Philips TDA8926TH Technical data

INTEGRATED CIRCUITS

DATA SH EET

TDA8926TH

Power stage 2 × 50 W class-D audio amplifier

Preliminary speciﬁcation Supersedes data of 2002 Feb 07

2002 Oct 22

Philips Semiconductors Preliminary speciﬁcation

Power stage 2 × 50 W class-D audio ampliﬁer

CONTENTS

1 FEATURES 2 APPLICATIONS 3 GENERAL DESCRIPTION 4 QUICK REFERENCE DATA 5 ORDERING INFORMATION 6 BLOCK DIAGRAM 7 PINNING 8 FUNCTIONAL DESCRIPTION

8.1 Power stage

8.2 Protection

8.2.1 Overtemperature

8.2.2 Short-circuit across the loudspeaker terminals

8.3 BTL operation 9 LIMITING VALUES 10 THERMAL CHARACTERISTICS 11 QUALITY SPECIFICATION 12 DC CHARACTERISTICS 13 AC CHARACTERISTICS 14 SWITCHING CHARACTERISTICS

14.1 Duty factor

TDA8926TH

15 TEST AND APPLICATION INFORMATION

15.1 BTL application

15.2 Package ground connection

15.3 Output power

15.4 Reference design

15.5 Curves measured in reference design 16 PACKAGE OUTLINE 17 SOLDERING

17.1 Introduction to soldering surface mount packages

17.2 Reflow soldering

17.3 Wave soldering

17.4 Manual soldering

17.5 Suitability of surface mount IC packages for wave and reflow soldering methods

18 DATA SHEET STATUS 19 DEFINITIONS 20 DISCLAIMERS

2002 Oct 22 2

Philips Semiconductors Preliminary speciﬁcation

Power stage 2 × 50 W class-D audio ampliﬁer

1 FEATURES

• High efficiency (>94%)

• Operating voltage from ±15 to ±30 V

• Very low quiescent current

• High output power

• Short-circuit proof across the load, only in combination

with controller TDA8929T

• Diagnostic output

• Usable as a stereo Single-Ended (SE) amplifier or as a

mono amplifier in Bridge-Tied Load (BTL)

• Standby mode

• Electrostatic discharge protection (pin to pin)

• Thermally protected, onlyin combination with controller

TDA8929T.

2 APPLICATIONS

• Television sets

• Home-sound sets

• Multimedia systems

• All mains fed audio systems

• Car audio (boosters).

TDA8926TH

3 GENERAL DESCRIPTION

The TDA8926TH is the switching power stage of a two-chip set for a high efficiency class-D audio power amplifier system. The system is split into two chips:

• TDA8926TH: a digital power stage in a HSOP24 power

package

• TDA8929T: the analog controller chip in a SO24

package.

With this chip set a compact 2 × 50 W audio amplifier systemcanbebuilt,operatingwithhighefficiency and very low dissipation. No heatsink is required, or depending on supply voltage and load, a very small one. The system operates over a wide supply voltage range from ±15 up to ±30 V and consumes a very low quiescent current.

4 QUICK REFERENCE DATA

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

General; VP= ±25 V

q(tot)

η efﬁciency P

supply voltage ±15 ±25 ±30 V total quiescent current no load connected − 35 45 mA

=30W − 94 − %

Stereo single-ended conﬁguration

output power RL=8Ω; THD = 10%; VP= ±25 V 30 37 − W

=4Ω; THD = 10%; VP= ±21 V 40 50 − W

Mono bridge-tied load conﬁguration

output power RL=8Ω; THD = 10%; VP= ±21 V 80 100 − W

5 ORDERING INFORMATION

PACKAGE

TYPE NUMBER

NAME DESCRIPTION VERSION

TDA8926TH HSOP24 plastic, heatsink small outline package; 24 leads; low stand-off

height

SOT566-3

2002 Oct 22 3

Philips Semiconductors Preliminary speciﬁcation

Power stage 2 × 50 W class-D audio ampliﬁer

6 BLOCK DIAGRAM

handbook, full pagewidth

LIM

EN1

SW1

REL1

STAB

DIAG

POWERUP

EN2

SW2

REL2

STAB

24 21 22 6

13 16 15 7

CONTROL

HANDSHAKE

temp

current

CONTROL

HANDSHAKE

TDA8926TH

DRIVER

HIGH

AND

DRIVER

LOW

TEMPERATURE SENSOR

AND

CURRENT PROTECTION

DRIVER

HIGH

AND

DRIVER

LOW

DD2VDD1

11 2

SS1

DD2

TDA8926TH

BOOT1

OUT1

BOOT2

OUT2

1, 7, 12, 18, 20

n.c.

