Philips TDA1576T User Manual

INTEGRATED CIRCUITS

DATA SH EET

TDA1576T

FM/IF amplifier/demodulator circuit

Product specification
Supersedes data of February 1991
File under Integrated Circuits, IC01

1998 Nov 18

Philips Semiconductors Product specification

FM/IF amplifier/demodulator circuit TDA1576T

FEATURES

• Fully balanced 4-stage limiting IF amplifier

• Symmetrical quadrature demodulator

• Field strength indication output for 1 mA ammeter

GENERAL DESCRIPTION

The TDA1576T is a monolithic integrated FM/IF amplifier
circuit for use in mono and stereo FM-receivers of car
radios or home sets.

• Detune detector for side response and noise attenuation

• Detune voltage output

• Internal muting circuit

• 0° and 180° AF output signals

• Reference voltage output

• Electronic smoothing of the supply voltage.

QUICK REFERENCE DATA

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

V

P

I

P

V

iIF(rms)

supply voltage (pin 1) 7.5 8.5 15 V
supply current 10 16 23 mA
input sensitivity (RMS value) −3 dB before limiting 14 22 35 µV

S/N = 26 dB − 10 −µV
S/N = 46 dB − 55 −µV

V

oAF(rms)

THD total harmonic distortion with double

AF output voltage (RMS value) 60 67 75 mV

− 0.02 − %

resonant circuits

S/N signal-to-noise ratio V

α

AM

AM suppression − 50 − dB

>1mV − 72 − dB

i

RR ripple rejection f = 100 Hz 43 48 − dB
I

15

T

amb

maximum indicator output current −−2mA
operating ambient temperature −30 − +80 °C

ORDERING INFORMATION

TYPE

NUMBER

NAME DESCRIPTION VERSION

PACKAGE

TDA1576T SO20 plastic small outline package; 20 leads; body width 7.5 mm SOT163-1

1998 Nov 18 2

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1998 Nov 18 3

BLOCK DIAGRAM

FM/IF amplifier/demodulator circuit TDA1576T

Philips Semiconductors Product specification

handbook, full pagewidth

2 V (RMS)

R

V

iIF

V

P

S

R

S

V

GND

20 19

25
kΩ

25
kΩ

V1 V2

V

+8.5 V

10 Ω

0.1 µF 47 µF

0.1 µF

FB1

TDA1576T

8.3 kΩ

P

0.1 µF

V

FB2

18

4-STAGE
LIMITER/

AMPLIFIER

PS

V

iIF

17

33 pF

560 pF

zero adjustment

of

field strength

indicator

V

F0

16

LEVEL DETECTOR

MUTE

ATTENUATOR

QUADRATURE

DEMODULATOR

RES1IF1C

QL = 20
fo = 10.7 MHz

1 mA

3.6 kΩ

V
15

FMON

RES2 IF2 V

FM
on

33 pF

field strength

detune
voltage

reference

voltage

1 nF 0.47 µF

F

+4.9 V
V

ref

14

REFERENCE

VOLTAGE

7654321

V

0.5
mA

AF

3.7 kΩ

oAF1

V

o(det)

13

DETUNE

DETECTOR

V2

3.7 kΩ

V

6.8 nF

audio

outputs

oAF2

−V

AF

V
12

i(det)

n.c.
11

1098
n.c.

MEH139

Fig.1 Block diagram.

Philips Semiconductors Product specification

FM/IF amplifier/demodulator circuit TDA1576T

PINNING

SYMBOL PIN DESCRIPTION

V

P

C

PS

IF1 3 IF signal to resonant circuit
RES1 4 resonant circuit input 1
FMON 5 FM-ON, standby switch
RES2 6 resonant circuit input 2
IF2 7 IF signal to resonant circuit
V

oAF1

V

oAF2

n.c. 10 not connected
n.c. 11 not connected
V

i(det)

V

o(det)

V

ref

V

F

V

F0

V

iIF

V

FB2

V

FB1

GND 20 ground (0 V)

1 positive supply voltage
2 smoothing capacitor of power supply

8 AF output voltage 1 (0° phase)
9 AF output voltage 2 (180° phase)

12 detune detector input voltage for

external audio reference
13 detune detector output voltage
14 reference voltage output
15 level output for field strength
16 zero adjust voltage for field strength
17 FM/IF input signal voltage
18 DC feedback 2
19 DC feedback 1

handbook, halfpage

V

1

P

C

2

PS

IF1

3

RES1

4

FMON

5

RES2

IF2

V

oAF1

V

oAF2

n.c. n.c.

