Philips TDA1517P Datasheet

DATA SH EET

Product specification
Supersedes data of 1998 Apr 28
File under Integrated Circuits, IC01

2002 Jan 17

INTEGRATED CIRCUITS

TDA1517; TDA1517P

2 × 6 W stereo power amplifier

2002 Jan 17 2

Philips Semiconductors Product specification

2 × 6 W stereo power amplifier TDA1517; TDA1517P

FEATURES

• Requires very few external components

• High output power

• Fixed gain

• Good ripple rejection

• Mute/standby switch

• AC and DC short-circuit safe to ground and V

P

• Thermally protected

• Reverse polarity safe

• Capability to handle high energy on outputs (VP=0V)

• No switch-on/switch-off plop

• Electrostatic discharge protection.

GENERAL DESCRIPTION

The TDA1517 is an integrated class-B dual output
amplifier in aplastic single in-line medium power package
with fin (SIL9MPF) and a plastic heat-dissipating dual
in-line package (HDIP18). The device is primarily
developed for multi-media applications.

QUICK REFERENCE DATA

ORDERING INFORMATION

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

V

P

supply voltage 6.0 14.4 18.0 V

I

ORM

repetitive peak output current −−2.5 A

I

q(tot)

total quiescent current − 40 80 mA

I

sb

standby current − 0.1 100 µA

I

sw

switch-on current −−40 µA

|Z

I

| input impedance 50 −−kΩ

P

o

output power RL=4Ω; THD = 0.5% − 5 − W

R

L

=4Ω; THD = 10% − 6 − W

SVRR supply voltage ripple rejection f

i

= 100 Hz to 10 kHz 48 −−dB

α

cs

channel separation 40 −−dB

G

v

closed loop voltage gain 19 20 21 dB

V

no(rms)

noise output voltage (RMS value) − 50 −µV

T

c

crystal temperature −−150 °C

TYPE

NUMBER

PACKAGE

NAME DESCRIPTION VERSION

TDA1517 SIL9MPF plastic single in-line medium power package with fin; 9 leads SOT110-1
TDA1517P HDIP18 plastic heat-dissipating dual in-line package; 18 leads SOT398-1

2002 Jan 17 3

Philips Semiconductors Product specification

2 × 6 W stereo power amplifier TDA1517; TDA1517P

BLOCK DIAGRAM

Fig.1 Block diagram.

handbook, full pagewidth

mute/stand-by

switch input

MLC351

output 1

15 kΩ

15 kΩ

x 1

VA

stand-by

switch

V

P

mute
switch

stand-by
reference
voltage

18 kΩ

18 kΩ

2

kΩ

60
kΩ

mute switch

C

m

power stage

4

8

mute switch

VA

VA

C

m

2

kΩ

60
kΩ

power stage

6

275

SGND

signal

ground

PGND

output 2

non-inverting

input 1

non-inverting

input 2

9

supply voltage
ripple rejection

output

3

1

TDA1517

mute
reference
voltage

input

reference

voltage

V

P

power
ground
(substrate)

2002 Jan 17 4

Philips Semiconductors Product specification

2 × 6 W stereo power amplifier TDA1517; TDA1517P

PINNING

SYMBOL PIN DESCRIPTION

−INV1 1 non-inverting input 1
SGND 2 signal ground
SVRR 3 supply voltage ripple rejection output
OUT1 4 output 1
PGND 5 power ground
OUT2 6 output 2
V

P

7 supply voltage

M/SS 8 mute/standby switch input

−INV2 9 non-inverting input 2

Fig.2 Pin configuration for SOT110-1.

dbook, halfpage

MLC352

1
2
3
4
5
6
7
8
9

P

V

OUT2

SGND

INV1

INV2

TDA1517

OUT1

M/SS

SVRR

PGND

Fig.3 Pin configuration for SOT398-1.

