Philips TDA8001 User Manual

INTEGRATED CIRCUITS

DATA SH EET

TDA8001

Smart card interface

Product specification
Supersedes data of 1995 Feb 01
File under Integrated Circuits, IC02

1996 Dec 12

Philips Semiconductors Product specification

Smart card interface TDA8001

FEATURES

• Protected I/O line

• VCC regulation (5 V ±5%, 100 mA max. with controlled

rise and fall times)

• VPP generation (12.5, 15 or 21 V ±2.5%, 50 mA max.,
with controlled rise and fall times) (only at TDA8001 and
TDA8001T)

• Clock generation (up to 10 MHz), with synchronous
frequency doubling

• Overload, thermal and card extraction protections

• Current limitation in case of short-circuit

• Idle mode and special circuitry for spikes killing during

powering on and off

• Two voltage supervisors (digital and analog supplies)

• Automatic activation and deactivation sequences

through an independent internal clock

• Enhanced ESD protections on card side (4 kV min.)

• Easy chaining for multiple card readers

• ISO 7816 compatibility.

ORDERING INFORMATION

APPLICATIONS

• Pay TV (multistandards conditional access system,
videoguard, newscript)

• Multi-application smart card readers (banking, vending
machine, electronic payment identification).

GENERAL DESCRIPTION

The TDA8001 is a complete, low-cost analog interface
which can be positioned between an asynchronous smart
card (ISO 7816) and a microcontroller. It is directly
compatible with the new Datacom chip verifier.

The complete supply, protection and control functions are
realized with only a few external components, making this
product very attractive for consumer applications
(see Chapter “Application information”).

TYPE

NUMBER

TDA8001;
TDA8001A

TDA8001T;
TDA8001AT

PACKAGE

NAME DESCRIPTION VERSION

DIP28 plastic dual in-line package; 28 leads (600 mil) SOT117-1

SO28 plastic small outline package; 28 leads; body width 7.5 mm SOT136-1

1996 Dec 12 2

Philips Semiconductors Product specification

Smart card interface TDA8001

QUICK REFERENCE DATA

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

V

DD

I

DD

V

th2

V

th4

V

CC

I

CC

V

H

V

PP

I

PP

SR slew rate on V

t

de

f

clk

P

tot

T

amb

supply voltage 6.7 − 18 V
supply current idle mode; VDD=12V − 32 − mA

active modes; unloaded − 45 − mA
threshold voltage on V
threshold voltage on V

SUP
DD

card supply voltage including static and dynamic

4.5 − 4.72 V
6 − 6.5 V

4.75 5.0 5.25 V

loads on 100 nF capacitor
card supply current operating −−−100 mA

detection −−150 − mA

limitation −−−200 mA
high voltage supply for

V

PP

card programming
voltage (only at TDA8001

including static and dynamic

loads on 100 nF capacitor

−−30 V

P − 2.5% − P + 2.5% V

and TDA8001T)
(P = 5, 12.5, 15 and 21 V)

programming current
(read or write mode)

operating −−−50 mA

detection −−75 − mA

limitation −−−100 mA

CC

and V

maximum load capacitor 150 nF − 0.38 − V/µs

PP

(rise and fall)
deactivation cycle duration 75 100 125 µs
clock frequency 0 − 8 MHz
continuous total power

dissipation

TDA8001; T

see Fig.10

TDA8001T; T

amb

amb

= +70 °C;

= +70 °C;

−−0.92 W

−−2W

see Fig.11
operating ambient

0 − +70 °C

temperature

1996 Dec 12 3

Philips Semiconductors Product specification

Smart card interface TDA8001

BLOCK DIAGRAM

handbook, full pagewidth

ALARM
ALARM

I/O(µC)

RSTIN

OFF

DETECT

CMDVCC

CMD7
GND2

CMD3.5

CLKOUT2

VPP12.5

VPP15
VPP21

17
18

28

26

19
2

20
27

25
23

24

6
7
21

AND

ENABLE

V

DD

MAIN

SUPPLY

V

SUP

SUPERVISOR

DELAY

15 16 13 12

VOLTAGE

PROTECTIONS

TDA8001

LOGIC

INTERNAL

CLOCK

CLOCK

CIRCUITRY

PROTECTIONS

GENERATOR

CLOCK

ENABLE

GENERATOR

V

V

GND1

CC

PP

22

CVNC

3

I/O

4

RST

9

PRES

8

PRES

14

V

CC

5

CLK

10

V

PP

OSCILLATOR

111

XTAL

Fig.1 Block diagram.

