Philips TDA1521A User Manual

INTEGRATED CIRCUITS
DATA SH EET
TDA1521A
2 x 6 W hi-fi audio power amplifier
Product specification File under Integrated Circuits, IC01
July 1994
2 x 6 W hi-fi audio power amplifier TDA1521A

GENERAL DESCRIPTION

The TDA1521A is a dual hi-fi audio power amplifier encapsulated in a 9-lead plastic power package. The device is especially designed for mains fed applications (e.g. stereo tv sound and stereo radio).

Features

Requires very few external components
Input muted during power-on and off
(no switch-on or switch-off clicks)
Low offset voltage between output and ground
Excellent gain balance between channels
Hi-fi according to IEC 268 and DIN 45500
Short-circuit-proof
Thermally protected.

QUICK REFERENCE DATA

Stereo applications
Supply voltage range V
P
± 7,5 to ± 21,0 V
Output power at THD = 0,5%,
V
= ± 12 V P
P
Voltage gain G Gain balance between channels G
o
V
V
typ. 6 W typ. 30 dB
typ. 0,2 dB Ripple rejection SVRR typ. 60 dB Channel separation α typ. 70 dB Noise output voltage V
no(rms)
typ. 70 µV

PACKAGE OUTLINE

TDA1521A: 9-lead single in-line; plastic power (SOT 110B); SOT110-1; 1996 July 22.
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Philips Semiconductors Product specification
2 x 6 W hi-fi audio power amplifier TDA1521A
Fig.1 Block diagram.
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Philips Semiconductors Product specification
2 x 6 W hi-fi audio power amplifier TDA1521A

PINNING

1 INV1 non-inverting input 1 2 INV1 inverting input 1 ground (asymmetrical)
3 GND
ground (symmetrical) 6 OUT2 output 2
1
⁄2VP(asymmetrical) 7 + V
5 V
P
negative supply (symmetrical)
positive supply
P
4 OUT1 output 1 8 INV2 inverting input 2
9 INV2 non-inverting input 2

FUNCTIONAL DESCRIPTION

This hi-fi stereo power amplifier is designed for mains fed applications. The circuit is designed for both symmetrical and asymmetrical power supply systems. An output power of 2 × 6 watts (THD = 0,5%) can be delivered into an 8load with a symmetrical power supply of ± 12 V.
The gain is fixed internally at 30 dB. Internal gain fixing gives low gain spread and very good balance between the amplifiers (0,2 dB).
A special feature of this device is a mute circuit which suppresses unwanted input signals during switching on and off. Referring to Fig.12, the 100 µF capacitor creates a time delay when the voltage at pin 3 is lower than an internally fixed reference voltage. During the delay the amplifiers remain in their DC operating mode but are isolated from the non-inverting inputs on pins 1 and 9.
Two thermal protection circuits are provided, one monitors the average junction temperature and the other the instantaneous temperature of the power transistors. Both protection circuits activate at 150 °C allowing safe operation to a maximum junction temperature of 150 °C without added distortion.

RATINGS

Limiting values in accordance with the Absolute Maximum System (IEC 134)
PARAMETER CONDITIONS SYMBOL MIN. MAX. UNIT
Supply voltage pin 7 V
pin 5 VP= V
Non-repetitive peak
pins 4 and 6 I
P
OSM
= V
7-3
5-3
+21 V
−−21 V
4A
output current Total power dissipation see Fig.2 P Storage temperature range T Junction temperature T
tot stg j
55 + 150 °C
150 °C
Short-circuit time: see note 1
outputs short-circuited
to ground symmetrical
(full signal drive) power supply t
sc
1 hour asymmetrical power supply t
sc
1 hour
Note
1. For asymmetrical power supplies (at short circuiting of the load) the maximum supply voltage is limited to V
= 28 V.
P
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Philips Semiconductors Product specification
2 x 6 W hi-fi audio power amplifier TDA1521A
Fig.2 Power derating curve.

