Philips saa8113hl DATASHEETS

INTEGRATED CIRCUITS

DATA SH EET

SAA8113HL

Digital PC-camera signal processor

Preliminary speciﬁcation File under Integrated Circuits, IC22

1999 Sep 27

Philips Semiconductors Preliminary speciﬁcation

Digital PC-camera signal processor SAA8113HL

CONTENTS

1 FEATURES 2 APPLICATIONS 3 GENERAL DESCRIPTION 4 ORDERING INFORMATION 5 QUICK REFERENCE DATA 6 BLOCK DIAGRAM 7 PINNING 8 FUNCTIONAL DESCRIPTION

8.1 Black offset preprocessing

8.2 Y, CRand CB separation

8.3 RGB processing

8.4 Y processing

8.5 RGB to UV conversion

8.6 UV processing

8.7 Display function

8.8 Analog output processing

8.9 Measurement engine

8.10 VH reference and window timing and control

8.11 Pulse pattern generator

8.12 Miscellaneous functions

8.13 Mode control

8.14 Microcontroller

8.15 Audio amplifier

8.16 I2C-bus interface 9 LIMITING VALUES 10 THERMAL CHARACTERISTICS 11 OPERATING CHARACTERISTICS 12 ELECTRICAL CHARACTERISTICS 13 APPLICATION INFORMATION 14 PACKAGE OUTLINE 15 SOLDERING

15.1 Introduction to soldering surface mount packages

15.2 Reflow soldering

15.3 Wave soldering

15.4 Manual soldering

15.5 Suitability of surface mount IC packages for wave and reflow soldering methods

16 DEFINITIONS 17 LIFE SUPPORT APPLICATIONS 18 PURCHASE OF PHILIPS I2C COMPONENTS

1999 Sep 27 2

Philips Semiconductors Preliminary speciﬁcation

Digital PC-camera signal processor SAA8113HL

1 FEATURES

• High precision digital processing with 10-bit input

• Medium resolution complementary mosaic CCD

sensors PAL or NTSC (interlaced mode only)

• Internal PPG, dedicated to SHARP, TOSHIBA and

PANASONIC sensors

• Integrated microcontroller (80C51) for control loops

Auto Optical Black (AOB), Auto White Balance (AWB) and Auto Exposure (AE)

• Black offset preprocessing

• RGB separation

• RGB processing (colour correction matrix,

programmable knee and gamma)

• Separate Y-processing (saturation concealment,

programmable knee and gamma)

• RGB to UV conversion (includingdown-sampling filters)

• Noise reduction in Y and UV

• Display function for system evaluation

• Analogoutputprocessing,includingPAL/NTSCencoder

and 9-bit Video Digital-to-Analog Converter (VDAC)

• Measurement engine (prepared for AE and AWB

features)

• Miscellaneous functions, e.g. power management, 7-bit

Control DAC (CDAC) serial interface with preprocessing

• VH reference and window timing for internal use

• Master I2C-bus interface for communication with an

external EEPROM (containing the default settings)

• Slave I2C-bus interface for communication with an

external microcontroller

• Parallel interface for communication with an external

EPROM (for ROM code debugging)

• Integrated audio amplifier.

2 APPLICATIONS

3 GENERAL DESCRIPTION

The SAA8113HL is a 2nd generation camera Digital Signal Processor (DSP) designed for low-cost DTV applications. It integrates the DSP core, the Pulse Pattern Generator (PPG), the 80C51 microcontroller and the VDAC in one IC. It is the successor of the SAA8110G, dedicated to analog output cameras.

The SAA8113HL must be applied together with an analog front-end that includes a Correlated Double Sampling (CDS), an Automatic Gain Control (AGC) and an Analog-to-Digital Converter (ADC). This may be the TDA8786 or the TDA8784.

The PPG generates the timing pulses to drive medium resolution PAL/NTSC complementary mosaic CCD sensors (512 × 492 NTSC and 512 × 582 PAL).

The input of the DSP is 10 bits with a maximum pixel frequency equal to 9.66 MHz. The DSP core processes this sensor signal to a standard video output signal. The SAA8113HL output is an analog CVBS video signal.

The microcontroller provides the settings for the IC registers from EEPROM at power-up or reset and controls the AWB, AE and AOB loops. It also provides a hardware I2C-businterface,sothemicrocontrollercanbe used as an I2C-bus slave. The software code is embedded in an internalROM but it is also possibleto use a combined data and address bus, connected to an external program EPROM.

