Philips TDA8566 User Manual

TDA8566

2 × 40 W/2 Ω stereo BTL car radio power ampliﬁer with differential inputs and diagnostic outputs

Rev. 06 — 15 October 2007 Product data sheet

1. General description

The TDA8566 is an integrated class-B output ampliﬁer which is available in several packages. TDA8566TH is contained in a 20-lead small outline plastic package. The TDA8566TH1 is a 24-lead small outline plastic package which is pin compatible with the I2C-bus controlled ampliﬁer TDA1566TH for one board layout. TDA8566Q is a 17-pin DIL-bent-SIL package.

The device contains 2 ampliﬁers in a Bridge-Tied Load (BTL) conﬁguration. The output power is 2 × 25 W in a 4 Ω load or 2 × 40 W in a 2 Ω load. It has a differential input stage and 2 diagnostic outputs. The device is primarily developed for car radio applications.

2. Features

n Differential inputs n Very high Common Mode Rejection Ratio (CMRR) n High common mode input signal handling n Requires very few external components n High output power n 4 Ω and 2 Ω load driving capability n Low offset voltage at output n Fixed gain n Diagnostic facility (distortion, short-circuit and temperature pre-warning) n Good ripple rejection n Mode select switch (operating, mute and standby) n Load dump protection n Short-circuit proof to ground, to VP and across the load n Low power dissipation in any short-circuit condition n Thermally protected n Reverse polarity safe n Protected against electrostatic discharge n No switch-on/switch-off plops n Low thermal resistance n TDA8566TH1 is pin compatible with TDA1566TH

NXP Semiconductors

3. Quick reference data

Table 1. Quick reference data

VP= 14.4 V; T speciﬁed.

Symbol Parameter Conditions Min Typ Max Unit

ORM

stb

SVRR supply voltage ripple

CMRR common mode rejection

n(o)

[1] The circuit is DC adjusted at VP= 6 V to 18 V and AC operating at VP= 8.5 V to 18 V. [2] V [3] Common mode rejection ratio measured at the output (over RL) with both inputs tied together;

[4] Noise measured in a bandwidth of 20 Hz to 20 kHz.

supply voltage repetitive peak output

current quiescent current RL= ∞Ω - 115 180 mA standby current - 0.1 10 µA input impedance differential 100 120 150 kΩ output power RL=4Ω; THD = 10 % 21 25 - W

rejection channel separation Po= 25 W; Rs=10kΩ 45 50 - dB

ratio closed loop voltage gain 25 26 27 dB noise output voltage operating; Rs=0Ω

ripple=Vripple(max)

≤ 3.5 V (RMS); fi= 100 Hz to 10 kHz; Rs=0Ω.

common

TDA8566

2 × 40 W/2 Ω stereo BTL car radio power ampliﬁer

=25°C; fi= 1 kHz; measured in test circuit of Figure 9; unless otherwise

amb

[1]

6 14.4 18 V

- - 7.5 A

=2Ω; THD = 10 % 33 40 - W

[2]

operating

= 2 V (p-p); Rs=0Ω.

=0Ω

50 60 - dB

[3]

60 75 - dB

[4]

- 85 120 µV

4. Ordering information

Table 2. Ordering information

Type number Package

Name Description Version

TDA8566TH HSOP20 plastic, heatsink small outline package; 20 leads; low stand-off height SOT418-3 TDA8566TH1 HSOP24 plastic, heatsink small outline package; 24 leads; low stand-off height SOT566-3 TDA8566Q DBS17P plastic DIL-bent-SIL power package; 17 leads (lead length 12 mm) SOT243-1

Product data sheet Rev. 06 — 15 October 2007 2 of 21

NXP Semiconductors

5. Block diagram

TDA8566

2 × 40 W/2 Ω stereo BTL car radio power ampliﬁer

IN1+

IN1−

n.c.

