Philips TDA8543 User Manual

DATA SH EET

INTEGRATED CIRCUITS

TDA8543

2 W BTL audio amplifier

Product specification 1997 Jun 12

NXP Semiconductors Product specification

2 W BTL audio amplifier TDA8543

FEATURES

• Flexibility in use

• Few external components

• Low saturation voltage of output stage

• Gain can be fixed with external resistors

• Standby mode controlled by CMOS compatible levels

GENERAL DESCRIPTION

The TDA8543(T) is a one channel audio power amplifier
for an output power of 2 W with an 8 Ω load at a 7.5 V
supply. The circuit contains a BTL amplifier with
a complementary PNP-NPN output stage and
standby/mute logic. The TDA8543T comes in a 16 pin
SO package and the TDA8543 in a 16 pin DIP package.

• Low standby current

• No switch-on/switch-off plops

• High supply voltage ripple rejection

• Protected against electrostatic discharge

• Outputs short-circuit safe to ground, V

CC

and across

APPLICATIONS

• Portable consumer products

• Personal computers

• Telephony.

the load

• Thermally protected.

QUICK REFERENCE DATA

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

V

CC

I

q

I

stb

P

o

THD total harmonic distortion P

supply voltage 2.2 5 18 V
quiescent current VCC=5V − 812mA
standby current −−10 μA
output power THD = 10%

=8Ω; VCC=5V 1 1.2 − W

R

L

R

=8Ω; VCC=7.5V − 2.2 − W

L

=16Ω; VCC=9V − 2.0 − W

R

L

=0.5W − 0.15 − %

o

SVRR supply voltage ripple rejection 50 −−dB

ORDERING INFORMATION

TYPE

NUMBER

NAME DESCRIPTION VERSION

PACKAGE

TDA8543T SO16 plastic small outline package; 16 leads; body width 3.9 mm SOT109-1
TDA8543 DIP16 plastic d ual in-line package; 16 leads (300 mil); long body SOT38-1

1997 Jun 12 2

NXP Semiconductors Product specification

MGK402

MGK401

2 W BTL audio amplifier TDA8543

BLOCK DIAGRAM

handbook, halfpage

−

6

IN−
IN+

V

CC

−

5

+

12

TDA8543

R

11

OUT−

R

20 kΩ

4

SVR

20 kΩ

MODE

3

STANDBY/MUTE LOGIC

Fig.1 Block diagram.

PINNING

SYMBOL PIN DESCRIPTION

n.c. 1 not connected
n.c. 2 not connected
MODE 3 operating mode select (standby,

mute, operating)

SVR 4 half supply voltage, decoupling

ripple rejection
IN+ 5 positive input
IN− 6 negative input
n.c. 7 not connected
n.c. 8 not connected
n.c. 9 not connected
n.c. 10 not connected
OUT− 11 negative loudspeaker terminal
V

CC

12 supply voltage
GND 13 ground
OUT+ 14 positive loudspeaker terminal
n.c. 15 not connected
n.c. 16 not connected

−

−

+

handbook, halfpage

14

OUT+

13
GND

n.c.

1

n.c.

2
3

MODE

4

SVR

IN+
IN−
n.c.
n.c.

5
6
7
8

TDA8543

Fig.2 Pin configuration.

16

n.c.

15

n.c

14

OUT+

13

GND

12

V

CC

11

OUT−

10

n.c.

9

n.c

1997 Jun 12 3

NXP Semiconductors Product specification

2 W BTL audio amplifier TDA8543

FUNCTIONAL DESCRIPTION

The TDA8543(T) is a BTL audio power amplifier capable
of delivering an output power between 1 and 2 W,
depending on supply voltage, load resistance
and package. Using the MODE pin the device can
be switched to standby and mute condition. The device
is protected by an internal thermal shutdown protection
mechanism.
The gain can be set within a range from 6 dB to 30 dB
by external feedback resistors.

The voltage loss on the positive supply line is
the saturation voltage of a PNP power transistor,
on the negative side the saturation voltage of an
NPN power transistor.

Mode select pin

The device is in standby mode (with a very low current
consumption) if the voltage at the MODE
pin is >(V

− 0.5 V), or if this pin is floating. At a MODE

CC

voltage level of less than 0.5 V the amplifier is fully
operational.

