Philips TDA6107JF User Manual

INTEGRATED CIRCUITS

DATA SH EET

TDA6107JF

Triple video output amplifier

Product specification 2002 Oct 18

Philips Semiconductors Product specification

Triple video output amplifier TDA6107JF

FEATURES

• Typical bandwidth of 5.5 MHz for an output signal of
60 V (p-p)

• High slew rate of 900 V/µs

• No external components required

• Very simple application

• Single supply voltage of 200 V

• Internal reference voltage of 2.5 V

• Fixed gain of 50

• Black-Current Stabilization (BCS) circuit with voltage

window from 1.8 to 6 V and current window from

−100 µA to 10 mA

• Thermal protection

• Internal protectionagainstpositive flashoverdischarges

appearing on the CRT.

ORDERING INFORMATION

TYPE

NUMBER

TDA6107JF DBS9MPF plastic DIL-bent-SIL medium power package with fin; 9 leads SOT111-1

NAME DESCRIPTION VERSION

GENERAL DESCRIPTION

The TDA6107JF includes three video output amplifiers
andis intendedto drivethethree cathodesof acolourCRT
directly. The device is contained in a plastic DIL-bent-SIL
9-pin medium power (DBS9MPF) package, and uses
high-voltage DMOS technology.

To obtain maximum performance, the amplifier should be
used with black-current control.

PACKAGE

2002 Oct 18 2

Philips Semiconductors Product specification

Triple video output amplifier TDA6107JF

BLOCK DIAGRAM

handbook, full pagewidth

V

,

i(1)

1, 2, 3

V

,

i(2)

V

i(3)

CURRENT

SOURCE

MIRROR 1

THERMAL

PROTECTION

CIRCUIT

R

i
R

a

3×

VIP

REFERENCE

MIRROR 3

TDA6107JF

DIFFERENTIAL

MIRROR 2

MIRROR 4

STAGE

V

DD

6

MIRROR 5

CASCODE 1

3×

V

1×

1×

R

f

CASCODE 2

9, 8, 7

oc(3),

V

oc(2),

V

oc(1)

5

I

o(m)

Fig.1 Block diagram (one amplifier shown).

PINNING

SYMBOL PIN DESCRIPTION

V

i(1)

V

i(2)

V

i(3)

1 inverting input 1
2 inverting input 2

3 inverting input 3
GND 4 ground (fin)
I
V
V
V
V

om

DD
oc(3)
oc(2)
oc(1)

5 black-current measurement output

6 supply voltage

7 cathode output 3

8 cathode output 2

9 cathode output 1

handbook, halfpage

V

1

i(1)

V

2

i(2)

V

3

i(3)

GND

4

I

5

om

TDA6107JF

V

6

DD

V

7

oc(3)

V

8

oc(2)

V

9

oc(1)

MBL524

Fig.2 Pin configuration.

4

MBL525

2002 Oct 18 3

Philips Semiconductors Product specification

Triple video output amplifier TDA6107JF

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 60134); voltages measured with respect to pin 4
(ground); currents as specified in Fig.1; unless otherwise specified.

SYMBOL PARAMETER MIN. MAX. UNIT

V

DD

V

i

V

o(m)

V

oc

I

ocsm(L)

I

ocsm(H)

T

stg

T

j

V

es

supply voltage 0 250 V
input voltage at pins 1 to 3 0 12 V
measurement output voltage 0 6 V
cathode output voltage 0 V
LOW non-repetitive peak cathode output current at a flashover

03A

DD

V

discharge of 100 µC
HIGH non-repetitive peak cathode output current at a flashover

06A

discharge of 100 nC
storage temperature −55 +150 °C
junction temperature −20 +150 °C
electrostatic handling voltage

Human Body Model (HBM) − 3000 V
Machine Model (MM) − 300 V

HANDLING

Inputs and outputs are protected against electrostatic discharge in normal handling. However, to be totally safe, it is
desirable to take normal precautions appropriate to handling MOS devices (see

“Handling MOS Devices”

).

QUALITY SPECIFICATION

Quality specification

“SNW-FQ-611 part D”

is applicable and can be found in the

“Quality reference Handbook”

.

The handbook can be ordered using the code 9397 750 00192.

