Philips TDA9181 Service Manual

INTEGRATED CIRCUITS

DATA SH EET

TDA9181

Integrated multistandard comb filter

Objective specification
File under Integrated Circuits, IC02

2000 Nov 22

Philips Semiconductors Objective specification

Integrated multistandard comb filter TDA9181

FEATURES

• One-chip multistandard adaptive comb filter

• Cross luminance reduction

• Cross colour reduction

• No chroma trap, therefore sharper vertical luminance

transients

• Analog discrete-time signal processing, therefore no
quantization noise

• Anti-aliasing and reconstruction filters are included

• Input switch selects between two Y/CVBS inputs

• Output switch selects between combed CVBS and an

external Y/C source

• fSC as well as 2 × fSC colour subcarrier signal may be
applied

• Alignment free

• Few external components

• Low power.

QUICK REFERENCE DATA

GENERAL DESCRIPTION

The TDA9181is a an adaptive PAL/NTSC comb filter with
two internal delay lines, filters, clock control and input
clamps. Video standards PAL B, G, H, D, I, M and N and
NTSC M are supported.

Two CVBS input signals can be selected by means of an
input switch.

The selected CVBS input signal is filtered to obtain
a combed luminance output signal and a combed
chrominance output signal. Switched capacitor circuit
techniques are used, requiring an internal clock, locked on
to the colour subcarrier frequency.

Thecoloursubcarrierfrequencyaswellastwicethecolour
subcarrier frequency may be applied to the IC.

In addition to the comb filter the circuit contains an output
switch so that a selection can be made between the
combed CVBS signal and an external Y/C signal.

The IC is available in a DIP16 and SO16 package.
The supply voltage is 5 V.

SYMBOL PARAMETER MIN. TYP. MAX. UNIT

V

CCA

I

CCA

V

DDD

I

DDD

V

i(Y/CVBS)(p-p)

V

i(CIN)(p-p)

V

i(FSC)(p-p)

V

o(Y/CVBS)(p-p)

V

o(CIN)(p-p)

analog supply voltage 4.5 5.0 5.5 V
analog supply current − 25 − mA
digital supply voltage 4.5 5.0 5.5 V
digital supply current − 10 − mA
luminance or CVBS input signal voltage (peak-to-peak value) 0.7 1.0 1.4 V
chrominance input signal voltage (peak-to-peak value) − 0.7 1.0 V
colour subcarrier input signal voltage (peak-to-peak value) 100 200 400 mV
luminance or CVBS output signal voltage (peak-to-peak value) 0.6 1.0 1.54 V
chrominance output signal voltage (peak-to-peak value) − 0.7 1.1 V

ORDERING INFORMATION

TYPE

NUMBER

NAME DESCRIPTION VERSION

PACKAGE

TDA9181P DIP16 plastic dual in-line package; 16 leads (300 mil); long body SOT38-4
TDA9181T SO16 plastic small outline package; 16 leads; body width 7.5 mm SOT162-1

2000 Nov 22 2

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2000 Nov 22 3

BLOCK DIAGRAM

Philips Semiconductors Objective specification

Integrated multistandard comb filter TDA9181

handbook, full pagewidth

INPSEL

Y/CVBS

1

Y/CVBS

2

C

IN

SC

2

12

3

1

7

CLAMP

CLAMP

SANDCASTLE

DETECTOR

TDA9181

FILTER

TUNING

(LPFs)

LPF

9

FSC FSCSEL

V

2H/4H

DELAY

CLOCK GENERATOR

8

V

CCA

6

ADAPTIVE

4 × f

sc

11

SYS110SYS2

DDD

5

COMB

FILTER

LPF

LPF

13

AGND4DGND

15

OUTSEL

14

Y/CVBS

OUT

16

C

OUT

MGT518

Fig.1 Block diagram.

Philips Semiconductors Objective specification

Integrated multistandard comb filter TDA9181

PINNING

SYMBOL PIN DESCRIPTION

C

IN

INPSEL 2 input switch select input
Y/CVBS

2

DGND 4 digital ground
V

DDD

V

CCA

SC 7 sandcastle signal input
FSCSEL 8 colour subcarrier select input
FSC 9 colour subcarrier input signal
SYS2 10 standard select 2 input
SYS1 11 standard select 1 input
Y/CVBS

1

AGND 13 analog ground (signal reference)
Y/CVBS

OUT

OUTSEL 15 output switch select input
C

OUT

1 chrominance signal input

3 luminance or CVBS signal 2 input

5 digital supply voltage
6 analog supply voltage

12 luminance or CVBS signal 1 input

14 luminance or CVBS signal output

16 chrominance signal output

handbook, halfpage

C

INPSEL

Y/CVBS

DGND

V

DDD

V

CCA

FSCSEL

SC

IN

2

1
2
3
4

TDA9181P

5
6
7
8

MGT519

16
15
14
13
12
11
10

9

C

OUT
OUTSEL
Y/CVBS

AGND
Y/CVBS

SYS1
SYS2
FSC

OUT

1

Fig.2 Pin configuration (DIP16).

2000 Nov 22 4

handbook, halfpage

Y/CVBS

C

INPSEL

DGND

V

DDD

V

CCA

SC

FSCSEL

1

IN

2
3

2

4

TDA9181T

5
6
7
8

MGT520

16
15
14
13
12
11
10

9

C

OUT
OUTSEL
Y/CVBS

AGND
Y/CVBS

SYS1
SYS2
FSC

Fig.3 Pin configuration (SO16).