TDA1576T

6
7
8
9

10

MEH140

Fig.2 Pin configuration.

20

GND

19

V

FB1

V

18

FB2

V

17

iIF

V

16

F0

V

15

F

V

14

ref

V

13

o(det)

V

12

i(det)

11

1998 Nov 18 4

Philips Semiconductors Product specification

FM/IF amplifier/demodulator circuit TDA1576T

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 134).

SYMBOL PARAMETER MIN. MAX. UNIT

V

P

V

2, 5,16

P

tot

T

stg

T

amb

THERMAL CHARACTERISTICS

SYMBOL PARAMETER VALUE UNIT

R

th j-a

supply voltage (pin 1) 0 15 V
voltage on pins 2, 5 and 16 0 V

P

V
total power dissipation 0 450 mW
storage temperature −55 +150 °C
operating ambient temperature −30 +80 °C

thermal resistance from junction to ambient in free air 85 K/W

1998 Nov 18 5

Philips Semiconductors Product specification

FM/IF amplifier/demodulator circuit TDA1576T

CHARACTERISTICS

V

= 8.5 V; fIF= 10.7 MHz; RS=60Ω; fm= 400 Hz with ∆f=±22.5 kHz; 50 µs de-emphasis (C

P

T

=25°C and measurements taken in Fig.1; unless otherwise specified. The demodulator circuit is adjusted at

amb

minimum second harmonic distortion for V

= 1 mV and a deviation ∆f=±75 kHz.

iIF

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

V

P

I

P

supply voltage (pin 1) 7.5 8.5 15 V
supply current V5=V9=V13= 0 10 16 23 mA

Reference voltage

V
∆V

I

14

R

ref

ref

14

reference voltage (pin 14) I14= −1mA − 4.9 − V
reference voltage dependence on

temperature

V14∆

---------------------­V

14

T∆×

− 0.3 − %/K

maximum output current short-circuit current 4 6 7.5 mA

I

< 1.2 mA − 60 150 Ω

output resistor

V

∆

-----------­I

∆

14

14

14

= 6.8 nF);

8-9

IF amplifier

V

iIF(rms)

R

17-18

C

17-18

V

oIF(p-p)

R

3-7

input sensitivity (RMS value; pin 17) −3 dB before limiting 14 22 35 µV
input resistance V
input capacitance V
output voltage at pins 3 and 7

(peak-to-peak value)

= 200 mV (RMS) 10 −−kΩ

iIF

= 200 mV (RMS) − 5 − pF

iIF

Z

= 10 pF parallel to

3, 7

610 680 750 mV

1MΩ

output resistance 200 250 300 Ω

Demodulator

R

4-6

C

4-6

R

8, 9

V

8, 9

V∆

-------

ϕ∆

V/V DC voltage ratio 0.653 0.667 0.680 V/V

V∆

------­T∆

input resistance 20 30 40 kΩ
input capacitance − 1 2.5 pF
output resistance 2.9 3.7 4.5 kΩ
DC offset voltage on output pins at

V

=0

4-6

demodulator efficiency − 40 − mV/°

demodulator efficiency dependent on
supply voltage

V5> 3 V or V
V13< 0.3 V

V

∆

8-9

--------------

ϕ∆

V

-----------------------------------------

8-9

ϕ∆ VP3V

–()

BE

3-7

= 0 or

− 0 ±100 mV

− 6.2 − mV/°

V8V9+

------------------­2V

2

dependence on temperature − 10

V

+

8V9

∆

------------------­2V

2

----------------------­T∆

−5

− 1/K

1998 Nov 18 6

Philips Semiconductors Product specification

FM/IF amplifier/demodulator circuit TDA1576T

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Field strength output; see Fig.4

V

15

output voltage V

S control steepness − 0.85 − V/dec
R

I

-------

15

15

V∆
T∆

output resistance − 150 200 Ω
dependence on temperature − 0.3 − %/K

standby operational cut-off current V5≥ 3 V; V15=0to5V −−10 µA

Zero level adjustment

V

16

R

16

internal bias voltage − 260 − mV
input resistance − 19 − kΩ

S control steepness

= 0 0 0.1 0.25 V

iIF

V

= 1 mV (RMS) 1.1 1.5 1.9 V

iIF

V

= 250 mV (RMS) 3.2 3.6 4.1 V

iIF

V

iIF

V

iIF

A

=

V15∆

=

----------------------

×

T∆ V

= 100 mV;

