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TDA1574T
User Manual
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Philips TDA1574T User Manual

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INTEGRATED CIRCUITS
DATA SH EET
TDA1574T
Integrated FM tuner for radio receivers
Product specification File under Integrated Circuits, IC01
August 1990
Philips Semiconductors Product specification
Integrated FM tuner for radio receivers TDA1574T

GENERAL DESCRIPTION

The TDA1574T is an integrated FM tuner circuit designed for use in the RF/IF section of car radios and home receivers. The circuit contains a mixer and an oscillator and a linear IF amplifier for signal processing. The circuit also incorporates the following features.

Features

• Keyed Automatic Gain Control (AGC)
• Regulated reference voltage
• Buffered oscillator output
• Electronic standby switch
• Internal buffered mixer driving.

QUICK REFERENCE DATA

PARAMETER CONDITIONS SYMBOL MIN. TYP. MAX. UNIT
Supply voltage range
(pin 17) V
P
Mixer input bias voltage
1,2-4
Noise factor NF − 9 − dB Oscillator output voltage
(pin 6) V
6-4
Output admittance at pin 6 f = 108.7 MHz Y22 − 1.5 + j2 ms Oscillator output buffer
9-4
Total harmonic distortion THD −−15 − dB Linear IF amplifier output
Noise factor R
= 300 Ω NF − 6.5 − dB
S
12-4
Keyed AGC output voltage
20-4
7 − 14 V
− 1 − V
− 2 − V
− 6 − V
− 4.5 − V
0.5 − VP−0.3 V

PACKAGE OUTLINE

20-lead mini-pack; plastic (SO20; SOT163A); SOT163-1; 1996 September 9.
Philips Semiconductors Product specification
Integrated FM tuner for radio receivers TDA1574T
Coil data
L1: TOKO MC-108, 514HNE-150023S14; L = 0.078 µH L2: TOKO MC-111, E516HNS-200057; L = 0.08 µH L3: TOKO Coil set 7P, N1 = 5.5 5.5 turns, N2 = 4 turns
Fig.1 Block diagram and test circuit.
Philips Semiconductors Product specification
Integrated FM tuner for radio receivers TDA1574T

PINNING

1. Mixer input 1
2. Mixer input 2
3. Wideband information input
4. Ground
5. Voltage reference
6. Oscillator output
7. Oscillator input 1
8. Oscillator input 2
9. Buffered oscillator output
10. Not connected
11. Not connected
12. IF output
13. Standby switch
14. Narrowband information input
15. IF input 1
16. IF input 2
17. Supply voltage
18. Mixer output 1
19. Mixer output 2
20. AGC output
Fig.2 Pinning diagram.
FUNCTIONAL DESCRIPTION Mixer
The mixer circuit uses a double balanced multiplier with a preamplifier (common base input) in order to obtain a large signal handling range and low oscillator radiation.

Oscillator

The oscillator circuit uses an amplifier with a differential input. Voltage regulation is achieved by utilizing the symmetrical tan h-transfer-function to obtain low order 2nd harmonics.
Linear IF amplifier
The IF amplifier is a one stage, differential input, wideband amplifier with an output buffer.

Keyed AGC

The AGC processor combines narrow and wideband information via an RF level detector, a comparator and an ANDing stage. The level dependent current sinking output has an active load which sets the AGC threshold. The AGC function can either be controlled by a combination of wideband narrowband information (keyed AGC) or by a wideband/narrowband information only. If narrowband AGC is required pin 3 should be connected to pin 5. If wideband AGC is required pin 14 should be connected to pin 15.
Philips Semiconductors Product specification
Integrated FM tuner for radio receivers TDA1574T

RATINGS

Limiting values in accordance with the Absolute Maximum System (IEC 134); note 1.
PARAMETER CONDITIONS SYMBOL MIN. MAX. UNIT
Supply voltage (pin 17) V Mixer output voltage
(pins 18 and 19) V
Standby switch input voltage
(pin 13) V Reference voltage (pin 5) V Total power dissipation P Storage temperature range T Operating ambient temperature range T
Notes to the ratings
1. All pins are short-circuit protected to ground.
17-4
18,19-4
13-4 5-4 tot stg amb
− 14 V
− 35 V
− 23 V
− 7V
− 500 mW
−55 + 150 °C
−40 + 85 °C