A built-in power management function allows the power dissipation to be optimized.

• Low-cost desktop video applications

• Videophone systems.

4 ORDERING INFORMATION

TYPE

NUMBER

SAA8113HL LQFP100 plastic low proﬁle quad ﬂat package; 100 leads;

1999 Sep 27 3

NAME DESCRIPTION VERSION

body 14 × 14 × 1.4 mm

PACKAGE

SOT407-1

Philips Semiconductors Preliminary speciﬁcation

Digital PC-camera signal processor SAA8113HL

5 QUICK REFERENCE DATA

Measured over full voltage and temperature range.

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

DDD

DDA

DD(tot)

clk

δ duty factor of f P

tot

stg

amb

digital supply voltage 3.0 3.3 3.6 V analog supply voltage 3.0 3.3 3.6 V total supply current V input voltage 3.0V<V

= 3.3 V − 60 − mA

DDD

< 3.6 V low-voltage TTL compatible V

DDD

note 1 5 V tolerant, TTL compatible V

output voltage 3.0V<V

< 3.6 V low-voltage TTL compatible V

DDD

note 1 5 V tolerant, TTL compatible V

clock frequency input − 38 − MHz

clk

total power dissipation T

=25°C − 200 250 mW

amb

− 50 − %

storage temperature −55 − +150 °C ambient temperature 0 25 70 °C junction temperature T

=70°C −40 − +125 °C

amb

Note

1. This concerns pins SCL and SDA.

1999 Sep 27 4

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1999 Sep 27 5

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6 BLOCK DIAGRAM

Philips Semiconductors Preliminary speciﬁcation

Digital PC-camera signal processor SAA8113HL

CCD9

CCD0

M2 to M0

XIN

XOUT

CDACOUT

RBIASCDAC

85 to 94

1 to 3

62 63

59 58

PROCESSING

XOSC

MISCELLANEOUS

CDAC

DDA9 DGND1 to DGND3

54, 56, 95 12, 19, 20, 21,

PROCESSING

RGB

PROCESSING

MEASUREMENT ENGINE

PPG

FH1, FH2,

75, 74, 76

OFDX

BCP, DCP,

FCDS

AGND7 to AGND11

RGB

TO UV

79, 80, 77, 78

FS,

AGND1 to AGND4,

41, 60, 61, 72, 82

PROCESSING

CONTROLLER

INTERFACE

SAA8113HL

CLK1

INTERNAL

MICRO-

DISPLAY

24638

T1,

INT1

MICIAB,

COMAB

DDA4

24, 2555, 96

ANALOG OUTPUT

(PRE-

PROCESSING)

PAL/NTSC ENCODER

MICRO-

CONTROLLER

80C51

RESET

AGND5,

AGND6

AUDIO BUFFER

VDAC

26, 28

49 to 42

39 to 33

5, 6, 7, 8

FCE312

100, 99, 98, 97, 84, 51, 30, 31

SDATA,

SCLK,

STROBE,

STDBY,

SMP,

LED,

OUTGAIN

DDA1 to VDDA3

DDA5

13, 17, 23, 40, 57, 64, 71, 83

AND

CR, C

SEPARATION

REFERENCE

TIMING

SENSOR/PREPROCESSOR TIMING AND CONTROL

65, 66, 67, 68, 69, 70

V1X,

VH1X,

V2X, V3X,

VH3X,

V4X

DDD1,

DDD2

28 3 9 2 2

OFFSET

PRE-

MODE

CONTROL

AND

CLOCK

GENERATOR

FUNCTIONS

4 16, 53

KNOB4

OUTBVEN,

18 22

50 32

10 11 14 15

OUTAB

VDOBCVBS DECREF

P0.7 to P0.0 ALE

PSEN

AD14 to AD8

SCLE SDAE SCL SDA

KNOB3

KNOB0

Fig.1 Block diagram.