OUT

1

Philips Semiconductors Objective specification

Integrated multistandard comb filter TDA9181

FUNCTIONAL DESCRIPTION
Input configuration

The Y/CVBS1and Y/CVBS2input signals are clamped by
means of an internally generated clamp pulse which is
derived from the sandcastle input signal (pin SC). If no
sandcastlesignalisavailable,aclamppulsesignalmaybe
applied to pin SC. External clamp capacitors are needed.

The buffered and clamped Y/CVBS1and Y/CVBS2signals
arethenappliedtotheinputswitch.Theinputswitchselect
signal (INPSEL) determines whether Y/CVBS1 or
Y/CVBS2ispassedthroughtotheanti-aliaslow-passfilter.
This 3rd-order low-pass filter is optimized for best
performance with respect to step response and clock
suppression. The filtered signal is sampled at a clock
frequency of four times the colour subcarrier frequency
(fSC).

A colour subcarrier frequency signal is applied to pin FSC.
The colour subcarrier select input signal (FSCSEL)
indicates whether the colour subcarrier frequency (fSC)or
twice the colour subcarrier frequency (2 × fSC) is being
applied at the FSC input. An external coupling capacitor is
needed for the colour subcarrier input signal.

Comb filter

The sampled CVBS signal is applied to two delay lines.
Depending on the applied standard, one delay line delays
the signal over 1 or 2H for NTSC and PAL respectively
(1H = oneline-time).ThestandardselectinputsSYS1and
SYS2 indicate which standard, PAL B, G, H, D, I, M, N or
NTSC M, is being applied.

Output configuration

The luminance output switch selects between the
reconstructed combed luminance signal and one of the
bufferedandclampedinputsignals,Y/CVBS1orY/CVBS2.
The chrominance output switch selects between the
reconstructed combed chrominance signal and the
chrominance input signal (CIN). An external coupling
capacitor is needed for CIN. The selected signals are
applied to the outputs Y/CVBS

OUT

and C

respectively

OUT

via a buffer stage. The output switch signal (OUTSEL)
determines whether the output switches selectthe internal
combed signals or the external Y/C signals.

Clock generation and filter tuning

The clock generator is driven by a Phase-Locked Loop
(PLL)circuitwhichgeneratesareferencefrequencyoffour
times the colour subcarrier frequency. This PLL circuit is
phase-locked to the colour subcarrier input signal (FSC).
Several internal clock signals are derived from the 4 × f

SC

reference.
The filter tuning ensures the automatic alignment of the

anti-alias and the reconstruction low-pass filters. A 4 × f

SC

clock signal is used as a reference for the alignment. The
tuning takes place each line during the line blanking and is
initiated by means of an internally generated signal which
is derived from the sandcastle input signal.

If the output switches select external Y/C signals the
oscillator of the PLL circuit is stopped regardless of the
FSCinputandnointernalclocksignalsaregenerated.The
filter tuning is also stopped.

The direct and delayed signals are applied to an adaptive
comb filter. The adaptive comb filter performs band-pass
filtering around the colour subcarrier frequency and
compares the contents of adjacent lines. In this way the
combing of signals with different information is prevented
and artifacts such as hanging dots are avoided.

Boththecombedchrominanceandthecombedluminance
signalsare passed through a reconstruction low-pass filter
to obtain continuous-time signals. These low-pass filters
are3rd-order, optimized for best performance with respect
to step response and clock suppression. The
reconstructed signals are applied to the output switches.

2000 Nov 22 5

Philips Semiconductors Objective specification

Integrated multistandard comb filter TDA9181

Mode definitions
Table 1 General mode definitions; note 1

PIN OUTSEL MODE

LOW COMB
HIGH YC

Note

1. If the OUTSEL pin is left open-circuit, the pin is pulled
LOW by means of an internal pull-down resistor to
analog ground (AGND). Thus the COMB mode can
also be selected by not connecting the OUTSEL pin.

Table 2 Y/CVBS

MODE Y/CVBS

output signal definitions

OUT

OUT

OUTPUT SIGNAL

COMB comb filtered luminance signal
YC Y/CVBS

Table 3 C

output signal definitions

OUT

MODE C

or Y/CVBS2 signal

1

OUTPUT SIGNAL

OUT

COMB comb filtered chrominance

signal

YC C

signal

IN

Table 4 Input switch mode definitions; note 1

PIN INPSEL INPUT SWITCH MODE

LOW Y/CVBS
HIGH Y/CVBS

input selected

1

input selected

2

Table 5 FSC mode definitions; note 1

PIN FSCSEL FSC INPUT SIGNAL FREQUENCY

LOW f
HIGH 2 × f

SC

SC

Note

1. If the FSCSEL pin is left open-circuit, the pin is pulled
LOW by means of an internal pull-down resistor to
analog ground (AGND). Thus the f

mode can also

SC

be selected by not connecting the FSCSEL pin.

Table 6 Video standard mode definitions; note 1

PIN SYS1 PIN SYS2

VIDEO

STANDARD

LOW LOW PAL M
LOW HIGH PAL B, G, H, D or I
HIGH LOW NTSC M
HIGH HIGH PAL N

Note

1. If the SYS1 and SYS2 pins are left open-circuit, the
SYS1 pin is pulled HIGH by means of an internal
pull-up resistor to analog supply (V

) and the SYS2

CCA

pin is pulled LOW by means of an internal pull-down
resistor to analog ground (AGND). Thus the NTSC M
videostandard can also be selected bynot connecting
pins SYS1 and SYS2.