2002 Oct 18 4

Philips Semiconductors Product specification

Triple video output amplifier TDA6107JF

THERMAL CHARACTERISTICS

SYMBOL PARAMETER CONDITIONS VALUE UNIT

R

th(j-a)

R

th(j-fin)

R

th(h-a)

Note

1. An external heatsink is necessary.

P

(W)

8

tot

6

handbook, halfpage

thermal resistance from junction to ambient 56 K/W
thermal resistance from junction to fin note 1 11 K/W
thermal resistance from heatsink to ambient 18 K/W

Thermal protection

The internal thermal protectioncircuit gives a decrease of

MBH989

the slew rate at high temperatures: 10% decrease at
130 °C and30% decreaseat 145 °C(typical valueson the
spot of the thermal protection circuit).

(1)

4

2

0

−40

(1) Infinite heatsink.
(2) No heatsink.

0

Fig.3 Power derating curves.

(2)

40 80 160120

T

amb

(°C)

handbook, halfpage

outputs

5 K/W

thermal protection circuit

6 K/W

fin

MGK279

Fig.4 Equivalent thermal resistance network.

2002 Oct 18 5

Philips Semiconductors Product specification

Triple video output amplifier TDA6107JF

CHARACTERISTICS

Operating range: Tj= −20 to +150 °C; VDD= 180 to 210 V. Test conditions: T
V

o(c1)=Vo(c2)=Vo(c3)

=1⁄2VDD; CL= 10 pF (CL consists of parasitic and cathode capacitance); R

(measured in test circuit of Fig.8); unless otherwise specified.

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

I

q

V

ref(int)

quiescent supply current 5.6 6.6 7.6 mA
internal reference voltage

(input stage)

R

i

input resistance − 3.6 − kΩ
G gain of amplifier 47.5 51.0 55.0
∆G gain difference −2.5 0 +2.5
V

O(oc)

nominal output voltage at

Ii=0µA 116 129 142 V

pins 7, 8 and 9 (DC value)
∆V

O(oc)(offset)

differential nominal output

Ii=0µA − 05V
offset voltage between
pins 7 and 8, 8 and 9 and
9 and 7 (DC value)

∆V

o(c)(T)

output voltage temperature
drift at pins 7, 8 and 9

∆V

o(c)(T)(offset)

differential output offset
voltage temperature drift
between pins 7 and 8,
8 and 9 and 7 and 9

I

o(m)(offset)

∆I

/∆I

o(m)

offsetcurrent ofmeasurement
output (for three channels)

linearity of current transfer

o(c)

(for three channels)

I

=0µA;

o(c)

1.5 V < Vi< 5.5 V;

1.8 V < V

−100 µA<I

o(m)

o(c)

<6V

< 100 µA;

1.5 V < Vi< 5.5 V;

1.8 V < V

−100 µA ≤ I

o(m)

<6V

<10mA;

o(c)

1.5 V < Vi< 5.5 V;

I

o(c)(max)

maximum peak output current

1.8 V < V

50V<V

<4V

o(m)

o(c)<VDD

− 50 V − 20 − mA

(pins 7, 8 and 9)

V

o(c)(min)

V

o(c)(max)

B

S

minimum output voltage
(pins 7, 8 and 9)

maximum output voltage
(pins 7, 8 and 9)

small signal bandwidth

Vi= 7.0 V; at I

o(c)

= 0 mA;

note 1

Vi= 1.0 V; at I

o(c)

= 0 mA;

note 1

V

= 60 V (p-p) − 5.5 − MHz

o(c)

(pins 7, 8 and 9)

B

L

large signal bandwidth

V

= 100 V (p-p) − 4.5 − MHz

o(c)

(pins 7, 8 and 9)

t

Pco

cathode output propagation
time 50% input to 50% output
(pins 7, 8 and 9)

V

= 100 V (p-p) square

o(c)

wave; f <1 MHz;

tr=tf=40ns

(pins 1, 2 and 3);

see Figs 6 and 7

=25°C; VDD= 200 V;

amb

= 18 K/W

th(h-a)

− 2.5 − V

− 10 − mV/K

− 0 − mV/K

−50 − +50 µA

−0.9 −1.0 −1.1

−0.9 −1.0 −1.1

−−10 V

VDD− 15 −−V

− 60 − ns

2002 Oct 18 6

Philips Semiconductors Product specification

Triple video output amplifier TDA6107JF

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

∆t

Pco

t

o(r)

t

o(f)

t

st

SR slew rate between

O

v

PSRR power supply rejection ratio f < 50 kHz; note 2 − 55 − dB

α

ct(DC)

difference in cathode output
propagationtime 50% inputto
50% output (pins 7 and 8,
7 and 9 and 8 and 9)

cathode output rise time
10% output to 90% output
(pins 7, 8 and 9)

cathode output fall time
90% output to 10% output
(pins 7, 8 and 9)

settling time 50% input to
99% < output < 101%
(pins 7, 8 and 9)