Philips Semiconductors Preliminary speciﬁcation

Digital PC-camera signal processor SAA8113HL

7 PINNING

SYMBOL PIN I/O DESCRIPTION

M2 1 I test mode control signal bit 2 M1 2 I test mode control signal bit 1 M0 3 I test mode control signal bit 0 KNOB4 4 I input connected to DSP core KNOB3 5 I/O I/O connected to internal 80C51 KNOB2 6 I/O I/O connected to internal 80C51 KNOB1 7 I/O I/O connected to internal 80C51 KNOB0 8 I/O I/O connected to internal 80C51 RESET 9 I Power-on reset SCLE 10 O master I SDAE 11 I/O master I AGND1 12 I analog ground 1 for output buffers V

DDA1

13 I analog supply voltage 1 for output buffers SCL 14 I slave I SDA 15 I/O slave I T1 16 I Timer 1 for internal 80C51 V

DDA2

17 I analog supply voltage 2 for DAC output buffer VDOBCVBS 18 O VDAC output buffer for CVBS signal AGND2 19 I analog ground 2 for DAC output buffer AGND3 20 I analog ground 3 for analog DAC core and band gap (connected to substrate) AGND4 21 I analog ground 4 for analog DAC core and band gap (not connected to substrate) DECREF 22 O decoupled pin for reference voltage HIGH V

DDA3

23 I analog supply voltage 3 for analog DAC core and band gap MICIAB 24 I microphone input audio buffer V

COMAB

25 I common voltage for audio buffer AGND5 26 I analog ground 5 for audio buffer (not connected to substrate) OUTAB 27 O output audio buffer AGND6 28 I analog ground 6 for audio buffer (connected to substrate) V

DDA4

29 I analog supply voltage 4 for audio buffer OUTBVEN 30 O output to enable the bias voltage of the microphone for the audio buffer OUTGAIN 31 O output to control the gain factor of an external audio buffer PSEN 32 O program store enable; read strobe for external program memory (active LOW) AD8 33 O address bit 8 for external program memory (PROM) AD9 34 O address bit 9 for external program memory (PROM) AD10 35 O address bit 10 for external program memory (PROM) AD11 36 O address bit 11 for external program memory (PROM) AD12 37 O address bit 12 for external program memory (PROM) AD13 38 O address bit 13 for external program memory (PROM) AD14 39 O address bit 14 for external program memory (PROM) V

DDA5

40 I analog supply voltage 5 for output buffers

C-bus clock output to control EEPROM

C-bus data I/O to control EEPROM

C-bus clock input

C-bus data I/O

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Philips Semiconductors Preliminary speciﬁcation

Digital PC-camera signal processor SAA8113HL

SYMBOL PIN I/O DESCRIPTION

AGND7 41 I analog ground 7 for output buffers P0.0 42 I/O port 0 bidirectional bit 0 for external program memory data I/O (PROM) P0.1 43 I/O port 0 bidirectional bit 1 for external program memory data I/O (PROM) P0.2 44 I/O port 0 bidirectional bit 2 for external program memory data I/O (PROM) P0.3 45 I/O port 0 bidirectional bit 3 for external program memory data I/O (PROM) P0.4 46 I/O port 0 bidirectional bit 4 for external program memory data I/O (PROM) P0.5 47 I/O port 0 bidirectional bit 5 for external program memory data I/O (PROM) P0.6 48 I/O port 0 bidirectional bit 6 for external program memory data I/O (PROM) P0.7 49 I/O port 0 bidirectional bit 7 for external program memory data I/O (PROM) ALE 50 O address latch enable pulse for external latch LED 51 O output to drive LED EA 52 I external access select bit for internal 80C51 (active LOW) INT1 53 I interrupt 1 for internal 80C51 DGND1 54 I digital ground 1 for input buffers, predrivers and the digital core V

DDD1

DGND2 56 I digital ground 2 for input buffers, predrivers and the digital core V

DDA6

RBIASCDAC 58 O bias resistor for CDAC CDACOUT 59 O output CDAC AGND8 60 I analog ground 8 for CDAC AGND9 61 I analog ground 9 for 38 MHz (fundamental) crystal oscillator XIN 62 I oscillator input XOUT 63 O oscillator output V

DDA7

V1X 65 O vertical CCD transfer pulse 1X VH1X 66 O vertical CCD load pulse H1X V2X 67 O vertical CCD transfer pulse 2X V3X 68 O vertical CCD transfer pulse 3X VH3X 69 O vertical CCD load pulse H3X V4X 70 O vertical CCD transfer pulse 4X V