Note

1. If the INPSEL pin is left open-circuit, the pin is pulled
LOW by means of an internal pull-down resistor to
analog ground (AGND). Thus the Y/CVBS

input can

1

also be selected by not connecting the INPSEL pin.

2000 Nov 22 6

Philips Semiconductors Objective specification

Integrated multistandard comb filter TDA9181

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 60134).

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

V

DDD

V

CCA

V

i(prot)(th)

T

stg

T

amb

T

sol

T

j

V

es

Notes

1. All pins are protected against ESD by means of internal clamping diodes.

2. Human Body Model (HBM): R = 1.5 kΩ; C = 100 pF.

3. Pin 5 (V

4. Machine Model (MM): R = 0 Ω; C = 200 pF.

5. Pin 5 (V

digital supply voltage − 5.5 V
analog supply voltage − 5.5 V
input voltage protection threshold −0.3 VDD+ 0.3 V
storage temperature −25 +150 °C
ambient temperature −25 +70 °C
soldering temperature for 5 s − 260 °C
junction temperature − 150 °C
electrostatic handling voltage HBM; all pins, except

−3000 +3000 V

pins 5 and 6; notes 1, 2 and 3
MM; all pins, except

−300 +300 V

pins 5 and 6; notes 1, 4 and 5

) and pin 6 (V

DDD

) and pin 6 (V

DDD

): HBM: −1500V<Ves< +1500 V.

CCA

): MM: −150V<Ves< +150 V.

CCA

THERMAL CHARACTERISTICS

SYMBOL PARAMETER CONDITIONS VALUE UNIT

R

th(j-a)

thermal resistance from junction to ambient in free air

TDA9181P 75 K/W
TDA9181T 95 K/W

QUALITY SPECIFICATION

In accordance with

“SNW-FQ-611E”

.

Latch-up

At an ambient temperature of 70 °C all pins meet the following specification:

• I

• I

≥ 100 mA or ≥ 1.5 V

trigger

≤−100 mA or ≤−0.5 V

trigger

DD(max)

DD(max)

.

2000 Nov 22 7

Philips Semiconductors Objective specification

Integrated multistandard comb filter TDA9181

CHARACTERISTICS

V

CCA=VDDD

C

= 0.7 V (p-p); input signal FSC = 200 mV (p-p) sine wave at fSC; input signal SC=5V (p-p) sandcastle signal; test

IN

signal: 100/0/75/0 EBU colour bar for PAL B, G, H, D,I and N, 100% white 75% amplitude FCC colour bar for NTSC M
and PAL M; source impedance for Y/CVBS
FSC = 75 Ω, coupled with 100 nF; load impedance for CVBS/Y
voltages are related to analog ground (pin AGND); unless otherwise specified.

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Supplies

V

CCA

I

CCA

V

DDD

I

DDD

P power dissipation − 175 − mW

Luminance or CVBS input 1 and input 2; pins Y/CVBS

V

i(Y/CVBS)(p-p)

t

clamp(Y/CVBS)

I

i(Y/CVBS)

Chrominance input; pin C

V

i(CIN)(p-p)

R

i(CIN)

Colour subcarrier input; pin FSC

V

i(FSC)(p-p)

D duty cycle square wave 40 50 60 %
R

i(FSC)

Sandcastle input; pin SC

V

i(SC)

t

W

t

W(rep)

R

i(SC)

C

i(SC)

Input switch select input; pin INPSEL

V

IL

V

IH

R

i(INPSEL)

C

i(INPSEL)

=5V; T

=25°C; input signal Y/CVBS1= 1 V (p-p); input signal Y/CVBS2= 1 V (p-p); input signal

amb

and Y/CVBS2=75Ω, coupled with 10 nF; source impedance for CIN and

1

OUT

and C

= 15 pF to analog ground (pin AGND); all

OUT

analog supply voltage 4.5 5.0 5.5 V
analog supply current − 25 − mA
digital supply voltage 4.5 5.0 5.5 V
digital supply current − 10 − mA

and Y/CVBS

luminance or CVBS input

1

including sync 0.7 1.0 1.4 V

2

voltage (peak-to-peak value)
clamp time constant − 20 − lines
input current during clamping −10 0 +10 µA

during active video −10 0 +10 nA

IN

chrominance input voltage

− 0.7 1.0 V

(peak-to-peak value)
input resistance 30 −−kΩ

subcarrier input voltage

100 200 400 mV

(peak-to-peak value)

input resistance 30 −−kΩ

sandcastle input voltage no clamping −−3.3 V

clamping 3.7 −−V
pulse width clamping; note 1 2.6 −−µs
pulse rising edge position with respect to end of

−−− 2.6 µs

line-blanking; note 1
input resistance 1 −−MΩ
input capacitance −−2pF

LOW-level input voltage Y/CVBS1 selected −−0.5 V
HIGH-level input voltage Y/CVBS2 selected 2.0 −−V
input resistance 100 −−kΩ
input capacitance −−2pF

2000 Nov 22 8

Philips Semiconductors Objective specification

Integrated multistandard comb filter TDA9181

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Output switch select input; pin OUTSEL

V

IL

V

IH

R

i(OUTSEL)

C

i(OUTSEL)

Colour subcarrier select input; pin FSCSEL

V

IL

V

IH

R

i(FSCSEL)

