Philips TDA9964 User Manual

1. Description

2. Features

TDA9964

12-bit, 3.0 V, 30 Msps analog-to-digital interface for CCD
cameras

Rev. 03 — 16 January 2001 Objective specification

The TDA9964 is a 12-bit analog-to-digital interface for CCD cameras. The device
includes a correlated double sampling circuit, PGA, clamp loops and a low-power
12-bit ADC together with its reference voltage regulator.

The PGA gain and the ADC input clamp level are controlled via the serial interface.
An additional DAC is provided for additional system controls; its output voltage range

is 1.0 V p-p, which is available at pin OFDOUT.

c

c

3. Applications

■ Correlated Double Sampling (CDS), Programmable Gain Amplifier (PGA), 12-bit

Analog-to-Digital Converter (ADC) and reference regulator included

■ Fully programmable via a 3-wire serial interface

■ Sampling frequency up to 30 MHz

■ PGA gain range of 24 dB (in steps of 0.1 dB)

■ Low power consumption of only 175 mW at 2.7 V

■ Power consumption in standby mode of 4.5 mW (typ.)

■ 3.0 V operation and 2.5 to 3.6 V operation for the digital outputs

■ All digital inputs accept 5 V signals

■ Active control pulses polarity selectable via serial interface

■ 8-bit DAC included for analog settings

■ TTL compatible inputs, CMOS compatible outputs.

■ Low-power, low-voltage CCD camera systems.

Philips Semiconductors

TDA9964

12-bit, 3.0 V, 30 Msps analog-to-digital interface for CCD cameras

4. Quick reference data

Table 1: Quick reference data

Symbol Parameter Conditions Min Typ Max Unit

V

CCA

V

CCD

V

CCO

I

CCA

I

CCD

I

CCO

ADC

res

V

i(CDS)(p-p)

f

pix(max)

f

pix(min)

DR

PGA

N

tot(rms)

E

in(rms)

P

tot

analog supply voltage 2.7 3.0 3.6 V
digital supply voltage 2.7 3.0 3.6 V
digital outputs supply voltage 2.5 2.7 3.6 V
analog supply current all clamps active − 60 − mA
digital supply current − 3 − mA
digital outputs supply current f

= 30 MHz; CL= 10 pF; input ramp

pix

− 1 − mA

response time is 800 µs
ADC resolution − 12 − bits
maximum CDS input voltage

(peak-to-peak value)

VCC= 2.85 V 650 −−mV

≥ 3.0 V 800 −−mV

V

CC

maximum pixel frequency 30 −−MHz
minimum pixel frequency tbf −−MHz
PGA dynamic range − 24 − dB
total noise from CDS input to

PGA gain = 0 dB; see Figure 8 − 1.5 − LSB
ADC output

equivalent input noise (RMS

gain=24dB − 70 −µV
value)

total power consumption V

CCA=VCCD=VCCO

V

CCA=VCCD=VCCO

=3V − 195 − mW
= 2.7 V − 175 − mW

5. Ordering information

Table 2: Ordering information

Type number Package

Name Description Version

TDA9964HL LQFP48 plastic low profile quad flat package; 48 leads; body 7 × 7 × 1.4 mm SOT313-2

9397 750 07918

Objective specification Rev. 03 — 16 January 2001 2 of 23

© Philips Electronics N.V. 2001. All rights reserved.

9397 750 07918

Objective specification Rev. 03 — 16 January 2001 3 of 23

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6. Block diagram

Philips Semiconductors

CLK

43

DATA
FLIP­FLOP

20

BLK

BLANKING

42

STDBY

SHD

AGND4

V

CCA1

1

46

SHIFT

V

ref

13

AGND5

SHP

45

CDS CLOCK GENERATOR

CPCDS1

CPCDS2

V

CCA2

AGND2

V

CCA3

AGND3

OFDOUT

© Philips Electronics N.V. 2001. All rights reserved.

8

9
7

3

CORRELATED

4

IN

14

5

11

DOUBLE

SAMPLING

OFD DAC

12 6

TEST

CLAMP

AGND1

2

CLAMP

V

CCA4

41

AGND6

40

PGA

8-BIT

REGISTER

8-BIT

REGISTER

CLPDM

CLPOB

44

15

OPGA OPGAC

48

TDA9964

16

BLACK
LEVEL

SHIFT

SEN

19

7-BIT

REGISTER

SERIAL

INTERFACE

18

SCLK

SDATA

12-bit ADC

17

VSYNC

47

REGULATOR

OE

39

OUTPUT
BUFFER

22
21

37

38
36
35
34
33
32
31
30
29
28
27
26
25

24
23

10

FCE515

DGND1
V

CCD1

OGND2

V

CCO2

D11
D10

D9
D8
D7
D6
D5
D4
D3
D2
D1

D0

OGND1

V

CCO1

DCLPC

12-bit, 3.0 V, 30 Msps analog-to-digital interface for CCD cameras

Fig 1. Block diagram.

TDA9964

Philips Semiconductors

7. Pinning information

7.1 Pinning

TDA9964

12-bit, 3.0 V, 30 Msps analog-to-digital interface for CCD cameras

Fig 2. Pin configuration.