SGND

IN2+

mute switch

2.3 kΩ

mute switch

kΩ

2.3 kΩ

standby

switch

ref

standby

reference

voltage

2.3 kΩ (9×) C

2.3 kΩ (9×)

TDA8566

mute

switch

CLIP

OUT1+

OUT1−

MODE

CLIP

1×

DIAG

mute

kΩ

reference voltage

mute switch

HEATTAB

IN2−

2.3 kΩ

mute switch

2.3

(1)

kΩ

(9×) C

2.3 kΩ (9×)

PGND2 PGND1

OUT2+

OUT2−

mgu358

(1) Pin HEATTAB is available in TDA8566TH1 only.

Fig 1. Block diagram

Product data sheet Rev. 06 — 15 October 2007 3 of 21

NXP Semiconductors

6. Pinning information

6.1 Pinning

TDA8566

2 × 40 W/2 Ω stereo BTL car radio power ampliﬁer

24 23

n.c. IN2−

OUT2− n.c.

PGND2 n.c.

OUT2+ n.c.

OUT1− MODE

PGND1 n.c.

OUT1+ n.c.

n.c. IN1+

CLIP SGND

TDA8566TH1

001aah015

MODE DIAG

OUT2− IN2−

PGND2 n.c.

OUT2+ n.c.

OUT1− n.c.

PGND1 n.c.

OUT1+ IN1+

CLIP SGND

TDA8566TH

001aag902

1 2

IN2+ 3 4 5 6 7 8 9

IN1−

HEATTAB DIAG

Fig 2. Pin conﬁguration TDA8566TH Fig 3. Pin conﬁguration TDA8566TH1

IN1+

IN1−

SGND

CLIP

n.c.

MODE

DIAG

IN2+ IN2−

6 7 8

9 10 11 12 13

14 15 16 17

TDA8566Q

OUT1+

PGND1

OUT1−

OUT2+

PGND2

OUT2−

1 2

IN2+ 3 4 5 6 7 8 9

10 11

IN1−

001aah059

Fig 4. Pin conﬁguration TDA8566Q

Product data sheet Rev. 06 — 15 October 2007 4 of 21

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6.2 Pin description

Table 3. Pin description TDA8566TH and TDA8566TH1

Symbol Pin Description

DIAG 1 1 short-circuit and temperature pre-warning

IN2+ 2 2 channel 2 input positive IN2− 3 3 channel 2 input negative n.c. 4 4 not connected n.c. 5 5 not connected n.c. 6 6 not connected n.c. 7 - not connected n.c. - 8 not connected n.c. - 9 not connected IN1+ 8 10 channel 1 input positive IN1− 9 11 channel 1 input negative SGND 10 12 signal ground CLIP 11 13 clip detection output V

n.c. - 15 not connected OUT1+ 13 16 channel 1 output positive PGND1 14 17 power ground 1 OUT1− 15 18 channel 1 output negative n.c. - - not connected OUT2+ 16 19 channel 2 output positive PGND2 17 20 power ground 2 OUT2− 18 21 channel 2 output negative n.c. - 22 not connected V

MODE 20 7 mode select switch input (standby/mute/operating) HEATTAB - 24 connect to ground, used for test purposes only

TDA8566

2 × 40 W/2 Ω stereo BTL car radio power ampliﬁer

TDA8566TH TDA8566TH1

diagnostic output

12 14 supply voltage 1

19 23 supply voltage 2

Table 4. Pin description TDA8566Q

Symbol Pin Description

IN1+ 1 channel 1 input positive IN1− 2 channel 1 input negative SGND 3 signal ground CLIP 4 clip detection output V

OUT1+ 6 channel 1 output positive PGND1 7 power ground 1 OUT1− 8 channel 1 output negative n.c. 9 not connected

Product data sheet Rev. 06 — 15 October 2007 5 of 21

5 supply voltage 1

NXP Semiconductors

TDA8566

2 × 40 W/2 Ω stereo BTL car radio power ampliﬁer

Table 4. Pin description TDA8566Q

Symbol Pin Description

OUT2+ 10 channel 2 output positive PGND2 11 power ground 2 OUT2− 12 channel 2 output negative V

