Philips TDA2614 User Manual

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Page 1

INTEGRATED CIRCUITS

DATA SH EET

TDA2614

6 W hi-fi audio power amplifier

Product speciﬁcation File under Integrated Circuits, IC01

July 1994

Page 2

Philips Semiconductors Product speciﬁcation

6 W hi-ﬁ audio power ampliﬁer TDA2614

FEATURES

• Requires very few external components

• No switch-on/switch-off clicks

• Input mute during switch-on and switch-off

GENERAL DESCRIPTION

The TDA2614 is a power amplifier in a 9-lead single-in-line (SIL9) plastic medium power package. It has been especially designed for mains fed applications, such as TV and radio.

• Low offset voltage between output and ground

• Hi-fi in accordance with IEC 268 and DIN 45500

• Short-circuit proof and thermal protected

• Mute possibility.

QUICK REFERENCE DATA

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

positive supply voltage range 15 − 42 V output power VS = 24 V; THD = 0.5% − 6.5 − W

internal voltage gain − 30 − dB SVRR supply voltage ripple rejection − 45 − dB V

noise output voltage − 70 −µV

ORDERING INFORMATION

EXTENDED TYPE

NUMBER

PINS PIN POSITION MATERIAL CODE

TDA2614 9 SIL plastic SOT110

PACKAGE

(1)

Note

1. SOT110-1; 1996 August 21.

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Philips Semiconductors Product speciﬁcation

6 W hi-ﬁ audio power ampliﬁer TDA2614

+ V

handbook, full pagewidth

MUTE

1/2 V / GND

INV

– V

20 kΩ

680 Ω

10 kΩ

4 kΩ

5 kΩ

+ V

– V

ref3

ref2

voltage

comparator

– V

+ V

20 kΩ

TDA2614

THERMAL

PROTECTION

OUT

+ V

ref1

n.c.

ref1

Fig.1 Block diagram.

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substrate

GND / V

MCD371 - 1

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Philips Semiconductors Product speciﬁcation

6 W hi-ﬁ audio power ampliﬁer TDA2614

PINNING

SYMBOL PIN DESCRIPTION

n.c. 1 not connected MUTE 2 mute input 1/2V

/GND 3 1/2 supply (or ground at

symmetrical power supplies) n.c. 4 not connected GND/−V

5 ground (or negative supply rail at

symmetrical power supplies) OUT 6 output V

7 supply voltage

INV 8 inverting input

−INV 9 non-inverting input

handbook, halfpage

1/2 V

GND / – V

/ GND

n.c.

MUTE

n.c.

OUT

INV

– INV

2 3 4

TDA2614

MCD367 - 1

FUNCTIONAL DESCRIPTION

The TDA2614 is a hi-fi power amplifier designed for mains fed applications, such as radio and TV. The circuit is optimally designed for asymmetrical power supplies, but is also well-suited to symmetrical power supply systems.

An output power of 6 W (THD = 0.5%) can be delivered into an 8 Ω load with a supply of 24 V. The gain is internally fixed at 30 dB, thus offering a low gain spread.

A special feature is the input mute circuit. This circuit disconnects the non-inverting input when the supply voltage drops below 10 V, while the amplifier still retains its DC operating adjustment. The circuit features suppression of unwanted signals at the input, during switch-on and switch-off.

The mute circuit can also be activated via pin 2. When a current at 300 µA is present at pin 2, the circuit is in the mute condition.

The device is provided with two thermal protection circuits. One circuit measures the average temperature of the crystal and the other measure the momentary temperature of the power transistors. These control circuits attack at temperatures in excess of 150 °C, so a crystal operating temperature of max. 150 °C can be used without extra distortion.

With the derating value of 8 K/W, the heatsink can be calculated as follows:

at RL=8Ωand VS= 24 V, dissipation is 4.1 W. With a maximum ambient temperature of 60 °C, the

thermal resistance of the heatsink is:

150 60–

----------------------

4.1

8– 14 K/W.==

Fig.2 Pin configuration.

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Philips Semiconductors Product speciﬁcation

6 W hi-ﬁ audio power ampliﬁer TDA2614

LIMITING VALUES

In accordance with the Absolute maximum System (IEC 134).

