Philips SOT624-1 User Manual
Philips Semiconductors |
PC board footprint |
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Footprint information for reflow soldering of HBGA1312 package |
SOT624-1 |
Hx
P 
P
Hy
see detail X
Generic footprint pattern
Refer to the package outline drawing for actual layout
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solder land |
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solder paste deposit |
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solder land plus solder paste |
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SL |
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occupied area |
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SP |
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solder resist |
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SR |
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detail X |
DIMENSIONS in mm |
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P |
SL |
SP |
SR |
Hx |
Hy |
1.00 |
0.450 |
0.450 |
0.600 |
40.575 |
40.575 |
SOT624-1_fp |
© Koninklijke Philips Electronics N.V. 2004. All rights reserved. |
14 September 2004 |
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