Fig.1 Block diagram.

19 5 8

SS(sub)

SS1VSS2

MGW139

2002 Oct 22 4

Philips Semiconductors Preliminary speciﬁcation

Power stage 2 × 50 W class-D audio ampliﬁer

7 PINNING

SYMBOL PIN DESCRIPTION

n.c. 1 not connected V

DD1

BOOT1 3 bootstrap capacitor; channel 1 OUT1 4 PWM output; channel 1 V

SS1

STAB 6 decoupling internal stabilizer for

n.c. 7 not connected V

SS2

OUT2 9 PWM output; channel 2 BOOT2 10 bootstrap capacitor; channel 2 V

DD2

n.c. 12 not connected EN2 13 digital enable input; channel 2 POWERUP 14 enable input for switching on

REL2 15 digital control output; channel 2 SW2 16 digital switch input; channel 2 LIM 17 pin reserved for testing; connect

n.c. 18 not connected V

SS(sub)

n.c. 20 not connected SW1 21 digital switch input; channel 1 REL1 22 digital control output; channel 1 DIAG 23 digital open-drain output for

EN1 24 digital enable input; channel 1

2 positive power supply; channel 1

5 negative power supply; channel 1

logic supply

8 negative power supply; channel 2

11 positive power supply; channel 2

internal reference sources

to VSS in the application

19 negative supply (substrate)

overtemperature and overcurrent report

handbook, halfpage

EN1 DIAG REL1

SW1

n.c.

SS(sub)

n.c. LIM

SW2

REL2

POWERUP

EN2

24 23 22 21 20 19 18 17

16 15 14 13

TDA8926TH

MGW143

Fig.2 Pin configuration.

TDA8926TH

n.c.

DD1

BOOT1

OUT1

SS1

STAB

n.c.

7 8

SS2

OUT2

BOOT2

DD2

n.c.

2002 Oct 22 5

Philips Semiconductors Preliminary speciﬁcation

Power stage 2 × 50 W class-D audio ampliﬁer

8 FUNCTIONAL DESCRIPTION

The combination of the TDA8926TH and the controller TDA8929T produces a two-channel audio power amplifier system using the class-D technology (see Fig.3). In the TDA8929T controller the analog audio input signal is converted into a digital Pulse Width Modulation (PWM) signal.

The power stage TDA8926TH is used for driving the low-passfilter and theloudspeakerload. It performs alevel shiftfromthelow-powerdigitalPWMsignal, at logic levels, to a high-power PWM signal that switches between the main supply lines. A 2nd-order low-pass filter converts the PWM signal into an analog audio signal across the loudspeaker.

For a description of the controller, see data sheet

“TDA8929T, Controller class-D audio amplifier”

8.1 Power stage

The power stage contains the high-power DMOS switches,the drivers, timing and handshakingbetweenthe power switches and some control logic. For protection, a temperature sensor and a maximum current detector are built-in on the chip.

For interfacing with the controller chip the following connections are used:

• Switch (pins SW1 and SW2): digital inputs; switching from VSS to VSS+ 12 V and driving the power DMOS switches

• Release (pins REL1 and REL2): digital outputs; switching from VSSto VSS+ 12 V; follow SW1 and SW2 with a small delay

• Enable (pins EN1 and EN2): digital inputs; at a level of VSSthe power DMOS switches are open and the PWM outputs are floating; at a level of VSS+ 12 V the power stage is operational and controlled by the switch pin if pin POWERUP is at VSS+12V

• Power-up (pin POWERUP): analog input; at LOW level with respect to VSS the device is in standby mode and the supply current is practically zero. With a HIGH level on this pin, the device is in operating mode

• Diagnostics(pin DIAG): digital open-drain output; pulled to VSS if the temperature or maximum current is exceeded.

TDA8926TH

8.2 Protection

Temperature and short-circuit protection sensors are included in the TDA8926TH. The protection circuits are operational only in combination with the controller TDA8929T. In the event that the maximum current or maximum temperature is exceeded the diagnostic output is activated. The controller has to take appropriate measures by shutting down the system.

8.2.1 OVERTEMPERATURE If the junction temperature (Tj) exceeds 150 °C, then

pin DIAG becomes LOW. The diagnostic pin is released if the temperature is dropped to approximately 130 °C, so there is a hysteresis of approximately 20 °C.

8.2.2 SHORT-CIRCUIT ACROSS THE LOUDSPEAKER

TERMINALS

When the loudspeaker terminals are short-circuited This will be detected by the current protection. If the output current exceeds the maximum output current of 5 A, then pin DIAG becomes LOW. The controller should shut down the system to prevent damage. Using the TDA8929T the system is shut down within 1 µs, and after 220 ms it will attempt to restart the system again. During this time the dissipation is very low, therefore the average dissipation during a short circuit is practically zero.