THERMAL RESISTANCE

From junction to case R
th j-c
= 6 K/W

HEATSINK DESIGN EXAMPLE

With derating of 6 K/W, the value of heatsink thermal resistance is calculated as follows: given RL = 8 and VP= ± 12 V, the measured maximum dissipation is 7,8 W; then, for a maximum ambient temperature
of 60 °C, the required thermal resistance of the heatsink is
R
th h-a
150 60
---------------------­78,
6 5,5 K/W==
Note: The metal tab (heatsink) has the same potential as pin 5 ( VP).
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Philips Semiconductors Product specification
2 x 6 W hi-fi audio power amplifier TDA1521A

CHARACTERISTICS

PARAMETER CONDITIONS SYMBOL MIN. TYP. MAX. UNIT
Supply voltage range
operating mode V input mute mode V
P P
Repetitive peak
output current I
ORM
Operating mode: symmetrical power supply; test circuit as per Fig.11;
= ± 12 V; RL= 8 ; T
V
P
Total quiescent current without R Output power THD = 0,5% P
= 25 °C; f = 1 kHz
amb
L
THD = 10% P
I
tot
o o
Total harmonic
distortion P
= 4 W THD 0,15 0,2 %
o
Power bandwidth THD = 0,5%
note 1 B 20 to
Voltage gain G Gain balance G
v
v
Noise output voltage
(r.m.s. value); unweighted (20 Hz to 20 kHz) R
Input impedance |Z
= 2 k V
S
no(rms)
| 142026k
i
Ripple rejection note 2 SVRR 40 60 dB Channel separation R Input bias current I
= 0 Ωα 46 70 dB
S
ib
DC output offset with respect
voltage to ground V
OFF
± 7,5 ± 12,0 ± 20,0 V ± 2,0 −±5,8 V
−−2,2 A
18 40 70 mA 56W 6,5 8,0 W
16 k Hz
29 30 31 dB
0,2 1,0 dB
70 140 µV
0,3 −µA
30 200 mV
Input mute mode: symmetrical power supply; test circuit as per Fig.11;
V
= ± 4 V; RL= 8 ; T
P
Total quiescent current without R Output voltage V
= 25 °C; f = 1 kHz
amb
L
= 600 mV V
i
I
tot
out
9 3040mA
0,6 1,8 mV
Noise output voltage
(r.m.s. value); unweighted (20 Hz to 20 kHz) R
= 2 k V
S
no(rms)
70 140 µV Ripple rejection note 2 SVRR 35 55 dB DC output offset with respect
voltage to ground V
OFF
40 200 mV
July 1994 6
Philips Semiconductors Product specification
2 x 6 W hi-fi audio power amplifier TDA1521A
PARAMETER CONDITIONS SYMBOL MIN. TYP. MAX. UNIT
Operating mode: asymmetrical power supply; test circuit as per Fig.12;
= 24 V; RL= 8 ; T
V
P
Total quiescent current I Output power THD = 0,5% P
Total harmonic distortion P Power bandwidth THD = 0,5% 40 to
Voltage gain G Gain balance G Noise output voltage
(r.m.s. value);
unweighted (20 Hz to 20 kHz) R Input impedance |Z Ripple rejection SVRR 35 44 dB Channel separation RS = 0 Ωα −45 dB
= 25 °C; f = 1 kHz
amb
tot
o
THD = 10% P
= 4 W THD 0,13 0,2 %
o
o
18 40 70 mA 56W 6,5 8 W
note 1 B 16 k Hz
29 30 31 dB
0,2 1,0 dB
70 140 µV
= 2 k V
S
v
v
no(rms)
| 1420 26k
i
Notes to the characteristics
1. Power bandwidth at P
o max
3 dB.
2. Ripple rejection at RS= 0 , f = 100 Hz to 20 kHz; ripple voltage = 200 mV (r.m.s. value) applied to positive or negative supply rail.
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Philips Semiconductors Product specification
2 x 6 W hi-fi audio power amplifier TDA1521A
APPLICATION INFORMATION Input mute circuit
1
The input mute circuit operates only during switching on and off of the supply voltage. The circuit compares the voltage (at pin 3) with an internally fixed reference voltage (V voltage at pin 3 is lower than V
the non-inverting inputs (pins 1 and 9) are disconnected from the amplifier. The voltage
ref
), derived directly from the supply voltage. When the
ref
at pin 3 is determined by an internal voltage divider and the external 100 µF capacitor. During switching on, a time delay is created between the reference voltage and the voltage at pin 3, during which the input terminal is disconnected, (as illustrated in Fig.3).
⁄2supply
Fig.3 Input mute circuit; time delay.
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Philips Semiconductors Product specification
2 x 6 W hi-fi audio power amplifier TDA1521A
Fig.4 Output power as a function of supply voltage; symmetrical supply; RL= 8 ; f = 1 kHz.
Fig.5 Distortion as a function of frequency; symmetrical supply; VP= ±12 V; RL= 8 ; Po = 3 W.
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Philips Semiconductors Product specification
2 x 6 W hi-fi audio power amplifier TDA1521A
Fig.6 Supply voltage ripple rejection; symmetrical supply, VP= ±12 V; VRR= 200 mV.
Fig.7 Power dissipation as a function of output power; asymmetrical supply; VS= 24 V; RL= 8 ; f = 1 kHz.
July 1994 10
Philips Semiconductors Product specification
2 x 6 W hi-fi audio power amplifier TDA1521A
Fig.8 Output power as a function of supply voltage; asymmetrical supply; RL= 8 ; f = 1 kHz.
Fig.9 Distortion as a function of frequency; asymmetrical supply; VS= 24 V; RL= 8 ; Po= 3 W.
July 1994 11
Philips Semiconductors Product specification
2 x 6 W hi-fi audio power amplifier TDA1521A
Fig.10 Supply voltage ripple rejection; asymmetrical supply; VS= 24 V; VRR= 200 mW.
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Philips Semiconductors Product specification
2 x 6 W hi-fi audio power amplifier TDA1521A
(1) To be connected as close as possible to the I.C.
Fig.11 Test and application circuit; symmetrical power supply.
(1) To be connected as close as possible to the I.C.
Fig.12 Test and application circuit; asymmetrical power supply.
July 1994 13
Philips Semiconductors Product specification
2 x 6 W hi-fi audio power amplifier TDA1521A