MODE 14 mode select switch input (standby/mute/operating) DIAG 15 short-circuit and temperature pre-warning diagnostic output IN2+ 16 channel 2 input positive IN2− 17 channel 2 input negative

13 supply voltage 2

7. Functional description

The TDA8566 contains 2 identical ampliﬁers and can be used for BTL applications. The gain of each ampliﬁer is ﬁxed at 26 dB. Special features of this device are:

• Mode select switch

• Clip detection

• Short-circuit diagnostic

• Temperature pre-warning

• Open-collector diagnostic outputs

• Differential inputs

…continued

7.1 Mode select switch (pin MODE)

•

Standby: low supply current

• Mute: input signal suppressed

• Operating: normal on condition

Since this pin has a very low input current (< 40 µA), a low-cost supply switch can be applied. To avoid switch-on plops, it is advisable to keep the ampliﬁer in the mute mode for a period of ≥ 150 ms (charging the input capacitors at pins IN1+, IN1−, IN2+ and IN2−). This can be realized by using a microcontroller or by using an external timing circuit as illustrated in Figure 8.

7.2 Clip detection (pin CLIP)

When clipping occurs at one or more output stages, the dynamic distortion detector becomes active and pin CLIP goes LOW. This information can be used to drive a sound processor or a DC volume control to attenuate the input signal and so limit the level of distortion. The output level of pin CLIP is independent of the number of channels that are being clipped. The clip detection circuit is disabled in a short-circuit condition, so if a fault condition occurs at the outputs, pin CLIP will remain at a HIGH level. The clip detection waveforms are illustrated in Figure 5.

Product data sheet Rev. 06 — 15 October 2007 6 of 21

NXP Semiconductors

TDA8566

2 × 40 W/2 Ω stereo BTL car radio power ampliﬁer

(V)

CLIP

(V)

t (s)

mgu357

Fig 5. Clip detection waveforms

7.3 Short-circuit diagnostic (pin DIAG)

When a short-circuit occurs at one or more outputs to ground or to the supply voltage, the output stages are switched off until the short-circuit is removed and the device is switched on again (with a delay of approximately 20 ms after the removal of the short-circuit). During this short-circuit condition, pin DIAG is continuously LOW.

When a short-circuit occurs across the load of one or both channels, the output stages are switched off for approximately 20 ms. After that time the load condition is checked during approximately 50 µs to see whether the short-circuit is still present. Due to this duty cycle of 50 µs/20 ms the average current consumption during the short-circuit condition is very low (approximately 40 mA). During this condition, pin DIAG is LOW for 20 ms and HIGH for 50 µs; see Figure 6. The power dissipation in any short-circuit condition is very low.

current

output

stage

t (s)

mgu360

DIAG

(V)

short-circuit over the load

20 ms

50 µs

Fig 6. Short-circuit diagnostic timing diagram

7.4 Temperature pre-warning (pin DIAG)

When the virtual junction temperature (Tvj) reaches 145 °C, pin DIAG will become continuously LOW.

7.5 Open-collector diagnostic outputs

Pins DIAG and CLIP are open-collector outputs, therefore more devices can be tied together. Pins DIAG and CLIP can also be tied together. An external pull-up resistor is required.

Product data sheet Rev. 06 — 15 October 2007 7 of 21

NXP Semiconductors

7.6 Differential inputs

The input stage is a high-impedance fully differential balanced input stage that is also capable of operating in a single-ended mode with one of the inputs capacitivelycoupled to an audio ground. It should be noted that if a source resistance is added (input voltage dividers) the CMRR degrades to lower values.

8. Limiting values

Table 5. Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol Parameter Conditions Min Max Unit

OSM

ORM

stg

amb

psc

tot

TDA8566

2 × 40 W/2 Ω stereo BTL car radio power ampliﬁer

supply voltage operating - 18 V

non-operating - 30 V load dump protection;

during 50 ms; t

≥ 2.5 ms

non-repetitive peak output current

repetitive peak output current

storage temperature −55 +150 °C virtual junction temperature - 150 °C ambient temperature −40 +85 °C short-circuit safe voltage - 18 V reverse polarity voltage - 6.0 V total power dissipation - 60 W

-45V

-10A

- 7.5 A

9. Thermal characteristics

Table 6. Thermal characteristics

Thermal characteristics in accordance with IEC 60747-1.