C

i(FSCSEL)

Standard select inputs 1 and 2; pins SYS1 and SYS2

V

IL

V

IH

R

i(SYS)

C

i(SYS)

Luminance output; pin Y/CVBS

V

o(Y/CVBSOUT)(p-p)

E

G(Y)

B

−3dB(Y)

t

d(proc)(Y)

V

clamp

E

bl

S/N luminance signal-to-noise

α

ct

f

CLK(res)(Y)

LOW-level input voltage COMB mode −−0.5 V
HIGH-level input voltage YC mode 2.0 −−V
input resistance 100 −−kΩ
input capacitance −−2pF

LOW-level input voltage fSC at FSC input; note 2 −−0.5 V
HIGH-level input voltage 2 × fSC at FSC input 2.0 −−V
input resistance 100 −−kΩ
input capacitance −−2pF

LOW-level input voltage −−0.5 V
HIGH-level input voltage 2.0 −−V
input resistance 100 −−kΩ
input capacitance −−2pF

OUT

luminance output signal

including sync 0.6 1.0 1.54 V
(peak-to-peak value)

luminance gain error −1 0 +1 dB

−3 dB luminance bandwidth COMB mode;

6 −−MHz

PALB,G,H,DandI

COMB mode; NTSC M,

5 −−MHz

PAL M and N

YC mode 10 −−MHz
luminance processing delay COMB mode; PAL B, G,

− 650 − ns

H, D and I; note 3

COMB mode; NTSC M,

− 800 − ns

PAL M and N; note 3

YC mode − 15 − ns
voltage level during clamping − 1.5 − V
black level error during blanking; note 4 −10 0 +10 mV

ratio (1 V/V

rms

noise)

crosstalk between different

unweighted;

200 kHz to 5 MHz

0 to 5 MHz −−−50 dB

56 −−dB

inputs
residues of clock frequencies

in the luminance signal
(V

/1 V)

rms

COMB mode; note 2

f=4×f
f=2×f
f = 1.33 × f
f=f

SC
SC

SC

SC

−−−30 dB

−−−30 dB

−−−30 dB

−−−40 dB

2000 Nov 22 9

Philips Semiconductors Objective specification

Integrated multistandard comb filter TDA9181

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

FSC

α

ct

SUP

R

o

Z

L

res(YC)

comb(Y)

FSC residue in YC mode
(V

/1 V)

rms

f=fSC; fSC at FSC input;

note 2

f=2×f

;2×fSCat FSC

SC

−−−60 dB

−−−60 dB

input
crosstalk suppression at

vertical transient black ↔
multi-burst [1 V/V (p-p)]

suppression (comb depth)
with respect to luminance
band-pass nearest to f

SC

vertical transition active

video ↔ vertical blanking;

Figs 6 and 7; note 5

COMB mode;

PALB,G,H,DandI;

note 2 and Fig.8

f=f

SC

283.75 74–

f

------------------------------ -

283.75 74+

f

-------------------------------

283.75

283.75

fSC×=

f

×=

SC

26 −−dB

30 −−dB

− 10 − dB

− 10 − dB

COMB mode; PAL M;

note 2 and Fig.9

f=f

SC

227.25 59–

f

------------------------------ -

227.25 59+

f

-------------------------------

227.25

227.25

×=

×=

30 −−dB

− 10 − dB

f

SC

− 10 − dB

f

SC

COMB mode, PAL N;

see note 2 and Fig.10

f=f

SC

229.25 59–

f

------------------------------ -

229.25 59+

f

-------------------------------

229.25

229.25

×=

×=

30 −−dB

− 10 − dB

f

SC

− 10 − dB

f

SC

COMB mode, NTSC M;

see note 2 and Fig.11

f=f

f

f

SC

227.5 59–

---------------------------

227.5

227.5 59+

--------------------------- -

227.5

×=

f

×=

f

30 −−dB

− 10 − dB

SC

− 10 − dB

SC

output resistance −−500 Ω
load impedance −−15 pF

2000 Nov 22 10

Philips Semiconductors Objective specification

Integrated multistandard comb filter TDA9181

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Chrominance output; pin C

V

o(COUT)(p-p)

chrominance output signal
(peak-to-peak value)

E

G(chrom)

B

−3dB(chrom)

chrominance gain error −1 0 +1 dB

−3 dB chrominance
bandwidth

∆t

(proc)(Y)

difference with luminance
processing delay

V

DC

S/N

chrom

DC voltage level − 1.5 − V
chrominance signal-to-noise

ratio (0.7 V/V

α

ct

crosstalk between different
inputs

f

clk(res)(chrom)

residues of clock frequencies
in the chrominance signal
(V

/0.7 V)

rms

FSC

α

ct

res(YC)

FSC residue in YC mode
(V

/0.7 V)

rms

crosstalk suppression at
vertical transient no-colour
colour [0.7 V/V (p-p)]

OUT

rms

noise)

− 0.7 1.1 V

COMB mode, around fSC;

1.5 −−MHz

note 2

YC mode; base-band 10 −−MHz

− 020ns

unweighted; f

± 0.3fSC;

SC

56 −−dB

note 2

0 to 5 MHz −−−50 dB

COMB mode; note 2

f=4×f
f=2×f
f = 1.33 × f
f=f

SC
SC

SC

SC

f=fSC; fSC at FSC input;