Power amplifier

The power amplifier is a Bridge Tied Load (BTL) amplifier
with a complementary PNP-NPN output stage.

In the range between 1.5 V and V
is in mute condition. The mute condition is useful to
suppress plop noise at the output, caused by charging of
the input capacitor.

− 1.5 V the amplifier

CC

LIMITING VALUES

In accordance with the Absolu te Maximum Rating System (IEC 134).

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

V
V
I

ORM

T
T
V
P

CC
I

stg
amb
psc
tot

supply voltage operating −0.3 +18 V
input voltage −0.3 VCC+0.3 V
repetitive peak output current − 1A
storage temperature non-operating −55 +150 °C
operating ambient temperature −40 +85 °C
AC and DC short-circuit safe voltage − 10 V
total power dissipation SO16 − 1.2 W

DIP16 − 2.2 W

QUALITY SPECIFICATION

In accordance with “SNW-FQ-611-E”. The number of the quality specification can be found in the “Quality Reference
Handbook”. The handbook can be ordered using the code 9397 750 00192.

THERMAL CHARACTERISTICS

SYMBOL PARAMETER CONDITIONS VALUE UNIT

R

th j-a

thermal resistance from junction to ambient in free air

TDA8543T (SO16) 100 K/W
TDA8543 (DIP16) 55 K/W

1997 Jun 12 4

NXP Semiconductors Product specification

MGK410

2 W BTL audio amplifier TDA8543

2.5

handbook, halfpage

P

(W)

2.0

1.5

(1)

1

0.5

0

0 40 80 160

(2)

120

T

(°C)

amb

(1) DIP16.
(2) SO16.

Table 1

(V) RL (Ω)P

V

CC

5 8 1.2 0.7 80 112

7.582.21.6− 62

7.5161.40.960100

9162.01.3− 78

9251.30.960100

Note

1. At THD = 10%; BTL.

Fig.3 Power derating curve.

CONTINUOUS SINE WAVE DRIVEN

(1)

(W)

o

P

(W)

max

T

amb(max)

(°C)

SO16 DIP16

1997 Jun 12 5

NXP Semiconductors Product specification

2 W BTL audio amplifier TDA8543

DC CHARACTERISTICS

=5V; T

V

CC

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

V

CC

I

q

I

stb

V

O

⎪V
I
V

I

OUT+

, I

IN+

MODE

MODE

− V

IN−

Notes

1. With a load connected at the outputs the quiescent current will increase, the maximum of this increase being equal
to the DC output offset voltage divided by R

2. The DC output voltage with respect to ground is approximately 0.5 × V

=25°C; RL=8Ω; V

amb

= 0 V; G = 20 dB; measured in test circuit Fig.4; unless otherwise specified.

MODE

supply voltage operating 2.2 5 18 V
quiescent current RL= ∞; note 1 − 812mA
standby current V

MODE=VCC

−−10 μA

DC output voltage note 2 − 2.2 − V

⎪ differential output voltage offset −−50 mV

OUT−

input bias current −−500 nA
input voltage mode select operating 0 − 0.5 V

mute 1.5 − V
standby V

input current mode select 0 < V

.

L

MODE<VCC

− 0.5 − V

CC

−−20 μA

.

CC

CC
CC

− 1.5 V
V

AC CHARACTERISTICS

V

CC

=5V; T

=25°C; RL=8Ω; f = 1 kHz; V

amb

= 0 V; G = 20 dB; measured in test circuit Fig.4; unless otherwise

MODE

specified.

