Philips SOT158-1 User Manual
Philips Semiconductors |
PC board footprint |
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Footprint information for reflow soldering of VSO40 package |
SOT158-1 |
Hx
Gx
P2 
(0.125) |
(0.125) |
Hy Gy |
By Ay |
C
D2 (4x) |
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P1 |
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D1 |
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Generic footprint pattern
Refer to the package outline drawing for actual layout
solder land
occupied area
DIMENSIONS in mm
P1 |
P2 |
Ay |
By |
C |
D1 |
D2 |
Gx |
Gy |
Hx |
Hy |
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0.760 |
0.835 |
12.700 |
8.300 |
2.200 |
0.450 |
0.600 |
15.440 |
8.100 |
16.100 |
12.950 |
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SOT158-1_fp |
© Koninklijke Philips Electronics N.V. 2004. All rights reserved. |
8 October 2004 |
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