INTEGRATED CIRCUITS
DATA SH EET
TDA2613
6 W hi-fi audio power amplifier
Product specification
File under Integrated circuits, IC01
July 1994
Philips Semiconductors Product specification
6 W hi-fi audio power amplifier TDA2613
GENERAL DESCRIPTION
The TDA2613 is a hi-fi audio power amplifier encapsulated in a 9-lead SIL plastic power package. The device is
especially designed for mains fed applications (e.g. tv and radio).
Features
• Requires very few external components
• Input muted during power-on and off
(no switch-on or switch-off clicks)
• Low offset voltage between output and ground
• Hi-fi according to IEC 268 and DIN 45500
• Short-circuit-proof
• Thermally protected.
QUICK REFERENCE DATA
Supply voltage range V
P
15 to 42 V
Output power at THD = 0,5%,
VP = 24 V P
Voltage gain G
o
v
typ. 6 W
typ. 30 dB
Supply voltage ripple rejection SVRR typ. 60 dB
Noise output voltage V
no(rms)
typ. 70 µV
PACKAGE OUTLINE
TDA2613: 9-lead SIL; plastic power (SOT110B); SOT110-1; 1996 August 07.
July 1994 2
Philips Semiconductors Product specification
6 W hi-fi audio power amplifier TDA2613
Fig.1 Block diagram.
PINNING
1. n.c. not connected
2. n.c. not connected negative supply (symmetrical)
1
3. V
/2
P
⁄2 VP (asymmetrical) or 6. OUT output
ground (symmetrical) 7. +V
5. GND
P
ground (asymmetrical) or
positive supply
4. n.c. not connected 8. INV inverting input
9. −INV non-inverting input
July 1994 3
Philips Semiconductors Product specification
6 W hi-fi audio power amplifier TDA2613
FUNCTIONAL DESCRIPTION
This hi-fi power amplifier is designed for mains fed applications. The device is intended for asymmetrical power supplies,
but a symmetrical supply may also be used. An output power of 6 watts (THD = 0,5%) can be delivered into an 8 Ω load
with an asymmetrical power supply of 24 V.
The gain is fixed internally at 30 dB. Internal gain fixing gives low gain spread.
A special feature of this device is a mute circuit which suppresses unwanted input signals during switching on and off.
Referring to Fig.4, the 100 µF capacitor creates a time delay when the voltage at pin 3 is lower than an internally fixed
reference voltage. During the delay the amplifier remains in the DC operating mode but is isolated from the non-inverting
input on pin 9.
Two thermal protection circuits are provided, one monitors the average junction temperature and the other the
instantaneous temperature of the power transistors. Both protection circuits activate at 150 °C allowing safe operation to
a maximum junction temperature of 150 °C without added distortion.
RATINGS
Limiting values in accordance with the Absolute Maximum System (IEC 134)
PARAMETER CONDITIONS SYMBOL MIN. MAX. UNIT
Supply voltage V
P
− 42 V
Non-repetitive peak
output current I
Total power dissipation see Fig.2 P
Storage temperature range T
Junction temperature T
OSM
tot
stg
j
− 4A
−55 + 150 °C
− 150 °C
Short-circuit time: see note
outputs short-circuited
to ground
(full signal drive) t
sc
− 1 hour
Note to the Ratings
For asymmetrical power supplies (at short-circuiting of the load) the maximum supply voltage is limited to V
= 28 V.
P
If the total internal resistance of the supply (RS) ≥ 4 Ω, the maximum unloaded supply voltage is increased to 32 V.
For symmetrical power supplies the circuit is short-circuit proof to VP = ± 21 V.
July 1994 4
Philips Semiconductors Product specification
6 W hi-fi audio power amplifier TDA2613
Fig.2 Power derating curve.
THERMAL RESISTANCE
From junction to case R
HEATSINK DESIGN EXAMPLE
With derating of 8 K/W, the value of heatsink thermal resistance is calculated as follows:
given RL = 8 Ω and VP = 24 V, the measured maximum dissipation is 4,1 W; then, for a maximum ambient temperature
of 60 °C, the required thermal resistance of the heatsink is:
R
th h-a
Note: The metal tab (heatsink) has the same potential as pin 5 (GND).