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

P

o

output power THD = 10 %;

=5V; RL=8Ω 11.2− W

V

CC

= 7.5 V; RL=8Ω− 2.2 − W

V

CC

=9V; RL=16Ω− 2.0 − W

V

CC

THD = 0.5%;

=5V; RL=8Ω 0.6 0.9 − W

V

CC

= 7.5 V; RL=8Ω− 1.7 − W

V

CC

=9V; RL=16Ω− 1.4 − W

V

CC

THD total harmonic distortion P
G

v

Z

i

V

no

closed loop voltage gain note 1 6 − 30 dB
differential input impedance − 100 − kΩ
noise output voltage note 2 −−100 μV

=0.5W − 0.15 0.3 %

o

SVRR supply voltage ripple rejection note 3 50 −−dB

note 4 40 −−dB

V

o

output voltage in mute condition note 5 −−200 μV

1997 Jun 12 6

NXP Semiconductors Product specification

2 W BTL audio amplifier TDA8543

Notes to the AC characteristics

R2

1. Gain of the amplifier is in test circuit of Fig.4.

2. The noise output voltage is measured at the output in a frequency range from 20 Hz to 20 kHz (unweighted), with
a source impedance of R

3. Supply voltage ripple rejection is measured at the output, with a sourc e impedance of R
The ripple voltage is a sine wave with a frequency of 1 kHz and an am plitude of 100 mV (R MS), which is applied
to the positive supply rail.

4. Supply voltage ripple rejection is measured at the output, with a sourc e impedance of R
The ripple voltage is a sine wave with a frequen cy between 100 Hz and 20 kHz and an amplitude of 100 mV (RMS),
which is applied to the positive supply rail.

5. Output voltage in mute position is measured with an input voltage of 1 V (RMS) in a bandwidth of 20 kHz, so including
noise.

------- -

2

×

R1

=0Ω at the input.

S

=0Ω at the input.

S

=0Ω at the input.

S

TEST AND APPLICATION INFORMATION
Test conditions

Because the application can be either Bridge Tied Load
(BTL) or Single-Ended (SE), the curves o f each application
are shown separately.

The thermal resistance = 55 K/W for the DIP16 envelope;
the maximum sine wave power dissipation
for T

150 25–

----------------------

For T

150 60–

----------------------

=25°C is:

amb

55

55

2.27 W=

=60°C the maximum total power dissipation is:

amb

1.63 W=

See the power derating curve illustrated in Fig.3.

BTL application

=25°C if not specially mentioned, VCC=5V,

T

amb

f=1kHz, R

=8Ω, Gv= 20 dB, audio band-pass

L

22 Hz to 22 kHz.
The BTL application diagram is shown in Fig.4.

SE application

=25°C if not specially mentioned, VCC=7.5V,

T

amb

f=1kHz, R

=4Ω, Gv= 20 dB, audio band-pass

L

22 Hz to 22 kHz.
The SE application diagram is shown in Fig.14.
The capacitor value of C3 in combination with the load

impedance determines the low frequen cy behaviour.
The total harmonic distortion as a function of frequency
was measured with low-pass filter of 80 kHz. The value
of capacitor C2 influences the behaviour of the SVRR
at low frequencies, increasing the value of C2 increases
the performance of the SVRR.

General remark

The frequency characteristic can be adapted
by connecting a small capacitor across th e feedback
resistor. To improve the immunity of HF radiation in radio
circuit applications, a small capacitor can be connected
in parallel with the feedback resistor; this creates a
low-pass filter.

The quiescent current has been measured without
any load impedance. The total harmonic distortion
as a function of frequency was measu red w ith a low- pass
filter of 80 k Hz . The v alue of capacitor C2 influences
the behaviour of the SVRR at low frequencies, increasing
the value of C2 increases the performance of the SVRR.
The figure of the mode select voltage (V

) as a function

ms

of the supply voltage shows three areas; operat in g, mute
and standby. It shows, that the DC-switching levels
of the mute and standby respectively depends
on the supply voltage level.

1997 Jun 12 7

NXP Semiconductors Product specification

2 W BTL audio amplifier TDA8543

BTL APPLICATION

handbook, full pagewidth

R2

------- -

15

I

q

(mA)

10

×=

R1

Gain 2

handbook, halfpage

C1

1 μF

V

V

R2

56 k

C2

47 μF

Ω

−

IN

6

+

IN

5

SVR

4

MODE

3

R1

11 k

Ω

in

12

TDA8543

13

GND

OUT

11

OUT

14

100 nF 100 μF

−

+

MGK403

R

L

CC

Fig.4 BTL application.

MGD876

10

handbook, halfpage

THD

(%)

1

(1)

MGK404

(3)

(2)

−1

10

−2

10

−2

10

f=1kHz, Gv=20dB.

