Philips TDA6106Q User Manual

INTEGRATED CIRCUITS

DATA SH EET

TDA6106Q

Video output amplifier

Product specification
File under Integrated Circuits, IC02

1997 Mar 03

Philips Semiconductors Product specification

Video output amplifier TDA6106Q

FEATURES

• No external heatsink required

• Black current measurement output for Automatic Black

current Stabilization (ABS)

• Internal 2.5 V reference circuit

• Internal protection against positive appearing CRT

GENERAL DESCRIPTION

The TDA6106Q is a monolithic video output amplifier with
a 6 MHz bandwidth and is contained in a 9-lead plastic
DIL-bent-SIL medium power package. The device uses
high-voltage DMOS technology and is intended to drive
the cathode of a CRT. To obtain maximum performance,
the amplifier should be used with black current control.

flashover discharges

• Single supply voltage of 200 V

• Simple application with a variety of colour decoders

• Controlled switch-off behaviour.

ORDERING INFORMATION

PACKAGE

TYPE NUMBER

NAME DESCRIPTION VERSION

TDA6106Q DBS9MPF plastic DIL-bent-SIL medium power package with fin; 9 leads SOT111-1

BLOCK DIAGRAM

handbook, full pagewidth

supply voltage

feedback

output

n.c.
n.c.
n.c.

inverting

input

1
2
7

3

−+

69

MIRROR 1

in out

V

bias

1× 1×

MIRROR 2

inout

TDA6106Q

DIFFERENTIAL

STAGE

out out out out in

MIRROR 3

CURRENT

SOURCE

gnd

8

cathode
output

black current

5

measurement
output

4

ground

(substrate)

MBG343

Fig.1 Block diagram.

1997 Mar 03 2

Philips Semiconductors Product specification

Video output amplifier TDA6106Q

PINNING

SYMBOL PIN DESCRIPTION

n.c. 1 not connected
n.c. 2 not connected
V

in

3 inverting input voltage
GND 4 ground, substrate
I

om

V

DD

5 black current measurement output

6 supply voltage
n.c. 7 not connected
V

oc

V

of

8 cathode output voltage

9 feedback output voltage

handbook, halfpage

n.c.
n.c.

V

GND

I

om

V

DD

n.c.

V

V

in

oc

of

1
2
3
4
5

TDA6106Q

6
7
8
9

MBG342

Fig.2 Pin configuration.

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 134); voltages with respect to pin 4 (ground) unless
otherwise specified; currents specified as in Fig.1.

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

V

DD

V

in

V

om

V

oc

V

of

I

oc(l)

I

oc(h)

P

max

T

stg

T

j

V

esd

supply voltage 0 250 V
inverting input voltage 0 8 V
black current measurement output voltage 0 6 V
cathode DC output voltage 0 V
feedback output voltage 0 V
low non-repetitive peak cathode output

current
high non-repetitive peak cathode output

current

flashover discharge = 100 µC;
note 1

flashover discharge = 100 nC;
note 2

05A

010A

DD
DD

V
V

maximum power dissipation 0 tbf W
storage temperature −55 +150 °C
junction temperature −20 +150 °C
electrostatic discharge note 3 −2000 +2000 V

note 4 −300 +300 V

Notes

1. The cathode output is protected against peak currents (caused by positive voltage peaks during high-resistance
flash) of 5 A maximum with a charge content of 100 µC.

2. The cathode output is also protected against peak currents (caused by positive voltage peaks during low-resistance
flash) of 10 A maximum with a charge content of 100 nC.

3. Human body model: equivalent to discharging a 100 pF capacitor through a 1.5 kΩ resistor.

4. Machine model: equivalent to discharging a 200 pF capacitor through a 0 Ω resistor.

1997 Mar 03 3

Philips Semiconductors Product specification

Video output amplifier TDA6106Q

HANDLING

Inputs and outputs are protected against electrostatic discharge in normal handling. However, to be totally safe, it is
desirable to take normal precautions appropriate to handling MOS devices (see

QUALITY SPECIFICATION

“Handling MOS Devices”

).

Quality specification
values”, and can be found in the

“SNW-FQ-611 part E”

“Quality reference handbook”

is applicable, except for ESD Human body model see Chapter “Limiting

(ordering number 9397 750 00192).

THERMAL CHARACTERISTICS

SYMBOL PARAMETER

R
R

th j-a
th j-c

thermal resistance from junction to ambient in free air 56 K/W
thermal resistance from junction to case 12 K/W

(1)

VALUE UNIT

Note

1. External heatsink not required.

CHARACTERISTICS

Operating range: T
Test conditions: T

= −20 to +65 °C; VDD= 180 to 210 V (see note 1), Vom= 1.4 to 6 V.

amb

=25°C; VDD= 200 V; Vom=4V; CL= 10 pF (CL consists of parasitic and cathode capacitance);

amb

measured in test circuit of Fig.5; unless otherwise specified.