Symbol Parameter Conditions Typ Unit

th(j-c)

th(j-a)

Fig 7. Equivalent thermal resistance network

Product data sheet Rev. 06 — 15 October 2007 8 of 21

thermal resistance from junction to case see Figure 7 1.3 K/W thermal resistance from junction to ambient in free air 40 K/W

virtual junction

output 1

2.2 K/W 2.2 K/W

case

output 2

0.2 K/W

001aaa155

NXP Semiconductors

10. Static characteristics

Table 7. Static characteristics

VP= 14.4 V; T

Symbol Parameter Conditions Min Typ Max Unit

Supply

Operating condition

MODE

Mute condition

MODE

∆V

Standby condition

MODE

stb

Diagnostic

DIAG

amb

supply voltage quiescent current RL= ∞Ω - 115 180 mA

mode select switch level

mode select switch current

output voltage output offset voltage - - 100 mV

mode select switch level

output voltage output offset voltage - - 60 mV output offset voltage

difference

mode select switch level

standby current - 0.1 10 µA

diagnostic output voltage

TDA8566

2 × 40 W/2 Ω stereo BTL car radio power ampliﬁer

=25°C; measured in test circuit of Figure 9; unless otherwise speciﬁed.

[1]

6 14.4 18 V

8.5 - V

= 14.4 V - 15 40 µA

MODE

[2]

- 7.0 - V

3.3 - 6.4 V

[2]

- 7.0 - V

with respect to

--60mV

operating condition

0- 2V

during any fault

- - 0.6 V

condition

[1] The circuit is DC adjusted at VP= 6 V to 18 V and AC operating at VP= 8.5 V to 18 V. [2] At VP= 18 V to 30 V the DC output voltage is ≤ 0.5VP.

Product data sheet Rev. 06 — 15 October 2007 9 of 21

NXP Semiconductors

11. Dynamic characteristics

Table 8. Dynamic characteristics

VP= 14.4 V; T otherwise speciﬁed.

Symbol Parameter Conditions Min Typ Max Unit

THD total harmonic

B power bandwidth THD = 0.5 %; P

ro(l)

ro(h)

SVRR supply voltage

| input impedance

|∆Z

n(o)

| channel unbalance - - 1 dB

|∆G

=25°C; RL=2Ω; fi= 1 kHz; measured in test circuit of Figure 9; unless

amb

output power THD = 0.5 % 25 30 - W

distortion

low frequency roll off

high frequency roll off

closed loop voltage gain

ripple rejection

input impedance differential 100 120 150 kΩ

mismatch noise output

voltage

channel separation Po= 25 W; Rs=10kΩ 45 50 - dB

TDA8566

2 × 40 W/2 Ω stereo BTL car radio power ampliﬁer

THD = 10 % 33 40 - W THD = 30 % 45 55 - W

= 13.5 V; THD = 0.5 % - 25 - W

= 13.5 V; THD = 10 % - 35 - W

THD = 0.5 %; R THD = 10 %; R THD = 30 %; R

= 13.5 V;

THD = 0.5 %; R

= 13.5 V;THD = 10 %;

=4Ω

= 1 W - 0.1 - %

= 0.6 V

CLIP

= 1 W; RL=4Ω - 0.05 - %

with respect to 25 W

−1dB

−1 dB 20 - - kHz

operating mute standby

single-ended 50 60 75 kΩ

operating; Rs=0Ω operating; R mute; independent of R

=4Ω 16 19 - W

=4Ω 21 25 - W

=4Ω 28 35 - W

-14-W

=4Ω

-22-W

[1]

-8-%

= −1dB

-20to 20000

[2]

-25-Hz

25 26 27 dB

[3]

50 60 - dB

[3]

50--dB

[3]

80--dB

-2-%

[4]

- 85 120 µV

=10kΩ

[4]

- 100 - µV

[4]

-60-µV

-Hz

Product data sheet Rev. 06 — 15 October 2007 10 of 21

NXP Semiconductors

TDA8566

2 × 40 W/2 Ω stereo BTL car radio power ampliﬁer

Table 8. Dynamic characteristics

VP= 14.4 V; T

=25°C; RL=2Ω; fi= 1 kHz; measured in test circuit of Figure 9; unless

amb

otherwise speciﬁed.