Pins 10 to 18 should be connected to GND or floating.

dbook, halfpage

MLC353

1
2
3
4
5
6
7
8
9

18
17
16
15
14
13
12
11
10

P

V

OUT2

SGND

INV1

INV2

TDA1517P

OUT1

M/SS

SVRR

PGND

FUNCTIONAL DESCRIPTION

The TDA1517 contains two identical amplifiers with
differential input stages. The gainof each amplifier is fixed
at 20 dB. A special feature of the device is the
mute/standby switch which has the following features:

• Low standby current (<100 µA)

• Low mute/standby switching current

(low cost supply switch)

• Mute condition.

2002 Jan 17 5

Philips Semiconductors Product specification

2 × 6 W stereo power amplifier TDA1517; TDA1517P

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 60134).

THERMAL RESISTANCE

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

V

P

supply voltage operating − 18 V

no signal − 20 V

V

P(sc)

AC and DC short-circuit safe voltage − 18 V

V

P(r)

reverse polarity − 6V

ERG

O

energy handling capability at outputs VP=0V − 200 mJ

I

OSM

non-repetitive peak output current − 4A

I

ORM

repetitive peak output current − 2.5 A

P

tot

total power dissipation see Fig.4 − 15 W

T

stg

storage temperature −55 +150 °C

T

amb

operating ambient temperature −40 +85 °C

T

c

crystal temperature − 150 °C

SYMBOL TYPE NUMBER PARAMETER VALUE UNIT

R

th j-c

TDA1517 thermal resistance from junction to case 8 K/W

R

th j-p

TDA1517P thermal resistance from junction to pins 15 K/W

R

th j-a

TDA1517; TDA1517P thermal resistance from junction to ambient 50 K/W

Fig.4 Power derating curve.

(1) R

th j-c

= 8 K/W.

(2) R

th j-p

= 15 K/W.

handbook, halfpage

25 0 50 150

12

0

MLC354

100

T ( C)

o

amb

P

(W)

18

6

(1)

(2)

2002 Jan 17 6

Philips Semiconductors Product specification

2 × 6 W stereo power amplifier TDA1517; TDA1517P

DC CHARACTERISTICS

VP= 14.4 V; T

amb

=25°C; measured in Fig.6; unless otherwise specified.

Note

1. The circuit is DC adjusted at V

P

= 6 to 18 V and AC operating at VP= 8.5 to 18 V.

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Supply

V

P

supply voltage note 1 6.0 14.4 18.0 V

I

q(tot)

total quiescent current − 40 80 mA

V

O

DC output voltage − 6.95 − V

Mute/standby switch

V

8

switch-on voltage level see Fig.5 8.5 −−V

Mute condition

V

O

output signal in mute position V

I(max)

=1V; fi=20Hzto15kHz −−2mV

Standby condition

I

sb

DC current in standby condition −−100 µA

V

sw

switch-on current − 12 40 µA

2002 Jan 17 7

Philips Semiconductors Product specification

2 × 6 W stereo power amplifier TDA1517; TDA1517P

AC CHARACTERISTICS

VP= 14.4 V; RL=4Ω; f = 1 kHz; T

amb

=25°C; measured in Fig.6; unless otherwise specified.

Notes

1. Output power is measured directly at the output pins of the IC.

2. Frequency response externally fixed.

3. Ripple rejection measured at the output with a source impedance of 0 Ω, maximum ripple amplitude of 2 V (p-p) and
a frequency between 100 Hz and 10 kHz.

4. Noise voltage measured in a bandwidth of 20 Hz to 20 kHz.

5. Noise output voltage independent of R

s

(VI= 0 V).

