Philips TDA7050T User Manual

INTEGRATED CIRCUITS

DATA SH EET

TDA7050T

Low voltage mono/stereo power
amplifier

Product specification
File under Integrated Circuits, IC01

July 1994

Philips Semiconductors Product specification

Low voltage mono/stereo power amplifier TDA7050T

GENERAL DESCRIPTION

The TDA7050T is a low voltage audio amplifier for small radios with headphones (such as watch, pen and pocket radios)
in mono (bridge-tied load) or stereo applications.

Features

• Limited to battery supply application only (typ. 3 and 4 V)

• Operates with supply voltage down to 1,6 V

• No external components required

• Very low quiescent current

• Fixed integrated gain of 26 dB, floating differential input

• Flexibility in use − mono BTL as well as stereo

• Small dimension of encapsulation (see package design example).

QUICK REFERENCE DATA

Supply voltage range V
Total quiescent current (at V

= 3 V) I

P

tot

P

typ. 3,2 mA

1,6 to 6,0 V

Bridge tied load application (BTL)

Output power at RL= 32 Ω

V

= 3 V; d

P

= 10% P

tot

o

typ. 140 mW
D.C. output offset voltage between the outputs |∆V| max. 70 mV
Noise output voltage (r.m.s. value)

at f = 1 kHz; R

= 5 kΩ V

S

no(rms)

typ. 140 µV

Stereo application

Output power at R

= 10%; VP= 3 V P

d

tot

d

= 10%; VP= 4,5 V P

tot

Channel separation at R

= 32 Ω

L

o
o

= 0 Ω; f = 1 kHz α typ. 40 dB

S

typ. 35 mW

typ. 75 mW

Noise output voltage (r.m.s. value)

at f = 1 kHz; RS= 5 kΩ V

no(rms)

typ. 100 µV

PACKAGE OUTLINE

8-lead mini-pack; plastic (SO8; SOT96A); SOT96-1; 1996 July 24.

July 1994 2

Philips Semiconductors Product specification

Low voltage mono/stereo power amplifier TDA7050T

RATINGS

Limiting values in accordance with the Absolute Maximum System (IEC 134)
Supply voltage V

Peak output current I

P

OM

Total power dissipation see derating curve Fig.1
Storage temperature range T
Crystal temperature T

stg
c

A.C. and d.c. short-circuit duration

at VP= 3,0 V (during mishandling) t

sc

max. 6 V
max. 150 mA

−55 to + 150 °C

max. 100 °C

max. 5 s

100

T ( C)

amb

MLB950

o

600

handbook, halfpage

P

tot

(mW)

400

200

0

50 0 50 150

Fig.1 Power derating curve.

SO PACKAGE DESIGN EXAMPLE

To achieve the small dimension of the encapsulation the SO package is preferred with only 8 pins. Because a heatsink
is not applicable, the dissipation is limited by the thermal resistance of the 8-pin SO encapsulation until:

T

–

jmaxTamb

--------------------------------- ­R

th j-a

100 60–

---------------------­160

0.25 W==

July 1994 3