Symbol Parameter Conditions Min Typ Max Unit

o(mute)

output signal voltage in mute

CMRR common mode

rejection ratio

[1] Dynamic distortion detector active; pin CLIP is LOW. [2] Frequency response externally ﬁxed. [3] V

ripple=Vripple(max)

[4] Noise measured in a bandwidth of 20 Hz to 20 kHz. [5] Common mode rejection ratio measured at the output (over RL) with both inputs tied together;

[6] Common mode rejection ratio measured at the output (over RL) with both inputs tied together;

≤ 3.5 V (RMS); fi= 100 Hz to 10 kHz; Rs=0Ω.

common

≤ 3.5 V (RMS); fi= 1 kHz; Rs=45kΩ. The mismatch of the input coupling capacitors is excluded.

common

12. Application information

12.1 Diagnostic output

Special care must be taken in the PCB layout to separate pin CLIP from pins IN1+, IN1−, IN2+ and IN2− to minimize the crosstalk between the CLIP output and the inputs.

…continued

Vin=V

=0Ω

=45kΩ

= 2 V (p-p); Rs=0Ω.

= 1 V (RMS) - - 2 mV

in(max)

[5]

60 75 - dB

[6]

40--dB

12.2 Mode select switch

To avoid switch-on plops, it is advisable to keep the ampliﬁer in the mute mode during ≥ 150 ms (charging of the input capacitors at pins IN1+, IN1−, IN2+ and IN2−). The circuit in Figure 8 slowly ramps-up the voltage at the mode select switch pin when switching on and results in fast muting when switching off.

Fig 8. Mode select switch circuit

10 kΩ

47 µF

100 Ω

100 kΩ

mode select switch

mgd102

Product data sheet Rev. 06 — 15 October 2007 11 of 21

NXP Semiconductors

13. Test information

TDA8566

2 × 40 W/2 Ω stereo BTL car radio power ampliﬁer

MODE

220 nF

Rs/2

in1

220 nF

Rs/2

IN1+

IN1

kΩ

−

SGND

220 nF

Rs/2

IN2+

MODE

ref

−

TDA8566

CLIP

DETECTOR

DIAGNOSTIC

INTERFACE

100

OUT1+

OUT1−

2200 µF

(16V)

VPV

10 kΩ

CLIP

DIAG

14.4 V

OUT2+

kΩ

in2

Rs/2

220 nF

IN2−

kΩ

OUT2−

PGND1 PGND2

mgu359

Fig 9. Stereo BTL test diagram

Product data sheet Rev. 06 — 15 October 2007 12 of 21

NXP Semiconductors

14. Package outline

TDA8566

2 × 40 W/2 Ω stereo BTL car radio power ampliﬁer

HSOP20: plastic, heatsink small outline package; 20 leads; low stand-off height

pin 1 index

SOT418-3

v M

(A3)

detail X

DIMENSIONS (mm are the original dimensions)

UNIT

Notes

1. Limits per individual lead.

2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

max.

3.5

3.5 0.35

3.2

OUTLINE VERSION

SOT418-3

(1)

bpc

+0.08

0.53

−0.04

0.40

IEC JEDEC JEITA

0.32

0.23

16.0

15.8

w M

0 5 10 mm

scale

(2)

13.0

12.6

REFERENCES

1.1

0.9

(2)

6.2

11.1

5.8

10.9

2.9

2.5

1.27

14.5

13.9

1.1

0.8

1.7

0.25w0.25

1.5

EUROPEAN

PROJECTION

0.03

2.5

0.07

2.0

ISSUE DATE

02-02-12 03-07-23

8° 0°

Fig 10. Package outline SOT418-3 (HSOP20)

Product data sheet Rev. 06 — 15 October 2007 13 of 21

NXP Semiconductors

TDA8566

2 × 40 W/2 Ω stereo BTL car radio power ampliﬁer

HSOP24: plastic, heatsink small outline package; 24 leads; low stand-off height

pin 1 index

SOT566-3

v M

(A3)

detail X

DIMENSIONS (mm are the original dimensions)

UNIT

Notes

1. Limits per individual lead.

2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

max.

