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TDA2616
User Manual
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Philips TDA2616, TDA2616Q User Manual

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INTEGRATED CIRCUITS
DATA SH EET
TDA2616/TDA2616Q
2 x 12 W hi-fi audio power amplifiers with mute
Product specification File under Integrated Circuits, IC01
July 1994
Philips Semiconductors Product specification
2 x 12 W hi-fi audio power amplifiers
TDA2616/TDA2616Q
with mute

FEATURES

• Requires very few external components
• No switch-on/switch-off clicks
• Input mute during switch-on and switch-off
• Low offset voltage between output and ground
• Excellent gain balance of both amplifiers
• Hi-fi in accordance with IEC 268 and DIN 45500
• Short-circuit proof and thermal protected
• Mute possibility.

QUICK REFERENCE DATA

Stereo application
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
±V
P
P
O
G
v
channel unbalance − 0.2 − dB
G
v
supply voltage range 7.5 − 21 V output power VP = ±16 V; THD = 0.5% − 12 − W internal voltage gain − 30 − dB
α channel separation − 70 − dB SVRR supply voltage ripple rejection − 60 − dB V
no
noise output voltage − 70 −µV

GENERAL DESCRIPTION

The TDA2616 and TDA2616Q are dual power amplifiers. The TDA2616 is supplied in a 9-lead single-in-line (SIL9) plastic power package (SOT131), while the TDA2616Q is supplied in a 9-lead SIL-bent-to-DIL plastic power package (SOT157). They have been especially designed for mains fed applications, such as stereo radio and stereo TV.

ORDERING INFORMATION

EXTENDED TYPE
NUMBER
PINS PIN POSITION MATERIAL CODE
TDA2616 9 SIL plastic SOT131
TDA2616Q 9 SIL-bent-to-DIL plastic SOT157
Notes
1. SOT131-2; 1996 August 27.
2. SOT157-2; 1996 August 27.
PACKAGE
(1) (2)
Philips Semiconductors Product specification
2 x 12 W hi-fi audio power amplifiers with mute
handbook, full pagewidth
INV1
MUTE
1/2 V / GND
P
V
ref1
680 Ω
1
20 kΩ
– V
10 kΩ
10 kΩ
P
4 kΩ
5 kΩ
+ V
– V
V
ref3
ref2
ref2
2
+ V
P
V
3
ref1
V
A
V
B
voltage
comparator
– V
– V
TDA2616/TDA2616Q
+ V
P
7
TDA2616
20 kΩ
CM
4
OUT1
P
+ V
P
THERMAL
PROTECTION
V
V
B
A
P
20 kΩ
INV2
INV1, 2
9
8
680 Ω
V
B
V
ref1
V
A
Fig.1 Block diagram.
CM
– V
20 kΩ
5
P
MCD375 - 1
6
OUT2
Philips Semiconductors Product specification
2 x 12 W hi-fi audio power amplifiers with mute

PINNING

SYMBOL PIN DESCRIPTION
−INV1 1 non-inverting input 1 MUTE 2 mute input 1/2V
/GND 3 1/2 supply voltage or ground
P
OUT1 4 output 1
−V
P
OUT2 6 output 2 +V
P
INV1, 2 8 inverting inputs 1 and 2
−INV2 9 non-inverting input 2
handbook, halfpage
1/2 V
5 supply voltage (negative)
7 supply voltage (positive)
INV1
1
MUTE
2 3
/ GND
P
OUT1
4
V
OUT2
+ V
INV1, 2
INV2
TDA2616
5
P
6 7
P
8 9
MCD372 - 1
TDA2616/TDA2616Q