1996 Dec 12 4

MBH813

V

H

Philips Semiconductors Product specification

Smart card interface TDA8001

PINNING

PIN

SYMBOL

TDA8001

TDA8001T

TDA8001A

TDA8001AT

XTAL 1 1 crystal connection
DETECT 2 2 card extraction open collector output (active LOW)
I/O 3 3 data line to/from the card
RST 4 4 card reset output
CLK 5 5 clock output to the card
VPP12.5 6 − control input for applying the 12.5 V programming voltage (active LOW)
n.c. − 6 not connected
VPP15 7 − control input for applying the 15 V programming voltage (active LOW)
n.c. − 7 not connected
PRES 8 8 card presence contact input (active LOW)
PRES 9 9 card presence contact input (active HIGH)
V

PP

10 − card programming voltage output
n.c. − 10 not connected
V

H

11 11 HIGH voltage supply for VPP generation
GND1 12 12 ground 1
V
V
V

DD
CC
SUP

13 13 positive supply voltage

14 14 card supply output voltage

15 15 voltage supervisor input
DELAY 16 16 external capacitor connection for delayed reset timing
ALARM 17 17 open-collector reset output for the microcontroller (active HIGH)
ALARM 18 18 open-collector reset output for the microcontroller (active LOW)
OFF 19 19 open-collector interrupt output to the microcontroller (active LOW)
CMDVCC 20 20 control input for applying supply voltage to the card (active LOW)
VPP21 21 − control input for applying the 21 V programming voltage (active LOW)
n.c. − 21 not connected
CVNC 22 22 internally generated 5 V reference, present when V

decoupled externally (100 nF)

CMD3.5

23 23 control input for having the crystal frequency divided-by-4 at pin CLK
or CDMTC

CLKOUT2 24 24 clock output to the microcontroller, or any other R4590

(crystal frequency divided by two)
GND2 25 25 ground 2
RSTIN 26 26 card reset input from the microcontroller (active HIGH)
CMD7

27 27 control input for having the crystal frequency divided by 2 at pin CLK

or CDMS
I/O(µC) 28 28 data line to/from the microcontroller

DESCRIPTION

is on; to be

DD

1996 Dec 12 5

Philips Semiconductors Product specification

Smart card interface TDA8001

handbook, halfpage

XTAL

DETECT

I/O
RST
CLK

VPP12.5

VPP15

PRES
PRES

V

PP

V

GND1

V

DD

V

CC

H

1
2
3
4
5
6
7

TDA8001T

8

9
10
11
12
13
14

TDA8001

MBH811

28

I/O(µC)

27

CMD7 or CDMS
RSTIN

26
25

GND2

24

CLKOUT2

23

CMD3.5 or CDMTC

22

CVNC

21

VPP21

20

CMDVCC

19

OFF

18

ALARM
ALARM

17
16

DELAY
V

15

SUP

handbook, halfpage

DETECT

XTAL

I/O
RST
CLK

n.c.

n.c.
PRES
PRES

n.c.

V

GND1

V

DD

V

CC

1
2
3
4
5
6
7
8

9
10
11

H

12
13
14

TDA8001A

TDA8001AT

MBH812

28

I/O(µC)

27

CMD7 or CDMS
RSTIN

26
25

GND2

24

CLKOUT2

23

CMD3.5 or CDMTC

22

CVNC

21

n.c.

20

CMDVCC

19

OFF

18

ALARM
ALARM

17
16

DELAY
V

15

SUP

Fig.2 Pin configuration.

1996 Dec 12 6

Fig.3 Pin configuration.

Philips Semiconductors Product specification

Smart card interface TDA8001

FUNCTIONAL DESCRIPTION
Power supply

The circuit operates within a supply voltage range of

6.7 to 18 V. V

and GND are the supply pins. All card

DD

contacts remain inactive during power up or down.

OWER UP

P
The logic part is powered first and is in the reset condition

until VDD reaches V
reaches V

OWER DOWN

P

th4+Vhys4

When VDD falls below V

. The sequencer is blocked until V

th1

.

, an automatic deactivation of

th4

DD

the contacts is performed.

Voltage supervisor

This block surveys the 5 V supply of the microcontroller

) in order to deliver a defined reset pulse and to avoid

(V

SUP

any transients on card contacts during power up or down
of V

. The voltage supervisor remains active even if V

SUP

DD

is powered-down.

OWER ON

P
As long as V

connected to pin DELAY, will be discharged. When V
rises to the threshold level, C

is below V

SUP

th2+Vhys2

DEL

the capacitor C

will be recharged.

DEL

SUP

ALARM and ALARM remain active, and the sequencer is
blocked until the voltage on the DELAY line reaches V

OWER DOWN (see Fig.4)

P
If V

falls below V

SUP

th2

, C

will be discharged, ALARM

DEL

th3

andALARM become active, and an automatic deactivation
of the contacts is performed.

Clock circuitry (see Fig.5)
The clock signal (CLK) can be applied to the card in two

different methods:

1. Generation by a crystal oscillator: the crystal, or the
ceramic resonator (4 to 16 MHz) is connected to the
XTAL pin.

2. Use of a signal frequency (up to 20 MHz), already
present in the system and connected to the XTAL pin
via a 10 nF capacitor (see Fig.14). In both cases the
frequency is first divided-by-two.

