DATASHEETS tda7088t DATASHEETS (Philips)

INTEGRATED CIRCUITS

DATA SH EET

TDA7088T

FM receiver circuit for battery
supply

Product specification
Supersedes data of January 1991
File under Integrated Circuits, IC01

1996 May 14

Philips Semiconductors Product specification

FM receiver circuit for battery supply TDA7088T

FEATURES

• Equipped with all stages of a mono receiver from
antenna to audio output

• Mute circuit

• Search tuning with a single varicap diode

• Mechanical tuning with integrating AFC

• AM application supported

• Power supply polarity protection

GENERAL DESCRIPTION

The TDA7088T is a bipolar integrated circuit for use in
mono portable and pocket radios. It is used when a
minimum of peripheral components (of small dimensions
and low costs) is important. The circuit contains a
frequency-locked-loop (FLL) system with an Intermediate
Frequency (IF) of about 70 kHz. Selectivity is achieved by
active RC-filters. De-tuning related to the IF and too weak
input signals is suppressed by the mute circuit.

• Power supply voltage down to 1.8 V.

APPLICATIONS

• Mechanical tuning; this is possible with or without
integrating AFC circuit

• Electrical tuning; this is realized by one directional
(band-up) search tuning facility, including RESET to the
lower-band limit.

QUICK REFERENCE DATA

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

V
I
f
V

P
iRF

P

i(rms)

supply voltage 1.8 3 5 V
supply current 4.2 5.2 6.6 mA
radio input frequency 0.5 − 110 MHz
RF sensitivity input voltage

(RMS value)

V

= −3 dB; V

oAF

oAF

= 0 dB

at Vi= 1 mV; mute off

− 3 6 µV

signal handling ∆f = ±75 kHz; THD < 10% 100 200 − mV

V

o(rms)

audio output signal (RMS

RL= 22 kΩ 60 85 120 mV

value)

T

amb

operating ambient temperature −10 − +70 °C

ORDERING INFORMATION

TYPE

NUMBER

NAME DESCRIPTION VERSION

PACKAGE

TDA7088T SO16 plastic small outline package; 16 leads; body width 3.9 mm SOT109-1

1996 May 14 2

Philips Semiconductors Product specification

handbook, full pagewidth

MEH089

MIXER

TDA7088T

VCO

14

16

1

2

315

run

13109876

AF

V2

L1

reset

&× +

+

R

MUTE

SEARCH

TUNING

S

ALLPASS

FILTER

10 kΩ

5.6

kΩ

2.2 kΩ 2.2 kΩ

6 kΩ

5.4 kΩ

6 kΩ

DEMODULATOR

22 nF

LOOP FILTER

AF

V2

V3

−1

5 kΩ

22 kΩ1.8 nF

0.1 µF

0.1 µF

0.1 µF

680

pF

10 nF

3 V

BB910

78

nH

70

nH

82

pF

+1

68

pF

220 pF

3.3 nF 3.9 nF

IF

LIMITER

180 pF

330 pF

470 pF

V1

V2

11

12

5

4

V

P

V

P

V

P

V

oAF

Fig.1 Block diagram and application circuit for search tuning.

V1, V2 and V3 are internal voltages.

FM receiver circuit for battery supply TDA7088T

BLOCK DIAGRAM AND APPLICATION CIRCUIT

1996 May 14 3

Philips Semiconductors Product specification

Fig.2 Pin configuration.

handbook, halfpage

TDA7088T

MGE664

1
2
3
4
5
6
7
8

16
15
14
13
12
11
10

9

MUTE

V

oAF

LOOP

V

P

OSC
IFFB

C

LP1

V

oIF

TUNE
C

AP

GND
C

LIM

V

iRF

V

iRF

C

LP2

V

iIF

FM receiver circuit for battery supply TDA7088T

PINNING

SYMBOL PIN DESCRIPTION

MUTE 1 mute output
V

oAF

LOOP 3 AF loop filter
V

P

OSC 5 oscillator resonant circuit
IFFB 6 IF feedback
C

LP1

V

oIF

V

iIF

C

LP2

V

iRF

V

iRF

C

LIM

GND 14 ground (0 V)
C

AP

TUNE 16 electrical tuning/AFC output

2 audio frequency output signal

4 +3 V supply voltage

7 low-pass capacitor of 1 dB amplifier
8 IF output to external coupling

capacitor (high-pass)

9 IF input to limiter amplifier

10 low-pass capacitor of IF limiter

amplifier
11 radio frequency input
12 radio frequency input
13 limiter offset voltage capacitor

15 all-pass filter capacitor/input for

search tuning

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 134).