=5V, RL=8Ω.

(1) V

CC

(2) V

=7.5V, RL=8Ω.

CC

(3) VCC=9V, RL=16Ω.

10

Fig.6 THD as a function of Po.

−1

1

Po (W)

10

RL= ∞.

5

0

0

420

81216

Fig.5 Iq as a function of VCC.

VCC (V)

1997 Jun 12 8

NXP Semiconductors Product specification

2 W BTL audio amplifier TDA8543

10

handbook, halfpage

THD

(%)

1

−

10

−

10

(2)

1

2

10 10

Po=0.5W, Gv=20dB.
(1) VCC=5V, RL=8Ω.
(2) VCC=7.5V, RL=8Ω.
(3) VCC=9V, RL=16Ω.

Fig.7 THD as a function of frequency.

MGK409

(1)

(3)

2

3

10

4

10

f (Hz)

5

10

−

20

handbook, halfpage

SVRR

(dB)

−

40

−

60

−

80

10 10

(1)

(2)
(3)

2

3

10

MGD879

4

10

f (Hz)

5

10

VCC=5V, 8Ω, Rs=0Ω, Vr=100mV.
(1) Gv=30dB.
(2) Gv=20dB.
(3) Gv=6dB.

Fig.8 SVRR as a function of frequency.

2.5

handbook, halfpage

P

o

(W)

2

1.5

1

0.5

0

0

THD = 10%.
(1) RL=8Ω.
(2) RL=16Ω.
(3) RL=25Ω.

(1)

48

(2)

VCC (V)

Fig.9 Po as a function of VCC.

MGK405

(3)

handbook, halfpage

2

MGK406

P

(W)

1.5

(1)

(2)

(3)

1

0.5

0

12

0

4

812

VCC (V)

(1) RL=8Ω.
(2) RL=16Ω.
(3) RL=25Ω.

Fig.10 Worst case power dissipation as a function

.

of V

CC

1997 Jun 12 9

NXP Semiconductors Product specification

P

2 W BTL audio amplifier TDA8543

handbook, halfpage

2

P

(W)

1.6

1.2

0.8

0.4

0

0 0.5 2.5

Sine wave of 1 kHz.
(1) VCC=9V, RL=16Ω.
(2) VCC=5V, RL=8Ω.
(3) VCC=7.5V, RL=8Ω.

Fig.11 P as a function of Po.

(3)

(1)

(2)

1 1.5 2

MGK407

Po (W)

10

handbook, halfpage

V

o

(V)

1

−1

10

−2

10

−3

10

−4

10

−5

10

−6

10

−1

10

Band-pass = 22 Hz to 22kHz.
(1) VCC=3V.
(2) VCC=5V.
(3) VCC=12V.

Fig.12 Vo as a function of Vms.

(1) (2) (3)

1

MGD883

10 10

Vms (V)

2

16

handbook, halfpage

V

ms

(V)

12

standby

MGL070

8

mute

4

0

048

12

operating

V

(V)

16

Fig.13 Vms as a function of VP.

1997 Jun 12 10

NXP Semiconductors Product specification

2 W BTL audio amplifier TDA8543

SE APPLICATION

handbook, full pagewidth

R2

Gain

=

------- ­R1

10

handbook, halfpage

THD

(%)

C1

1 μF

V

V

R2

R1

11 kΩ

in

C2

47 μF

IN
IN

SVR

MODE

−

6

+

5
4

3

110 kΩ

12

TDA8543

13

OUT

11

OUT

14

GND

100 nF 100 μF

C3

−

470 μF

+

MGK408

CC

R

L

Fig.14 SE application.

MGD884

10

handbook, halfpage

THD

(%)

MGD885

1

−1

10

−2

10

−2

10

10

f=1kHz, Gv=20dB.
(1) VCC=7.5V, RL=4Ω.
(2) VCC=9V, RL=8Ω.

=12V, RL=16Ω.

(3) V

CC

Fig.15 THD as a function of Po.

(1)

(2)

(3)

−1

1

Po (W)

10

1

(1)

−1

10

−2

10

10 10

(2)
(3)

2

3

10

Po=0.5W, Gv=20dB.
(1) VCC=7.5V, RL=4Ω.
(2) VCC=9V, RL=8Ω.

