Product specification
File under Integrated Circuits, IC01
July 1994
Philips SemiconductorsProduct specification
2 x 6 W hi-fi audio power amplifierTDA1521A
GENERAL DESCRIPTION
The TDA1521A is a dual hi-fi audio power amplifier encapsulated in a 9-lead plastic power package. The device is
especially designed for mains fed applications (e.g. stereo tv sound and stereo radio).
Features
• Requires very few external components
• Input muted during power-on and off
(no switch-on or switch-off clicks)
• Low offset voltage between output and ground
• Excellent gain balance between channels
• Hi-fi according to IEC 268 and DIN 45500
• Short-circuit-proof
• Thermally protected.
QUICK REFERENCE DATA
Stereo applications
Supply voltage rangeV
P
± 7,5 to ± 21,0 V
Output power at THD = 0,5%,
V
= ± 12 VP
P
Voltage gainG
Gain balance between channels∆G
o
V
V
typ.6 W
typ.30 dB
typ.0,2 dB
Ripple rejectionSVRRtyp.60 dB
Channel separationαtyp.70 dB
Noise output voltageV
no(rms)
typ.70 µV
PACKAGE OUTLINE
TDA1521A: 9-lead single in-line; plastic power (SOT 110B); SOT110-1; 1996 July 22.
This hi-fi stereo power amplifier is designed for mains fed applications. The circuit is designed for both symmetrical and
asymmetrical power supply systems. An output power of 2 × 6 watts (THD = 0,5%) can be delivered into an 8Ωload with
a symmetrical power supply of ± 12 V.
The gain is fixed internally at 30 dB. Internal gain fixing gives low gain spread and very good balance between the
amplifiers (0,2 dB).
A special feature of this device is a mute circuit which suppresses unwanted input signals during switching on and off.
Referring to Fig.12, the 100 µF capacitor creates a time delay when the voltage at pin 3 is lower than an internally fixed
reference voltage. During the delay the amplifiers remain in their DC operating mode but are isolated from the
non-inverting inputs on pins 1 and 9.
Two thermal protection circuits are provided, one monitors the average junction temperature and the other the
instantaneous temperature of the power transistors. Both protection circuits activate at 150 °C allowing safe operation to
a maximum junction temperature of 150 °C without added distortion.
RATINGS
Limiting values in accordance with the Absolute Maximum System (IEC 134)
PARAMETERCONDITIONSSYMBOLMIN.MAX.UNIT
Supply voltagepin 7V
pin 5−VP= V
Non-repetitive peak
pins 4 and 6I
P
OSM
= V
7-3
5-3
−+21V
−−21V
−4A
output current
Total power dissipationsee Fig.2P
Storage temperature rangeT
Junction temperatureT
tot
stg
j
−55+ 150°C
−150°C
Short-circuit time:see note 1
outputs short-circuited
to groundsymmetrical
(full signal drive)power supplyt
sc
−1hour
asymmetrical
power supplyt
sc
−1hour
Note
1. For asymmetrical power supplies (at short circuiting of the load) the maximum supply voltage is limited to V
= 28 V.
P
July 19944
Philips SemiconductorsProduct specification
2 x 6 W hi-fi audio power amplifierTDA1521A
Fig.2 Power derating curve.
THERMAL RESISTANCE
From junction to caseR
th j-c
= 6 K/W
HEATSINK DESIGN EXAMPLE
With derating of 6 K/W, the value of heatsink thermal resistance is calculated as follows:
given RL = 8 Ω and VP= ± 12 V, the measured maximum dissipation is 7,8 W; then, for a maximum ambient temperature
of 60 °C, the required thermal resistance of the heatsink is
R
th h-a
150 60–
---------------------78,
65,5 K/W=–=
Note: The metal tab (heatsink) has the same potential as pin 5 ( − VP).
July 19945
Philips SemiconductorsProduct specification
2 x 6 W hi-fi audio power amplifierTDA1521A
CHARACTERISTICS
PARAMETERCONDITIONSSYMBOLMIN.TYP.MAX.UNIT
Supply voltage range
operating modeV
input mute modeV
P
P
Repetitive peak
output currentI
ORM
Operating mode: symmetrical power supply; test circuit as per Fig.11;
= ± 12 V; RL= 8 Ω; T
V
P
Total quiescent currentwithout R
Output powerTHD = 0,5%P
2. Ripple rejection at RS= 0 Ω , f = 100 Hz to 20 kHz; ripple voltage = 200 mV (r.m.s. value) applied to positive or
negative supply rail.
July 19947
Philips SemiconductorsProduct specification
2 x 6 W hi-fi audio power amplifierTDA1521A
APPLICATION INFORMATION
Input mute circuit
1
The input mute circuit operates only during switching on and off of the supply voltage. The circuit compares the
voltage (at pin 3) with an internally fixed reference voltage (V
voltage at pin 3 is lower than V
the non-inverting inputs (pins 1 and 9) are disconnected from the amplifier. The voltage
ref
), derived directly from the supply voltage. When the
ref
at pin 3 is determined by an internal voltage divider and the external 100 µF capacitor.
During switching on, a time delay is created between the reference voltage and the voltage at pin 3, during which the
input terminal is disconnected, (as illustrated in Fig.3).
⁄2supply
Fig.3 Input mute circuit; time delay.
July 19948
Philips SemiconductorsProduct specification
2 x 6 W hi-fi audio power amplifierTDA1521A
Fig.4 Output power as a function of supply voltage; symmetrical supply; RL= 8 Ω; f = 1 kHz.
Fig.5 Distortion as a function of frequency; symmetrical supply; VP= ±12 V; RL= 8 Ω; Po = 3 W.
(1) To be connected as close as possible to the I.C.
Fig.11 Test and application circuit; symmetrical power supply.
(1) To be connected as close as possible to the I.C.
Fig.12 Test and application circuit; asymmetrical power supply.
July 199413
Philips SemiconductorsProduct specification
2 x 6 W hi-fi audio power amplifierTDA1521A
PACKAGE OUTLINE
SIL9MPF: plastic single in-line medium power package with fin; 9 leads
D
D
1
q
P
pin 1 index
P
1
q
2
q
1
SOT110-1
A
2
A
3
A
A
4
E
seating plane
19
Z
b
e
2
b
b
1
0510 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
mm
A
18.5
17.8
max.
3.7
2
A
8.7
8.0
A
3
4
15.8
15.4
b
0.67
0.50
b
1
2
1.40
1.14
bcD
1.40
1.14
0.48
0.38
21.8
21.4
(1)
D
1
21.4
20.7
A
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
IEC JEDEC EIAJ
REFERENCES
SOT110-1
w M
(1)
E
eLPP
6.48
6.20
2.54
3.9
3.4
L
c
Q
(1)
w
0.25
Z
max.
1.0
2.75
2.50
1
3.4
3.2
q
Q
1.75
15.1
1.55
14.9
EUROPEAN
PROJECTION
q1q
2
5.9
4.4
5.7
4.2
ISSUE DATE
92-11-17
95-02-25
July 199414
Philips SemiconductorsProduct specification
2 x 6 W hi-fi audio power amplifierTDA1521A
SOLDERING
Introduction
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
“IC Package Databook”
our
Soldering by dipping or by wave
The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.
DEFINITIONS
(order code 9398 652 90011).
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (T
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
Repairing soldered joints
Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300 °C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400 °C, contact may be up to 5 seconds.
stg max
). If the
Data sheet status
Objective specificationThis data sheet contains target or goal specifications for product development.
Preliminary specificationThis data sheet contains preliminary data; supplementary data may be published later.
Product specificationThis data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
July 199415
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