FUNCTIONAL DESCRIPTION

The TDA2616 is a hi-fi stereo amplifier designed for mains fed applications, such as stereo radio and TV. The circuit is optimally designed for symmetrical power supplies, but is also well-suited to asymmetrical power supply systems.
An output power of 2 × 12 W (THD = 0.5%) can be delivered into an 8Ωload with a symmetrical power supply of ±16 V. The gain is internally fixed at 30 dB, thus offering a low gain spread and a very good gain balance between the two amplifiers (0.2 dB).
A special feature is the input mute circuit. This circuit disconnects the non-inverting inputs when the supply voltage drops below±6 V, while the amplifier still retains its DC operating adjustment. The circuit features suppression of unwanted signals at the inputs, during switch-on and switch-off.
The mute circuit can also be activated via pin 2. When a current of 300 µA is present at pin 2, the circuit is in the mute condition.
The device is provided with two thermal protection circuits. One circuit measures the average temperature of the crystal and the other measures the momentary temperature of the power transistors. These control circuits attack at temperatures in excess of +150 °C, so a crystal operating temperature of max. +150 °C can be used without extra distortion.
With the derating value of 2.5 K/W, the heatsink can be calculated as follows:
Fig.2 Pin configuration.
at RL = 8 Ω and VP = ±16 V, the measured maximum dissipation is 14.6 W.
With a maximum ambient temperature of +65 °C, the thermal resistance of the heatsink is:
150 65–
R
----------------------
th
14.6
2.5– 3.3 K/W.==
The internal metal block has the same potential as pin 5.
Philips Semiconductors Product specification
2 x 12 W hi-fi audio power amplifiers with
TDA2616/TDA2616Q
mute

LIMITING VALUES

In accordance with the Absolute maximum System (IEC 134).
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
±V
P
I
OSM
P
tot
T
stg
T
XTAL
T
amb
t
sc
Note to the limiting values
1. For asymmetrical power supplies (with the load short-circuited), the maximum unloaded supply voltage is limited to V
P
(with the load short-circuited). For symmetrical power supplies the circuit is short-circuit-proof up to VP= ±21 V.
supply voltage − 21 V non-repetitive peak output current − 4A total power dissipation see Fig.3 − 25 W storage temperature range −55 +150 °C crystal temperature − +150 °C ambient operating temperature range −25 150 °C short circuit time short-circuit to ground; note 1 − 1h
= 28 V and with an internal supply resistance of RS≥4 Ω, the maximum unloaded supply voltage is limited to 32 V
32
handbook, halfpage
P
tot
(W)
24
16
R = 3.3 K/W
th-hs
8
0
– 25 0 50 150
Fig.3 Power derating curve.

THERMAL RESISTANCE

infinite
heatsink
100
T ( C)
amb
MCD376 - 2
o
SYMBOL PARAMETER THERMAL RESISTANCE
R
th j-a
from junction to ambient in free air 2.5 K/W
Philips Semiconductors Product specification
2 x 12 W hi-fi audio power amplifiers with
TDA2616/TDA2616Q
mute