∆

V

15

------------

∆

V

16

15

0.87 1.0 1.2 V/V

Detuning detector

I

12

Z

V

-------- ­V

12

13
14

input bias current − 20 100 nA
input impedance

output voltage ratio for
∆ϕ = ϕ(V

) −ϕ(V

3-7

) − 90°

4-6

∆ϕ = 9.2° (43 kHz); Q = 20 V
∆ϕ = 3.5° (16 kHz); Q = 20 V
∆ϕ =14° (65 kHz); Q = 20 V

I

13

maximum output current V13= 6 V; see Fig.7 0.4 0.5 0.6 mA
cut-off current V

Internal audio attenuation; see Fig.8

V

-------- ­V

I

13

13
14

output voltage ratio α = attenuation factor

input current V13≤ 0.1 V −−−225 nA

Z

5V

---------­I12∆

; see Fig.5

=

12

630−MΩ

V1=V2= 7.5 V;
R

=10kΩ; pins 9

13-14

and 12 short-circuit;
see Fig.6

= 334 mV 0.45 0.5 0.55 V/V

9, 12

= 138 mV 0.75 0.8 0.85 V/V

9, 12

= 501 mV 0.335 0.345 0.355 V/V

9, 12

= 2.5 V; V

13

=0 −−−100 nA

9, 12

α = 1 dB 0.11 0.12 0.13 V/V
α = 7.2 dB 0.095 0.1 0.105 V/V
α≥40 dB − 0.06 − V/V

1998 Nov 18 7

Philips Semiconductors Product specification

FM/IF amplifier/demodulator circuit TDA1576T

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Standby switch; see Fig.9

V

5

input voltage for FM on
input voltage for FM off − 2.9 3 V
linear range − 350 − mV

I

5

V

------ -

5

T∆

input current V5=0to2V −−−100 µA

temperature dependence FM on (3.5V

Supply voltage smoothing

V

1-2

R

1-2

internal voltage drop proportional to

internal resistor 5.8 8.3 10.8 kΩ

V

3, 7

---------------------- ­V

3, 7(max)

V

= 0.3 V

19

V

= 3.5 to 15 V −−1µA

5

FM off (5V

V1− 3V

BE

;

0.9=

) − 7 − mV/K

BE

) − 10 − mV/K

BE

2.4 2.5 − V

80 210 400 mV

OPERATING CHARACTERISTICS

V

= 8.5 V; fIF= 10.7 MHz; RS=60Ω; fm= 400 Hz with ∆f=±22.5 kHz; 50 µs de-emphasis (C

P

=25°C and measurements taken in Fig.1; unless otherwise specified. The demodulator circuit is adjusted at

T

amb

minimum second harmonic distortion with V

= 1 mV.

iIF

= 6.8 nF);

8-9

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
IF amplifier and demodulator

V

iIF(rms)

input sensitivity (RMS value) −3 dB before limiting 14 22 35 µV

S/N = 26 dB − 10 −µV
S/N = 46 dB − 55 −µV

V

oAF(rms)

V

oN

AF output voltage (RMS value) 60 67 75 mV
noise voltage for V

pins 8 and 9)
weighted noise voltage in accordance with

= 0 (RMS value;

iIF

RS= 300 Ω;
f = 250 to 15000 Hz

− 900 −µV

− 2 − mV

“DIN 45405”

S/N signal-to-noise ratio (pins 8 and 9) V

= 1 mV (RMS);

iIF

− 72 − dB

see Fig.3

α

AM

AM suppression V

= 0.5 to 200 mV;

iIF

− 50 − dB
FM: 70 Hz; ±15 kHz;
AM: 1 kHz; m = 30%

α
∆V

FM

8, 9

FM suppression for FM off V
AFC shift in relation to minimum second

harmonic distortion α

2H

= 500 mV; V5=3V 80 −−dB

iIF

V

= 0.03 to 500 mV − 25 − mV

iIF

DC offset at second harmonic distortion operating − 0 ±100 mV

mute or FM off − 0 ±50 mV

α

3H

RR ripple rejection V

distortion for third harmonic − 0.65 − %

= 200 mV on V

ripple

f = 100 Hz 43 48 − dB

P

1998 Nov 18 8

Philips Semiconductors Product specification

FM/IF amplifier/demodulator circuit TDA1576T

20

handbook, full pagewidth

V8, V

9

(dB)

0

−20

−40

−60

−80

−6

10

−5

10

−4

10

−3

10

Fig.3 AF output voltage level on pins 8 and 9 as a function of V

de-emphasis.

