I.F. amplifier and demodulator for
multistandard TV receivers
Product specification
File under Integrated Circuits, IC02
April 1985
Page 2
Philips SemiconductorsProduct specification
I.F. amplifier and demodulator for
TDA2549
multistandard TV receivers
GENERAL DESCRIPTION
The TDA2549 is a complete i.f. circuit with a.f.c., a.g.c., demodulation and video preamplification facilities for
multistandard television receivers. It is capable of handling positively and negatively modulated video signals in both
colour and black/white receivers.
Features
• Gain-controlled wide-band amplifier providing complete i.f. gain
• Synchronous demodulator for positive and negative modulation
• Video preamplifier with noise protection for negative modulation
• Auxiliary video input and output (75 Ω)
• Video switch to select between auxiliary video input signal and demodulated video signal
• A.F.C. circuit with on/off switch and inverter switch
• A.G.C. circuit for positive modulation (mean level) and negative modulation (noise gate)
• A.G.C. output for controlling MOSFET tuners
QUICK REFERENCE DATA
Supply voltage (pins 13 and 21)V
Supply current (pins 13 and 21)I
I.F. input signal at V
=2 V
o
(between pins 6 and 7)V
Video output voltage at V
=0 V
i
P=V13;21-3
P=I13;21-3
i=V6-7
(between pins 22 and 3)
positive modulationV
negative modulationV
Gain control rangeG
Signal-to-noise ratio at V
= 10 mVS/Ntyp.57dB
i
A.F.C. output voltage swing (pin 15)V
o=V22-3
o=V22-3
v
15-3
Max. tuner a.g.c. output current
(pin 10)I
10
Video bandwidth (3 dB)Btyp.5,5MHz
Auxiliary video input voltage (pin 12)
= 2 V (peak-to-peak value)V
at V
o
12-3(p-p)
Auxiliary video output impedance
(pin 14)|Z
|typ.7Ω
14-3
Auxiliary video output voltage
(pin 14)V
14-3
typ.12V
typ.82mA
typ.50µV
typ.2V
typ.4V
typ.74dB
min.10V
min.0,3mA
typ.1V
typ.2V
PACKAGE OUTLINE
24-lead DIL; plastic (SOT101A); SOT101-1; 1996 November 19.
April 19852
Page 3
Philips SemiconductorsProduct specification
I.F. amplifier and demodulator for
multistandard TV receivers
TDA2549
Fig.1 Block diagram.
April 19853
Page 4
Philips SemiconductorsProduct specification
I.F. amplifier and demodulator for
TDA2549
multistandard TV receivers
RATINGS
Limiting values in accordance with the Absolute Maximum System (IEC 134)
Supply voltage (pins 13 and 21)V
Storage temperature rangeT
Operating ambient temperature rangeT
P
stg
amb
CHARACTERISTICS (measured in fig.5)
= 12 V; T
V
P
amb
=25°C
PARAMETERSYMBOLMIN.TYP.MAX.UNIT
Supply voltage rangeV
Supply current (pins 13 and 21)I
I.F. input signal for V
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
A
A
UNIT
inches
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
max.
mm
OUTLINE
VERSION
SOT101-1
12
min.
max.
1.7
1.3
0.066
0.051
IEC JEDEC EIAJ
051G02MO-015AD
b
b
1
0.53
0.38
0.021
0.015
0.32
0.23
0.013
0.009
REFERENCES
cD E eM
32.0
31.4
1.26
1.24
12
scale
14.1
13.7
0.56
0.54
E
(1)(1)
e
L
3.9
3.4
EUROPEAN
PROJECTION
M
15.80
15.24
0.62
0.60
E
17.15
15.90
0.68
0.63
1
0.15
0.13
H
w
0.252.5415.24
0.010.100.60
ISSUE DATE
92-11-17
95-01-23
Z
max.
2.25.10.514.0
0.0870.200.0200.16
(1)
April 19858
Page 9
Philips SemiconductorsProduct specification
I.F. amplifier and demodulator for
TDA2549
multistandard TV receivers
SOLDERING
Introduction
There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and
surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for
surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often
used.
This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our
“IC Package Databook”
Soldering by dipping or by wave
The maximum permissible temperature of the solder is 260 °C; solder at this temperature must not be in contact with the
joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds.
The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the
specified maximum storage temperature (T
be necessary immediately after soldering to keep the temperature within the permissible limit.
Repairing soldered joints
Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more
than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to
10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds.
(order code 9398 652 90011).
). If the printed-circuit board has been pre-heated, forced cooling may
stg max
DEFINITIONS
Data sheet status
Objective specificationThis data sheet contains target or goal specifications for product development.
Preliminary specificationThis data sheet contains preliminary data; supplementary data may be published later.
Product specificationThis data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
April 19859
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