SYMBOL PARAMETER MIN. MAX. UNIT

V

P

T

stg

T

amb

V

es

supply voltage 0 5 V
storage temperature −55 +150 °C
operating ambient temperature −10 +70 °C
electrostatic handling; note 1 − − −

Note

1. There is no special ESD protection circuit built-in; ESD data on request.

1996 May 14 4

Philips Semiconductors Product specification

+

--

FM receiver circuit for battery supply TDA7088T

DC CHARACTERISTICS

VP= 3 V; T

SYMBOL PARAMETER MIN. TYP. MAX. UNIT

V

P

I

P

V

1

V

3

V

6, 7

V

8

V

9, 10,13

V

11,12

V

15

I

2

I

5

= 25 °C; unless otherwise specified.

amb

supply voltage (pin 4) 1.8 3 5 V
supply current (pin 4) 4.2 5.2 6.6 mA
DC voltage on pin 1 2.50 2.55 2.60
DC voltage on pin 3 2.64 2.69 2.74
DC voltage on pins 6 and 7 2.38 2.44 2.50
DC voltage on pin 8 1.60 1.67 1.74 V
DC voltage on pins 9, 10 and 13 2.42 2.47 2.52 V
DC voltage on pins 11 and 12 0.91 0.94 0.98 V
DC voltage on pin 15 2.06 2.12 2.18 V
AF output current on pin 2 45 60 80 µA
oscillator current on pin 5 275 375 500 µA

V
V
V

AC CHARACTERISTICS

VP= 3 V; T
EMF; R

S

amb

= 25 °C; f

= 96 MHz modulated with f

iRF

= 1 kHz and ±22.5 kHz deviation; Vi= 400 µV (measured as

mod

= 75 Ω) and measurements taken in Fig.4; unless otherwise specified.

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

V

i(rms)

S N+

-----------­N

THD total harmonic distortion ∆f = ±22.5 kHz − 1 1.4

α

AM

RF sensitivity input voltage
(RMS value)

signal handling ∆f = ±75 kHz; THD < 10% 100 200 −

V

= −3 dB; V

oAF

oAF

= 0 dB

at Vi= 1 mV; see Fig.3

mute off − 3 6
mute on 3 6 12

S N

--------------

26 dB=

N

− 5 10 µV

µV
µV

mV

signal plus noise-to-noise ratio see Fig.3 52 56 − dB

%

∆f = ±75 kHz − 2.4 3.3

AM suppression FM: 1 kHz; ±75 kHz;

47 52 −

%
dB

AM: 1 kHz; m = 0.8

RR

1000

ripple rejection 100 mV RMS ripple on VP;

7 10 − dB

f = 1 kHz

V

o(rms)

Search tuning (with BB910 and C
V

16

audio output signal (RMS value) RL= 22 kΩ 60 85 120 mV

= 0.1 µF) see Fig.1

16

minimum output voltage on

limiting point − VP− 1.85 − V

pin 16

∆V/∆t tuning steepness voltage at pin 16 95 210 420 mV/s
∆f

/∆t oscillator steepness 1.25 2.83 5.6 MHz/s

osc

∆I

AFC

/∆V

AFC steepness voltage at pin 3 4.75 9.5 19 µS

3

1996 May 14 5

Philips Semiconductors Product specification

Fig.3 Input sensitivity.

(1) Mute on.
(2) Mute off.

handbook, full pagewidth

−80

25

V

oAF

(dB)

MEH092

10

−6

10

−5

10

−4

10

−3

10

−2

−60

−40

−20

0

EMF (V)

(2)
(2)

(1)

(1)

S+N

noise

FM receiver circuit for battery supply TDA7088T

1996 May 14 6

Philips Semiconductors Product specification

Fig.4 Test circuit and application for mechanical tuning.

C1 = Toko 2A-15BT-R01.

handbook, full pagewidth

MEH090

22 kΩ

1.2
kΩ

1.8 nF

22 nF

10 nF

27 pF

18
pF

180 pF

78

nH

3.3 nF

C1

10 kΩ

75 Ω

0.1 µF

0.1 µF

mute disable

70
nH

TDA7088T

3.9 nF

330 pF

82 pF

220

pF

470 pF

V

iRF

VP =
+3 V

V

P

V

oAF

68
pF

9

10

11

12

13

14

15

16

8

7

6

5

4

3

2

1

EMF (fRF)

R

S

FM receiver circuit for battery supply TDA7088T

TEST AND APPLICATION INFORMATION

1996 May 14 7

Philips Semiconductors Product specification

Fig.5 Application circuit with AFC for mechanical tuning.