DDA8

AGND10 72 I analog ground 10 for output buffers OFDX 73 O overﬂow drain pulse for shutter control FH2 74 O horizontal CCD transfer pulse F2 FH1 75 O horizontal CCD transfer pulse F1 FR 76 O CCD output ampliﬁer reset pulse (TDA8786 or TDA8784) FS 77 O CCD output level sample and hold pulse (TDA8786 or TDA8784) FCDS 78 O reference level sample and hold pulse (TDA8786 or TDA8784) BCP 79 O black pixel clamp pulse (TDA8786 or TDA8784) DCP 80 O dummy pixel clamp pulse (TDA8786 or TDA8784) CLK1 81 O pixel clock to preprocessor (TDA8786 or TDA8784)

55 I digital supply voltage 1 for input buffers, predrivers and the digital core

57 I analog supply voltage 6 for CDAC

64 I analog supply voltage 7 for 38 MHz (fundamental) crystal oscillator

71 I analog supply voltage 8 for output buffers

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Philips Semiconductors Preliminary speciﬁcation

Digital PC-camera signal processor SAA8113HL

SYMBOL PIN I/O DESCRIPTION

AGND11 82 I analog ground 11 for output buffers V

DDA9

SMP 84 O switch mode pulse for DC-to-DC power supply CCD9 85 I (preprocessed) AD-converted CCD signal bit 9 CCD8 86 I (preprocessed) AD-converted CCD signal bit 8 CCD7 87 I (preprocessed) AD-converted CCD signal bit 7 CCD6 88 I (preprocessed) AD-converted CCD signal bit 6 CCD5 89 I (preprocessed) AD-converted CCD signal bit 5 CCD4 90 I (preprocessed) AD-converted CCD signal bit 4 CCD3 91 I (preprocessed) AD-converted CCD signal bit 3 CCD2 92 I (preprocessed) AD-converted CCD signal bit 2 CCD1 93 I (preprocessed) AD-converted CCD signal bit 1 CCD0 94 I (preprocessed) AD-converted CCD signal bit 0 DGND3 95 I digital ground 3 for input buffers, predrivers and the digital core V

DDD2

STDBY 97 O standby control output to TDA8786 or TDA8784 STROBE 98 O strobe to TDA8786 or TDA8784 SCLK 99 O serial clock to TDA8786 or TDA8784 SDATA 100 O serial data to TDA8786 or TDA8784

83 I analog supply voltage 9 for output buffers

96 I digital supply voltage 2 for input buffers, predrivers and the digital core

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Philips Semiconductors Preliminary speciﬁcation

Digital PC-camera signal processor SAA8113HL

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M2 M1

M0 KNOB4 KNOB3 KNOB2 KNOB1 KNOB0

RESET

SCLE

SDAE

AGND1

DDA1

SCL

SDA

DDA2

VDOBCVBS

AGND2 AGND3 AGND4

DECREF

DDA3

MICIAB

COMAB

STROBE

STDBY

DDD2

DGND3

CCD0

CCD1

CCD2

CCD3

CCD4

CCD5

CCD6

SAA8113HL

CCD7

CCD8

SDATA

SCLK

99989796959493929190898887868584838281

100

1 2 3 4 5 6 7 8

9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25

CCD9

SMP

DDA9

AGND11

CLK1

DCP 8079787776

BCP

FCDSFSFR

FH1

FH2

OFDX AGND10

DDA8

V4X

VH3X

V3X

V2X

VH1X

V1X V

DDA7

XOUT XIN

AGND9

AGND8

CDACOUT

RBIASCDAC

DDA6

DGND2 V

DDD1

DGND1

INT1

LED

AGND5

OUTAB

AGND6

31323334353637383940414243444546474849

AD8

AD9

AD10

DDA4

OUTBVEN

PSEN

OUTGAIN

AD11

Fig.2 Pin configuration.

1999 Sep 27 9

AD12

AD13

AD14

DDA5

P0.0

AGND7

P0.1

P0.2

P0.3

P0.4

P0.5

P0.6

P0.7

ALE

FCE313

Philips Semiconductors Preliminary speciﬁcation

Digital PC-camera signal processor SAA8113HL

8 FUNCTIONAL DESCRIPTION

8.1 Black offset preprocessing

The CCD signal contains additional pixels outside the active window, which are used to measure the reference black level. These pixels are located in the optical black window, whose position can be set through the serial interface. The optical black level can be adjusted by the microcontrollerinorderto proceed rapidly. In this case, the microcontroller directly adjusts the analog preprocessing clamp included in the TDA8786 or TDA8784 and takes

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CCD inputs

LINE

MEMORY

LINE

MEMORY

advantage of the full code range. Otherwise, the black level is fixed by settings that are downloaded through the serial interface.