50Vto(V

DD

− 50 V)

(pins 7, 8 and 9)
cathode output voltage

overshoot (pins 7, 8 and 9)

DC crosstalk between
channels

V

= 100 V (p-p) square

o(c)

wave; f < 1 MHz;

tr=tf=40ns

(pins 1, 2 and 3)

V

= 50 to 150 V square

o(c)

wave; f < 1 MHz; tf=40ns

(pins 1, 2 and 3); see Fig.6

V

= 150 to 50 V square

o(c)

wave; f < 1 MHz; tr=40ns

(pins 1, 2 and 3); see Fig.7

V

= 100 V (p-p) square

o(c)

wave; f < 1 MHz;

tr=tf=40ns

(pins 1, 2 and 3);

see Figs 6 and 7

Vi= 4 V (p-p) square wave;

f < 1 MHz; tr=tf=40ns

(pins 1, 2 and 3)

V

= 100 V (p-p) square

o(c)

wave; f < 1 MHz;

tr=tf=40ns

(pins 1, 2 and 3);

see Figs 6 and 7

−10 0 +10 ns

67 91 113 ns

67 91 113 ns

−−350 ns

− 900 − V/µs

− 2 − %

−−50 − dB

Notes

1. See also Fig.5 for the typical DC-to-DC transfer of VIto V

O(oc)

.

2. The ratio of the change in supply voltage to the change in input voltage when there is no change in output voltage.

2002 Oct 18 7

Philips Semiconductors Product specification

Triple video output amplifier TDA6107JF

200

handbook, halfpage

V

o(c)

(V)

160

129

120

80

40

0

0

2.5

2

46

Fig.5 Typical DC-to-DC transfer of VIto VOC.

MBH988

V

(V)

i

2002 Oct 18 8

Philips Semiconductors Product specification

Triple video output amplifier TDA6107JF

4.04

V

i

(V)

3.08

2.12

t

st

Ov (in %)

150
140

V

o(c)

(V)

100

60
50

t

o(r)

t

Pco

t

151

149

t

MGK280

Fig.6 Output voltage (pins 7, 8 and 9) rising edge as a function of the AC input signal.

2002 Oct 18 9

Philips Semiconductors Product specification

Triple video output amplifier TDA6107JF

4.04

V

i

(V)

3.08

2.12

t

st

150
140

V

o(c)

(V)

100

Ov (in %)

60
50

t

o(f)

t

Pco

t

51

49

t

MGK281

Fig.7 Output voltage (pins 7, 8 and 9) falling edge as a function of the AC input signal.

2002 Oct 18 10

Philips Semiconductors Product specification

Triple video output amplifier TDA6107JF

Cathode output

The cathode output is protected against peak current
(caused by positive voltage peaks during high-resistance
flash) of3 A maximum with acharge content of 100 µC

(1)

The cathode is also protected against peak currents
(caused by positive voltage peaks during low-resistance
flash) of6 A maximum with acharge content of 100 nC

(1)

TheDC voltageof VDD(pin 6)must bewithin theoperating
range of 180 to 210 V during the peak currents.

Flashover protection

The TDA6107JF incorporates protection diodes against
CRT flashover dischargesthat clamp the cathodesoutput
voltage up to a maximum of VDD+V

diode

.

To limit the diode current an external 1.5 kΩ carbon
high-voltage resistorin series with thecathode output and
a 2 kV spark gap are needed (for this resistor value, the
CRT has to be connected to the main PCB

(1)

.

VDD must be decoupled to GND:

1. With a capacitor >20 nF with good HF behaviour
(e.g. foil); this capacitor must be placed as close as
possible to pins 6 and 4, but definitely within 5 mm.

2. With a capacitor >3.3 µF on the picture tube base
print, depending on the CRT size.

Switch-off behaviour

Theswitch-off behaviourofthe TDA6107JF iscontrollable.
This isbecause the output pinsof the TDA6107JF arestill
under control of the input pins for low power supply
voltages (approximately 30 V and higher).

Dissipation

Regarding dissipation, distinction must first be made
between staticdissipation (independent of frequency) and

.

dynamic dissipation (proportional to frequency).
The static dissipation of the TDA6107JF is due to voltage

supply currentsand load currentsin the feedbacknetwork

.

and CRT.
The static dissipation P

stat

V

DDIDD

P

3VOCIOC××+×=

equals:

stat

Where:

= supply voltage

V

DD

IDD= supply current
VOC= DC value of cathode voltage
IOC= DC value of cathode current.