3.5

3.5 0.35

3.2

OUTLINE VERSION

SOT566-3

(1)

bpc

+0.08

0.53

−0.04

0.40

IEC JEDEC JEITA

0.32

0.23

16.0

15.8

w M

0 5 10 mm

scale

(2)

13.0

12.6

REFERENCES

1.1

0.9

(2)

6.2

11.1

5.8

10.9

2.9

2.5

14.5

13.9

1.1

0.8

1.7

0.25w0.25

1.5

EUROPEAN

PROJECTION

0.03

2.7

0.07

2.2

ISSUE DATE

03-02-18 03-07-23

8° 0°

Fig 11. Package outline SOT566-3 (HSOP24)

Product data sheet Rev. 06 — 15 October 2007 14 of 21

NXP Semiconductors

TDA8566

2 × 40 W/2 Ω stereo BTL car radio power ampliﬁer

DBS17P: plastic DIL-bent-SIL power package; 17 leads (lead length 12 mm)

non-concave

view B: mounting base side

SOT243-1

117

DIMENSIONS (mm are the original dimensions)

UNIT A e

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

OUTLINE VERSION

SOT243-1

A2bpcD

17.0

4.6

4.4

0.75

0.60

15.5

(1)

deD

0.48

24.0

23.6

20.0

19.6

0.38

IEC JEDEC JEITA

w M

(1)

12.2

10 2.54

11.8

REFERENCES

0 5 10 mm

scale

1.27

5.08

3.4

3.1

LL3m

12.4

2.4

11.0

1.6

2.1

4.3

1.8

EUROPEAN

PROJECTION

v M

0.8

0.4w0.03

ISSUE DATE

99-12-17 03-03-12

(1)

2.00

1.45

Fig 12. Package outline SOT243-1 (DBS17P)

Product data sheet Rev. 06 — 15 October 2007 15 of 21

NXP Semiconductors

15. Soldering

This text provides a very brief insight into a complex technology.A more in-depth account of soldering ICs can be found in Application Note

soldering description”

15.1 Introduction to soldering

Soldering is one of the most common methods through which packages are attached to Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both the mechanical and the electrical connection. There is no single soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not suitable for ﬁne pitch SMDs. Reﬂow soldering is ideal for the small pitches and high densities that come with increased miniaturization.

15.2 Wave and reﬂow soldering

Wave soldering is a joining technology in which the joints are made by solder coming from a standing wave of liquid solder. The wave soldering process is suitable for the following:

TDA8566

2 × 40 W/2 Ω stereo BTL car radio power ampliﬁer

AN10365 “Surface mount reﬂow

• Through-hole components

• Leaded or leadless SMDs, which are glued to the surface of the printed circuit board

Not all SMDs can be wave soldered. Packages with solder balls, and some leadless packages which have solder lands underneath the body, cannot be wave soldered. Also, leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered, due to an increased probability of bridging.

The reﬂow soldering process involves applying solder paste to a board, followed by component placement and exposure to a temperature proﬁle. Leaded packages, packages with solder balls, and leadless packages are all reﬂow solderable.