−−−30 dB

−−−30 dB

−−−40 dB

−−−50 dB

−−−60 dB

note 2

f=2×f

;2×fSCat FSC

SC

−−−60 dB

input

vertical transition active

26 −−dB
video ↔ vertical blanking;
see Figs 6 and 7 and
note 6

2000 Nov 22 11

Philips Semiconductors Objective specification

Integrated multistandard comb filter TDA9181

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

SUP

R

o

Z

L

comb(chrom)

suppression (comb depth)
with respect to chrominance
band-pass at f = f

SC

COMB mode;
PALB,G,H,DandI;
note 2 and Fig.12

284

f

f

f

----------------- -

283.75
284 74–

----------------------

283.75

284 74+

---------------------- -

283.75

fSC×=

f

×=

SC

×=

f

SC

30 −−dB

30 −−dB

30 −−dB

COMB mode; PAL M;
see note 2 and Fig.13

f

f

f

227

----------------- -

227.25
227 59–

----------------------

227.25

227 59+

---------------------- -

227.25

×=

f

SC

×=

f

SC

f

×=

SC

30 −−dB

30 −−dB

30 −−dB

COMB mode; PAL N;
see note 2 and Fig.14

f

f

f

229

----------------- -

229.25
229 59–

----------------------

229.25

229 59+

---------------------- -

229.25

fSC×=

f

×=

SC

×=

f

SC

30 −−dB

30 −−dB

30 −−dB

COMB mode; NTSC M;
see note 2 and Fig.15

f

f

f

227

-------------- -

227.5
227 59–

----------------------

227.5

227 59+

---------------------- -

227.5

fSC×=

×=

f

SC

×=

f

SC

30 −−dB

30 −−dB

30 −−dB

output resistance −−500 Ω
load impedance −−15 pF

2000 Nov 22 12

Philips Semiconductors Objective specification

Integrated multistandard comb filter TDA9181

Notes

1. The pulse should fall inside the line-blanking interval, after the rising edge of the synchronizing pulse.

2. fSC= colour subcarrier frequency; fSC= 4.43361875 MHz for the PAL B, G, H, D and I systems;
fSC= 3.57561149 MHz for the PAL M system; fSC= 3.58205625 MHz for the PAL N system; fSC= 3.579545 MHz for
the NTSC M system.

3. For PAL B, G, H, D and I: with respect to 567.5 colour subcarrier periods (equals 128.00 µs) due to 2H delay in the
comb filter. For PAL M: with respect to 454.5 colour subcarrier periods (equals 127.11 µs) due to 2H delay in the
comb filter. For PAL N: with respect to 458.5 colour subcarrier periods (equals 128.00 µs) due to 2H delay in the
comb filter. For NTSC M: with respect to 227.5 colour subcarrier periods (equals 63.556 µs) due to 1H delay in the
comb filter.

4. With respect to the voltage level during clamping.

5. Test signal for PAL B, G, H, D, I and N: CCIR-18 multi-burst (see Fig.4). For PAL M and NTSC M: 100% amplitude
FCC multi-burst (see Fig.5).

6. Test signal for PAL B, G, H, D, I and N: 100/0/75/0 EBU colour bar. For PAL M and NTSC M: 100% white 75%
amplitude FCC colour bar.

handbook, full pagewidth

(V)

0.86

0.65

0.45

0.44

0.30

0.15

1

0.5 1.0 2.0 3.8 4.8 5.8 MHz

0

MGT521

Fig.4 CCIR-18 multi-burst.

2000 Nov 22 13

Philips Semiconductors Objective specification

Integrated multistandard comb filter TDA9181

handbook, full pagewidth

(V)

0.65

0.45

0.30

0.15

1

0

0.5 1.5 2.0 3.0 3.58 4.1 MHz

MGT522

Fig.5 100% amplitude FCC multi-burst.

2000 Nov 22 14

Philips Semiconductors Objective specification

Integrated multistandard comb filter TDA9181

handbook, full pagewidth

input

output

input

output

line n − 2

line n − 2

line n − 2

line n − 2

line n − 1

line n − 1

crosstalk crosstalk

line n − 1

line n − 1

line n

line n

Transition at top of field

line n

line n

Transition at bottom of field

line n + 1

line n + 1

line n + 1

line n + 1

crosstalk crosstalk

line n + 2 line n + 3

line n + 2 line n + 3

line n + 2 line n + 3

line n + 2

line n + 3

MGT523

Fig.6 Vertical transitions active video ↔ vertical blanking from line to line (PAL systems).

handbook, full pagewidth

input

output

input

output

line n − 2

line n − 2

line n − 2

line n − 2

line n − 1

line n − 1

line n − 1

line n − 1

line n

line n

crosstalk

Transition at top of field

line n

line n

Transition at bottom of field

Fig.7 Vertical transitions active video ↔ vertical blanking from line to line (NTSC system).

2000 Nov 22 15

line n + 1

line n + 1

line n + 1

line n + 1

crosstalk

line n + 2 line n + 3

line n + 2 line n + 3

line n + 2 line n + 3

line n + 2

line n + 3

MGT524

Philips Semiconductors Objective specification

Integrated multistandard comb filter TDA9181

handbook, full pagewidth

1

1

0.5

0

0

Y

1 × fSC 2 × fSC

Detailed view

comb depth at f = f

Y

SC

0.5

0

282.75

283.75

283

283.75

f

SC

f

SC

VUUVU

283.25

283.75

283.5

f

SC

283.75

283.75

f

SC

283.75

Fig.8 Luminance transfer characteristic (PAL B, G, H, D and I systems).