V

CCA1
AGND1
AGND2

AGND3

AGND4
V

CCA2

CPCDS1

CPCDS2

DCLPC

OFDOUT

TEST

CLPDM
48

1
2
3
4

IN

5
6
7
8
9

10
11

12

13

AGND5

SHD

CLK

474645

141516

CCA3

OPGA

V

SHP

CLPOB
44

TDA9964HL

17

SDATA

OPGAC

BLK
43

181920

SCLK

STDBY

42

SEN

VSYNC

CCA4

V
414039

V

CCO2

AGND6

V

OE

38

21

22

23

CCD1VCCO1

DGND1

OGND2

37

24

OGND1

36
35
34
33
32
31
30
29
28
27
26
25

FCE516

D11
D10

D9
D8
D7
D6
D5
D4
D3
D2
D1
D0

7.2 Pin description

Table 3: Pin description

Symbol Pin Description

V

CCA1

AGND1 2 analog ground 1
AGND2 3 analog ground 2
IN 4 input signal from CCD
AGND3 5 analog ground 3
AGND4 6 analog ground 4
V

CCA2

CPCDS1 8 clamp storage capacitor pin 1
CPCDS2 9 clamp storage capacitor pin 2
DCLPC 10 regulator decoupling pin
OFDOUT 11 analog output of the additional 8-bit control DAC
TEST 12 test mode input pin (should be connected to AGND5)
AGND5 13 analog ground 5
V

CCA3

9397 750 07918

Objective specification Rev. 03 — 16 January 2001 4 of 23

1 analog supply voltage 1

7 analog supply voltage 2

14 analog supply 3

© Philips Electronics N.V. 2001. All rights reserved.

Philips Semiconductors

TDA9964

12-bit, 3.0 V, 30 Msps analog-to-digital interface for CCD cameras

Table 3: Pin description

…continued

Symbol Pin Description

OPGA 15 PGA output (test pin)
OPGAC 16 PGA complementary output (test pin)
SDATA 17 serial data input for serial interface control
SCLK 18 serial clock input for serial interface
SEN 19 strobe pin for serial interface
VSYNC 20 vertical sync pulse input
V

CCD1

21 digital supply voltage 1
DGND1 22 digital ground 1
V

CCO1

23 output supply voltage 1
OGND1 24 digital output ground 1
D0 25 ADC digital output 0 (LSB)
D1 26 ADC digital output 1
D2 27 ADC digital output 2
D3 28 ADC digital output 3
D4 29 ADC digital output 4
D5 30 ADC digital output 5
D6 31 ADC digital output 6
D7 32 ADC digital output 7
D8 33 ADC digital output 8
D9 34 ADC digital output 9
D10 35 ADC digital output 10
D11 36 ADC digital output 11 (MSB)
OGND2 37 output digital ground 2
V

CCO2

38 output supply voltage 2
OE 39 output enable control input (LOW: outputs active; HIGH:

outputs are high impedance)
AGND6 40 analog ground 6
V

CCA4

41 analog supply voltage 4

STDBY 42 standby mode control input (LOW: TDA9964 active; HIGH:

TDA9964 standby)
BLK 43 blanking control input
CLPOB 44 clamp pulse input at optical black
SHP 45 preset sample-and-hold pulse input
SHD 46 data sample-and-hold pulse input
CLK 47 data clock input
CLPDM 48 clamp pulse input at dummy pixel

9397 750 07918

Objective specification Rev. 03 — 16 January 2001 5 of 23

© Philips Electronics N.V. 2001. All rights reserved.

Philips Semiconductors

TDA9964

12-bit, 3.0 V, 30 Msps analog-to-digital interface for CCD cameras

8. Limiting values

Table 4: Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol Parameter Conditions Min Max Unit

V
V
V
∆V

V
I

o

T
T
T

CCA
CCD
CCO

CC

i

stg
amb
j

analog supply voltage
digital supply voltage
digital outputs supply voltage
supply voltage difference:

between V
between V
between V

CCA
CCA
CCD

and V
and V
and V

CCD
CCO
CCO

input voltage referenced to AGND −0.3 +7.0 V
data output current −±10 mA
storage temperature −55 +150 °C
ambient temperature −20 +75 °C
junction temperature − 150 °C

[1]

−0.3 +7.0 V

[1]

−0.3 +7.0 V

[1]

−0.3 +7.0 V

−0.5 +0.5 V

−0.5 +1.2 V

−0.5 +1.2 V

[1] The supply voltages V

∆VCC remains as indicated.

CCA

, V

CCD

and V

may have any value between −0.3 and +7.0 V provided that the supply voltage difference

CCO

9. Thermal characteristics

Table 5: Thermal characteristics

Symbol Parameter Conditions Value Unit

R

th(j-a)

thermal resistance from junction to ambient in free air 76 K/W

10. Characteristics

Table 6: Characteristics

V

CCA=VCCD

Symbol Parameter Conditions Min Typ Max Unit

Supplies

V

CCA

V

CCD

V

CCO

I

CCA

I

CCD

I

CCO

= 3.0 V; V

CCO

= 2.7 V; f

= 30 MHz; T

pix

=25°C; unless otherwise specified.

amb

analog supply voltage 2.7 3.0 3.6 V
digital supply voltage 2.7 3.0 3.6 V
digital outputs supply voltage 2.5 2.7 3.6 V
analog supply current all clamps active − 60 − mA
digital supply current − 3 − mA
digital outputs supply current CL= 10 pF on all data

− 1 − mA
outputs; input ramp
response time is 800 µs

9397 750 07918

Objective specification Rev. 03 — 16 January 2001 6 of 23

© Philips Electronics N.V. 2001. All rights reserved.