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

OSM

tot

stg

XTAL

amb

Note to the limiting values

1. For asymmetrical power supplies (with the load short-circuited), the maximum unloaded supply voltage is limited to V

32 V (with the load short-circuited). For symmetrical power supplies, the circuit is short-circuit-proof up to VP= ±21 V.

positive supply voltage − 42 V non-repetitive peak output current − 4A total power dissipation see Fig.3 − 15 W storage temperature range −55 +150 °C crystal temperature −+150 °C ambient operating temperature range −25 +150 °C short circuit time short circuit to ground; note 1 − 1h

= 28 V, and with an internal supply resistance of RS≥ 4 Ω, the maximum unloaded supply voltage is limited to

handbook, halfpage

tot

(W)

R = 14 K/W

th-hs

– 25 0 50 150

Fig.3 Power derating curve.

MGA091 - 2

infinite heatsink

100

T ( C)

amb

THERMAL RESISTANCE

SYMBOL PARAMETER

th j-c

from junction to case 8 K/W

THERMAL

RESISTANCE

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Philips Semiconductors Product speciﬁcation

6 W hi-ﬁ audio power ampliﬁer TDA2614

CHARACTERISTICS

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Supply

ORM

Operating position; note 1 V

THD total harmonic distortion P B power bandwidth THD = 0.5%; note 2 − 30 to − Hz

|∆V

3-6

| input impedance 14 20 26 kΩ

SVRR supply voltage ripple rejection note 4 35 45 − dB I

bias

MUTE POSITION (AT I V

2-7

SVRR supply voltage ripple rejection note 4 35 44 − dB |∆V

3-6

|∆V

off

Mute position; note 5 V

SVRR supply voltage ripple rejection note 4 35 44 − dB |∆V

3-6

supply voltage range − 24 42 V repetitive peak output current − 2.2 − A

supply voltage range 15 24 42 V total quiescent current 10 20 35 mA output power

THD = 0.5% 5 6.5 − W THD = 10% 6.5 8.5 − W THD = 0.5%; R THD = 10%; R

= 4 W − 0.15 0.2 %

= 4 Ω− 10 − W

= 4 Ω− 14 − W

20 000

voltage gain 29 30 31 dB

| DC output offset voltage − 30 200 mV

noise output voltage note 3 − 70 140 µV

input bias current − 0.3 −µA

≥ 300 µA)

MUTE

output voltage VI = 600 mV − 0.1 1.0 mV mute input impedance − 9 − kΩ total quiescent current 10 20 35 mA noise output voltage note 3 − 70 140 µV

| DC output offset voltage − 40 200 mV

| offset voltage with respect to

− 4 150 mV

operating position current if pin 2 is connected to pin 5 −− 6mA

positive supply voltage range 4 − 10 V total quiescent current RL = ∞ 515 20mA output voltage VI = 600 mV − 0.1 1.0 mV noise output voltage note 3 − 70 140 µV

| DC output offset voltage − 40 200 mV

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Philips Semiconductors Product speciﬁcation

6 W hi-ﬁ audio power ampliﬁer TDA2614

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Operating position; note 6

±V

THD total harmonic distortion P B power bandwidth THD = 0.5%; note 2 − 40 to − Hz

| input impedance 14 20 26 kΩ

SVRR supply voltage ripple rejection 40 55 − dB I

bias

GND

MUTE POSITION (AT I V

2-7

SVRR supply voltage ripple rejection note 4 40 55 − dB |∆V

GND

|∆V

off

Notes to the characteristics

1. VP = 24 V; RL = 8 Ω; T

2. The power bandwidth is measured at an output power of P

3. The noise output voltage (RMS value) is measured at RS = 2 kΩ, unweighted (20 Hz to 20 kHz).

4. The ripple rejection is measured at RS = 0 and f = 100 Hz to 20 kHz, at a ripple voltage of 200 mV. With symmetrical power supplies, the ripple (200 mV) is applied in phase to the positive and the negative supply rails. With asymmetrical power supplies, the ripple rejection is measured at f = 1 kHz.

