Philips SOT617-1 User Manual
Philips Semiconductors |
PC board footprint |
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Footprint information for reflow soldering of HVQFN32 package |
SOT617-1 |
(0.105)
Hy Gy
solder land
solder paste deposit
Hx
Gx
D 
P
C
nSPx |
SPx |
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SPy |
tot |
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SPy |
nSPy |
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SPx tot 
SLx
Bx
Ax
Generic footprint pattern
Refer to the package outline drawing for actual layout
solder land plus solder paste
occupied area
DIMENSIONS in mm
SLy By Ay
nSPx |
nSPy |
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2 |
2 |
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P |
Ax |
Ay |
Bx |
By |
C |
D |
SLx |
SLy |
SPx tot |
SPy tot |
SPx |
SPy |
Gx |
Gy |
Hx |
Hy |
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0.500 |
6.000 |
6.000 |
4.200 |
4.200 |
0.900 |
0.290 |
3.100 |
3.100 |
1.800 |
1.800 |
0.700 |
0.700 |
5.300 |
5.300 |
6.250 |
6.250 |
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SOT617-1_fp_reflow |
© Koninklijke Philips Electronics N.V. 2004. All rights reserved. |
13 October 2004 |
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