S + N

N

−2

10

at VP= 8.5 V; fm= 1 kHz; QL= 20 with

iIF

−1

10

V

i 17 (rms)

MEH166

(V)

1

handbook, full pagewidth

5

V

15

(V)

4

3

2

1

0

−6

10

MEH143

−5

10

−4

10

−3

10

−2

10

−1

10

V

iIF (rms)

(V)

1

Fig.4 Field strength output (I16= 0).

1998 Nov 18 9

Philips Semiconductors Product specification

FM/IF amplifier/demodulator circuit TDA1576T

handbook, halfpage

I

12

R

i

I

12

Fig.5 Detuning input impedance.

MEH144

V

9, 12

handbook, halfpage

1

V13/V

14

0.5

0

−1.2 −0.8 −0.4 0 0.4 0.8

Fig.6 Detuning curve.

V

9, 12

MEH145

1.2

(V)

handbook, halfpage

1

I

13

(mA)

0.5

0

024

|V

9, 12

1.2 1 0.5 0

|

MEH146

V13 (V)

6

Fig.7 Detuning output.

1998 Nov 18 10

handbook, halfpage

0

αV

o

(dB)

−20

−40

−60

−80

0 0.1 0.2

V13 /V

Fig.8 Internal audio attenuation.

MEH147

0.3

14

Philips Semiconductors Product specification

FM/IF amplifier/demodulator circuit TDA1576T

handbook, halfpage

2

V

3-7

V

3-7 (max)

1

0

012

Fig.9 Standby switch.

V5 (V)

MEH148

∆V

5

3

handbook, full pagewidth

TDA1576T

98

C

8-9

V

Adjustment of the demodulator circuit is obtained with an IF signal which is higher than the 3 dB limiting level; L2 should be short-circuited or detuned;
L1 should be adjusted to minimum d

(1) Coil data: L1 = L2 = 0.38 µH; Qo= 70; coil former KAN (C).

distortion, and then L2 to minimum d2 distortion.

2

oAF

33 pF

3
4

6
7

33 pF

560

pF

39 pF

(1) (1)

L1

1 kΩ

39 pF

560

pF

L2

390 Ω

MBK240

Fig.10 An example of the TDA1576T when using a demodulator with two tuned circuits.

1998 Nov 18 11

Philips Semiconductors Product specification

FM/IF amplifier/demodulator circuit TDA1576T

PACKAGE OUTLINE

SO20: plastic small outline package; 20 leads; body width 7.5 mm

D

c

y

Z

20

pin 1 index

1

e

11

A

2

10

w M

b

p

SOT163-1

E

H

E

Q

A

1

L

p

L

detail X

(A )

A

X

v M

A

A

3

θ

0 5 10 mm

scale

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

mm

OUTLINE
VERSION

SOT163-1

A

max.

2.65

0.10

A

1

0.30

0.10

0.012

0.004

A2A

2.45

2.25

0.096

0.089

IEC JEDEC EIAJ

075E04 MS-013AC

0.25

0.01

b

3

p

0.49

0.32

0.36

0.23

0.019

0.013

0.014

0.009

UNIT

inches

Note

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

(1)E(1) (1)

cD

13.0

7.6

7.4

0.30

0.29

1.27

0.050

12.6

0.51

0.49

REFERENCES

1998 Nov 18 12

eHELLpQ

10.65

10.00

0.419

0.394

1.4

0.055

1.1

0.4

0.043

0.016

1.1

1.0

0.043

0.039

PROJECTION

0.25

0.25 0.1

0.01

0.01

EUROPEAN

ywv θ

Z

0.9

0.4

8

0.004

ISSUE DATE

0.035

0.016

95-01-24
97-05-22

0

o
o

Philips Semiconductors Product specification

FM/IF amplifier/demodulator circuit TDA1576T

SOLDERING
Introduction to soldering surface mount packages

This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our

“Data Handbook IC26; Integrated Circuit Packages”

(document order number 9398 652 90011).
There is no soldering method that is ideal for all surface

mount IC packages. Wave soldering is not always suitable
for surface mount ICs, or for printed-circuit boards with
high population densities. In these situations reflow
soldering is often used.

Reflow soldering

Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.

Several methods exist for reflowing; for example,
infrared/convection heating in a conveyor type oven.
Throughput times (preheating, soldering and cooling) vary
between 100 and 200 seconds depending on heating
method.

Typical reflow peak temperatures range from
215 to 250 °C. The top-surface temperature of the
packages should preferable be kept below 230 °C.

• Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.

• For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27 mm, the footprint

longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;

– smaller than 1.27 mm, the footprint longitudinal axis

must be parallel to the transport direction of the
printed-circuit board.

The footprint must incorporate solder thieves at the
downstream end.