Philips Semiconductors

TDA9964

12-bit, 3.0 V, 30 Msps analog-to-digital interface for CCD cameras

Table 6: Characteristics

V

CCA=VCCD

= 3.0 V; V

…continued

= 2.7 V; f

CCO

= 30 MHz; T

pix

=25°C; unless otherwise specified.

amb

Symbol Parameter Conditions Min Typ Max Unit

Digital inputs

Pins: SHP, SHD and CLK (referenced to DGND)

V

IL

V

IH

I

i

Z

i

C

i

Pins: CLPDM, CLPOB, SEN, SCLK, SDATA, STBY,

V

IL

V

IH

I

i

LOW-level input voltage 0 − 0.6 V
HIGH-level input voltage 2.2 − 5.5 V
input current 0 ≤ Vi≤ 5.5 V −3 − +3 µA
input impedance f
input capacitance f

= 30 MHz − 50 − kΩ

CLK

= 30 MHz −− 2pF

CLK

OE, BLK, VSYNC

LOW-level input voltage 0 − 0.6 V
HIGH-level input voltage 2.2 − 5.5 V
input current 0 ≤ Vi≤ 5.5 V −2 − +2 µA

Clamps

Global characteristics of the clamp loops

t

W(clamp)

clamp active pulse width in
number of pixels

PGA code = 255 for
maximum 4 LSB error

12 −−pixels

Input clamp (driven by CLPDM)

g

m(CDS)

CDS input clamp

− 20 − mS

transconductance

Correlated Double Sampling (CDS)

V

i(CDS)(p-p)

V

reset(max)

maximum peak-to-peak CDS
input amplitude (video signal)

maximum CDS input reset

VCC= 2.85 V 650 −−mV

≥ 3.0 V 800 −−mV

V

CC

500 −−mV

pulse amplitude

I

i(IN)

C

i

t

CDS(min)

input current into pin IN at floating gate level tbf − tbf µA
input capacitance − 2 − pF
CDS control pulsesminimum

active time

V

i(CDS)(p-p)

= 800 mV

black to white transition in

8 −−ns

1 pixel with 98.5%

recovery

V

i

t

h(IN;SHP)

CDS input hold time (pin IN)

see Figure 3 and 4 4 −−ns
compared to control pulse
SHP

t

h(IN;SHD)

CDS input hold time (pin IN)

see Figure 3 and 4 4 −−ns
compared to control pulse
SHD

Amplifier

DR
∆G

PGA
PGA

PGA dynamic range − 24 − dB
PGA gain step 0.08 0.10 0.12 dB

Analog-to-Digital Converter (ADC)

DNL differential non linearity f

= 30 MHz; ramp input −±0.5 ±0.9 LSB

pix

Total chain characteristics (CDS + PGA + ADC)

f

pix(max)

maximum pixel frequency 30 −−MHz

9397 750 07918

Objective specification Rev. 03 — 16 January 2001 7 of 23

© Philips Electronics N.V. 2001. All rights reserved.

Philips Semiconductors

TDA9964

12-bit, 3.0 V, 30 Msps analog-to-digital interface for CCD cameras

Table 6: Characteristics

V

CCA=VCCD

= 3.0 V; V

…continued

= 2.7 V; f

CCO

= 30 MHz; T

pix

=25°C; unless otherwise specified.

amb

Symbol Parameter Conditions Min Typ Max Unit

f

pix(min)

t

CLKH

t

CLKL

t

d(SHD;CLK)

minimum pixel frequency tbf −−MHz
CLK pulse width HIGH 12 −−ns
CLK pulse width LOW 12 −−ns
time delay between

see Figure 3 and 4 10 −−ns
SHD and CLK

t

su(BLK;SHD)

set-up timeofBLK compared

see Figure 3 and 4 5 −−ns
to SHD

V

i(IN)

N

tot(rms)

video input dynamic signal
for ADC full-scale output

total noise from CDS input to
ADC output (RMS value)

PGA code = 00 800 −−mV

PGA code = 255 50 −−mV

see Figure 8

PGA gain = 0 dB − 1.5 − LSB
PGA gain = 9 dB − 2.2 − LSB

E

in(rms)

O

CCD(max)

equivalent input noise
voltage (RMS value)

maximum offset between

PGA gain = 24 dB − 70 −µV

PGA gain = 9 dB − 140 −µV

−100 − +100 mV
CCD floating level and CCD
dark pixel level

Digital-to-analog converter (OFDOUT DAC)

V

OFDOUT(p-p)

additional 8-bit control DAC

Ri=1MΩ−1.0 − V
(OFD) output voltage
(peak-to-peak value)