CMD7 (respectively CMD3.5) is LOW, the clock signal

If
(its frequency again divided by two) is enabled and
buffered before being fed to the CLK pin.

CMD3.5 and internal ENRST are sampled in order to give
the first clock pulse the correct width, and to avoid false
pulses during frequency change.

The CLKOUT2 pins may be used to clock a
microcontroller or an other TDA8001. The signal1⁄2f
available when the circuit is powered up.

State diagram

Once activated, the circuit has six possible modes of
operation:

• Idle

• Activation

• Read

• Write

• Deactivation

• Fault.

Figure 6 shows the way these modes are accessible.

DLE MODE

I
After reset, the circuit enters the IDLE state. A minimum

number of circuits are active while waiting for the
microcontroller to start a session.

• All card contacts are inactive

,

• I/O(µC) is high impedance

• Voltage generators are stopped

• Oscillator or XTAL input is running, delivering CLKOUT2

.

• Voltage supervisors are active.
The DETECT line is HIGH if a card is present (PRES and

PRES active) and LOW if a card is not present. The OFF
line is HIGH if no hardware problem is detected.

CTIVATION SEQUENCE

A
From the IDLE mode, the circuit enters the ACTIVATION

mode when the microcontroller sets the CMDVCC line
(active LOW). The I/O(µC) signal must not be LOW.
The internal circuitry is activated, the internal clock starts
and the sequence according to ISO7816 is performed:

• VCC rises from 0 to 5 V

• VPP rises from 0 to 5 V and I/O is enabled

• CLK and RST are enabled.

The time interval between steps 1 and 2 is 16 µs, and
64 µs between steps 2 and 3 (see Fig.7).

xtal

is

1996 Dec 12 7

Philips Semiconductors Product specification

Smart card interface TDA8001

READ MODE
When the activation sequence is completed and, after the

card has replied its Answer-to-Reset, the TDA8001 will be
in the READ mode. Data is exchanged between the card
and the microcontroller via the I/O line.

W

RITE MODE

Cards with EPROM memory need a programming voltage
(VPP). When it is required to write to the internal memory
of the card, the microcontroller sets one of the VPP12.5,
VPP15 and VPP21 lines LOW, according to the
programming value given in the Answer-to-Reset.
VPP rises from 5 V to the selected value with a typical slew
rate of 0.38 V/µs. In order to respect the ISO 7816 slopes,
the circuit generates VPP by charging and discharging an
internal capacitor. The voltage on this capacitor is then
amplified by a power stage gain of 5, powered via an
external supply pin VH (30 V max).

EACTIVATION SEQUENCE (see Fig.8)

D
When the session is completed, the microcontroller sets

the CMDVCC line to its HIGH state. The circuit then
executes an automatic deactivation sequence by counting
the sequencer back:

• RST falls to LOW and CLK is stopped

• I/O(µC) becomes high impedance and VPP falls to 0 V

• VCC falls to 0 V.

The circuit returns to the IDLE mode on the next rising
edge of the clock.

ROTECTIONS

P
Main fault conditions are monitored by the circuit:

• Short-circuit or overcurrent on V

• Short-circuit or overcurrent on V

CC
PP

• Card extraction during transaction

• Overheating problem

• V

drop-out

SUP

• VDD drop-out.
When one of these fault conditions is detected, the circuit

pulls the interrupt line

OFF to its active LOW state and
returns to the FAULT mode. The current on I/O is internally
limited to 5 mA.

AULT MODE (see Fig.9)

F
When a fault condition is written to the microcontroller via

the OFF line, the circuit initiates a deactivation sequence.
After the deactivation sequence has been completed, the
OFF line is reset to its HIGH state after the microcontroller
has reset the CMDVCC line HIGH.

handbook, full pagewidth

V

SUP

V

DELAY

ALARM

Fig.4 Alarm and delay as a function of V

1996 Dec 12 8

V

+ V

th2

hys2

V

th2

V

th3

t

d

MGG818

(C

SUP

fixes the pulse width).

DEL

Philips Semiconductors Product specification

Smart card interface TDA8001

handbook, full pagewidth

CDMS

CDMTC

XTAL

S
S

S
S

QB

QBA

QH

QI
QD

DCKQ

Q

ENCLK

QE

D

CKQQ

QC

QCA

1/2 CLKOUT

QG

D

QF

CK

CMD7 or CDMS = Z Z 1 1 0 0

CMD3.5 or CDMTC = 1 0 1 0 1 0

Q

QAA

Q

QA

CLK = 2 4 0 4 2 4

CLK

QB
QC
QD

ENCLK

QF

CLK

MGG827

Fig.5 Clock circuitry.