The dynamic dissipation P

P

3VDDCLC

dyn

equals:

dyn

+()f

int

V

i

oc(p-p)

δ×××××=

Where:

= load capacitance

C

L

C

= internal load capacitance (≈4 pF)

int

fi= input frequency
V

= output voltage (peak-to-peak value)

oc(p-p)

δ = non-blanking duty cycle.

The IC must be mounted on the picture tube base print to
minimize the load capacitance CL.

Bandwidth

The addition of the flash resistor produces a decreased
bandwidth and increases the rise and fall times; see

“Application Note AN96072”

.

(1)External protectionagainst highercurrents isdescribed
in

“Application Note AN96072”

.

2002 Oct 18 11

Philips Semiconductors Product specification

Triple video output amplifier TDA6107JF

TEST AND APPLICATION INFORMATION

handbook, full pagewidth

V

i(1)

V

i(2)

V

i(3)

C1

22 µF

C2

22 nF

C3

22 µF

C4

22 nF

C5

22 µF

C6

22 nF

V

DD

20 nFC710 µF

C10

6.8 pF

C11
136 pF

C13

6.8 pF

C14
136 pF

C16

6.8 pF

C17
136 pF

V

o(m)

4 V

I

I

I

of

om

of

om

of

om

V

V

V

oc(1)

oc(2)

oc(3)

6

9

C9

3.2 pF

8

C12

3.2 pF

7

C15

3.2 pF

5

J1

R

i

1

R

a

J2

R

i

2

R

a

J3

R

i

3

R

a

VIP

REFERENCE

R

f

V

1

R

f

V

2

R

f

V

3

TDA6107JF

4

C8

R1
2 MΩ

probe 1

R2
100 kΩ

R3
2 MΩ

probe 2

R4
100 kΩ

R5
2 MΩ

probe 3

R6
100 kΩ

Current sources J1, J2 and J3 are to be tuned so that V

of pins 9, 8 and 7 is set to 100 V.

o(c)

Fig.8 Test circuit.

2002 Oct 18 12

MBL526

Philips Semiconductors Product specification

Triple video output amplifier TDA6107JF

INTERNAL CIRCUITRY

handbook, full pagewidth

1, 2, 3

5

esd

to black current

measurement circuit

6.8 Vesd

to black current

measurement circuit

to cascode

stage

from
control
circuit

from black
current
measurement
circuit

from
control
circuit

GND

46

V

DD

TDA6107JF

(1)

from

input

circuit

esd

from

input

circuit

measurement circuit

esd

V

bias

esd

esd

to black current

to black current

measurement circuit

flash

7, 8, 9

MBL527

(1) All pins have an energy protection for positive or negative overstress situations.

Fig.9 Internal pin configuration.

2002 Oct 18 13

Philips Semiconductors Product specification

Triple video output amplifier TDA6107JF

PACKAGE OUTLINE

DBS9MPF: plastic DIL-bent-SIL medium power package with fin; 9 leads

D

D

1

q

P

pin 1 index

P

1

q

2

q

1

SOT111-1

A

2

Q

A

3

A

A

4

E

seating plane

19

Z

b

e

2

b

b

1

0 5 10 mm

scale

DIMENSIONS (mm are the original dimensions)

A

UNIT A A

mm

2

max. max.

18.5

3.7

17.8

8.7

8.0

b

bcD

A

3

4

15.5

1.40

15.1

1.14

b

1

2

0.67

1.40

0.50

1.14

0.48

0.38

(1)

21.8

21.4

(1)

D

E

12

21.4

6.48

20.7

6.20

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

OUTLINE

VERSION

IEC JEDEC EIAJ

REFERENCES

SOT111-1

L

w M

eLPP

2.54

e

2.54

3.9

3.4

2.75

2.50

1

3.4

1.75

3.2

1.55

Q

c

q

q

1

15.1

4.4

14.9

4.2

EUROPEAN

PROJECTION

e

2

θ

q

w

2

5.9

0.25

5.7

ISSUE DATE

92-11-17
95-03-11

Z

1.0

(1)

θ

o

65

o

55

2002 Oct 18 14

Philips Semiconductors Product specification

Triple video output amplifier TDA6107JF

SOLDERING
Introduction to soldering through-hole mount

packages

This text gives a brief insight to wave, dip and manual
soldering.A morein-depth accountofsoldering ICscan be
found in our

Packages”

Wave soldering is the preferred method for mounting of
through-hole mount IC packages on a printed-circuit
board.