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

I

DD

I

bias

V

int

I

om(os)

quiescent voltage supply current V
input bias current (pin 3) V
internal reference voltage input stage V
offset current of black current

measurement output

= 100 V 2.8 3.0 3.3 mA

ocDC

= 100 V 0 − 20 µA

ocDC

= 100 V − 2.5 − V

ocDC

Ioc=0µA;

−10 0 +10 µA
Vin= 1.5 to +3.5 V;
Vom= 1.4 to 6 V

∆V

Tint

temperature drift of internal

V

= 100 V − 0.5 − mV/K

ocDC

reference voltage input stage

∆I

om

-----------­∆I

oc

I

of(max)

V

oc(min)

V

oc(max)

linearity of current transfer I

maximum peak output current (pin 9) Voc= 20 V to VDD−30 V − 25 − mA
minimum output voltage (pin 8) Vin= 3.5 V − 712V
maximum output voltage (pin 8) Vin= 1.5 V VDD− 14 VDD− 10 − V

GB gain bandwidth product of open-loop

gain V

os/Vi, dm

BW

BW

S

L

small signal bandwidth V

large signal bandwidth V

= −10 µA to 3 mA;

oc

Vin= 1.5 to +3.5 V;
Vom= 1.4 to 6 V

f = 500 kHz;
V

= 100 V

ocDC

= 60 V (p-p);

ocAC

V

= 100 V

ocDC

= 100 V (p-p);

ocAC

V

= 100 V

ocDC

0.9 1.0 1.1

− 0.52 − GHz

56−MHz

4.7 5.7 − MHz

1997 Mar 03 4

Philips Semiconductors Product specification

Video output amplifier TDA6106Q

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

t

pd

t

r

t

f

t

s

SR slew rate between 50 and 150 V V

O

V

PSRR power supply rejection ratio f < 50 kHz; note 2 − 60 − dB

cathode output propagation delay
time 50% input to 50% output

Voc= 50 to 150 V square
wave; f < 1 MHz;
t

rin=tfin

= 40 ns;

see Figs 3 and 4

cathode output rise time 10% output
to 90% output

Voc= 50 to 150 V square
wave; f < 1 MHz;
tfin= 40 ns; see Fig.4

cathode output fall time 90% output to
10% output

settling time 50% input to
(99% < output < 101%)

Voc= 150 to 50 V square
wave; f < 1 MHz;
t

= 40 ns; see Fig.4

rin

Voc= 50 to 150 V square
wave; f < 1 MHz;
t

rin=tfin

= 40 ns;

see Figs 3 and 4

= 2 V (p-p) square

in

wave; f < 1 MHz;
t

rin=tfin

=40ns

cathode output voltage overshoot Voc= 50 to 150 V square

wave; f < 1 MHz;
t

rin=tfin

= 40 ns;

see Figs 3 and 4

38 49 60 ns

62 74 87 ns

62 74 87 ns

−−350 ns

− 1200 − V/µs

− 1 − %

Notes

1. The rating of supply voltage is 250 V, but because of flash the maximum operating range for supply voltage is 210 V.

2. PSSR: The ratio of the change in supply voltage to the change in input voltage when there is no change in output
voltage.

1997 Mar 03 5

Philips Semiconductors Product specification

Video output amplifier TDA6106Q

x

V

i

0

x

t

s

overshoot (in %)

150
140

V

oc

100

60
50

t

r

t

pd

t

151

149

t

MGA974

Fig.3 Output voltage (pin 8 rising edge) as a function of AC input signal.

1997 Mar 03 6

Philips Semiconductors Product specification

Video output amplifier TDA6106Q

x

V

i

0

x

t

s

150
140

V

oc

100

overshoot (in %)

60
50

t

f

t

pd

t

51

49

t

MGA975

Fig.4 Output voltage (pin 8 falling edge) as a function of AC input signal.

Flashover protection

The TDA6106Q incorporates a protection diode against
CRT flashover discharges that clamp the cathode output
voltage to a maximum of VDD+V

. To limit the diode

diode

current, an external 1.5 kΩ carbon high-voltage resistor in
series with the cathode output and a 2 kV spark gap are
needed (for this resistor-value, the CRT has to be
connected to the main PCB). This addition produces an
increase in the rise and fall times of approximately 7.5 ns
and a decrease in the overshoot of approximately 1.3%.