Key characteristics in both wave and reﬂow soldering are:

• Board speciﬁcations, including the board ﬁnish, solder masks and vias

• Package footprints, including solder thieves and orientation

• The moisture sensitivity level of the packages

• Package placement

• Inspection and repair

• Lead-free soldering versus PbSn soldering

15.3 Wave soldering

Key characteristics in wave soldering are:

• Process issues, such as application of adhesive and ﬂux, clinching of leads, board

transport, the solder wave parameters, and the time during which components are exposed to the wave

• Solder bath speciﬁcations, including temperature and impurities

Product data sheet Rev. 06 — 15 October 2007 16 of 21

NXP Semiconductors

15.4 Reﬂow soldering

Key characteristics in reﬂow soldering are:

• Lead-freeversus SnPb soldering; note that a lead-free reﬂow process usually leads to

• Solder paste printing issues including smearing, release, and adjusting the process

• Reﬂow temperature proﬁle; this proﬁle includes preheat, reﬂow (in which the board is

Table 9. SnPb eutectic process (from J-STD-020C)

Package thickness (mm) Package reﬂow temperature (°C)

< 2.5 235 220 ≥ 2.5 220 220

TDA8566

2 × 40 W/2 Ω stereo BTL car radio power ampliﬁer

higher minimum peak temperatures (see Figure 13) than a PbSn process, thus reducing the process window

window for a mix of large and small components on one board

heated to the peak temperature) and cooling down. It is imperative that the peak temperature is high enough for the solder to make reliable solder joints (a solder paste characteristic). In addition, the peak temperature must be low enough that the packages and/or boards are not damaged. The peak temperature of the package depends on package thickness and volume and is classiﬁed in accordance with

Table 9 and 10

Volume (mm3) < 350 ≥ 350

Table 10. Lead-free process (from J-STD-020C)

Package thickness (mm) Package reﬂow temperature (°C)

Volume (mm3) < 350 350 to 2000 > 2000

< 1.6 260 260 260

1.6 to 2.5 260 250 245 > 2.5 250 245 245

Moisture sensitivity precautions, as indicated on the packing, must be respected at all times.

Studies have shown that small packages reach higher temperatures during reﬂow soldering, see Figure 13.

Product data sheet Rev. 06 — 15 October 2007 17 of 21

NXP Semiconductors

Fig 13. Temperature proﬁles for large and small components

maximum peak temperature

temperature

MSL: Moisture Sensitivity Level

= MSL limit, damage level

minimum peak temperature

= minimum soldering temperature

TDA8566

2 × 40 W/2 Ω stereo BTL car radio power ampliﬁer

peak

temperature

time

001aac844

For further information on temperature proﬁles, refer to Application Note

“Surface mount reﬂow soldering description”

AN10365

Product data sheet Rev. 06 — 15 October 2007 18 of 21

NXP Semiconductors

2 × 40 W/2 Ω stereo BTL car radio power ampliﬁer

TDA8566

16. Revision history

Table 11. Revision history

Document ID Release date Data sheet status Change notice Supersedes

TDA8566_6 20071015 Product data sheet - TDA8566Q_5

TDA8566TH_2

Modiﬁcations:

TDA8566Q_5 20010221 Product speciﬁcation - TDA8566TH_2 20030708 Product speciﬁcation - -

• The format of this data sheet has been redesigned to comply with the new identity

guidelines of NXP Semiconductors.

• Legal texts have been adapted to the new company name where appropriate.

• Section 9 “Thermal characteristics”: changed value of R

to 1.3 K/W

th(j-c)

• Figure 7: values updated

• Included TDA8566TH1 and TDA8566Q in the data sheet

Product data sheet Rev. 06 — 15 October 2007 19 of 21

NXP Semiconductors

17. Legal information

17.1 Data sheet status

TDA8566

2 × 40 W/2 Ω stereo BTL car radio power ampliﬁer

Document status

Objective [short] data sheet Development This document contains data from the objective speciﬁcation for product development. Preliminary [short] data sheet Qualiﬁcation This document contains data from the preliminary speciﬁcation. Product [short] data sheet Production This document contains the product speciﬁcation.

[1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Deﬁnitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status

information is available on the Internet at URL

[1][2]

Product status

17.2 Deﬁnitions

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in modiﬁcations or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information.

Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales ofﬁce. In case of any inconsistency or conﬂict with the short data sheet, the full data sheet shall prevail.