CHARACTERISTICS

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Supply
±V
P
I
ORM
Operating position; note 1 ±V
P
I
P
P
O
THD total harmonic distortion P B power bandwidth THD = 0.5%; note 2 − 20 to
G
v
G
gain unbalance − 0.2 1 dB
v
V
no
Z
input impedance 14 20 26 kΩ
i
SVRR supply voltage ripple rejection note 4 40 60 − dB α channel separation R I
bias
∆V
GND
∆V
4-6
MUTE POSITION (AT I V
O
Z
2-7
I
P
V
no
SVRR supply voltage ripple rejection note 4 40 55 − dB ∆V
GND
∆V
off
I
2
Mute position; note 5 ±V
P
I
P
V
O
V
no
SVRR supply voltage ripple rejection note 4 40 55 − dB
supply voltage range − 16 21 V repetitive peak output current − 2.2 − A
supply voltage range 7.5 16 21 V total quiescent current RL = ∞ 18 40 70 mA output power
THD = 0.5% 10 12 − W THD = 10% 12 15 − W
= 6 W − 0.15 0.2 %
O
− Hz
20 000
voltage gain 29 30 31 dB
noise output voltage note 3 − 70 140 µV
= 0 46 70 − dB
S
input bias current − 0.3 −µA
DC output offset voltage − 30 200 mV
DC output offset voltage between two channels − 4 150 mV
≥ 300 µA)
MUTE
output voltage VI = 600 mV − 0.3 1.0 mV mute input impedance note 7 6.7 9 11.3 kΩ total quiescent current RL = ∞ 18 40 70 mA noise output voltage note 3 − 70 140 µV
DC output offset voltage − 40 200 mV
offset voltage with respect to operating
− 4 150 mV
position current if pin 2 is connected to pin 5 −− 8.2 mA
supply voltage range 2 − 5.8 V total quiescent current RL = ∞ 930 40mA output voltage VI = 600 mV − 0.3 1.0 mV noise output voltage note 3 − 70 140 µV
Philips Semiconductors Product specification
2 x 12 W hi-fi audio power amplifiers with
TDA2616/TDA2616Q
mute
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
∆V
Operating position; note 6 I
P
THD total harmonic distortion P B power bandwidth THD = 0.5%; note 2 − 40 to
G G V Z SVRR supply voltage ripple rejection 35 44 − dB α channel separation − 45 − dB
M V
Z I V SVRR supply voltage ripple rejection note 4 35 44 − dB ∆V
I
Notes to the characteristics
1. VP = ±16 V; RL = 8 Ω; T
2. The power bandwidth is measured at an output power of P
3. The noise output voltage (RMS value) is measured at RS = 2 kΩ, unweighted (20 Hz to 20 kHz)
4. The ripple rejection is measured at RS = 0 and f = 100 Hz to 20 kHz. The ripple voltage (200 mV) is applied in phase
5. ±VP = 4 V; RL = 8 Ω; T
6. VP = 24 V; RL = 8 Ω; T
7. The internal network at pin 2 is a resistor devider of typical 4 kΩand 5 kΩto the positive supply rail. At the connection
DC output offset voltage − 40 200 mV
GND
P
O
total quiescent current 18 40 70 mA output power
THD = 0.5% 5 6 − W THD = 10% 6.5 8 − W THD = 0.5%; R THD = 10%; R
= 4 W − 0.13 0.2 %
O
= 4 Ω−10 − W
L
= 4 Ω−14 − W
L
− Hz
20 000
v
gain unbalance − 0.2 1 dB
v
no
input impedance 14 20 26 kΩ
i
UTE POSITION (I
O 2-7
P
no
off
voltage gain 29 30 31 dB
noise output voltage note 3 − 70 140 µV
≥ 300 µA)
MUTE
output voltage VI = 600 mV − 0.3 1.0 mV mute input impedance note 7 6.7 9 11.3 kΩ total quiescent current 18 40 70 mA noise output voltage note 3 − 70 140 µV
offset voltage with respect to operating
− 4 150 mV
position
2
current if pin 2 is connected to pin 5 −− 8.2 mA
= 25 °C; f = 1 kHz; symmetrical power supply I
amb
− 3 dB
O max
< 30 µA. See Fig.4
MUTE
to the positive and the negative supply rails. With asymmetrical power supplies, the ripple rejection is measured at f = 1 kHz
= 25 °C; f = 1 kHz; symmetrical power supply. See Fig.4
amb
= 25 °C; f = 1 kHz; asymmetrical power supply I
amb
< 30 µA. See Fig.5
MUTE
of the 4 kΩ and 5 kΩ resistor a zener diode of typical 6.6 V is also connected to the positive supply rail. The spread of the zener voltage is 6.1 to 7.1 V.
Philips Semiconductors Product specification
2 x 12 W hi-fi audio power amplifiers with mute
V
V
I
I
mute input
220 nF
220 nF
72
20 kΩ680 Ω
1
20 kΩ
3
20 kΩ
9
8
TDA2616
20 kΩ680 Ω
5
handbook, full pagewidth
TDA2616/TDA2616Q
+ V
P
2200 µF
4
22 nF
8.2 Ω
6
22 nF
8.2 Ω
R = 8 Ω
L
R = 8 Ω
L
100 nF
2200 µF
Fig.4 Test and application circuit with symmetrical power supply.
MCD374 - 3
– V
P
Philips Semiconductors Product specification
2 x 12 W hi-fi audio power amplifiers with mute
V
internal
1/2 V
P
72
20 kΩ680 Ω
P
handbook, full pagewidth
V
I
V
I
100 µF
mute input
220 nF
220 nF
2
1
20 kΩ
3
20 kΩ
9
TDA2616
4
6
100 nF
TDA2616/TDA2616Q
R
S
V
S
2200 µF
22 nF
8.2 Ω
680 µF
R = 8 Ω
L
22 nF
8
20 kΩ680 Ω
8.2 Ω
5
680 µF
R = 8 Ω
L
MCD373 - 2
Fig.5 Test and application circuit with asymmetrical power supply.
Philips Semiconductors Product specification
2 x 12 W hi-fi audio power amplifiers with mute