1996 Dec 12 9

Philips Semiconductors Product specification

Smart card interface TDA8001

handbook, full pagewidth

handbook, full pagewidth

OFF

PRES

DETECT

CMDVCC

VEILLE

(INTERNAL)

INTERNAL

CLOCK

V

CC

I/O

V

PP

CMD3.5

CLK

ENRST

(INTERNAL)

RSTIN

IDLE

Fig.6 State diagram.

01 32

ACTIVATION

FAULT READWRITEPDOWN

DEACTIVATION

MGG820

RST

t

2

t

act

Fig.7 Activation sequence.

1996 Dec 12 10

MGG828

Philips Semiconductors Product specification

Smart card interface TDA8001

handbook, full pagewidth

CMDVCC

VEILLE

(INTERNAL)

INTERNAL

CLOCK

V

CC

I/O

V

PP

CMD3.5

CLK

ENRST

(INTERNAL)

RSTIN

RST

handbook, full pagewidth

PRES

DETECT

CMDVCC

VEILLE

(INTERNAL)

INTERNAL

CLOCK

V

CC

I/O

3012

t

de

Fig.8 Deactivation sequence.

3012

MGG829

V

PP

CMD3.5

CLK

ENRST

(INTERNAL)

RSTIN

RST

t

de

Fig.9 Deactivation after a card extraction during write mode.

1996 Dec 12 11

MGG830

Philips Semiconductors Product specification

Smart card interface TDA8001

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 134).

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

V

DD

V

x1

V

H

V

PP

V

SUP

V

x2

V

x3

V

x4

P

tot

T

stg

V

es

supply voltage −0.3 18 V
voltage on pins VPP21, VPP15, VPP12.5, PRES,

0VDDV

PRES, CMDVCC, OFF, ALARM, DETECT and RSTIN
voltage on pin V
voltage on pin V
voltage on pin V

H
PP
SUP

voltage on pins ALARM and DELAY 0 V
voltage on pins XTAL, I/O(µC), CLKOUT2, CMD7,

030V
0V

H

V

012V

V

SUP

0 6.0 V

CMD3.5 and CVNC
voltage on pins I/O, RST, CLK and V

CC

continuous total power dissipation TDA8001;

duration < 1 ms 0 7.0 V

− 2W

T

= +70 °C; note 1;

amb

see Fig.10
TDA8001T;

= +70 °C; note 1;

T

amb

− 0.92 W

see Fig.11
storage temperature −55 +150 °C
electrostatic voltage on pins I/O, VCC, VPP, RST, CLK,

−6+6kV

PRES and PRES
electrostatic voltage on other pins −2+2kV

Note

1. P

tot=VDD

+VH×I

× (I

DD(unloaded)

H(unloaded)+VSUP

+ ∑I

× I

)+ICC× (VDD− VCC) + max.{(VH− VPP) × I

signals

+(VDD− CVNC) × I

SUP

PP(read)

, where ‘signals’ means all signal pins, except supply pins.

CVNC

+(VH−VPP) × I

PP(write)

}

1996 Dec 12 12

Philips Semiconductors Product specification

Smart card interface TDA8001

handbook, halfpage

4

P

tot

(W)

3

2

1

0

50 0 50 100 150

Fig.10 Power derating curve (DIP28).

MBE256

o

T ( C)

amb

3

handbook, halfpage

P

tot

(W)

2

1

0

50

Fig.11 Power derating curve (SO28).

0

50 100 150

MBE255

o

T ( C)

amb

HANDLING

Every pin withstands the ESD test according to MIL-STD-883C class 3 for card contacts, class 2 for the remaining.
Method 3015 (HBM 1500 Ω, 100 pF) 3 pulses positive and 3 pulse negative on each pin referenced to ground.

THERMAL CHARACTERISTICS

SYMBOL PARAMETER VALUE UNIT

R

th j-a

thermal resistance from junction to ambient in free air

SOT117-1 30 K/W
SOT136-1 70 K/W

1996 Dec 12 13

Philips Semiconductors Product specification

Smart card interface TDA8001

CHARACTERISTICS

V

=12V; VH= 25 V; V

DD

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Supply

V

DD

I

DD

V

th1

supply voltage 6.7 − 18 V
supply current idle mode; VDD= 8 V 20 30 38 mA

threshold voltage for power-on

reset
V
V

th4
hys4

threshold voltage on VDD(falling) 6.0 − 6.5 V

hysteresis on V

Voltage supervisor

V

SUP

I

SUP

V

th2

V

hys2

V

th3

I

DEL

V

DEL

ALARM,

I

OH

voltage supply for the supervisor − 5.0 − V

input current at V

threshold voltage on V

hysteresis on V

threshold voltage on DELAY 2.35 − 2.65 V

output current at DELAY pin grounded (charge) −5 −−2 µA

voltage on pin DELAY −−3.5 V

ALARM (open-collector outputs)