THERMAL RESISTANCE

From junction to ambient (in free air) R
th j-a
= 95 K/W
Philips Semiconductors Product specification
Integrated FM tuner for radio receivers TDA1574T

CHARACTERISTICS

V
= V
P
All measurements are with respect to ground (pin 4); unless otherwise specified
Supply (pin 17)
Supply voltage V Supply current
(except mixer) I Reference voltage (pin 5) V
Mixer DC characteristics
Input bias voltage
(pins 1 and 2) V Output voltage
(pins 18 and 19) V Other current
(pins 18 and 19) I
AC characteristics
Noise figure NF − 9 − dB Noise figure including
transforming network NF − 11 − dB 3rd order intercept point EMF1 Conversion power gain note 1 G Input resistance
(pins 1 and 2) R Output capacitance
(pins 18 and 19) C
Oscillator
= 8.5 V; T
17-4
= 25 °C; measured in test circuit Fig.1;
amb
PARAMETER CONDITIONS SYMBOL MIN. TYP. MAX. UNIT
= V
P
= I
P
17
= 98 MHz
f
i
17
V
17
I
17
5
1,2
18,19
18 + 19
CP
1,2
18, 19
IP3
7 − 14 V
16 23 30 mA
4.0 4.2 4.4 V
− 1 − V
4 − 35 V
− 4.5 − mA
− 115 − dB/µV
− 14 − dB
− 14 −Ω
− 13 − pF
DC characteristics
Input voltage
(pins 7 and 8) V Output voltage (pin 6) V
7,8 6
− 1.3 − V
− 2 − V
AC characteristics
Residual FM (bandwidth =
300 Hz to 15 kHz) de-emphasis = 50 µs ∆f − 2.2 − Hz
Linear IF amplifier DC characteristics
Input bias voltage (pin 15) V
15
− 1.2 − V
Philips Semiconductors Product specification
Integrated FM tuner for radio receivers TDA1574T
PARAMETER CONDITIONS SYMBOL MIN. TYP. MAX. UNIT
Output voltage (pin 12) V
f
= 10.7 MHz
AC characteristics
i
Input impedance R
Output impedance R
Voltage gain note 2 G Voltage gain with
variation of temperature T
amb
= −40
to + 85 °C ∆G
1 dB compression point
(RMS value)
= 8.5 V V
at V
P
at V
= 7.5 V V
P
Signal-to-noise ratio R
= 300 Ω S/N − 6.5 − dB
S
Keyed AGC
12
16-15
C
16-15 12
C
12
v
12(rms) 12(rms)
T
− 4.5 − V
240 300 360 Ω
− 13 − pF 240 300 360 Ω
− 3 − pF 27 30 − dB
− 0 − dB
− 750 − mV
− 550 − mV
DC characteristics
Output voltage range
at I
= 0 or
3
V
= 450 mV;
14
= VP/2 −I
V
20
at V
= 2 V and
3
V
= 1 V; V20= V
14
15
Narrowband threshold
at V
= 2 V; V14= 550 mV V
3
at V
= 2 V; V14= 450 mV V
3
f
= 98 MHz
AC characteristics
i
Input impedance R
20
20
I
20
20 20
3
C
3
0.5 − VP−0.3 V
25 50 100 µA
2 − 5mA
−−1V VP−0.3 −−V
− 4 − kΩ
− 3 − pF
Philips Semiconductors Product specification
Integrated FM tuner for radio receivers TDA1574T
PARAMETER CONDITIONS SYMBOL MIN. TYP. MAX. UNIT
Wideband threshold
(RMS value)
(see Figs 3, 4, 5 and 6)
at V
= 0.7 V;
14
V
= VP/2; I20= 0 EMF
20
2(rms)
Oscillator output buffer
(pin 9) DC output voltage V
9
Oscillator output voltage
(RMS value)
at R
= oo; CL= 2 pF V
L
= 75 Ω V
at R
L
DC output resistance R
9(rms) 9(rms) 9-17
Signal purity Total harmonic distortion THD −−15 − dB Spurious frequencies
at EMF 1 = 1 V; R
= 50 Ω f
S1
S
Electronic standby switch
(pin 11) Oscillator; linear IF
amplifier; AGC T
amb
= −40
to + 85 °C
Input switching voltage
for threshold ON V
for threshold OFF V
= > VP−3 V V
20
= < 0.5 V V
20
13 13
Input current
at ON condition V
at OFF condition V Input voltage I
= 0 V −I
13
= 23 V −I
13
= 0 V
13
13 13
13
Notes to the characteristics
1. Power gain conversion is equated by the following equation:
2
4V
10
log
M out()
----------------------------------------------------------­EMF1 98 MHz()
10.7MHz()
R
S1
x
---------- -
2
R
ML
− 17 − mV
− 6 − V
− 110 − mV 30 50 − mV
− 2.5 − kΩ
−−35 − dB
0 − 2.3 V
3.3 − 23 V
−−150 µA
−−10 µA
−−4.4 V
2. Voltage gain is equated by the following equation: V
20
12
------------------log V
16 15–
Philips Semiconductors Product specification
Integrated FM tuner for radio receivers TDA1574T
Fig.3 Keyed AGC output voltage V20 as a function
of RMS input voltage V3. Measured in test circuit Fig.1 at V14 = 0.7 V; I20 = 0.
Fig.4 Keyed AGC output voltage V20 as a function
of input voltage V14. Measured in test circuit Fig.1 at V3 = 2 V; I20 = 0.
Fig.5 Keyed AGC output current I20 as a function
of RMS input voltage V3. Measured in test circuit Fig.1 at V14 = 0.7 V; V20 = 8.5 V.
Fig.6 Keyed AGC output voltage I20 as a function
of input voltage V14. Measured in test circuit Fig.1 at V3 = 2 V; V20 = 8.5 V.
Philips Semiconductors Product specification
Integrated FM tuner for radio receivers TDA1574T
Coil data
L1: TOKO MC-108, N1 = 5.5 turns, N2 = 1 turn L2: see Fig.1 L3: see Fig.1 (1) Field strength indication of main IF amplifier.
Fig.7 TDA1574T application diagram.
August 1990 10
Philips Semiconductors Product specification
Integrated FM tuner for radio receivers TDA1574T