V

OFDOUT(0)

V

OFDOUT(255)

DC output voltage for code 0 − AGND − V
DC output voltage for

− AGND + 1.0 − V

code 255

TC

DAC

DAC output range

− 250 − ppm/°C

temperature coefficient

Z

OFDOUT

I

OFDOUT

Digital outputs (f

V

OH

V

OL

I

OZ

DAC output impedance − 2000 −Ω
OFD output current drive static −− 100 µA

= 30 MHz; CL= 10 pF); see Figure 3 and 4

pix

HIGH-level output voltage IOH= −1mA V

− 0.5 − V

CCO

CCO

V
LOW-level output voltage IOL=1mA 0 − 0.5 V
output current in 3-state

0.5 V < Vo<V

CCO

−20 − +20 µA

mode

t
t

C

h(o)
d(o)

L

output hold time 5 −−ns
output delay time CL= 10 pF; V

= 10 pF; V

C

L

= 3.0 V − 12 tbf ns

CCO

= 2.7 V − 14 tbf ns

CCO

output load capacitance −− 15 pF

Serial interface

f

SCLK(max)

maximum frequency of serial

10 −−MHz

interface

9397 750 07918

Objective specification Rev. 03 — 16 January 2001 8 of 23

© Philips Electronics N.V. 2001. All rights reserved.

9397 750 07918

Objective specification Rev. 03 — 16 January 2001 9 of 23

Philips Semiconductors

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IN

SHP

t

h(IN;SHP)

SHD

CLK

DATA

© Philips Electronics N.V. 2001. All rights reserved.

BLK

0.6 V

N

0.6 V

t

h(IN;SHD)

2.2 V

N − 4

N + 1N + 2N + 3N + 4N + 5

t

CDS(min)

2.2 V

t

CDS(min)

t

CLKH

t

d(SHD;CLK)

2.2 V

0.6 V

t

h(o)

0.6 V

0.6 V

50%

N − 3N − 2N − 1

2.2 V

t

d(o)

2.2 V

t

2.2 V

N

su(BLK;SHD)

12-bit, 3.0 V, 30 Msps analog-to-digital interface for CCD cameras

ADC CLAMP

CODE

FCE517

TDA9964

Fig 3. Pixel frequency timing diagram; all polarities active HIGH.

9397 750 07918

Objective specification Rev. 03 — 16 January 2001 10 of 23

Philips Semiconductors

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IN

SHP

t

h(IN;SHP)

SHD

CLK

DATA

BLK

© Philips Electronics N.V. 2001. All rights reserved.

2.2 V

N

2.2 V

t

h(IN;SHD)

t

CLKL

0.6 V

N − 4

N + 1N + 2N + 3N + 4N + 5

0.6 V

t

CDS(min)

2.2 V

0.6 V

t

CDS(min)

2.2 V 2.2 V

0.6 V

t

d(SHD;CLK)

50%

N − 3N − 2N − 1

t

h(o)

t

d(o)

0.6 V

0.6 V

N

12-bit, 3.0 V, 30 Msps analog-to-digital interface for CCD cameras

ADC CLAMP

CODE

Fig 4. Pixel frequency timing diagram; all polarities active LOW.

t

su(BLK;SHD)

FCE518

TDA9964

Philips Semiconductors

TDA9964

12-bit, 3.0 V, 30 Msps analog-to-digital interface for CCD cameras

FCE519

1.0

OFDOUT

DAC voltage

output

(V)

0

0

OFDOUT control DAC input code

Fig 5. DAC voltage output as a function of DAC input code.

CLPOB

WINDOW

AGCOUT VIDEO OPTICAL BLACK

CLPOB
(active HIGH)

CLPDM
(active HIGH)

BLK
(active HIGH)

HORIZONTAL FLYBACK DUMMY VIDEO

BLK window

255

CLPDM

WINDOW

FCE520

Fig 6. Line frequency timing diagram.

9397 750 07918

Objective specification Rev. 03 — 16 January 2001 11 of 23

© Philips Electronics N.V. 2001. All rights reserved.

Philips Semiconductors

TDA9964

12-bit, 3.0 V, 30 Msps analog-to-digital interface for CCD cameras

FCE521

25.9

192

PGA input code

TOTAL

gain
(dB)

30

24

18

12

6

1.9

0

0 64 128 255

Fig 7. Total gain from CDS input to ADC input as a function of PGA input code.

6

handbook, halfpage

N

tot(rms)

(LSB)

5

FCE522

4

3

2

1

0

0 64 128 255

192

PGA code

Noise measurement at ADC outputs: Coupling capacitor at input is grounded, so only noise contribution of the front-end is
evaluated. Front-end works at 30 Mpixels with line of 1024 pixels of which the first 40 lines are used to run CLPOB and the
last 40 lines for CLPDM. Data at the ADC outputs is measured during the other pixels. As a result, the standard deviation of the
codes statistic is computed, resulting in the noise. No quantization noise is taken into account as there is no input.

Fig 8. Typical total noise performance as a function of PGA gain.

9397 750 07918

© Philips Electronics N.V. 2001. All rights reserved.