HIGH level output current on

pin ALARM
V

OL

LOW level output voltage on

pin ALARM
I

OL

LOW level output current on

pin ALARM
V

OH

HIGH level output voltage on

pin ALARM
t

d

t

pulse

Interrupt lines

I

OH

V

OL

Logic inputs (

V

IL

V

IH

I

IL

delay between V

ALARM pulse width C

OFF and DETECT (open-collector)

HIGH level output current VOH= 5V −−25 µA

LOW level output voltage IOL= 1mA −−0.4 V

CMDVCC, VPP21, VPP15, VPP12.5, CMD7, CMD3.5, PRES, PRES and RSTIN); note 1

LOW level input voltage −−0.8 V

HIGH level input voltage 1.5 −− V

LOW level input current VIL= 0V −−−10 µA

SUP

=5V; T

th4

th2

amb

SUP

SUP

and ALARM C

SUP

=25°C; unless otherwise specified.

idle mode; V

= 18V223442mA

DD

active mode; unloaded 35 45 55 mA

− 3.0 4.0 V

50 − 200 mV

− 1.8 2.4 mA

(falling) 4.5 − 4.72 V

10 − 80 mV

= 4 V (discharge) 6 −− mA

V

DEL

VOH= 5V −−25 µA

IOL= 2mA −−0.4 V

VOL= 0V −−−25 µA

IOH=−2mA V

= 47 nF; see Fig.4 −−10 µs

DEL

= 47 nF 15 − 50 ms

DEL

− 1 −− V

SUP

1996 Dec 12 14

Philips Semiconductors Product specification

Smart card interface TDA8001

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

I

IH

Reset output to the card (RST)

V

IDLE

V

OL

V

OH

t

RST

Clock output to the card (CLK)

V

IDLE

V

OL

V

OH

t

r

t

f

δ duty factor C

Card programming voltage (V

V

PP

I

PP

SR slew rate up or down 0.3 0.4 0.5 V/µs

HIGH level input current VIH= 5V −−10 µA

output voltage in IDLE −−0.4 V

LOW level output voltage IOL= 200 µA −−0.45 V

HIGH level output voltage IOH=−200 µA 4.3 − V

I

=−10 µAV

OH

− 0.7 − V

CC

CC
CC

V
V

delay between RSTIN and RST RST enabled; see Fig.7 −−2µs

output voltage in IDLE −−0.4 V

LOW level output voltage IOL= 200 µA −−0.4 V

HIGH level output voltage IOH=−200 µA 2.4 − V

=−20 µA 0.7V

I

OH

=−10 µAV

I

OH

CC

− 0.7 − V

CC

− V

CC
CC
CC

V
V

V
rise time CL= 30 pF; note 2 −−14 ns
fall time CL= 30 pF; note 2 −−14 ns

= 30 pF; note 2 45 − 55 %

L

)

PP

output voltage idle mode −−0.4 V

read mode V
write mode; I

/∆t < 40 mA/100 ns;

∆I

PP

<50mA P−2.5%

PP

− 4% − VCC+ 4% V

CC

(3)

− P + 2.5%

P − 2.5%

(3)

− P + 2.5%

(3)
(3)

V

V

note 4

output current active; from 0 to P

shorted to GND −−−100 mA

V

PP

(3)

−−−50 mA

High voltage input (V

V

H

I

H

input voltage −−30 V
input current at V

)

H

H

idle mode; active mode;
unloaded

P=5V 5 − 9mA
P = 12.5 V 6.5 − 10.5 mA
P=15V 7 − 11 mA
P=21V 8 − 12 mA

V

H−VPP

voltage drop −−2.2 V

1996 Dec 12 15

4 − 6mA

Philips Semiconductors Product specification

Smart card interface TDA8001

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Card supply voltage (VCC)

V

CC

output voltage idle mode; active mode −−0.4 V

< 100 mA 4.75 − 5.25 V

I

CC

∆I

/∆t < 100 mA/100 ns;

PP

4.75 − 5.25 V

note 4

I

CC

output current VCC from 0 to 5 V −−−100 mA

shorted to GND −−−200 mA

V

CC

SR slew rate up or down 0.3 0.4 0.5 V/µs

5 V reference output voltage (CVNC)

V

CVNC

I

CVNC

output voltage at pin CVNC 4.5 5.0 5.5 V
output current at pin CVNC −−−50 mA

Crystal connection (XTAL)

R

xtal(neg)

negative resistance at pin XTAL 2 MHz < fi< 16 MHz;

−−300 Ω

note 5
V
f

xtal

xtal

DC voltage at pin XTAL 3.0 − 4.0 V
resonant frequency 4 − 16 MHz
external frequency 0 − 20 MHz