5. VP = 8 V; RL = 8 Ω; T

6. ±VP = 12 V; RL = 8 Ω; T

7. The internal network at pin 2 is a resistor devider of typical 4 kΩand 5 kΩto the positive supply rail. At the connection of the 4 kΩ and 5 kΩ resistor a zener diode of typical 6.6 V is also connected to the positive supply rail. The spread of the zener voltage is 6.1 to 7.1 V.

supply voltage range 7.5 12 21 V total quiescent current 10 20 35 mA output power

THD = 0.5% 5 6.5 − W THD = 10% 6.5 8 − W

= 4 W − 0.13 0.2 %

20000 voltage gain 29 30 31 dB noise output voltage note 3 − 70 140 µV

input bias current − 0.3 −µA

| DC output offset voltage − 30 200 mV

≥ 300 µA)

MUTE

output voltage VI = 600 mV − 0.1 1.0 mV mute input impedance note 7 6.7 9 11.3 kΩ total quiescent current RL = ∞ 10 20 35 mA noise output voltage note 3 − 70 140 µV

| DC output offset voltage − 40 200 mV

| offset voltage with respect to

− 4 150 mV

operating position current if pin 2 is connected to pin 5 −− 6mA

= 25 °C; f = 1 kHz; asymmetrical power supply I

amb

− 3 dB.

O max

= 25 °C; f = 1 kHz; asymmetrical power supply. See Fig.5

amb

= 25 °C; f = 1 kHz; symmetrical power supply I

amb

< 30 µA. See Fig.5

MUTE

< 30 µA. See Fig.4

MUTE

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Philips Semiconductors Product speciﬁcation

6 W hi-ﬁ audio power ampliﬁer TDA2614

handbook, full pagewidth

mute input

680 µF

TDA2614

20 kΩ

220 nF

20 kΩ680 Ω

22 nF

8.2 Ω

680 µF

Fig.4 Test and application circuit with symmetrical power supply.

R = 8 Ω

100 nF

MCD370

+ V

– V

internal

1/2

20 kΩ

handbook, full pagewidth

100 µF

mute input

220 nF

20 kΩ

680 Ω

Fig.5 Test and application circuit with asymmetrical power supply.

July 1994 8

TDA2614

100 nF

22 nF

8.2 Ω

680 µF

R = 8 Ω

MCD369

Page 9

Philips Semiconductors Product speciﬁcation

6 W hi-ﬁ audio power ampliﬁer TDA2614

PACKAGE OUTLINE

SIL9MPF: plastic single in-line medium power package with fin; 9 leads

pin 1 index

SOT110-1

seating plane

0 5 10 mm

scale

DIMENSIONS (mm are the original dimensions)

UNIT

18.5

17.8

max.

3.7

8.7

8.0

15.8

15.4

0.67

0.50

1.40

1.14

bcD

1.40

1.14

0.48

0.38

21.8

21.4

(1)

21.4

20.7

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

OUTLINE

VERSION

IEC JEDEC EIAJ

REFERENCES

SOT110-1

w M

(1)

eLPP

6.48

6.20

2.54

3.9

3.4

(1)

0.25

max.

1.0

2.75

2.50

3.4

3.2

1.75

15.1

1.55

14.9

EUROPEAN

PROJECTION

q1q

5.9

4.4

5.7

4.2

ISSUE DATE

92-11-17 95-02-25

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Philips Semiconductors Product speciﬁcation

6 W hi-ﬁ audio power ampliﬁer TDA2614

SOLDERING Introduction

There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used.

This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in

“IC Package Databook”

our

Soldering by dipping or by wave

The maximum permissible temperature of the solder is 260 °C; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds.

DEFINITIONS

Data sheet status

Objective speciﬁcation This data sheet contains target or goal speciﬁcations for product development. Preliminary speciﬁcation This data sheet contains preliminary data; supplementary data may be published later. Product speciﬁcation This data sheet contains ﬁnal product speciﬁcations.

(order code 9398 652 90011).

The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (T printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit.

Repairing soldered joints

Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds.

stg max

). If the

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the speciﬁcation is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the speciﬁcation.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.

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