17.3 Disclaimers

General — Information in this document is believed to be accurate and

reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information.

Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation speciﬁcations and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof.

Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or

[3]

http://www.nxp.com.

Deﬁnition

malfunction of a NXP Semiconductors product can reasonably be expectedto result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk.

Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the speciﬁed use without further testing or modiﬁcation.

Limiting values — Stress above one or more limiting values (as deﬁned in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device.Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability.

Terms and conditions of sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at

http://www.nxp.com/proﬁle/terms, including those pertaining to warranty,

intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conﬂict between information in this document and such terms and conditions, the latter will prevail.

No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyanceor implication of any license under any copyrights, patents or other industrial or intellectual property rights.

17.4 Trademarks

Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners.

18. Contact information

For additional information, please visit: http://www.nxp.com For sales ofﬁce addresses, send an email to: salesaddresses@nxp.com

Product data sheet Rev. 06 — 15 October 2007 20 of 21

NXP Semiconductors

19. Contents

1 General description. . . . . . . . . . . . . . . . . . . . . . 1

2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

3 Quick reference data . . . . . . . . . . . . . . . . . . . . . 2

4 Ordering information. . . . . . . . . . . . . . . . . . . . . 2

5 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3

6 Pinning information. . . . . . . . . . . . . . . . . . . . . . 4

6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 5

7 Functional description . . . . . . . . . . . . . . . . . . . 6

7.1 Mode select switch (pin MODE) . . . . . . . . . . . . 6

7.2 Clip detection (pin CLIP). . . . . . . . . . . . . . . . . . 6

7.3 Short-circuit diagnostic (pin DIAG). . . . . . . . . . 7

7.4 Temperature pre-warning (pin DIAG) . . . . . . . . 7

7.5 Open-collector diagnostic outputs . . . . . . . . . . 7

7.6 Differential inputs . . . . . . . . . . . . . . . . . . . . . . . 8

8 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 8

9 Thermal characteristics. . . . . . . . . . . . . . . . . . . 8

10 Static characteristics. . . . . . . . . . . . . . . . . . . . . 9

11 Dynamic characteristics . . . . . . . . . . . . . . . . . 10

12 Application information. . . . . . . . . . . . . . . . . . 11

12.1 Diagnostic output . . . . . . . . . . . . . . . . . . . . . . 11

12.2 Mode select switch . . . . . . . . . . . . . . . . . . . . . 11

13 Test information. . . . . . . . . . . . . . . . . . . . . . . . 12

14 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 13

15 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

15.1 Introduction to soldering . . . . . . . . . . . . . . . . . 16

15.2 Wave and reﬂow soldering . . . . . . . . . . . . . . . 16

15.3 Wave soldering. . . . . . . . . . . . . . . . . . . . . . . . 16

15.4 Reﬂow soldering . . . . . . . . . . . . . . . . . . . . . . . 17

16 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 19

17 Legal information. . . . . . . . . . . . . . . . . . . . . . . 20

17.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 20

17.2 Deﬁnitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

17.3 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

17.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 20

18 Contact information. . . . . . . . . . . . . . . . . . . . . 20

19 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

TDA8566

2 × 40 W/2 Ω stereo BTL car radio power ampliﬁer

Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’.

For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 15 October 2007 Document identifier: TDA8566_6

Philips TDA8566 User Manual

Specifications and Main Features

Frequently Asked Questions

User Manual

1. General description

2. Features

3. Quick reference data

4. Ordering information

5. Block diagram

6. Pinning information

6.1 Pinning

6.2 Pin description

7. Functional description

7.5 Open-collector diagnostic outputs

7.6 Differential inputs

8. Limiting values

9. Thermal characteristics

10. Static characteristics

11. Dynamic characteristics

12. Application information

12.1 Diagnostic output

12.2 Mode select switch

13. Test information

14. Package outline

15. Soldering

15.1 Introduction to soldering

15.3 Wave soldering

16. Revision history

17. Legal information

17.1 Data sheet status

17.3 Disclaimers

17.4 Trademarks

18. Contact information

19. Contents