Objective specification Rev. 03 — 16 January 2001 12 of 23

Philips Semiconductors

TDA9964

12-bit, 3.0 V, 30 Msps analog-to-digital interface for CCD cameras

SDATA

SCLK

SEN

SCLK

OFDOUT DAC

LATCHES

FLIP-FLOP

8-bit DAC

SD0

LSB

8 8 7 10

PGA GAIN

LATCHES

FLIP-FLOP

PGA control

Fig 9. Serial interface block diagram.

SD2SD1

SD3

SD4

ADC CLAMP

LATCHES

FLIP-FLOP

ADC clamp

control

SD5

12

SHIFT REGISTER

SD6

SD7

CONTROL PULSE

POLARITY

LATCHES

control pulses

polarity settings

SD9 SD10 SD11

SD8

VSYNC

FCE523

MSB

A0

A1 A2 A3

LATCH

SELECTION

t

su2

t

hd4

SD7 SD6 SD5 SD4 SD3

SDATA

SCLK

SEN

t

su1=tsu2=tsu3

A3

t

su1

= 10 ns (min.); t

A1A2

A0

hd3=thd4

MSB

SD10

SD11

= 10 ns (min.)

SD9

SD8

Fig 10. Loading sequence of control input data via the serial interface.

LSB

SD2 SD1 SD0

t

su3

t

hd3

FCE524

9397 750 07918

© Philips Electronics N.V. 2001. All rights reserved.

Objective specification Rev. 03 — 16 January 2001 13 of 23

Philips Semiconductors

Table 7: Serial interface programming

Address bits Data bits D9 to D0
A3 A2 A1 A0

0 0 0 0 PGA gain control (SD7 to SD0)
0001DAC OFDOUT output control (SD7 to SD0)
0 0 1 0 ADC clamp reference control (SD6 to SD0); from code 0 to 127
0 0 1 1 control pulses (pins SHP, SHD, CLPDM, CLPOB, BLK and CLK)

0 1 0 0 SD7 = 0 by default; SD7 = 1 PGA gain up to 36 dB but noise and

1 1 1 1 initialization (SD11 to SD0 = 0)
other addresses test modes

Table 8: Polarity settings

Symbol Pin Serial control bit Active edge or level

SHP and SHD 45 and 46 SD4 1 = HIGH; 0 = LOW
CLK 47 SD5 1 = rising; 0 = falling
CLPDM 48 SD0 1 = HIGH; 0 = LOW
CLPOB 44 SD1 1 = HIGH; 0 = LOW
BLK 43 SD3 1 = HIGH; 0 = LOW
VSYNC 20 SD8 0 = rising; 1 = falling

TDA9964

12-bit, 3.0 V, 30 Msps analog-to-digital interface for CCD cameras

polarity settings; SD2, SD6, SD7 and SD9 should be set to logic 1;
for SD6 and SD7 see Table 9, 10, 11, and 12

clamp behaviour are not guaranteed

Table 9: Standby control using pin STDBY

Bit SD7 of
register 0011

1 1 last logic state 1.5 mA

0 1 active 65 mA

Table 10: Output enable selection using output enable pin (

Bit SD6 of register 0011 OE ADC digital outputs D11 to D0

1 0 active, binary

0 0 high impedance

Table 11: Standby control by serial interface (register

address A3 = 0, A2 = 0, A1 = 1 and A0 = 1); pin STDBY connected to ground

SD7 ADC digital outputs D11 to D0 I

0 last logic state 1.5 mA
1 active 65 mA

STDBY ADC digital outputs

D11 to D0

0 active 65 mA

0 test logic state 1.5 mA

1 high impedance

1 active binary

CCA+ICCO+ICCD

I

CCA+ICCO+ICCD

OE)

(typ.)

(typ.)

9397 750 07918

Objective specification Rev. 03 — 16 January 2001 14 of 23

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Philips Semiconductors

Table 12: Output enable control by serial interface (register address A3 = 0, A2 = 0,

A1 = 1 and A0 = 1); output enable pin (

SD6 ADC digital outputs D11 to D0

0 high impedance
1 active binary

11. Application information

TDA9964

12-bit, 3.0 V, 30 Msps analog-to-digital interface for CCD cameras

OE) connected to ground

handbook, full pagewidth

V

CCA

CCD

100

nF

(2)

1 µF

V

CCA

1
µF

1
µF

1
µF

V

CCA1
AGND1
AGND2

AGND3

AGND4
V

CCA2

CPCDS1
CPCDS2

DCLPC

OFDOUT

TEST

V

(2) (2)

CLK

SHD

CLPDM

48 47 46 45 44 43 42 41 40 39 38 37
1
2
3

IN

4
5
6
7
8
9
10
11
12

13 14 15 16 17 18 19 20 21 22 23 24

SHP

BLK

CLPOB

TDA9964

STDBY

CCA

100 nF

CCA4

V

V

CCD

AGND6

OE

V

CCO

CCO2

V

V

CCD

100 nF

OGND2

D11

36

D10

35

D9

34

D8

33

D7

32

D6

31

D5

30

D4

29

D3

28

D2

27

D1

26

D0

25

SEN

CCA3

AGND5

V

V

CCA

OPGA

100 nF

SDATA

OPGAC

SCLK

serial

interface

VSYNC

(1)

V

CCD1

V

100 nF

CCD

CCO1

V

DGND1

V

CCO

OGND1

100 nF

FCE525

(1) Pins SEN and VSYNC should be interconnected when the vertical sync signal is not available.
(2) Input signals IN, SHD and SHP must be adjusted to comply with timing signals t

h(IN;SHP)

and t

h(IN;SHD)

(see Section 10

“Characteristics”).