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

P

o

output power THD = 0.5%; note 1 4 5 − W

THD = 10%; note 1 5.5 6.0 − W

THD total harmonic distortion P

o

=1W − 0.1 − %

f

lr

low frequency roll-off at −3 dB; note 2 − 45 − Hz

f

hr

high frequency roll-off at −1dB 20 −−kHz

G

v

closed loop voltage gain 19 20 21 dB

SVRR supply voltage ripple rejection note 3

on 48 −−dB
mute 48 −−dB
standby 80 −−dB

|Z

i

| input impedance 50 60 75 kΩ

V

no

noise output voltage

on R

s

=0Ω; note 4 − 50 −µV

on R

s

=10Ω; note 4 − 70 100 µV

mute note 5 − 50 −µV

α

cs

channel separation Rs=10Ω 40 −−dB

|∆G

v

| channel unbalance − 0.1 1 dB

2002 Jan 17 8

Philips Semiconductors Product specification

2 × 6 W stereo power amplifier TDA1517; TDA1517P

Fig.5 Standby, mute and on conditions.

handbook, halfpage

8.5

0

MLC355

V

18

6.4

3.3
2

11

(V)

,,,,,

,

,,,,,

,

ON (I = 40 mA)

P

mute (I = 40 mA)

P

standby (I 100 µA)

P

APPLICATION INFORMATION

Fig.6 Application circuit diagram.

handbook, full pagewidth

MLC356

100 nF

P

V

TDA1517

87

standby switch

220 nF

input 1

1000 µF 1000 µF

input

reference

voltage

2 5

signal

ground

power

ground

1 9

220 nF

input 2

4

6

3

2200
µF

internal

1/2 V

P

100
µF

60 kΩ60 kΩ

20 dB 20 dB

2002 Jan 17 9

Philips Semiconductors Product specification

2 × 6 W stereo power amplifier TDA1517; TDA1517P

PACKAGE OUTLINES

UNIT

A

A

max.

2

A

3

b

1

D

1

b

2

bcD

(1)

E

(1)

Z

max.

(1)

eLPP

1

q1q

2

q

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC JEDEC EIAJ

mm

18.5

17.8

3.7

8.7

8.0

A

4

15.8

15.4

1.40

1.14

0.67

0.50

1.40

1.14

0.48

0.38

21.8

21.4

21.4

20.7

6.48

6.20

3.4

3.2

2.54

1.0

5.9

5.7

4.4

4.2

3.9

3.4

15.1

14.9

Q

1.75

1.55

DIMENSIONS (mm are the original dimensions)

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

2.75

2.50

SOT110-1

92-11-17
95-02-25

0 5 10 mm

scale

0.25

w

D

E

A

A

c

A

2

3

A

4

q

1

q

2

L

Q

w M

b

b

1

b

2

D

1

P

q

1

Z

e

19

P

seating plane

pin 1 index

SIL9MPF: plastic single in-line medium power package with fin; 9 leads

SOT110-1

2002 Jan 17 10

Philips Semiconductors Product specification

2 × 6 W stereo power amplifier TDA1517; TDA1517P

UNIT

A

max.

12

b

1

(1) (1)

(1)

b

2

cD E e M

Z

H

L

REFERENCES

OUTLINE
VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC JEDEC EIAJ

mm

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

SOT398-1

94-04-13
95-01-25

A

min.

A

max.

b

max.

w

M

E

e

1

1.40

1.14

0.67

0.50

0.47

0.38

21.85

21.35

6.5

6.2

3.9

3.1

0.252.54 7.62

8.32

8.02

8.7

7.7

1.04.7 0.51 3.7

inches

0.06

0.04

0.03

0.02

0.02

0.01

1.05

0.75

0.04

0.03

0.87

0.84

0.26

0.24

0.15

0.12

0.010.10 0.30

0.33

0.32

0.34

0.30

0.040.19 0.02 0.15

M

H

c

(e )

1

M

E

w M

b

1

b

2

e

A

A

1

A

2

L

seating plane

Z

D

E

18

1

10

9

b

pin 1 index

0 5 10 mm

scale

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

HDIP18: plastic heat-dissipating dual in-line package; 18 leads

SOT398-1

2002 Jan 17 11

Philips Semiconductors Product specification

2 × 6 W stereo power amplifier TDA1517; TDA1517P

SOLDERING
Introduction to soldering through-hole mount

packages

This text gives a brief insight to wave, dip and manual
soldering.A more in-depth account of solderingICscan be
found in our

“Data Handbook IC26; Integrated Circuit

Packages”

(document order number 9398 652 90011).