2000 Nov 22 16

SC

284

283.75

f

284.25

f

SC

283.75

284.5

f

SC

283.75

284.75

f

SC

283.75

MGT525

f

SC

Philips Semiconductors Objective specification

Integrated multistandard comb filter TDA9181

handbook, full pagewidth

1

1

0.5

0

0

Y

1 × fSC 2 × fSC

Detailed view

comb depth at f = f

SC

Y

0.5

0

226.25

227.25

226.5

227.25

f

SC

f

SC

VUUVU

226.75

227.25

f

SC

227

227.25

227.25

f

SC

227.25

Fig.9 Luminance transfer characteristic (PAL M system).

2000 Nov 22 17

227.5

f

SC

227.25

227.75

f

SC

227.25

f

SC

228

227.25

228.25

f

SC

227.25

MGT526

f

SC

Philips Semiconductors Objective specification

Integrated multistandard comb filter TDA9181

handbook, full pagewidth

1

1

0.5

0

0

Y

1 × fSC 2 × fSC

Detailed view

comb depth at f = f

SC

Y

0.5

0

228.25

229.25

228.5

229.25

f

SC

f

SC

VUUVU

228.75

229.25

f

SC

229

229.25

229.25

f

SC

229.25

Fig.10 Luminance transfer characteristic (PAL N system).

2000 Nov 22 18

229.5

f

SC

229.25

229.75

f

SC

229.25

f

SC

230

229.25

230.25

f

SC

229.25

MGT527

f

SC

Philips Semiconductors Objective specification

Integrated multistandard comb filter TDA9181

handbook, full pagewidth

1

0.5

0.5

1

0

225.5

227.5

0

0

YY

CCCCC

SC

226

227.5

f

f

SC

226.5

227.5

SC

227

227.5

f

1 × fSC 2 × fSC

Detailed view

comb depth at f = f

YY

SC

227.5

227.5

f

f

SC

228

227.5

f

SC

SC

228.5

227.5

f

SC

229

227.5

f

SC

229.5

227.5

f

SC

MGT528

Fig.11 Luminance transfer characteristic (NTSC M system).

2000 Nov 22 19

Philips Semiconductors Objective specification

Integrated multistandard comb filter TDA9181

handbook, full pagewidth

1

1

0.5

0

0

Detailed view

UV

1 × fSC 2 × fSC

comb depth at f =

UV

284

283.75

f

SC

0.5

0

282.75

283.75

f

SC

YU Y

283

283.75

283.25

f

SC

283.75

283.5

f

SC

283.75

f

SC

Fig.12 Chrominance transfer characteristic (PAL B, G, D, H and I systems).

2000 Nov 22 20

283.75

283.75

SC

284

283.75

f

284.25

f

SC

283.75

284.5

f

SC

283.75

f

SC

MGT529

Philips Semiconductors Objective specification

Integrated multistandard comb filter TDA9181

handbook, full pagewidth

1

1

0.5

0

0

Detailed view

227

comb depth at f =

UV

227.25

f

SC

1 × fSC 2 × fSC

UV

0.5

0

226.25

227.25

226.5

f

SC

227.25

226.75

f

SC

227.25

f

SC

YY

227

f

SC

227.25

Fig.13 Chrominance transfer characteristic (PAL M system).

2000 Nov 22 21

227.25

227.25

227.5

f

SC

227.25

227.75

f

SC

227.25

f

SC

228

227.25

f

SC

MGT530

Philips Semiconductors Objective specification

Integrated multistandard comb filter TDA9181

handbook, full pagewidth

1

0.5

0

0

229

comb depth at f =

UV

1

0.5

0

228.25

229.25

228.5

229.25

f

SC

f

SC

229.25

228.75

229.25

f

SC

SC

229

229.25

f

1 × fSC 2 × fSC

Detailed view

UV

YY

f

SC

229.25

229.25

229.5

f

SC

229.25

229.75

f

SC

229.25

f

SC

230

229.25

f

SC

MGT531

Fig.14 Chrominance transfer characteristic (PAL N system).

2000 Nov 22 22

Philips Semiconductors Objective specification

Integrated multistandard comb filter TDA9181

handbook, full pagewidth

1

0.5

0

0

227

comb depth at f =

CC

1

0.5

0

225.5

227.5

f

SC

YYYY

226

f

SC

227.5

227.5

226.5

227.5

f

SC

f

SC

227

227.5

1 × fSC 2 × fSC

Detailed view

CC

f

SC

227.5

227.5

f

SC

228

227.5

228.5

f

SC

227.5

f

SC

229

227.5

f

SC

MGT532

Fig.15 Chrominance transfer characteristic (NTSC M system).

2000 Nov 22 23

Philips Semiconductors Objective specification

Integrated multistandard comb filter TDA9181

APPLICATION INFORMATION

handbook, full pagewidth

5 V

INPSEL

Y/CVBS

220 µH

220 µH
SC

FSCSEL

C6

C1

100 nF

C3

10 nF

100 nF

100

nF

C4

1

2

3

4

TDA9181

5

6

7

8

16

15

14

13

C12

12

10 nF

11

10

C9

9

100 nF

MGT533

C

OUT

OUTSEL

Y/CVBS

Y/CVBS

SYS1

SYS2

FSC

OUT

1

C

IN

2

L5

L6

Fig.16 Application diagram.