Fig 11. Application diagram.

9397 750 07918

Objective specification Rev. 03 — 16 January 2001 15 of 23

© Philips Electronics N.V. 2001. All rights reserved.

Philips Semiconductors

11.1 Power and grounding recommendations

When designing a printed-circuit board for applications such as PC cameras,
surveillance cameras, camcorders and digital still cameras, care should be taken to
minimize the noise.

For the front-end integrated circuit, the basic rules of printed-circuit board design and
implementation of analog components (such as classical operational amplifiers) must
be respected, particularly with respect to power and ground connections.

The following additional recommendation is given for the CDS input pin(s) which is
(are) internally connected to the programmable gain amplifier:

The connections between CCD interface and CDS input should be as short as
possible and a ground ring protection around these connections can be beneficial.
Separate analog and digital supplies provide the best solution. If it is not possible to
do this on the board, the analog supply pins must be decoupled effectively from the
digital supply pins. If the same power supply and ground are used for all the pins, the
decoupling capacitors must be placed as closely as possible to the IC package.

To minimize the noise caused by package and die parasitics in a two-ground system,
the following recommendation must be implemented:

TDA9964

12-bit, 3.0 V, 30 Msps analog-to-digital interface for CCD cameras

All analog and digital supply pins must be decoupled to the analog ground plane.
Only the ground pin associated with the digital outputs must be connected to the
digital ground plane. All other ground pins should be connected to the analog ground
plane. The analog and digital ground planes must be connected together at one point
as closely as possible to the ground pin associated with the digital outputs.

The digital output pins and their associated lines should be shielded by the digital
ground plane, which can then be used as return path for digital signals.

9397 750 07918

Objective specification Rev. 03 — 16 January 2001 16 of 23

© Philips Electronics N.V. 2001. All rights reserved.

Philips Semiconductors

12. Package outline

TDA9964

12-bit, 3.0 V, 30 Msps analog-to-digital interface for CCD cameras

LQFP48: plastic low profile quad flat package; 48 leads; body 7 x 7 x 1.4 mm

c

y

X

36

37

pin 1 index

48

25

Z

24

E

e

w M

b

p

13

A

H

E

E

A

2

A

SOT313-2

(A )

A

1

L

3

θ

L

p

1

e

DIMENSIONS (mm are the original dimensions)

UNIT

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

A

A1A2A3b

max.

0.20

0.05

1.45

1.35

1.60

mm

OUTLINE

VERSION

SOT313-2 MS-026136E05

IEC JEDEC EIAJ

b

p

0.25

w M

D

H

D

p

0.27

0.17

12

Z

D

B

0 2.5 5 mm

(1)

(1) (1)(1)

cE

D

7.1

0.18

0.12

7.1

6.9

6.9

REFERENCES

Fig 12. SOT313-2.

v M

A

v M

B

scale

eH

H

D

9.15

0.5

8.85

9.15

8.85

E

LL

0.75

0.45

detail X

Zywv θ

p

0.12 0.10.21.0

EUROPEAN

PROJECTION

Z

0.95

0.55

D

E

0.95

7

0.55

0

ISSUE DATE

99-12-27
00-01-19

o
o

9397 750 07918

© Philips Electronics N.V. 2001. All rights reserved.

Objective specification Rev. 03 — 16 January 2001 17 of 23

Philips Semiconductors

13. Handling information

Inputs and outputs are protected against electrostatic discharge in normal handling.
However, to be completely safe, it is desirable to take normal precautions appropriate
to handling integrated circuits.

14. Soldering

14.1 Introduction to soldering surface mount packages

This text gives a very brief insight to a complex technology. A more in-depth account
of soldering ICs can be found in our

Packages

There is no soldering method that is ideal for all surface mount IC packages. Wave
soldering can still be used for certain surface mount ICs, but it is not suitable for fine
pitch SMDs. In these situations reflow soldering is recommended.

TDA9964

12-bit, 3.0 V, 30 Msps analog-to-digital interface for CCD cameras

Data Handbook IC26; Integrated Circuit

(document order number 9398 652 90011).

14.2 Reflow soldering

Reflow soldering requires solder paste (a suspension of fine solder particles, flux and
binding agent) to be applied to the printed-circuit board by screen printing, stencilling
or pressure-syringe dispensing before package placement.

Several methods exist for reflowing; for example, convection or convection/infrared
heating in a conveyor type oven. Throughput times (preheating, soldering and
cooling) vary between 100 and 200 seconds depending on heating method.

Typical reflow peak temperatures range from 215 to 250 °C. The top-surface
temperature of the packages should preferable be kept below 220 °C for thick/large
packages, and below 235 °C small/thin packages.