=12V, RL=16Ω.

(3) V

CC

Fig.16 THD as a function of frequency.

4

10

f (Hz)

5

10

1997 Jun 12 11

NXP Semiconductors Product specification

2 W BTL audio amplifier TDA8543

−

20

handbook, halfpage

SVRR

(dB)

−

40

(1)

−

60

−

80

10 10

2

(2)

(3)

3

10

VCC=7.5V, RL=4Ω, Rs=0Ω, Vi= 100mV.
(1) Gv=24dB.
(2) Gv=20dB.
(3) Gv=0dB.

Fig.17 SVRR as a function of frequency.

MGD886

2

handbook, halfpage

P

o

(W)

MGD887

1.6

(1) (2)

(3)

1.2

0.8

0.4

4

10

f (Hz)

5

10

0

04

8

12

VCC (V)

16

(1) THD = 10%, RL=4Ω.
(2) THD = 10%, RL=8Ω.
(3) THD = 10%, RL=16Ω.

Fig.18 Po as a function of VCC.

1.6

handbook, halfpage

MGD888

P

(W)

1.2

(1)

(2) (3)

0.8

0.4

0

04

816

12

VCC (V)

(1) RL=4Ω.

=8Ω.

(2) R

L

(3) R

=16Ω.

L

Fig.19 Worst case power dissipation as a function

of V

.

CC

1.2

handbook, halfpage

P

(W)

0.8

0.4

0

0

(1) VCC=7.5V, RL=4Ω.
(2) VCC=12V, RL=16Ω.
(3) VCC=9V, RL=8Ω.

Fig.20 P as a function of Po.

MGD889

(1)
(2)

(3)

0.4 0.8 1.6

1.2
Po (W)

1997 Jun 12 12

NXP Semiconductors Product specification

2 W BTL audio amplifier TDA8543

handbook, full pagewidth

a. Top view.

MS

IN

1 μF

11 kΩ

47 μF

10 kΩ
10 kΩ

1

TDA8543

8

100 μF

16

9

56 kΩ

100 nF

OUT

OUT

+

V

+

−

P

MGK411

b. Component side.

Fig.21 Printed-circuit board layout (BTL and SE).

1997 Jun 12 13

NXP Semiconductors Product specification

D

-1

2 W BTL audio amplifier TDA8543

PACKAGE OUTLINES

IP16: plastic dual in-line package; 16 leads (300 mil); long body

D

M

E

A

2

seating plane

L

Z

16

pin 1 index

A

e

b

w M

b

1

9

A

1

c

(e )

1

M

H

E

SOT38

1

0 5 10 mm

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

A

UNIT

mm

inches

Note

1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.

A

max.

4.7 0.51 3.7

OUTLINE
VERSION

SOT38-1

min.

A

1 2

max.

0.15

IEC JEDEC JEITA

050G09 MO-001 SC-503-16

b

1.40

1.14

0.055

0.045

b

1

0.53

0.38

0.021

0.015

REFERENCES

cEe M

D

0.32

21.8

0.23

21.4

0.013

0.009

0.86

0.84

8

scale

(1) (1)

6.48

6.20

0.26

0.24

e

0.3

1

3.9

3.4

0.15

0.13

E

8.25

7.80

0.32

0.31

EUROPEAN

PROJECTION

9.5

8.3

0.37

0.33

M

L

H

ISSUE DATE

w

0.2542.54 7.62

0.010.10.020.19

99-12-27
03-02-13

max.

2.2

0.087

(1)

Z

1997 Jun 12 14

NXP Semiconductors Product specification

S

-1

2 W BTL audio amplifier TDA8543

O16: plastic small outline package; 16 leads; body width 3.9 mm

D

c

y

Z

16

pin 1 index

1

e

9

A

2

A

1

8

w M

b

p

E

H

E

detail X

A

Q

(A )

3

θ

L

p

L

SOT109

X

v M

A

A

0 2.5 5 mm

scale

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

mm

OUTLINE
VERSION

SOT109-1

A

max.