C1 = Toko 2A-15BT-R01.

handbook, full pagewidth

MEH091

22 kΩ

1.2
kΩ

1.8 nF

AFC

22 nF

10 nF

27 pF

18
pF

180 pF

78
nH

3.3 nF

C2

C1

D1

10 kΩ

0.1 µF

0.1 µF

0.1 µF

BA483

70

nH

TDA7088T

3.9 nF

330 pF

82 pF

220

pF

470 pF

V

iRF

VP =
+3 V

V

P

V

oAF

68

pF

9

10

11

12

13

14

15

16

8

7

6

5

4

3

2

1

FM receiver circuit for battery supply TDA7088T

1996 May 14 8

Philips Semiconductors Product specification

handbook, full pagewidth

MEH157

180

pF

2.7 kΩ

10 kΩ

100 kΩ

BAW62

CC7642

AM-IF

10 nF

(1)

27 kΩ

5.1 Ω

12 Ω

1 µF

0.1

µF

1 µF

4.7 nF

22

kΩ

0.1

µF

TDA7088T

8 7 6 5 4 3 2 1

off

battery

switch

on

9 10 11 12 13 14

AF

(FM antenna)

AF

330

pF

33 pF

RF

470 pF

AF amplifier

AM antenna

15 16

L

H

10

nF

earphone

volume

oscillator

resonant

circuit

FM

33 pF

12 pF

AM

FM

AM

4.7 nF

3.9

nF

4.7 nF

22 nF

V

P

47 nF

+3 V

+3 V

22 µF

AF

transformer

+3 V

Fig.6 AM application circuit.

(1) CC7642: AM-IF amplifier/demodulator type number WU-xi 742 Fty.

FM receiver circuit for battery supply TDA7088T

1996 May 14 9

Philips Semiconductors Product specification

X

w M

θ

A

A

1

A

2

b

p

D

H

E

L

p

Q

detail X

E

Z

e

c

L

v M

A

(A )

3

A

8

9

1

16

y

pin 1 index

UNIT

A

max.

A1A2A

3

b

p

c D

(1)E(1) (1)

e H

E

L L

p

Q Zywv θ

REFERENCES

OUTLINE
VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC JEDEC EIAJ

mm

inches

1.75

0.25

0.10

1.45

1.25

0.25

0.49

0.36

0.25

0.19

10.0

9.8

4.0

3.8

1.27

6.2

5.8

0.7

0.6

0.7

0.3

8
0

o
o

0.25 0.1

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

Note

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

1.0

0.4

SOT109-1

91-08-13
95-01-23

076E07S MS-012AC

0.069

0.0098

0.0039

0.057

0.049

0.01

0.019

0.014

0.0098

0.0075

0.39

0.38

0.16

0.15

0.050

1.05

0.041

0.24

0.23

0.028

0.020

0.028

0.012

0.01

0.25

0.01 0.004

0.039

0.016

0 2.5 5 mm

scale

SO16: plastic small outline package; 16 leads; body width 3.9 mm

SOT109-1

FM receiver circuit for battery supply TDA7088T

PACKAGE OUTLINE

1996 May 14 10

Philips Semiconductors Product specification

FM receiver circuit for battery supply TDA7088T

SOLDERING
Introduction

There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.

This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our

“IC Package Databook”

Reflow soldering

Reflow soldering techniques are suitable for all SO
packages.

Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.

Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250 °C.

(order code 9398 652 90011).

During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.

Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
6 seconds. Typical dwell time is 4 seconds at 250 °C.

A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.

Repairing soldered joints

Fix the component by first soldering two diagonally­opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320 °C.

Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45 °C.

Wave soldering

Wave soldering techniques can be used for all SO
packages if the following conditions are observed:

• A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.

• The longitudinal axis of the package footprint must be
parallel to the solder flow.

• The package footprint must incorporate solder thieves at
the downstream end.

1996 May 14 11

Philips Semiconductors Product specification

FM receiver circuit for battery supply TDA7088T

DEFINITIONS

Data sheet status

Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.

1996 May 14 12

Philips Semiconductors Product specification

FM receiver circuit for battery supply TDA7088T

NOTES

1996 May 14 13

Philips Semiconductors Product specification

FM receiver circuit for battery supply TDA7088T

NOTES

1996 May 14 14

Philips Semiconductors Product specification

FM receiver circuit for battery supply TDA7088T

NOTES

1996 May 14 15

Philips Semiconductors – a worldwide company

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Internet: http://www.semiconductors.philips.com/ps/
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SCDS48 © Philips Electronics N.V. 1996

All rights are reserved. Reproduction in whole or in part is prohibited without the
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The information presented in this document does not form part of any quotation
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use. Publication thereof does not convey nor imply any license under patent- or
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Printed in The Netherlands

517021/1200/02/pp16 Date of release: 1996 May14
Document order number: 9397 750 00843