Wave soldering is the preferred method for mounting of
through-hole mount IC packages on a printed-circuit
board.

Soldering by dipping or by solder wave

The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact
with the joints for more than 5 seconds.

Thetotalcontacttime of successive solder waves must not
exceed 5 seconds.

The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (T

stg(max)

). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.

Manual soldering

Apply the soldering iron (24 V or less) to the lead(s) of the
package, either below the seating plane or not more than
2 mm above it. If the temperature of the soldering iron bit
is less than 300 °C it may remain in contact for up to
10 seconds. If the bit temperature is between
300 and 400 °C, contact may be up to 5 seconds.

Suitability of through-hole mount IC packages for dipping and wave soldering methods

Note

1. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board.

PACKAGE

SOLDERING METHOD

DIPPING WAVE

DBS, DIP, HDIP, SDIP, SIL suitable suitable

(1)

2002 Jan 17 12

Philips Semiconductors Product specification

2 × 6 W stereo power amplifier TDA1517; TDA1517P

DATA SHEET STATUS

Notes

1. Please consult the most recently issued data sheet before initiating or completing a design.

2. The product status of the device(s) described in this data sheet may have changed since this data sheet was
published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.

DATA SHEET STATUS

(1)

PRODUCT

STATUS

(2)

DEFINITIONS

Objective data Development This data sheet contains data from the objective specification for product

development. Philips Semiconductors reserves the right to change the
specification in any manner without notice.

Preliminary data Qualification This data sheet contains data from the preliminary specification.

Supplementary data will be published at a later date. Philips
Semiconductors reserves the right to change the specification without
notice, in order to improve the design and supply the best possible
product.

Product data Production This data sheet contains data from the product specification. Philips

Semiconductors reserves the right to make changes at any time in order
to improve the design, manufacturing and supply. Changes will be
communicated according to the Customer Product/Process Change
Notification (CPCN) procedure SNW-SQ-650A.

DEFINITIONS
Short-form specification  The data in a short-form

specification is extracted from a full data sheet with the
same type number and title. For detailed information see
the relevant data sheet or data handbook.

Limiting values definition  Limiting values given are in
accordance with the Absolute Maximum Rating System
(IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device.
These are stress ratings only and operation of the device
attheseor at any other conditionsabovethosegiven in the
Characteristics sections of the specification is not implied.
Exposure to limiting values for extended periods may
affect device reliability.

Application information  Applications that are
described herein for any of these products are for
illustrative purposes only. Philips Semiconductors make
norepresentationorwarrantythat such applications will be
suitable for the specified use without further testing or
modification.

DISCLAIMERS
Life support applications  These products are not

designed for use in life support appliances, devices, or
systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips
Semiconductorscustomersusingorsellingthese products
for use in such applications do so at their own risk and
agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.

Right to make changes  Philips Semiconductors
reserves the right to make changes, without notice, in the
products, including circuits, standard cells, and/or
software, described or contained herein in order to
improve design and/or performance. Philips
Semiconductors assumes no responsibility or liability for
theuseofany of these products, conveys no licenceortitle
under any patent, copyright, or mask work right to these
products,and makes no representations orwarrantiesthat
these products are free from patent, copyright, or mask
work right infringement, unless otherwise specified.

2002 Jan 17 13

Philips Semiconductors Product specification

2 × 6 W stereo power amplifier TDA1517; TDA1517P

NOTES

2002 Jan 17 14

Philips Semiconductors Product specification

2 × 6 W stereo power amplifier TDA1517; TDA1517P

NOTES

2002 Jan 17 15

Philips Semiconductors Product specification

2 × 6 W stereo power amplifier TDA1517; TDA1517P

NOTES

© Koninklijke Philips Electronics N.V. 2002

SCA74

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For additional information please visit http://www.semiconductors.philips.com. Fax: [phone]
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Printed in The Netherlands 753503/04/pp16 Date of release: 2002 Jan 17 Document order number: 9397 750 08925