1.75

0.069

A1A2A

0.25

1.45

0.10

1.25

0.010

0.057

0.004

0.049

IEC JEDEC JEITA

076E07 MS-012

0.25

0.01

b

3

p

0.49

0.25

0.36

0.19

0.0100

0.019

0.0075

0.014

UNIT

inches

Note

1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.

(1)E(1) (1)

cD

10.0

9.8

0.39

0.38

REFERENCES

eHELLpQZywv θ

4.0

3.8

0.16

0.15

1.27

0.05

6.2

5.8

0.244

0.228

1.05

0.041

1.0

0.4

0.039

0.016

0.7

0.25

0.6

0.028

0.01 0.004

0.020

EUROPEAN

PROJECTION

0.25 0.1

0.01

0.7

0.3

0.028

0.012

ISSUE DATE

99-12-27
03-02-19

o

8

o

0

1997 Jun 12 15

NXP Semiconductors Product specification

2 W BTL audio amplifier TDA8543

SOLDERING
Introduction

There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.

This text gives a very brief insight to a complex te chnology.
A more in-depth account of soldering ICs can be found in
our “IC Package Databook” (order code 9398 652 90011).

DIP

OLDERING BY DIPPING OR BY WAVE

S
The maximum permissible temperature of the solder is

260 °C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.

The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (T

stg max

). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.

EPAIRING SOLDERED JOINTS

R
Apply a low voltage soldering iron (less than 24 V) to the

lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300 °C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400 °C, contact may be up to 5 seconds.

SO

EFLOW SOLDERING

R
Reflow soldering techniques are suitable for all SO

packages.

Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215to250°C.

Preheating is necessary to dry the paste an d evaporate
the binding agent. Preheating duration: 45 minutes at
45 °C.

AVE SOLDERING

W
Wave soldering techniques can be used for all SO

packages if the following conditions are observed:

• A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.

• The longitudinal axis of the package footprint must be
parallel to the solder flow.

• The package footprint must incorporat e solder thieves at
the downstream end.

During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.

Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
6 sec onds. Typical dwell time is 4 seconds at 250 °C.

A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.

EPAIRING SOLDERED JOINTS

R
Fix the component by first soldering two diagonally-

opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320 °C.

Reflow soldering requires solder paste (a su spension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.

1997 Jun 12 16

NXP Semiconductors Product specification

2 W BTL audio amplifier TDA8543

DATA SHEET STATUS

DOCUMENT

STATUS

Objective data sheet Development This document contains data from the objective specification for product

Preliminary data sheet Qualification This document contains data from the preliminary specification.
Product data sheet Production This document contains the product specification.

Notes

1. Please consult the most recently issued document before initiating or comple ting a design.

2. The product status of device(s) desc ribed in this document may have changed since this document was published
and may differ in case of multiple devices. The latest product status information is available on the Internet at
URL http://www.nxp.com.

DISCLAIMERS
Limited warranty and liability ⎯ Information in this

document is believed to be accurate and reliable.
However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to
the accuracy or completeness of such information and
shall have no liability for the consequences of use of such
information.

In no event shall NXP Semiconductors be liable for any
indirect, incidental, punitive, special or consequential
damages (including - without limitation - lost profits, lost
savings, business interruption, costs related to the
removal or replacement of any products or rework
charges) whether or not such damages are based on tort
(including negligence), warranty, breach of contract or any
other legal theory.

Notwithstanding any damages that customer might incur
for any reason whatsoever, NXP Semiconductors’
aggregate and cumulative liability towards custo m er for
the products described herein shall be limited in
accordance with the Terms and conditions of commercial
sale of NXP Semiconductors.

Right to make changes ⎯ NXP Semiconductors
reserves the right to make changes to information
published in this document, including without limitation
specifications and product descriptions, at any time and
without notice. This document supersedes and replaces all
information supplied prior to the publication hereof.

Suitability for use ⎯ NXP Semiconductors products are
not designed, authorized or warranted to be su itable for
use in life support, life-critical or safety-critical systems or
equipment, nor in applications where failure or malfunction
of an NXP Semiconductors product can reasonably be
expected to result in personal injury, death or severe

(1)

PRODUCT
STATUS

(2)

DEFINITION

development.

property or environmental damage. NXP Semiconductors
accepts no liability for inclusion and/or use of NXP
Semiconductors products in such equipment or
applications and therefore such inc l usion and/or use is at
the customer’s own risk.