Soldering by dipping or by solder wave

The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact
with the joints for more than 5 seconds.

Suitability of through-hole mount IC packages for dipping and wave soldering methods

DBS, DIP, HDIP, SDIP, SIL suitable suitable

Note

1. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board.

“Data Handbook IC26; Integrated Circuit

(document order number 9398 652 90011).

PACKAGE

Thetotal contacttimeof successivesolder waves mustnot
exceed 5 seconds.

The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (T
printed-circuit board has been pre-heated, forced cooling
may benecessary immediately after solderingto keep the
temperature within the permissible limit.

Manual soldering

Apply the solderingiron (24 V or less) to the lead(s) of the
package, either below the seating plane or not more than
2 mm above it. If the temperature of the soldering iron bit
is less than 300 °C it may remain in contact for up to
10 seconds. If the bit temperature is between
300 and 400 °C, contact may be up to 5 seconds.

SOLDERING METHOD

DIPPING WAVE

(1)

stg(max)

). If the

2002 Oct 18 15

Philips Semiconductors Product specification

Triple video output amplifier TDA6107JF

DATA SHEET STATUS

LEVEL

DATA SHEET

STATUS

(1)

PRODUCT

STATUS

(2)(3)

DEFINITION

I Objective data Development This data sheet contains data from the objective specification for product

development. Philips Semiconductors reserves the right to change the
specification in any manner without notice.

II Preliminary data Qualification This data sheet contains data from the preliminary specification.

Supplementary data will be published at a later date. Philips
Semiconductors reserves the right to change the specification without
notice, in order to improve the design and supply the best possible
product.

III Product data Production This data sheet contains data from the product specification. Philips

Semiconductors reserves the right to make changes at any time in order
to improve the design, manufacturing and supply. Relevant changes will
be communicated via a Customer Product/Process Change Notification
(CPCN).

Notes

1. Please consult the most recently issued data sheet before initiating or completing a design.

2. The product status of the device(s) described in this data sheet may have changed since this data sheet was
published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.

3. For datasheets describingmultiple type numbers,the highest-levelproduct status determinesthe data sheet status.

DEFINITIONS

DISCLAIMERS

Short-form specification  The data in a short-form

specification is extracted from a full data sheet with the
same type number and title. For detailed information see
the relevant data sheet or data handbook.

Limiting valuesdefinition Limiting values givenare in
accordance with the Absolute Maximum Rating System
(IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device.
These are stress ratings only and operation of the device
atthese orat anyotherconditions abovethose given inthe
Characteristics sectionsof the specification isnot implied.
Exposure to limiting values for extended periods may
affect device reliability.

Application information  Applications that are
described herein for any of these products are for
illustrative purposes only. Philips Semiconductors make
norepresentation orwarrantythat suchapplicationswill be
suitable for the specified use without further testing or
modification.

Life support applications  These products are not
designed for use in life support appliances, devices, or
systems where malfunction of these products can
reasonably be expected toresult inpersonal injury.Philips
Semiconductorscustomers usingorselling theseproducts
for use in such applications do so at their own risk and
agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.

Right to make changes  Philips Semiconductors
reserves the right to make changes in the products ­including circuits, standard cells, and/or software ­described or contained herein in order to improve design
and/or performance.When theproduct isin full production
(status ‘Production’), relevant changes will be
communicated via a Customer Product/Process Change
Notification (CPCN). Philips Semiconductorsassumes no
responsibility or liability for the use of any of these
products, conveys no licence or title under any patent,
copyright, or mask work right to these products, and
makes no representations or warranties that these
products are free from patent, copyright, or mask work
right infringement, unless otherwise specified.

2002 Oct 18 16

Philips Semiconductors Product specification

Triple video output amplifier TDA6107JF

NOTES

2002 Oct 18 17

Philips Semiconductors Product specification

Triple video output amplifier TDA6107JF

NOTES

2002 Oct 18 18

Philips Semiconductors Product specification

Triple video output amplifier TDA6107JF

NOTES

2002 Oct 18 19

Philips Semiconductors – a w orldwide compan y

Contact information

For additional information please visit http://www.semiconductors.philips.com. Fax: [phone]
For sales offices addresses send e-mail to: [e-mail].

© Koninklijke Philips Electronics N.V. 2002
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information presented in thisdocument does not form part of anyquotation or contract, is believedto be accurate and reliable and maybe changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.

Printed in The Netherlands 753504/02/pp20 Date of release: 2002 Oct 18 Document order number: 9397 750 10545

SCA74