2000 Nov 22 24

Philips Semiconductors Objective specification

Integrated multistandard comb filter TDA9181

PACKAGE OUTLINES

DIP16: plastic dual in-line package; 16 leads (300 mil)

SOT38-4

seating plane

L

Z

16

1

pin 1 index

D

A

2

A

A

1

e

b

9

w M

b

1

b

2

E

8

M

E

c

(e )

1

M

H

0 5 10 mm

scale

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

A

A

A

UNIT

max.

mm

inches

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

OUTLINE
VERSION

SOT38-4

12

min.

max.

IEC JEDEC EIAJ

b

1.73

1.30

0.068

0.051

b

1

0.53

0.38

0.021

0.015

b

cD E e M

2

0.36

1.25

0.23

0.85

0.014

0.049

0.009

0.033

REFERENCES

19.50

18.55

0.77

0.73

2000 Nov 22 25

(1) (1)

6.48

6.20

0.26

0.24

L

e

1

M

3.60

8.25

3.05

7.80

0.14

0.32

0.12

0.31

EUROPEAN

PROJECTION

E

10.0

8.3

0.39

0.33

H

0.2542.54 7.62

0.010.10 0.30

ISSUE DATE

w

92-11-17
95-01-14

max.

0.764.2 0.51 3.2

0.0300.17 0.020 0.13

(1)

Z

Philips Semiconductors Objective specification

Integrated multistandard comb filter TDA9181

SO16: plastic small outline package; 16 leads; body width 7.5 mm

D

c

y

Z

16

pin 1 index

1

e

9

A

2

A

1

8

w M

b

p

E

H

E

detail X

SOT162-1

A

X

v M

A

Q

(A )

L

p

L

A

3

θ

0 5 10 mm

scale

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

mm

OUTLINE

VERSION

SOT162-1

A

max.

2.65

0.10

A

1

0.30

0.10

0.012

0.004

A2A

2.45

2.25

0.096

0.089

IEC JEDEC EIAJ

075E03 MS-013

0.25

0.01

b

3

p

0.49

0.32

0.36

0.23

0.019

0.013

0.014

0.009

UNIT

inches

Note

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

(1)E(1) (1)

cD

10.5

7.6

7.4

0.30

0.29

1.27

0.050

10.1

0.41

0.40

REFERENCES

2000 Nov 22 26

eHELLpQ

10.65

10.00

0.419

0.394

1.4

0.055

1.1

0.4

0.043

0.016

1.1

1.0

0.043

0.039

PROJECTION

0.25

0.25 0.1

0.01

0.01

EUROPEAN

ywv θ

Z

0.9

0.4

8

0.004

ISSUE DATE

0.035

0.016

97-05-22

99-12-27

0

o
o

Philips Semiconductors Objective specification

Integrated multistandard comb filter TDA9181

SOLDERING
Introduction

Thistextgivesaverybriefinsighttoacomplextechnology.
A more in-depth account of soldering ICs can be found in
our

“Data Handbook IC26; Integrated Circuit Packages”

(document order number 9398 652 90011).
There is no soldering method that is ideal for all IC

packages. Wave soldering is often preferred when
through-holeandsurfacemountcomponents are mixed on
one printed-circuit board. Wave soldering can still be used
for certain surface mount ICs, but it is not suitable for fine
pitch SMDs. In these situations reflow soldering is
recommended.

Through-hole mount packages

SOLDERING BY DIPPING OR BY SOLDER WAVE
The maximum permissible temperature of the solder is

260 °C; solder at this temperature must not be in contact
with the joints for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.

The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (T
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.

MANUAL SOLDERING
Apply the soldering iron (24 V or less) to the lead(s) of the

package, either below the seating plane or not more than
2 mm above it. If the temperature of the soldering iron bit
is less than 300 °C it may remain in contact for up to
10 seconds. If the bit temperature is between
300 and 400 °C, contact may be up to 5 seconds.

Surface mount packages

REFLOW SOLDERING
Reflow soldering requires solder paste (a suspension of

fine solder particles, flux and binding agent) to be applied
totheprinted-circuitboard by screen printing, stencilling or
pressure-syringe dispensing before package placement.

Several methods exist for reflowing; for example,
convection or convection/infrared heating in a conveyor
type oven. Throughput times (preheating, soldering and
cooling) vary between 100 and 200 seconds depending
on heating method.

stg(max)

). If the

Typical reflow peak temperatures range from
215 to 250 °C. The top-surface temperature of the
packages should preferable be kept below 220 °C for
thick/large packages, and below 235 °C for small/thin
packages.

WAVE SOLDERING
Conventional single wave soldering is not recommended

forsurfacemountdevices(SMDs)orprinted-circuitboards
with a high component density, as solder bridging and
non-wetting can present major problems.

To overcome these problems the double-wave soldering
method was specifically developed.

If wave soldering is used the following conditions must be
observed for optimal results:

• Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.

• For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27 mm, the footprint

longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;

– smaller than 1.27 mm, the footprint longitudinal axis

must be parallel to the transport direction of the
printed-circuit board.

The footprint must incorporate solder thieves at the
downstream end.

• Forpackageswithleadsonfoursides,thefootprintmust
be placed at a 45° angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.

During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.

Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.

MANUAL SOLDERING
Fix the component by first soldering two

diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300 °C. When using a dedicated tool, all other leads can
be soldered in one operation within 2 to 5 seconds
between 270 and 320 °C.

