The TDA8943SF is a single-channel audio power amplifier with an output power of
7 W at an 8 Ω load and a 12 V supply. The circuit contains a Bridge Tied Load (BTL)
amplifier with an all-NPN output stage and standby/mute logic. The TDA8943SF
comes in a 9-lead single in-line (SIL) medium power package. The TDA8943SF is
printed-circuit board (PCB) compatible with all other types in the TDA894x family.
One PCB footprint accommodates both the mono and the stereo products.
2.Features
■ Few external components
■ Fixed gain
■ Standby and mute mode
■ No on/off switching plops
■ Low standby current
■ High supply voltage ripple rejection
■ Outputs short-circuit protected to ground, supply and across the load
■ Thermally protected
■ Printed-circuit board compatible, see Table 3 “Product family overview”.
The TDA8943SF is a mono BTL audio power amplifier capable of delivering 7 W
output power to an 8 Ω load at THD = 10%, using a 12 V power supply and an
external heatsink. The voltage gain is fixed at 32 dB.
TDA8943SF
7 W mono BTL audio amplifier
2supply voltage
With the three-level MODE input the device can be switched from ‘standby’ to ‘mute’
and to ‘operating’ mode.
The TDA8943SF outputs are protected by an internal thermal shutdown protection
mechanism and a short-circuit protection.
8.1 Power amplifier
The power amplifier is a Bridge Tied Load (BTL) amplifier with an all-NPN output
stage, capable of delivering a peak output current of 1.5 A.
The BTL principle offers the following advantages:
Lower peak value of the supply current
•
The ripple frequency on the supply voltage is twice the signal frequency
•
No expensive DC-blocking capacitor
•
Good low frequency performance.
•
8.2 Mode selection
The TDA8943SF has three functional modes, which can be selected by applying the
proper DC voltage to pin MODE.
Standby — In this mode the current consumption is very low and the outputs are
floating. The device is in standby mode when V
MODE pin is left floating.
>(VCC− 0.5 V), or when the
MODE
Mute — In this mode the amplifier is DC-biased but not operational (no audio output).
This allows the input coupling capacitors to be charged to avoid pop-noise. The
device is in mute mode when 2.5V<V
16.1 Introduction to soldering through-hole mount packages
This text gives a brief insight to wave, dip and manual soldering. A more in-depth
account of soldering ICs can be found in our
Packages
Wave soldering is the preferred method for mounting of through-hole mount IC
packages on a printed-circuit board.
16.2 Soldering by dipping or by solder wave
The maximum permissible temperature of the solder is 260 °C; solder at this
temperature must not be in contact with the joints for more than 5 seconds. The total
contact time of successive solder waves must not exceed 5 seconds.
The device may be mounted up to the seating plane, but the temperature of the
plastic body must not exceed the specified maximum storage temperature (T
If the printed-circuit board has been pre-heated, forced cooling may be necessary
immediately after soldering to keep the temperature within the permissible limit.
Data Handbook IC26; Integrated Circuit
(document order number 9398 652 90011).
TDA8943SF
7 W mono BTL audio amplifier
).
stg(max)
16.3 Manual soldering
Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the
seating plane or not more than 2 mm aboveit. If the temperature of the soldering iron
bit is less than 300 °C it may remain in contact for up to 10 seconds. If the bit
temperature is between 300 and 400 °C, contact may be up to 5 seconds.
16.4 Package related soldering information
Table 9:Suitability of through-hole mount IC packages for dipping and wave soldering
methods
PackageSoldering method
DBS, DIP, HDIP, SDIP, SILsuitablesuitable
[1] For SDIP packages, the longitudinal axis must be parallel to the transport direction of the
Objective specificationDevelopmentThis data sheet contains the design target or goal specifications for product development. Specification may
change in any manner without notice.
Preliminary specification QualificationThis data sheet contains preliminary data, and supplementary data will be published at a later date. Philips
Semiconductors reserves the right to make changes at any time without notice in order to improve design and
supply the best possible product.
Product specificationProductionThis data sheet contains final specifications. Philips Semiconductors reserves the right to make changes at any
time without notice in order to improve design and supply the best possible product.
[1] Please consult the most recently issued data sheet before initiating or completing a design.
19. Definitions
Short-form specification — The data in a short-form specification is
extracted from a full data sheet with the same type number and title. For
detailed information see the relevant data sheet or data handbook.
Limiting values definition — Limiting values given are in accordance with
the Absolute Maximum Rating System (IEC 60134). Stress above one or
more of the limiting values may cause permanent damage to the device.
These are stress ratings only and operation of the device at these or at any
other conditions above those given in the Characteristics sections of the
specification is not implied. Exposure to limiting values for extended periods
may affect device reliability.
Application information — Applications that are described herein for any
of these products are for illustrative purposes only. Philips Semiconductors
make no representation or warranty that such applications will be suitable for
the specified use without further testing or modification.
[1]
20. Disclaimers
Life support — These products are not designed for use in life support
appliances, devices, or systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips Semiconductors
customers using or selling these products for use in such applications do so
at their own risk and agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Right to make changes — Philips Semiconductors reserves the right to
make changes, without notice, in the products, including circuits, standard
cells, and/or software, described or contained herein in order to improve
design and/or performance. Philips Semiconductors assumes no
responsibility or liability for the use of any of these products, conveys no
licence or title under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that these products
are free from patent, copyright, or mask work right infringement, unless
otherwise specified.
All rights are reserved. Reproduction in whole or in part is prohibited without the prior
written consent of the copyright owner.
The information presented in this document does not form part of any quotation or
contract, is believed to be accurate and reliable and may be changed without notice. No
liability will be accepted by the publisher for any consequence of its use. Publication
thereof does not convey nor imply any license under patent- or other industrial or
intellectual property rights.
Date of release: 14 April 1999Document order number: 9397 750 04877
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