Applications ⎯ Applications that ar e described herein for
any of these products are for illustrative purposes only.
NXP Semiconductors makes no representation or
warranty that such applications will be suitable for the
specified use without further testing or modification.

Customers are responsible for the design and operation of
their applications and products using NXP
Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or
customer product design. It is customer’s sole
responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the
customer’s applications and products planned, as well as
for the planned application and use of customer’s third
party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the ris ks
associated with their applications and products.

NXP Semiconductors does not acce pt a ny lia bil ity related
to any default, damage, costs or problem which is based
on any weakness or default in the cu stomer’s applicat ions
or products, or the application or use by customer’s third
party customer(s). Customer is responsible for doin g all
necessary testing for the customer’s applications and
products using NXP Semiconductors products in order to
avoid a default of the applications and the products or of
the application or use by customer’s third party
customer(s). NXP does not accept any liability in this
respect.

1997 Jun 12 17

NXP Semiconductors Product specification

2 W BTL audio amplifier TDA8543

Limiting values ⎯ Stress above one or more limiting
values (as defined in the Absolute Maximum Ratings
System of IEC 60134) will cause permanent damage to
the device. Limiting values are stress ratings only an d
(proper) operation of the device at these or any other
conditions above those given in the Recommended
operating conditions section (if present) or the
Characteristics sections of this document is not warranted.
Constant or repeated exposure to limiting values will
permanently and irreversibly affect the quality and
reliability of the device.

Terms and conditions of commercial sale ⎯ NXP
Semiconductors products are sold subject to the general
terms and conditions of commercial sale, as published at
http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In cas e an
individual agreement is concluded only the terms and
conditions of the respective agreement shall apply. NXP
Semiconductors hereby expressly objects to applying the
customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.

No offer to sell or license ⎯ Nothing in this document
may be interpreted or construed as an offer to sell products
that is open for acceptance or the grant, conveyance or
implication of any license under any copyrights, patents or
other industrial or intellectual property rights.

Export control ⎯ This document as well as the item(s)
described herein may be subject to export cont ro l
regulations. Export might require a prior authorization from
national authorities.

Quick reference data ⎯ The Quick reference data is an
extract of the product data given in the Limiting values and
Characteristics sections of this document, and as such is
not complete, exhaustive or legally binding.

Non-automotive qualified products ⎯ Unless this data
sheet expressly states that this specific NXP
Semiconductors product is automotive qualified, the
product is not suitable for automotive use. It is neither
qualified nor tested in accordance with automot ive testing
or application requirements. NXP Semiconductors accepts
no liability for inclusion and/or use of non-automotive
qualified products in automotive equipmen t or
applications.

In the event that customer uses the product for design-in
and use in automotive applications to automotive
specifications and standards, customer (a) shall use the
product without NXP Semiconductors’ warranty of the
product for such automotive applications, us e and
specifications, and (b) whenever customer uses the
product for automotive applications beyond NXP
Semiconductors’ specifications such use shall be solely at
customer’s own risk, and (c) customer fully indem nif i es
NXP Semiconductors for any liability, damages or failed
product claims resulting from cus to mer d esi gn an d us e of
the product for automotive applications beyond NXP
Semiconductors’ standard warranty and NXP
Semiconductors’ product specifications.

1997 Jun 12 18

NXP Semiconductors

provides High Performance Mixed Signal and Standard Product
solutions that leverage its leading RF, Analog, Power Management,
Interface, Security and Digital Processing expertise

Customer notification

This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal
definitions and disclaimers. No changes were made to the technical content, except for package outline
drawings which were updated to the latest version.

Contact information

For additional information please visit: http://www.nxp.com
For sales offices addresses send e-mail to: [e-mail]

© NXP B.V. 2010
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information presented in this documen t d oes not form part of any quotation or contract, is believe d t o b e a ccur ate a nd re li a ble and may be chan ged
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industri al or intellectual property righ ts.

Printed in The Netherlands 547027/50/01/pp19 Date of release: 1997 Jun 12 Document order number: 9397750 02232