PACKAGE OUTLINES

SIL9P: plastic single in-line power package; 9 leads
D
d
j
TDA2616/TDA2616Q
non-concave
x
E
h
view B: mounting base side
A
B
D
h
2
E

SOT131-2

seating plane
b
19
Z
DIMENSIONS (mm are the original dimensions)
A
UNIT A
mm
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
1
max.
2.0
OUTLINE VERSION
SOT131-2
4.6
4.2
e
b
b
cD
max.
1.1
p2
0.75
0.48
0.60
0.38
IEC JEDEC EIAJ
b
p
(1)
24.0
23.6
REFERENCES
w M
0 5 10 mm
scale
deD
h
20.0
10 2.54
19.6
E
12.2
11.8
A
1
L
c
Q
(1)
E
h
6
3.4
3.1
Lj
Q
17.2
2.1
16.5
1.8
EUROPEAN
PROJECTION
0.25w0.03
ISSUE DATE
92-11-17 95-03-11
(1)
Z
x
2.00
1.45
July 1994 10
Philips Semiconductors Product specification
2 x 12 W hi-fi audio power amplifiers with mute
DBS9P: plastic DIL-bent-SIL power package; 9 leads (lead length 12 mm)
non-concave
D
d
x
E
h
TDA2616/TDA2616Q
D
h
view B: mounting base side
A
2

SOT157-2

j
19
e
0.75
0.60
1
e
cD
0.48
24.0
0.38
23.6
(1)
deD
20.0
19.6
Z
DIMENSIONS (mm are the original dimensions)
UNIT A A e
17.0
15.5
4.6
4.2
mm
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
w M
b
p
E
h
12.2
10 5.08
11.8
0 5 10 mm
scale
(1)
12bp
2.54
e
5.08
B
E
A
L
3
L
E
2
h
6
Q
LL3m
3.4
12.4
3.1
11.0
c
2.4
1.6
e
4.3
2.1
1.8
v M
(1)
v
Qj
0.8
0.25w0.03
Z
x
2.00
1.45
2
m
OUTLINE
VERSION
SOT157-2
IEC JEDEC EIAJ
REFERENCES
July 1994 11
EUROPEAN
PROJECTION
ISSUE DATE
92-10-12 95-03-11
Philips Semiconductors Product specification
2 x 12 W hi-fi audio power amplifiers with mute
SOLDERING Introduction
There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used.
This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in
“IC Package Databook”
our
Soldering by dipping or by wave
The maximum permissible temperature of the solder is 260 °C; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds.
(order code 9398 652 90011).
TDA2616/TDA2616Q
The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (T printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit.
Repairing soldered joints
Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds.
stg max
). If the

DEFINITIONS

Data sheet status
Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.
July 1994 12
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