2002 Oct 22 6

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2002 Oct 22 7

OUT1

BOOT2

OUT2

DDA

BOOT1

SSA

+25 V

−25 V

MBL510

SSA

i(1)

MODE

i(2)

OSC

IN1−

IN1+

SGND1

OSC

MODE

SGND2

IN2+

IN2−

SSAVDDA

SGND

SS2(sub)

SS1VDD1

TDA8929T

INPUT

STAGE

mute

OSCILLATOR

MODE

mute

INPUT

STAGE

12 10

SSAVDDA

PWM

MODULATOR

PWM

MODULATOR

DD2

STABI

MANAGER

SSD

23 24

21 19

22 15

13 14 17

PWM1

REL1 SW1

EN1

STAB

DIAGCUR

DIAGTMP

EN2

SW2 REL2

PWM2

REL1

SW1

EN1

STAB

DIAG

POWERUP

EN2

SW2

REL2

TDA8926TH

CONTROL

AND

HANDSHAKE

TEMPERATURE SENSOR

CURRENT PROTECTION

CONTROL

AND

HANDSHAKE

1, 7, 12, 18, 20 n.c.

AND

SS(sub)

DRIVER

HIGH

DRIVER

LOW

DRIVER

HIGH

DRIVER

LOW

DD2VDD1

11 2

LIM

SSD

DDD

SS1

DD2

SS2

SGND

(0 V)

Philips Semiconductors Preliminary speciﬁcation

Power stage 2 × 50 W class-D audio

ampliﬁer

TDA8926TH

Fig.3 Typical application schematic of the class-D system using the controller TDA8929T and the TDA8926TH.

handbook, full pagewidth

Philips Semiconductors Preliminary speciﬁcation

Power stage 2 × 50 W class-D audio ampliﬁer

8.3 BTL operation

BTL operation can be achieved by driving the audio input channels of the controller in the opposite phase and by connecting the loudspeaker with a BTL output filter between the two outputs (pins OUT1 and OUT2) of the power stage (see Fig.4).

handbook, full pagewidth

TDA8926TH

EN1

SW1

REL1

STAB

DIAG

POWERUP

EN2

SW2

REL2

24 21 22 6

13 16 15

CONTROL

AND

HANDSHAKE

temp

TEMPERATURE SENSOR

current

CURRENT PROTECTION

CONTROL

AND

HANDSHAKE

TDA8926TH

In this way the system operates as a mono BTL amplifier and with the same loudspeaker impedance a four times higher output power can be obtained.

For more information see Chapter 15.

DD2VDD1

11 2

BOOT1

DRIVER

AND

HIGH

DRIVER

LOW

V V

DRIVER

HIGH

DRIVER

LOW

SS1 DD2

OUT1

SGND

(0 V)

BOOT2

OUT2

1, 7, 12, 18, 20 8

n.c.

Fig.4 Mono BTL application.

2002 Oct 22 8

SS(sub)

LIM

SS1VSS2

MBL511

Philips Semiconductors Preliminary speciﬁcation

Power stage 2 × 50 W class-D audio

TDA8926TH

ampliﬁer

9 LIMITING VALUES

In accordance with the Absolute Maximum Rate System (IEC 60134).

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

P(sc)

ORM

stg

amb

es(HBM)

es(MM)

supply voltage −±30 V supply voltage for

−±30 V

short-circuits across the load repetitive peak current in

− 5A

output pins storage temperature −55 +150 °C ambient temperature −40 +85 °C virtual junction temperature − 150 °C electrostatic discharge

voltage (HBM)

note 1

all pins with respect to V all pins with respect to V

(class 1a) −1000 +1000 V

all pins with respect to each other

−500 +500 V

(class 1a)

electrostatic discharge voltage (MM)

note 2

all pins with respect to V all pins with respect to V

(class A1) −150 +150 V

(class B) −200 +200 V

all pins with respect to each other

−100 +100 V

(class A1)

Notes

1. Human Body Model (HBM); R

= 1500 Ω; C = 100 pF.

2. Machine Model (MM); Rs=10Ω; C = 200 pF; L = 0.75 µH.

10 THERMAL CHARACTERISTICS

SYMBOL PARAMETER CONDITIONS VALUE UNIT

R R

th(j-a) th(j-c)

thermal resistance from junction to ambient in free air 40 K/W thermal resistance from junction to case in free air 1 K/W

11 QUALITY SPECIFICATION

In accordance with

“SNW-FQ611-part D”

if this device is used as an audio amplifier (except for ESD, see also Chapter 9).

2002 Oct 22 9

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