Clock output (CLKOUT2)

f

CLKOUT2

V

OL

V

OH

, t

t

r

f

δ duty factor C

frequency on CLKOUT2 1 − 8 MHz
LOW level output voltage IOL= 2mA −−0.4 V
HIGH level output voltage IOH=−200 µA 3.0 −− V

=−10 µA 4.0 −− V

I

OH

rise and fall times CL= 15 pF; note 2 −−25 ns

= 15 pF; note 2 40 − 60 %

L

Data line [I/O, I/O(µC)]

V

OH

HIGH level output voltage on
pin I/O

4.5V<V

4.5V<V

SUP
I/O(µC)

< 5.5 V;

< 5.5 V;

4.0 − VCC+ 0.1 V

IOH=−20 µA

4.5V<V

4.5V<V

SUP
I/O(µC)

< 5.5 V;

< 5.5 V;

2.4 −− V

IOH= −200 µA
V

OL

I

IL

LOW level output voltage on
pin I/O

LOW level input current on

I

= 1 mA;

I/O

−−100 mV

I/O(µC) grounded

I/O(µC) grounded −−−500 µA

pin I/O(µC)

V

OH

HIGH level output voltage on

4.5V<V

< 5.5 V 4.0 − V

I/O

SUP

+ 0.2 V

pin I/O(µC)

V

OL

LOW level output voltage on
pin I/O(µC)

I

IL

LOW level input current on pin I/O I/O grounded −−−500 µA

I

= 1 mA;

I/O(µC)

I/O grounded

−−70 mV

1996 Dec 12 16

Philips Semiconductors Product specification

Smart card interface TDA8001

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

V

IDLE

Z

IDLE

R

pu

, t

t

r

f

Protections

T

sd

I

CC(sd)

I

PP(sd)

I

I/O(lim)

Timing

t

act

t

de

t

3

t

5

t

st

voltage on pin I/O outside a

−−0.4 V

session
impedance on pin I/O(µC)

10 −− MΩ

outside a session
internal pull-up resistance

between pin I/O and V

CC

81012kΩ

rise and fall times Ci=Co=30 pF −−0.5 µs

shut-down local temperature − 135 −°C
shut-down current at V
shut-down current at V

CC
PP

−−150 − mA

−−75 − mA

current limitation on pin I/O from I/O to I/O(µC) 3 − 5mA

activation sequence duration see Fig.7 − 110 −µs
deactivation sequence duration see Fig.8 − 100 −µs
start of the window for sending

−−70 µs

CLK to the card
end of the window for sending

80 −− µs

CLK to the card
maximum pulse width on

−−30 µs

CMDVCC before VCC starts rising

Notes

1. Pins CMDVCC, VPP21, VPP15, VPP12.5, CMD7, CMD3.5 and PRES are active LOW; pins RSTIN and PRES are
active HIGH.

t

2. The transition time and duty cycle definitions are shown in Fig.12; .

δ

=

1

-------------- ­t1t2+

3. P is the card programming voltage set by pin VPP12.5, VPP15 or VPP21.

4. The tests for dynamic response of both VPP and VCC are performed at 1 Hz, 10 kHz, 100 kHz and 1 MHz, with a
capacitive load of 100 nF.

5. This condition ensures proper starting of the oscillator with crystals having a series resistance up to 100 Ω.

handbook, full pagewidth

t

r

10%

90%

t

1

t

f

90%

10%

V

OH

1.5 V

V

OL

t

2

MBH856

Fig.12 Definition of transition times.

1996 Dec 12 17

Philips Semiconductors Product specification

Smart card interface TDA8001

INTERNAL PIN CONFIGURATION

handbook, full pagewidth

V

SUP

XTAL

DETECT

RST

CLK

VPP12.5

I/O

V

CC

5 kΩ

V

CC

10 kΩ

100

µA

100 Ω

50 Ω

20

µA

V

CC

V

V

CC

V

CC

1.25 V

CC

100

µA

TDA8001

100

µA

100

µA

1350

Ω

650

Ω

100

µA

5 V

as VPP12.5
as VPP12.5

V

DD

as VPP12.5

as VPP12.5
as VPP12.5

V

SUP

I/O(µC)

CMD7
RSTIN
GND2
CLKOUT2

CMD3.5

CVNC
VPP21

CMDVCC
OFF

ALARM

VPP15

PRES
PRES

V

V

GND1

V

DD

V

CC

PP

as VPP12.5
as VPP12.5
as VPP12.5

H

as VPP12.5

V

H

Fig.13 Internal pin configuration.