2000 Nov 22 27

Philips Semiconductors Objective specification

Integrated multistandard comb filter TDA9181

Suitability of IC packages for wave, reflow and dipping soldering methods

MOUNTING PACKAGE

Through-hole mount DBS, DIP, HDIP, SDIP, SIL suitable

WAVE REFLOW

(2)

− suitable

(1)

DIPPING

Surface mount BGA, LFBGA, SQFP, TFBGA not suitable suitable −

SOLDERING METHOD

HBCC, HLQFP, HSQFP, HSOP, HTQFP,

not suitable

(3)

suitable −

HTSSOP, SMS

(4)

PLCC
LQFP, QFP, TQFP not recommended
SSOP, TSSOP, VSO not recommended

, SO, SOJ suitable suitable −

(4)(5)

suitable −

(6)

suitable −

Notes

1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the

“Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”

.

2. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board.

3. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).

4. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.

5. Wave soldering is only suitable for LQFP, QFP and TQFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.

6. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.

2000 Nov 22 28

Philips Semiconductors Objective specification

Integrated multistandard comb filter TDA9181

DATA SHEET STATUS

DATA SHEET STATUS

Objective specification Development This data sheet contains the design target or goal specifications for

Preliminary specification Qualification This data sheet contains preliminary data, and supplementary data will be

Product specification Production This data sheet contains final specifications. Philips Semiconductors

Note

1. Please consult the most recently issued data sheet before initiating or completing a design.

DEFINITIONS
Short-form specification  The data in a short-form

specification is extracted from a full data sheet with the
same type number and title. For detailed information see
the relevant data sheet or data handbook.

Limiting values definition  Limiting values given are in
accordance with the Absolute Maximum Rating System
(IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device.
These are stress ratings only and operation of the device
attheseoratanyotherconditionsabovethosegiveninthe
Characteristics sections of the specification is not implied.
Exposure to limiting values for extended periods may
affect device reliability.

Application information  Applications that are
described herein for any of these products are for
illustrative purposes only. Philips Semiconductors make
norepresentationorwarrantythatsuchapplications will be
suitable for the specified use without further testing or
modification.

PRODUCT

STATUS

DEFINITIONS

product development. Specification may change in any manner without
notice.

published at a later date. Philips Semiconductors reserves the right to
make changes at any time without notice in order to improve design and
supply the best possible product.

reserves the right to make changes at any time without notice in order to
improve design and supply the best possible product.

DISCLAIMERS
Life support applications  These products are not

designed for use in life support appliances, devices, or
systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips
Semiconductorscustomersusingorsellingthese products
for use in such applications do so at their own risk and
agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.

Right to make changes  Philips Semiconductors
reserves the right to make changes, without notice, in the
products, including circuits, standard cells, and/or
software, described or contained herein in order to
improve design and/or performance. Philips
Semiconductors assumes no responsibility or liability for
theuseofanyoftheseproducts,conveysnolicence or title
under any patent, copyright, or mask work right to these
products,andmakesnorepresentationsorwarrantiesthat
these products are free from patent, copyright, or mask
work right infringement, unless otherwise specified.

(1)

2000 Nov 22 29

Philips Semiconductors Objective specification

Integrated multistandard comb filter TDA9181

NOTES

2000 Nov 22 30

Philips Semiconductors Objective specification

Integrated multistandard comb filter TDA9181

NOTES

2000 Nov 22 31

Philips Semiconductors – a w orldwide compan y

Argentina: see South America
Australia: 3 Figtree Drive, HOMEBUSH, NSW 2140,

Tel. [phone], Fax. [phone]
Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213,

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220050 MINSK, Tel. [phone], Fax. [phone]

Belgium: see The Netherlands
Brazil: see South America
Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor,

51 James Bourchier Blvd., 1407 SOFIA,
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Pakistan: see Singapore
Philippines: Philips Semiconductors Philippines Inc.,

106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI,
Metro MANILA, Tel. [phone], Fax. [phone]

Poland: Al.Jerozolimskie 195 B, 02-222 WARSAW,
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Portugal: see Spain
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Tel. [phone], Fax. [phone]
Singapore: Lorong 1, Toa Payoh, SINGAPORE 319762,

Tel. [phone], Fax. [phone]

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2092 JOHANNESBURG, P.O. Box 58088 Newville 2114,
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Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,
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Taiwan: Philips Semiconductors, 5F, No. 96, Chien Kuo N. Rd., Sec. 1,
TAIPEI, Taiwan Tel. [phone], Fax. [phone]

Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,
60/14 MOO 11, Bangna Trad Road KM. 3, Bagna, BANGKOK 10260,
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Turkey: Yukari Dudullu, Org. San. Blg., 2.Cad. Nr. 28 81260 Umraniye,
ISTANBUL, Tel. [phone], Fax. [phone]

Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,
252042 KIEV, Tel. [phone], Fax. [phone]

United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,
MIDDLESEX UB3 5BX, Tel. [phone], Fax. [phone]

United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. [phone], Fax. [phone]

Uruguay: see South America
Vietnam: see Singapore
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,

Tel. [phone], Fax.[phone]

For all other countries apply to: Philips Semiconductors,
Marketing Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN,
The Netherlands, Fax. [phone]

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2000

Internet: http://www.semiconductors.philips.com

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Printed in The Netherlands 753504/25/01/pp32 Date of release: 2000 Nov 22 Document order number: 9397 750 07313