150 60–
---------------------41,
814K/W≈–=
th j-c
= 8 K/W
July 1994 5
Philips Semiconductors Product specification
6 W hi-fi audio power amplifier TDA2613
CHARACTERISTICS
PARAMETER CONDITIONS SYMBOL MIN. TYP. MAX. UNIT
Supply voltage range
operating mode V
input mute mode V
P
P
Repetitive peak
output current I
ORM
Operating mode: asymmetrical power supply; test circuit as per Fig.4;
VP = 24 V; RL = 8 Ω; T
Total quiescent current I
Output power THD = 0,5% P
= 25 °C; f = 1 kHz
amb
THD = 10% P
tot
o
o
Total harmonic
distortion P
= 4 W THD − 0,15 0,2 %
o
Power bandwidth THD = 0,5%;
note 1 B − 20 to 16 k − Hz
Voltage gain G
v
Noise output voltage
(r.m.s. value);
unweighted (20 Hz
to 20 kHz) R
Input impedance |Z
= 2 kΩ V
S
no(rms)
|142026kΩ
i
Supply voltage
ripple rejection note 2 SVRR 35 44 − dB
Input bias current I
ib
DC output offset with respect
voltage to VP/2 V
os
Input mute mode: asymmetrical power supply; test circuit as per Fig.4;
VP = 8 V; RL = 8 Ω; T
Total quiescent current I
Output voltage V
= 25 °C; f = 1 kHz
amb
= 600 mV V
i
tot
out
Noise output voltage
(r.m.s. value);
unweighted (20 Hz
to 20 kHz) R
= 2 kΩ V
S
no(rms)
Supply voltage
ripple rejection note 2 SVRR 35 55 − dB
DC output offset with respect
voltage to V
/2 V
P
os
15 24 42 V
4 − 10 V
2.2 −−A
10 20 35 mA
56 −W
6,5 8,0 − W
29 30 31 dB
− 70 140 µV
− 0,3 −µA
− 30 200 mV
515 20mA
− 2,0 2,8 mV
− 70 140 µV
− 40 200 mV
July 1994 6
Philips Semiconductors Product specification
6 W hi-fi audio power amplifier TDA2613
PARAMETER CONDITIONS SYMBOL MIN. TYP. MAX. UNIT
Operating mode: symmetrical power supply; test circuit as per Fig.3;
V
= ± 12 V; RL = 8 Ω; T
P
Total quiescent current I
Output power THD = 0,5% P
Total harmonic distortion P
Power bandwidth THD = 0,5%
Voltage gain G
Noise output voltage
(r.m.s. value);
unweighted (20 Hz to
20 kHz) R
Input impedance |Z
Supply voltage
ripple rejection SVRR 40 60 − dB
DC output offset with respect
voltage to ground V
= 25 °C; f = 1 kHz
amb
tot
o
THD = 10% P
= 4 W THD − 0,13 0,2 %
o
o
10 20 35 mA
56 −W
6,5 8,5 − W
note 1 B − 40 to 16 k − Hz
29 30 31 dB
− 70 140 µV
− 30 200 mV
= 2 kΩ V
S
v
no(rms)
|142026kΩ
i
os
Notes to the characteristics
1. Power bandwidth at P
o max
−3 dB.
2. Ripple rejection at RS = 0 Ω, f = 100 Hz to 20 kHz;
ripple voltage = 200 mV (r.m.s. value) applied to positive or negative supply rail.
July 1994 7
Philips Semiconductors Product specification
6 W hi-fi audio power amplifier TDA2613
APPLICATION INFORMATION
Fig.3 Test and application circuit; symmetrical power supply.
Fig.4 Test and application circuit; asymmetrical power supply.
July 1994 8
Philips Semiconductors Product specification
6 W hi-fi audio power amplifier TDA2613
Input mute circuit
The input mute circuit operates only during switching on and off of the supply voltage. The circuit compares the1⁄2supply
voltage (at pin 3) with an internally fixed reference voltage (V
voltage at pin 3 is lower than V
is determined by an internal voltage divider and the external 100 µF capacitor.
During switching on, a time delay is created between the reference voltage and the voltage at pin 3, during which the
input terminal is disconnected, (as illustrated in Fig.5).
the non-inverting input (pin 9) is disconnected from the amplifier. The voltage at pin 3
ref
), derived directly from the supply voltage. When the
ref
Fig.5 Input mute circuit; time delay.
July 1994 9
Philips Semiconductors Product specification
6 W hi-fi audio power amplifier TDA2613
PACKAGE OUTLINE
SIL9MPF: plastic single in-line medium power package with fin; 9 leads
D
D
1
q
P
pin 1 index
P
1
q
2
q
1
SOT110-1
A
2
A
3
A
A
4
E
seating plane
19
Z
b
e
2
b
b
1
0 5 10 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
mm
A
18.5
17.8
max.
3.7
2
A
8.7
8.0
A
3
4
15.8
15.4
b
0.67
0.50
b
1
2
1.40
1.14
bcD
1.40
1.14
0.48
0.38
21.8
21.4
(1)
D
1
21.4
20.7
A
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
IEC JEDEC EIAJ
REFERENCES
SOT110-1
w M
(1)
E
eLPP
6.48
6.20
2.54
3.9
3.4
L
c
Q
(1)
w
0.25
Z
max.
1.0
2.75
2.50
1
3.4
3.2
q
Q
1.75
15.1
1.55
14.9
EUROPEAN
PROJECTION
q1q
2
5.9
4.4
5.7
4.2
ISSUE DATE
92-11-17
95-02-25
July 1994 10
Philips Semiconductors Product specification
6 W hi-fi audio power amplifier TDA2613
SOLDERING
Introduction
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
“IC Package Databook”
our
Soldering by dipping or by wave
The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.
DEFINITIONS
(order code 9398 652 90011).
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (T
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
Repairing soldered joints
Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300 °C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400 °C, contact may be up to 5 seconds.
stg max
). If the
Data sheet status
Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
July 1994 11
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