1996 Dec 12 18

1.25 V

2.5 V

20
µA

V

SUP

100

µA

100

µA

2.5 V

µA

ALARM

2.5
µA

DELAY

20

V

SUP

4690

Ω

5310

Ω

MBE257

Philips Semiconductors Product specification

Smart card interface TDA8001

APPLICATION INFORMATION

handbook, full pagewidth

to 8805

micro-

controller

12 V

25 V

GND

+5 V

10
µF

10
µF

V

RST

DD

INT0

PORT

1

PORT

2

XTAL1
XTAL2

80C52

MICRO-

CONTROLLER

(1)

V

ALARM

ALARM

OFF

DETECT
I/O(µC)
CMDVCC
VPP15
VPP12.5
VPP21

RSTIN

CMD7
CMD3.5

CLKOUT2

GND2

DELAYGND GND1 XTAL

47 nF

SUP

TDA8001

14 MHz

CVNC

100 nF

12 V 25 V

V

DD

47 nF

V

H

PRES

PRES

V

CC

RST

CLK

V

PP

I/O

1 kΩ

(2)

100 nF

C1

C2

C3

C4

C5

100 nF

C6

C7

C8

CARD

SOCKET

MGG831


(1) The capacitor should be placed as close as possible to the IC.
(2) If pin VH is not connected to 25 V, it should be connected to VDD.

Fig.14 Application in a pay TV decoder.

1996 Dec 12 19

Philips Semiconductors Product specification

Smart card interface TDA8001

PACKAGE OUTLINES

handbook, full pagewidth

DIP28: plastic dual in-line package; 28 leads (600 mil)

SOT117-1

seating plane

L

Z

28

1

pin 1 index

D

A

2

A

A

1

e

b

w M

b

1

15

E

14

c

M

(e )

M

E

1

H

0 5 10 mm

scale

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

A

A

A

UNIT

inches

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

max.

mm

OUTLINE

VERSION

SOT117-1

1 2

min.

max.

1.7

1.3

0.066

0.051

IEC JEDEC EIAJ

051G05 MO-015AH

b

b

1

0.53

0.38

0.020

0.014

0.32

0.23

0.013

0.009

REFERENCES

cD E weM

(1) (1)

36.0

35.0

1.41

1.34

1996 Dec 12 20

14.1

13.7

0.56

0.54

(1)

92-11-17
95-01-14

Z

max.

1.75.1 0.51 4.0

0.0670.20 0.020 0.16

L

3.9

15.80

3.4

15.24

EUROPEAN

PROJECTION

M

0.62

0.60

H

E

17.15

15.90

0.68

0.63

0.252.54 15.24

0.010.10 0.60

ISSUE DATE

e

1

0.15

0.13

Philips Semiconductors Product specification

Smart card interface TDA8001

SO28: plastic small outline package; 28 leads; body width 7.5 mm

D

c

y

Z

28

pin 1 index

1

e

15

14

w M

b

p

SOT136-1

E

H

E

Q

A

2

A

1

L

p

L

detail X

(A )

A

X

v M

A

A

3

θ

0 5 10 mm

scale

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

mm

OUTLINE

VERSION

SOT136-1

A

max.

2.65

0.10

A

0.30

0.10

0.012

0.004

A2A

1

2.45

2.25

0.096

0.089

IEC JEDEC EIAJ

075E06 MS-013AE

0.25

0.01

b

3

p

0.49

0.32

0.36

0.23

0.019

0.013

0.014

0.009

UNIT

inches

Note

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

(1)E(1) (1)

cD

18.1

7.6

7.4

0.30

0.29

1.27

0.050

17.7

0.71

0.69

REFERENCES

1996 Dec 12 21

eHELLpQ

10.65

10.00

0.42

0.39

1.4

0.055

1.1

0.4

0.043

0.016

1.1

1.0

0.043

0.039

PROJECTION

0.25

0.25 0.1

0.01

0.01

EUROPEAN

ywv θ

Z

0.9

0.4

8

0.004

ISSUE DATE

0.035

0.016

91-08-13

95-01-24

0

o
o

Philips Semiconductors Product specification

Smart card interface TDA8001

SOLDERING
Introduction

There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.

This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our

“IC Package Databook”

(order code 9398 652 90011).

DIP

OLDERING BY DIPPING OR BY WA VE

S
The maximum permissible temperature of the solder is

260 °C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.

The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (T

stg max

). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.

EPAIRING SOLDERED JOINTS

R
Apply a low voltage soldering iron (less than 24 V) to the

lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300 °C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400 °C, contact may be up to 5 seconds.

SO

REFLOW SOLDERING
Reflow soldering techniques are suitable for all SO

packages.

Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250 °C.

Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45 °C.

AVE SOLDERING

W
Wave soldering techniques can be used for all SO

packages if the following conditions are observed:

• A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.

• The longitudinal axis of the package footprint must be
parallel to the solder flow.

• The package footprint must incorporate solder thieves at
the downstream end.

During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.

Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
6 seconds. Typical dwell time is 4 seconds at 250 °C.

A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.

EPAIRING SOLDERED JOINTS

R
Fix the component by first soldering two diagonally-

opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C.
When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320 °C.

Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.

1996 Dec 12 22

Philips Semiconductors Product specification

Smart card interface TDA8001

DEFINITIONS

Data sheet status

Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.

1996 Dec 12 23

Philips Semiconductors – a worldwide company

Argentina: see South America
Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113,

Tel. [phone], Fax. [phone]
Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213,

Tel. [phone], Fax. [phone]
Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6,

220050 MINSK, Tel. [phone], Fax. [phone]

Belgium: see The Netherlands
Brazil: seeSouth America
Bulgaria: Philips Bulgaria Ltd., Energoproject, 15thfloor,

51 James Bourchier Blvd., 1407 SOFIA,
Tel. [phone], Fax. [phone]

Canada: PHILIPS SEMICONDUCTORS/COMPONENTS,
Tel. [phone]

China/Hong Kong: 501 Hong Kong Industrial Technology Centre,
72 Tat Chee Avenue, Kowloon Tong, HONG KONG,
Tel. [phone], Fax. [phone]

Colombia: see South America
Czech Republic: see Austria
Denmark: Prags Boulevard 80, PB 1919, DK-2300 COPENHAGEN S,

Tel. [phone], Fax. [phone]
Finland: Sinikalliontie 3, FIN-02630 ESPOO,

Tel. [phone], Fax. [phone]/xxx
France: 4 Rue du Port-aux-Vins, BP317, 92156 SURESNES Cedex,

Tel. [phone], Fax. [phone]
Germany: Hammerbrookstraße 69, D-20097 HAMBURG,

Tel. [phone], Fax. [phone]
Greece: No. 15, 25th March Street, GR 17778 TAVROS/ATHENS,

Tel. [phone], Fax. [phone]

Hungary: seeAustria
India: Philips INDIA Ltd, Shivsagar Estate, A Block, Dr. Annie Besant Rd.

Worli, MUMBAI 400 018, Tel. [phone], Fax. [phone]

Indonesia: see Singapore
Ireland: Newstead, Clonskeagh, DUBLIN 14,

Tel. [phone], Fax. [phone]
Israel: RAPAC Electronics, 7 Kehilat Saloniki St, TEL AVIV 61180,

Tel. [phone], Fax. [phone]
Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3,

20124 MILANO, Tel. [phone], Fax. [phone]
Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108,

Tel. [phone], Fax. [phone]
Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,

Tel. [phone], Fax. [phone]
Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,

Tel. [phone], Fax. [phone]
Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,

Tel. [phone]

Middle East: see Italy

Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB,

Tel. [phone], Fax. [phone]
New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,

Tel. [phone], Fax. [phone]
Norway: Box 1, Manglerud 0612, OSLO,

Tel. [phone], Fax. [phone]
Philippines: Philips Semiconductors Philippines Inc.,

106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI,
Metro MANILA, Tel. [phone], Fax. [phone]

Poland: Ul. Lukiska 10, PL 04-123 WARSZAWA,
Tel. [phone], Fax. [phone]

Portugal: see Spain
Romania: see Italy
Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW,

Tel. [phone], Fax. [phone]
Singapore: Lorong 1, Toa Payoh, SINGAPORE 1231,

Tel. [phone], Fax. [phone]

Slovakia: see Austria
Slovenia: see Italy
South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,

2092 JOHANNESBURG, P.O. Box 7430 Johannesburg 2000,
Tel. [phone], Fax. [phone]

South America: Rua do Rocio 220, 5th floor, Suite 51,
04552-903 São Paulo, SÃO PAULO - SP, Brazil,
Tel. [phone], Fax. [phone]

Spain: Balmes 22, 08007 BARCELONA,
Tel. [phone], Fax. [phone]

Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,
Tel. [phone], Fax. [phone]

Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,
Tel. [phone], Fax. [phone]

Taiwan: PHILIPS TAIWAN Ltd., 23-30F, 66,
Chung Hsiao West Road, Sec. 1, P.O. Box 22978,
TAIPEI 100, Tel. [phone], Fax. [phone]

Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,
209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260,
Tel. [phone], Fax. [phone]

Turkey: Talatpasa Cad. No. 5, 80640 GÜLTEPE/ISTANBUL,
Tel. [phone], Fax. [phone]

Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,
252042 KIEV, Tel. [phone], Fax. [phone]

United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,
MIDDLESEX UB3 5BX, Tel. [phone], Fax. [phone]

United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. [phone]

Uruguay: see South America
Vietnam: see Singapore
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,

Tel. [phone], Fax.[phone]

For all other countries apply to: Philips Semiconductors, Marketing & Sales Communications,
Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. [phone]

© Philips Electronics N.V. 1996 SCA52
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.

Internet: http://www.semiconductors.philips.com

Printed in The Netherlands 537021/1200/02/pp24 Date of release: 1996 Dec 12 Document order number: 9397 750 01384