTE

GAR

E

VCI

I

CC

V

CC

V

EE

V

Voltage gain defined as Gv= 20 log ; VI=VIRor V
Earpiece gain: S1 = open.
Confidence tone: S1 = closed.
Inputs not being tested should be open circuit.

O

------­V

I

Fig.15 Test circuit for defining earpiece gains.

DTMF

FCA061

.

1999 Nov 22 18

Philips Semiconductors Product specification

Speech circuit with dialler interface, regulated
supply and earpiece volume control

handbook, full pagewidth

V

CC

C

REG

4.7 µF

LN

IR
MIC−
MIC+
DTMF
LEDC

REG AGC SLPE

R

CC

619 Ω

TEA1111A

R

SLPE

20 Ω

V

CC

V

EE

V

DD

MUTE

QR

GAR

VCI

TEA1111A

V

DD

10 µF

I

DD

Inputs not being tested should be open circuit.

Fig.16 Test circuit for defining regulated supply (VDD) performance in ringer and trickle modes.

FCA062

1999 Nov 22 19

Philips Semiconductors Product specification

Speech circuit with dialler interface, regulated
supply and earpiece volume control

PACKAGE OUTLINE

SO16: plastic small outline package; 16 leads; body width 3.9 mm

D

c

y

Z

16

9

TEA1111A

SOT109-1

E

H

E

A

X

v M

A

pin 1 index

1

e

0 2.5 5 mm

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

mm

A

max.

1.75

0.069

A1A

0.25

0.10

0.010

0.004

2

1.45

1.25

0.057

0.049

A

0.25

0.01

b

3

p

0.49

0.25

0.36

0.19

0.0100

0.019

0.0075

0.014

UNIT

inches

Note

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

(1)E(1) (1)

cD

10.0

9.8

0.39

0.38

8

b

p

scale

eHELLpQZywv θ

4.0

1.27

3.8

0.16

0.050

0.15

w M

6.2

5.8

0.244

0.228

A

2

1.05

0.041

Q

A

1

detail X

1.0

0.7

0.4

0.6

0.028

0.039

0.020

0.016

(A )

L

p

L

0.25 0.1

0.25

0.01

0.01 0.004

A

3

θ

0.7

0.3

0.028

0.012

o

8

o

0

OUTLINE

VERSION

SOT109-1

IEC JEDEC EIAJ

076E07S MS-012AC

REFERENCES

1999 Nov 22 20

EUROPEAN

PROJECTION

ISSUE DATE

95-01-23
97-05-22

Philips Semiconductors Product specification

Speech circuit with dialler interface, regulated
supply and earpiece volume control

SOLDERING
Introduction to soldering surface mount packages

Thistextgivesaverybriefinsight to a complex technology.
A more in-depth account of soldering ICs can be found in
our

“Data Handbook IC26; Integrated Circuit Packages”

(document order number 9398 652 90011).
There is no soldering method that is ideal for all surface

mount IC packages. Wave soldering is not alwayssuitable
for surface mount ICs, or for printed-circuit boards with
high population densities. In these situations reflow
soldering is often used.

Reflow soldering

Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
tothe printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.

Several methods exist for reflowing; for example,
infrared/convection heating in a conveyor type oven.
Throughput times (preheating, soldering and cooling) vary
between 100 and 200 seconds depending on heating
method.

Typical reflow peak temperatures range from
215 to 250 °C. The top-surface temperature of the
packages should preferable be kept below 230 °C.

• Use a double-wave soldering method comprising a

• For packages with leads on two sides and a pitch (e):

• Forpackageswithleadsonfoursides,thefootprintmust

During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.

Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.

Manual soldering

TEA1111A

turbulent wave with high upward pressure followed by a
smooth laminar wave.

– larger than or equal to 1.27 mm, the footprint

longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;

– smaller than 1.27 mm, the footprint longitudinal axis

must be parallel to the transport direction of the
printed-circuit board.

The footprint must incorporate solder thieves at the
downstream end.

be placed at a 45° angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.

Wave soldering

Conventional single wave soldering is not recommended
forsurfacemountdevices(SMDs)orprinted-circuitboards
with a high component density, as solder bridging and
non-wetting can present major problems.

To overcome these problems the double-wave soldering
method was specifically developed.

If wave soldering is used the following conditions must be
observed for optimal results:

Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300 °C.

When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320 °C.

1999 Nov 22 21

Philips Semiconductors Product specification

Speech circuit with dialler interface, regulated

TEA1111A

supply and earpiece volume control

Suitability of surface mount IC packages for wave and reflow soldering methods

PACKAGE

BGA, SQFP not suitable suitable
HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, SMS not suitable

(3)

PLCC
LQFP, QFP, TQFP not recommended
SSOP, TSSOP, VSO not recommended

Notes

1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum

2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink

3. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.

4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;

5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is

, SO, SOJ suitable suitable

temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the

(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).

The package footprint must incorporate solder thieves downstream and at the side corners.

it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.

definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.

“Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”

WAVE REFLOW

(2)

SOLDERING METHOD

suitable

(3)(4)
(5)

suitable
suitable

(1)

.

DEFINITIONS

Data sheet status

Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.

1999 Nov 22 22

Philips Semiconductors Product specification

Speech circuit with dialler interface, regulated
supply and earpiece volume control

NOTES

TEA1111A

1999 Nov 22 23

Philips Semiconductors – a w orldwide compan y

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Brazil: see South America
Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor,

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Middle East: see Italy

Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB,

Tel. [phone], Fax. [phone]
New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,

Tel. [phone], Fax. [phone]
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Pakistan: see Singapore
Philippines: Philips Semiconductors Philippines Inc.,

106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI,
Metro MANILA, Tel. [phone], Fax. [phone]

Poland: Al.Jerozolimskie 195 B, 02-222 WARSAW,
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Portugal: see Spain
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Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW,

Tel. [phone], Fax. [phone]
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252042 KIEV, Tel. [phone], Fax. [phone]

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United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. [phone], Fax. [phone]

Uruguay: see South America
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Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,

Tel. [phone], Fax.[phone]

For all other countries apply to: Philips Semiconductors,
International Marketing & Sales Communications, Building BE-p, P.O. Box 218,
5600 MD EINDHOVEN, The Netherlands, Fax. [phone]

© Philips Electronics N.V. SCA
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.

1999

Internet: http://www.semiconductors.philips.com

68

Printed in The Netherlands 465002/02/pp24 Date of release: 1999 Nov 22 Document order number: 9397 750 06482