14.3 Wave soldering

Conventional single wave soldering is not recommended for surface mount devices
(SMDs) or printed-circuit boards with a high component density, as solder bridging
and non-wetting can present major problems.

To overcome these problems the double-wave soldering method was specifically
developed.

If wave soldering is used the following conditions must be observed for optimal
results:

Use a double-wave soldering method comprising a turbulent wave with high

•

upward pressure followed by a smooth laminar wave.
For packages with leads on two sides and a pitch (e):

•

– larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be

parallel to the transport direction of the printed-circuit board;

– smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the

transport direction of the printed-circuit board.

9397 750 07918

Objective specification Rev. 03 — 16 January 2001 18 of 23

© Philips Electronics N.V. 2001. All rights reserved.

Philips Semiconductors

•

During placement and before soldering, the package must be fixed with a droplet of
adhesive. The adhesive can be applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the adhesive is cured.

Typical dwell time is 4 seconds at 250 °C. A mildly-activated flux will eliminate the
need for removal of corrosive residues in most applications.

14.4 Manual soldering

Fix the component by first soldering two diagonally-opposite end leads. Use a low
voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time
must be limited to 10 seconds at up to 300 °C.

When using a dedicated tool, all other leads can be soldered in one operation within
2 to 5 seconds between 270 and 320 °C.

TDA9964

12-bit, 3.0 V, 30 Msps analog-to-digital interface for CCD cameras

The footprint must incorporate solder thieves at the downstream end.
For packages with leads on four sides, the footprint must be placed at a 45° angle

to the transport direction of the printed-circuit board. The footprint must
incorporate solder thieves downstream and at the side corners.

14.5 Package related soldering information

Table 13: Suitability of surface mount IC packages for wave and reflow soldering

methods

Package Soldering method

Wave Reflow

BGA, HBGA, LFBGA, SQFP, TFBGA not suitable suitable
HBCC, HLQFP, HSQFP, HSOP, HTQFP,

HTSSOP, HVQFN, SMS

[3]

PLCC
LQFP, QFP, TQFP not recommended
SSOP, TSSOP, VSO not recommended

[1] All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the

[2] These packages are not suitable for wave soldering as a solder joint between the printed-circuit board

[3] If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave

[4] Wave soldering is only suitable for LQFP, QFP and TQFP packages with a pitch (e) equal to or larger

[5] Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than

, SO, SOJ suitable suitable

maximum temperature (with respect to time) and body size of the package, there is a risk that internal
or external package cracks may occur due to vaporization of the moisture in them (the so called
popcorn effect). For details, refer to the Drypack information in the

Circuit Packages; Section: Packing Methods

and heatsink (at bottom version) can not be achieved,and as solder may stick to the heatsink (on top
version).

direction. The package footprint must incorporate solder thieves downstream and at the side corners.

than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.

0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.

not suitable

.

[2]

[3][4]
[5]

Data Handbook IC26; Integrated

suitable

suitable
suitable

[1]

9397 750 07918

Objective specification Rev. 03 — 16 January 2001 19 of 23

© Philips Electronics N.V. 2001. All rights reserved.

Philips Semiconductors

12-bit, 3.0 V, 30 Msps analog-to-digital interface for CCD cameras

15. Revision history

Table 14: Revision history

Rev Date CPCN Description

03 20010116 - Objective specification; third version
02 20000801 - Objective specification; second version
01 20000502 - Objective specification; initial version

TDA9964

9397 750 07918

Objective specification Rev. 03 — 16 January 2001 20 of 23

© Philips Electronics N.V. 2001. All rights reserved.

Philips Semiconductors

16. Data sheet status

TDA9964

12-bit, 3.0 V, 30 Msps analog-to-digital interface for CCD cameras

Datasheet status Product status Definition

Objective specification Development This data sheet contains the design target or goal specifications for product development. Specification may

change in any manner without notice.

Preliminary specification Qualification This data sheet contains preliminary data, and supplementary data will be published at a later date. Philips

Semiconductors reserves the right to make changes at any time without notice in order to improve design and
supply the best possible product.

Product specification Production This data sheet contains final specifications. Philips Semiconductors reserves the right to make changes at any

time without notice in order to improve design and supply the best possible product.

[1] Please consult the most recently issued data sheet before initiating or completing a design.

17. Definitions

Short-form specification — The data in a short-form specification is

extracted from a full data sheet with the same type number and title. For
detailed information see the relevant data sheet or data handbook.

Limiting values definition — Limiting values given are in accordance with
the Absolute Maximum Rating System (IEC 60134). Stress above one or
more of the limiting values may cause permanent damage to the device.
These are stress ratings only and operation of the device at these or at any
other conditions above those given in the Characteristics sections of the
specification is not implied. Exposure to limiting values for extended periods
may affect device reliability.

Application information — Applications that are described herein for any
of these products are for illustrative purposes only. Philips Semiconductors
make no representation or warranty that such applications will be suitable for
the specified use without further testing or modification.

[1]

18. Disclaimers

Life support — These products are not designed for use in life support

appliances, devices, or systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips Semiconductors
customers using or selling these products for use in such applications do so
at their own risk and agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.

