24 W BTL or 2 x 12 watt stereo car
radio power amplifier
Product specification
File under Integrated Circuits, IC01
July 1994
Page 2
Philips SemiconductorsProduct specification
24 W BTL or 2 x 12 watt stereo car radio
TDA1516BQ
power amplifier
GENERAL DESCRIPTION
The TDA 1516BQ is an integrated class-B output amplifier in a 13-lead single-in-line (SlL) plastic power package.
The device is primarily developed for car radio applications.
FEATURES
• Requires very few external components
• Flexibility in use − stereo as well as mono BTL
• High output power (without bootstrap)
• Low offset voltage at output (important for BTL)
• Fixed gain
• Good ripple rejection
• Mute/stand-by switch
• Load dump protection
• A.C. and d.c. short-circuit-safe to ground and V
P
QUICK REFERENCE DATA
PARAMETERCONDITIONSSYMBOLMIN.TYP.MAX.UNIT
Supply voltage range
operatingV
non-operatingV
load dump protectedV
Repetitive peak output
currentI
Total quiescent currentI
Stand-by currentI
Switch-on currentI
Input impedance
The TDA1516BQ contains two identical amplifiers with differential input stages. This device can be used for stereo or
bridge applications. The gain of each amplifier is fixed at 20 dB. A special feature of this device is the mute/stand-by
switch which has the following features:
• low stand-by current (< 100 µA)
• low mute/stand-by switching current (low cost supply switch)
• mute condition.
P
supply voltage
RATINGS
Limiting values in accordance with the Absolute Maximum System (IEC 134)
PARAMETERCONDITIONSSYMBOLMIN.MAX.UNIT
Supply voltage
operatingV
non-operatingV
P
P
load dump protectedduring 50 ms;
tr≥ 2,5 msV
P
A.C. and d.c. short-circuit-
safe voltageV
Reverse polarityV
PSC
PR
Energy handling capability
at outputsV
= 0 V−200mJ
P
Non-repetitive peak output
currentI
OSM
Repetitive peak output
currentI
Total power dissipationsee Fig.2P
Crystal temperatureT
Storage temperature rangeT
ORM
tot
c
stg
−18V
−30V
−45V
−18V
−6V
−6A
−4A
−25W
−150°C
−55+ 150°C
July 19944
Page 5
Philips SemiconductorsProduct specification
24 W BTL or 2 x 12 watt stereo car radio
power amplifier
TDA1516BQ
Fig.2 Power derating curve.
July 19945
Page 6
Philips SemiconductorsProduct specification
24 W BTL or 2 x 12 watt stereo car radio
power amplifier
D.C. CHARACTERISTICS (note 1)
= 14,4 V; T
V
P
PARAMETERCONDITIONSSYMBOLMIN.TYP.MAX.UNIT
Supply
Supply voltage rangenote 2V
Quiescent currentI
D.C. output voltage at
approximately VP/2note 3V
D.C. output offset
voltage|∆V
Mute/stand-by switch
Switch-on voltage levelV
Mute condition
Output signal in muteV
positionf = 20 Hz to
D.C. output offset
voltage|∆V
Stand-by condition
D.C. current in
stand-by conditionI
Switch-on currentI
= 25 °C; unless otherwise specified
amb
= 1 V (max.);
I
15 kHzV
TDA1516BQ
P
P
O
|−−100mV
5-9
ON
V
mute
O
|−−100mV
5-9
V
sb
sb
sw
6,014,418,0V
−4080mA
−6,8−V
8,5−−V
3,0−6,4V
−−2mV
0−2V
−−100µA
−1240µA
July 19946
Page 7
Philips SemiconductorsProduct specification
24 W BTL or 2 x 12 watt stereo car radio
TDA1516BQ
power amplifier
A.C. CHARACTERISTICS
= 14,4 V; RL = 4 Ω; f = 1 kHz; T
V
P
PARAMETERCONDITIONSSYMBOLMIN.TYP.MAX.UNIT
Stereo application
Output powernote 4;
Output power atnote 4;
= 2 ΩTHD = 0,5%P
R
L
Low frequency roll-offnote 6;
High frequency roll-off−1 dBf
Closed loop voltage gainG
Supply voltage ripple
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
A2bpcD
17.0
4.6
4.2
0.75
0.60
15.5
1
e
(1)
deD
0.48
24.0
23.6
20.0
19.6
0.38
b
p
h
103.4
w M
0510 mm
scale
(1)
E
12.2
11.8
1
1.7
e
5.08
B
E
A
L
3
L
E
2
h
6
Q
c
m
LL3m
3.4
12.4
3.1
11.0
2.4
1.6
e
2
4.3
2.1
1.8
v M
(1)
v
Qj
0.8
0.25w0.03
Z
x
2.00
1.45
OUTLINE
VERSION
SOT141-6
IEC JEDEC EIAJ
REFERENCES
July 199410
EUROPEAN
PROJECTION
ISSUE DATE
92-11-17
95-03-11
Page 11
Philips SemiconductorsProduct specification
24 W BTL or 2 x 12 watt stereo car radio
power amplifier
SOLDERING
Introduction
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
“IC Package Databook”
our
Soldering by dipping or by wave
The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.
(order code 9398 652 90011).
TDA1516BQ
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (T
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
Repairing soldered joints
Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300 °C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400 °C, contact may be up to 5 seconds.
stg max
). If the
DEFINITIONS
Data sheet status
Objective specificationThis data sheet contains target or goal specifications for product development.
Preliminary specificationThis data sheet contains preliminary data; supplementary data may be published later.
Product specificationThis data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
July 199411
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