PACKAGE OUTLINE

SO20: plastic small outline package; 20 leads; body width 7.5 mm
D
c
y
Z
20
pin 1 index
1
e
11
A
2
10
w M
b
p

SOT163-1

E
H
E
Q
A
1
L
p
L
detail X
(A )
A
X
v M
A
A
3
θ
0 5 10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
mm
OUTLINE VERSION
SOT163-1
A
max.
2.65
0.10
A
1
0.30
0.10
0.012
0.004
A2A
2.45
2.25
0.096
0.089
IEC JEDEC EIAJ
075E04 MS-013AC
0.25
0.01
b
3
p
0.49
0.32
0.36
0.23
0.019
0.013
0.014
0.009
UNIT
inches
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
(1)E(1) (1)
cD
13.0
7.6
7.4
0.30
0.29
1.27
0.050
12.6
0.51
0.49
REFERENCES
August 1990 11
eHELLpQ
10.65
10.00
0.419
0.394
1.4
0.055
1.1
0.4
0.043
0.016
1.1
1.0
0.043
0.039
PROJECTION
0.25
0.25 0.1
0.01
0.01
EUROPEAN
ywv θ
Z
0.9
0.4
8
0.004
ISSUE DATE
0.035
0.016
95-01-24 97-05-22
0
o o
Philips Semiconductors Product specification
Integrated FM tuner for radio receivers TDA1574T
SOLDERING Introduction
There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used.
This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our
“IC Package Databook”
Reflow soldering
Reflow soldering techniques are suitable for all SO packages.
Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement.
Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating method. Typical reflow temperatures range from 215 to 250 °C.
Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 °C.
(order code 9398 652 90011).
Wave soldering
Wave soldering techniques can be used for all SO packages if the following conditions are observed:
• A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used.
• The longitudinal axis of the package footprint must be parallel to the solder flow.
• The package footprint must incorporate solder thieves at the downstream end.
During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured.
Maximum permissible solder temperature is 260 °C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 °C within 6 seconds. Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications.
Repairing soldered joints
Fix the component by first soldering two diagonally­opposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C.
August 1990 12
Philips Semiconductors Product specification
Integrated FM tuner for radio receivers TDA1574T

DEFINITIONS

Data sheet status
Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.
August 1990 13
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