Right to make changes — Philips Semiconductors reserves the right to
make changes, without notice, in the products, including circuits, standard
cells, and/or software, described or contained herein in order to improve
design and/or performance. Philips Semiconductors assumes no
responsibility or liability for the use of any of these products, conveys no
licence or title under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that these products
are free from patent, copyright, or mask work right infringement, unless
otherwise specified.

9397 750 07918

© Philips Electronics N.V. 2001 All rights reserved.

Objective specification Rev. 03 — 16 January 2001 21 of 23

Philips Semiconductors

12-bit, 3.0 V, 30 Msps analog-to-digital interface for CCD cameras

Philips Semiconductors - a worldwide company

TDA9964

Argentina: see South America
Australia: Tel. [phone], Fax. [phone]
Austria: Tel. [phone], Fax. [phone]
Belarus: Tel. [phone], Fax. [phone]
Belgium: see The Netherlands
Brazil: see South America
Bulgaria: Tel. [phone], Fax. [phone]
Canada: Tel. [phone]
China/Hong Kong: Tel. [phone], Fax. [phone]
Colombia: see South America
Czech Republic: see Austria
Denmark: Tel. [phone], Fax. [phone]
Finland: Tel. [phone], Fax. [phone]
France: Tel. [phone], Fax. [phone]
Germany: Tel. [phone], Fax. [phone]
Hungary: Tel. [phone], Fax. [phone]
India: Tel. [phone], Fax. [phone]
Indonesia: see Singapore
Ireland: Tel. [phone], Fax. [phone]
Israel: Tel. [phone], Fax. [phone]
Italy: Tel. [phone], Fax [phone]
Japan: Tel. [phone], Fax. [phone]
Korea: Tel. [phone], Fax. [phone]
Malaysia: Tel. [phone], Fax. [phone]
Mexico: Tel. [phone]
Middle East: see Italy

Netherlands: Tel. [phone], Fax. [phone]
New Zealand: Tel. [phone], Fax. [phone]
Norway: Tel. [phone], Fax. [phone]
Philippines: Tel. [phone], Fax. [phone]
Poland: Tel. [phone], Fax. [phone]
Portugal: see Spain
Romania: see Italy
Russia: Tel. [phone], Fax. [phone]
Singapore: Tel. [phone], Fax. [phone]
Slovakia: see Austria
Slovenia: see Italy
South Africa: Tel. [phone], Fax. [phone]
South America: Tel. [phone], Fax. [phone]
Spain: Tel. [phone], Fax. [phone]
Sweden: Tel. [phone], Fax. [phone]
Switzerland: Tel. [phone], Fax. [phone]
Taiwan: Tel. [phone], Fax. [phone]
Thailand: Tel. [phone], Fax. [phone]
Turkey: Tel. [phone], Fax. [phone]
Ukraine: Tel. [phone], Fax. [phone]
United Kingdom: Tel. [phone], Fax. [phone]
United States: Tel. [phone]
Uruguay: see South America
Vietnam: see Singapore
Yugoslavia: Tel. [phone], Fax. [phone]

For all other countries apply to: Philips Semiconductors,

Marketing Communications,
Building BE, P.O. Box 218, 5600 MD EINDHOVEN,
The Netherlands, Fax. [phone]

Internet: http://www.semiconductors.philips.com

(SCA71)

9397 750 07918

Objective specification Rev. 03 — 16 January 2001 22 of 23

© Philips Electronics N.V. 2001. All rights reserved.

Philips Semiconductors

12-bit, 3.0 V, 30 Msps analog-to-digital interface for CCD cameras

Contents

1 Description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

4 Quick reference data . . . . . . . . . . . . . . . . . . . . . 2

5 Ordering information. . . . . . . . . . . . . . . . . . . . . 2

6 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3

7 Pinning information. . . . . . . . . . . . . . . . . . . . . . 4

7.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

7.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4

8 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 6

9 Thermal characteristics. . . . . . . . . . . . . . . . . . . 6

10 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 6

11 Application information. . . . . . . . . . . . . . . . . . 15

11.1 Power and grounding recommendations . . . . 16

12 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 17

13 Handling information. . . . . . . . . . . . . . . . . . . . 18

14 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

14.1 Introduction to soldering surface mount

packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

14.2 Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 18

14.3 Wave soldering. . . . . . . . . . . . . . . . . . . . . . . . 18

14.4 Manual soldering . . . . . . . . . . . . . . . . . . . . . . 19

14.5 Package related soldering information . . . . . . 19

15 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 20

16 Data sheet status. . . . . . . . . . . . . . . . . . . . . . . 21

17 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

18 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

TDA9964

© Philips Electronics N.V. 2001. Printed in The Netherlands

All rights are reserved. Reproduction in whole or in part is prohibited without the prior
written consent of the copyright owner.

The information presented in this document does not form part of any quotation or
contract, is believed to be accurate and reliable and may be changed without notice. No
liability will be accepted by the publisher for any consequence of its use. Publication
thereof does not convey nor imply any license under patent- or other industrial or
intellectual property rights.

Date of release: 16 January 2001 Document order number: 9397 750 07918