• For packages with leads on four sides, the footprint must
be placed at a 45° angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.

During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.

Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.

Manual soldering

Wave soldering

Conventional single wave soldering is not recommended
for surface mount devices (SMDs) or printed-circuit boards
with a high component density, as solder bridging and
non-wetting can present major problems.

To overcome these problems the double-wave soldering
method was specifically developed.

If wave soldering is used the following conditions must be
observed for optimal results:

Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300 °C.

When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320 °C.

1998 Nov 18 13

Philips Semiconductors Product specification

FM/IF amplifier/demodulator circuit TDA1576T

Suitability of surface mount IC packages for wave and reflow soldering methods

PACKAGE

WAVE REFLOW

(1)

BGA, SQFP not suitable suitable

SOLDERING METHOD

HLQFP, HSQFP, HSOP, SMS not suitable

(3)

PLCC

, SO, SOJ suitable suitable
LQFP, QFP, TQFP not recommended
SSOP, TSSOP, VSO not recommended

(2)

(3)(4)
(5)

suitable

suitable
suitable

Notes

1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the

“Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”

.

2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).

3. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.

4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.

5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.

DEFINITIONS

Data sheet status

Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.

1998 Nov 18 14

Philips Semiconductors Product specification

FM/IF amplifier/demodulator circuit TDA1576T

NOTES

1998 Nov 18 15

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Tel. [phone], Fax. [phone]
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India: Philips INDIA Ltd, Band Box Building, 2nd floor,

254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025,
Tel. [phone], Fax. [phone]

Indonesia: PT Philips Development Corporation, Semiconductors Division,
Gedung Philips, Jl. Buncit Raya Kav.99-100, JAKARTA 12510,
Tel. [phone] ext. 2501, Fax. [phone]

Ireland: Newstead, Clonskeagh, DUBLIN 14,
Tel. [phone], Fax. [phone]

Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053,
TEL AVIV 61180, Tel. [phone], Fax. [phone]

Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3,
20124 MILANO, Tel. [phone], Fax. [phone]

Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku,
TOKYO 108-8507, Tel. [phone], Fax. [phone]

Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,
Tel. [phone], Fax. [phone]

Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,
Tel. [phone], Fax. [phone]

Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,
Tel. [phone]

Middle East: see Italy
Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB,

Tel. [phone], Fax. [phone]
New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,

Tel. [phone], Fax. [phone]
Norway: Box 1, Manglerud 0612, OSLO,

Tel. [phone], Fax. [phone]

Pakistan: see Singapore
Philippines: Philips Semiconductors Philippines Inc.,

106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI,
Metro MANILA, Tel. [phone], Fax. [phone]

Poland: Ul. Lukiska 10, PL 04-123 WARSZAWA,
Tel. [phone], Fax. [phone]

Portugal: see Spain
Romania: see Italy
Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW,

Tel. [phone], Fax. [phone]
Singapore: Lorong 1, Toa Payoh, SINGAPORE 319762,

Tel. [phone], Fax. [phone]

Slovakia: see Austria
Slovenia: see Italy
South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,

2092 JOHANNESBURG, P.O. Box 7430 Johannesburg 2000,
Tel. [phone], Fax. [phone]

South America: Al. Vicente Pinzon, 173, 6th floor,
04547-130 SÃO PAULO, SP, Brazil,
Tel. [phone], Fax. [phone]

Spain: Balmes 22, 08007 BARCELONA,
Tel. [phone], Fax. [phone]

Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,
Tel. [phone], Fax. [phone]

Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,
Tel. [phone] Fax. [phone]

Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1,
TAIPEI, Taiwan Tel. [phone], Fax. [phone]

Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,
209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260,
Tel. [phone], Fax. [phone]

Turkey: Talatpasa Cad. No. 5, 80640 GÜLTEPE/ISTANBUL,
Tel. [phone], Fax. [phone]

Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,
252042 KIEV, Tel. [phone], Fax. [phone]

United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,
MIDDLESEX UB3 5BX, Tel. [phone], Fax. [phone]

United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. [phone]

Uruguay: see South America
Vietnam: see Singapore
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,

Tel. [phone], Fax.[phone]

For all other countries apply to: Philips Semiconductors,
International Marketing & Sales Communications, Building BE-p, P.O. Box 218,
5600 MD EINDHOVEN, The Netherlands, Fax. [phone]

© Philips Electronics N.V. 1998 SCA60
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.

Internet: http://www.semiconductors.philips.com

Printed in The Netherlands 545102/750/02/pp16 Date of release: 1998 Nov 18 Document order number: 9397 75004823