1997 Mar 03 7

to GND must be decoupled:

V

DD

1. With a capacitor larger than 20 nF with good HF
behaviour (e.g. foil). This capacitor must be placed as
close as possible to pins 6 and 4, but definitely within
5 mm.

2. With a capacitor larger than10 µF on the picture tube
base print (shared by three output stages).

Switch-off behaviour

The output pins of the TDA6106Q are still under the control
of the input pin for a supply voltage down to approximately
30 V.

Philips Semiconductors Product specification

Video output amplifier TDA6106Q

TEST AND APPLICATION INFORMATION

C

R10

par

R

fb
100 kΩ

200 V

C6

100 nF

C

n

handbook, full pagewidth

C1

V

in

22 nF

C2

22 µF

R9

866 Ω

C

par

R1
50 Ω

GND

= 150fF.

0.98 mA

Fig.5 Test circuit with feedback factor1⁄

Dissipation

With respect to dissipation, distinction must be made
between static dissipation (independent of frequency) and
dynamic dissipation (proportional to frequency).

The static dissipation of the TDA6106Q is due to supply
currents and load currents in the feedback network and
CRT.



V

of

P

stat

V

DDIDDVocIocVof



×–×+×=

-------­R



fb

Where:

= value of feedback resistor.

R

fb

Ioc= DC value of cathode current.

116

C7

3.2 pF

.

560 pF

C8

6.8 pF

C9
136 pF

R3
20 MΩ

R2
1 MΩ

probe

MBG344

6

TDA6106Q

3

45

V

om

4 V

9

8

A

The dynamic dissipation equals:

P

dyn

V

DD

CLCfbC

++()× fV

int

× b××=

op p–()

Where:

= load capacitance.

C

L

Cfb= feedback capacitance.
C

= internal load capacitance (≈ 4 pF).

int

f = input frequency.
V

= output voltage (peak-to-peak value).

o(p-p)

b = non-blanking duty-cycle.

The IC must be mounted on the picture tube base print to
minimize the load capacitance (C

).

L

1997 Mar 03 8

Philips Semiconductors Product specification

Video output amplifier TDA6106Q

INTERNAL PIN CONFIGURATION

handbook, full pagewidth

V

from

reference

circuit

DD

from

reference

circuit

from

pin 9

6.8 V

from

input

circuit

esd

from
input

circuit

from
pin 9

esd

esd

V

bias

esd

to BCS-circuit

output

flash
prot.

flash
prot.

9

V

of

8

V

oc

GND

46

TDA6106Q

3

V

in

esd

5

I

om

esd

Fig.6 Internal pin configuration.

1997 Mar 03 9

MBG345

Philips Semiconductors Product specification

Video output amplifier TDA6106Q

PACKAGE OUTLINE

DBS9MPF: plastic DIL-bent-SIL medium power package with fin; 9 leads

D

D

1

q

P

pin 1 index

P

1

q

2

q

1

SOT111-1

A

2

Q

A

3

A

A

4

E

seating plane

19

Z

b

e

2

b

b

1

0 5 10 mm

scale

DIMENSIONS (mm are the original dimensions)

A

UNIT A A

mm

2

max. max.

18.5

3.7

17.8

8.7

8.0

b

bcD

A

3

4

15.5

1.40

15.1

1.14

b

1

2

0.67

1.40

0.50

1.14

0.48

0.38

(1)

21.8

21.4

(1)

D

E

12

21.4

6.48

20.7

6.20

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

OUTLINE

VERSION

IEC JEDEC EIAJ

REFERENCES

SOT111-1

L

w M

eLPP

2.54

e

2.54

3.9

3.4

2.75

2.50

1

3.4

1.75

3.2

1.55

Q

c

q

q

1

15.1

4.4

14.9

4.2

EUROPEAN

PROJECTION

e

2

θ

q

w

2

5.9

0.25

5.7

ISSUE DATE

92-11-17
95-03-11

Z

1.0

(1)

θ

o

65

o

55

1997 Mar 03 10

Philips Semiconductors Product specification

Video output amplifier TDA6106Q

SOLDERING
Introduction

There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.

This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our

“IC Package Databook”

Soldering by dipping or by wave

The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.

DEFINITIONS

Data sheet status

Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.

(order code 9398 652 90011).

The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (T
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.

Repairing soldered joints

Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300 °C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400 °C, contact may be up to 5 seconds.

stg max

). If the

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.

1997 Mar 03 11

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© Philips Electronics N.V. 1997 SCA53
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
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under patent- or other industrial or intellectual property rights.

Internet: http://www.semiconductors.philips.com

Printed in The Netherlands 547047/1200/01/pp12 Date of release: 1997 Mar 03 Document order number: 9397 750 01869