PACKAGE OUTLINE

SIL9MPF: plastic single in-line medium power package with fin; 9 leads
D
D
1
q
P
pin 1 index
P
1
q
2
q
1

SOT110-1

A
2
A
3
A
A
4
E
seating plane
19
Z
b
e
2
b
b
1
0 5 10 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
mm
A
18.5
17.8
max.
3.7
2
A
8.7
8.0
A
3
4
15.8
15.4
b
0.67
0.50
b
1
2
1.40
1.14
bcD
1.40
1.14
0.48
0.38
21.8
21.4
(1)
D
1
21.4
20.7
A
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE VERSION
IEC JEDEC EIAJ
REFERENCES
SOT110-1
w M
(1)
E
eLPP
6.48
6.20
2.54
3.9
3.4
L
c
Q
(1)
w
0.25
Z
max.
1.0
2.75
2.50
1
3.4
3.2
q
Q
1.75
15.1
1.55
14.9
EUROPEAN
PROJECTION
q1q
2
5.9
4.4
5.7
4.2
ISSUE DATE
92-11-17 95-02-25
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Philips Semiconductors Product specification
2 x 6 W hi-fi audio power amplifier TDA1521A
SOLDERING Introduction
There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used.
This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in
“IC Package Databook”
our
Soldering by dipping or by wave
The maximum permissible temperature of the solder is 260 °C; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds.

DEFINITIONS

(order code 9398 652 90011).
The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (T printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit.
Repairing soldered joints
Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds.
stg max
). If the
Data sheet status
Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.
July 1994 15
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