Philips SOT314-2 Technical data
Philips Semiconductors |
PC board footprint |
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Footprint information for reflow soldering of LQFP64 package |
SOT314-2 |
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Hx |
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Gx |
P2 |
P1 |
(0.125) |
Hy Gy |
By Ay |
C
D2 (8×) |
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D1 |
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Bx
Ax
Generic footprint pattern
Refer to the package outline drawing for actual layout
solder land
occupied area
DIMENSIONS in mm
P1 |
P2 |
Ax |
Ay |
Bx |
By |
C |
D1 |
D2 |
Gx |
Gy |
Hx |
Hy |
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0.500 |
0.560 |
13.300 |
13.300 |
10.300 |
10.300 |
1.500 |
0.280 |
0.400 |
10.500 |
10.500 |
13.550 |
13.550 |
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SOT314-2_fp_reflow |
© Koninklijke Philips Electronics N.V. 2004. All rights reserved. |
29 December 2004 |
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