8.2 Y, CRand CB separation

For each pixel value, this block (see Fig.3) generates the three components: the luminance signal Y and the two colour signals C

(2R − G) and CB(2B − G). Two line

memories are required for this function. This block also provides vertical contour and white clip information.

Y C

RGB

COLOUR

SEPARATION

white clip Y

vertical contour

FCE314

Fig.3 Y, CRand CB separation diagram.

1999 Sep 27 10

Philips Semiconductors Preliminary speciﬁcation

Digital PC-camera signal processor SAA8113HL

8.3 RGB processing

The RGB processing (see Fig.4)includes several features:

• Colour space matrix to handle different types of colour sensors. The result is an optimum colour reproduction through the minimization of colour errors. The default matrixcoefficients(positiveornegative)canbeadjusted through an external interface.

• Separate and adjustable black offsets for R, G and B signals.

black

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LPF GAMMA

COLOUR

MATRIX

• Separate gain controls for R and B signals dedicated to white balance control. The colour temperature can be adjusted independently of the colour matrix.

• Knee function (compression factor and knee point are adjustable).

• Adjustable gamma function to compensate for the non-linearity of display devices.

The RGB path has a reduced bandwidth (less than 1 MHz), which is required for CVBS output.

gain

KNEE

Fig.4 RGB processing diagram.

FCE315

1999 Sep 27 11

Philips Semiconductors Preliminary speciﬁcation

Digital PC-camera signal processor SAA8113HL

8.4 Y processing

The separate Y processing (see Fig.5) includes the following features:

• Saturation concealment to reduce the typical saturation distortion

• Contour processing to improve picture sharpness

• Noise reduction

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vertical contour

SATURATION

CONCEALMENT

CONTOUR PROCESSING

AND

NOISE REDUCTION

black

+ +

• Black offset

• Pre-gaincontroltoadjust the Y signal with respect to the

gamma range

• Knee function (compression factor and knee point are adjustable)

• Adjustable gamma function

• Gain control.

pre-gain

KNEE

GAMMA

gain

FCE316

Fig.5 Y processing diagram.

8.5 RGB to UV conversion

After R, G and B processing, the data path is converted to U and V signals (see Fig.1). As a result of the reduced bandwidth, the Y signal is only used as an input for control loop purposes (measurement engine).

8.6 UV processing

The chrominance processing consists of a noise reduction by coring and the UV gain control.

8.7 Display function

As an optional feature and for software debugging, it is possible to visualize:

• Eight display bars (assigned via the microcontroller)

• Several measurement engine inputs.

1999 Sep 27 12

Philips Semiconductors Preliminary speciﬁcation

Digital PC-camera signal processor SAA8113HL

8.8 Analog output processing

The analog output processing (see Fig.6) contains a PAL/NTSC encoder to transform the YUV data path to the CVBS output. The YUV input signals are up-sampled to

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Y U V

sync, blank, scaling, levels

PAL/NTSC ENCODER

twice the pixel clock and digitally prefiltered to keep the external analog filter simple. The block also contains an adjustable luminance clipper.

MIX

VDAC

FCE317

VDOBCVBS

Fig.6 Analog output processing.

8.9 Measurement engine

The measurement engine performs data measurements on a field basis to get inputs for the AE and AWB control loops of the microcontroller. Up to 16 programmable windows can be used for the measurement. There are two down-samplers to prepare the data for two separate accumulators. It is possible to proceed with eight different measurements per field (odd and even fields separately). An internal RAM workspace is used for data handling operation.

8.10 VH reference and window timing and control

This block generates internal control signals for different purposes:

• Vertical, horizontal and field references (VD,HDand FI) for PAL or NTSC sensors

• Specification of the active window and the optical black window

• Specification of the measurement window grid with respect to the active window

• Specification of the vertical position of the display bars, see Section 8.7.

Allthesespecifications can be controlled through the serial interface.

1999 Sep 27 13

Philips Semiconductors Preliminary speciﬁcation

Digital PC-camera signal processor SAA8113HL

8.11 Pulse pattern generator

The PPG generates timing pulses (Figs. 7 to 10) for driving the CCD sensor (including the vertical driver) and pulses for the preprocessor TDA8786 or TDA8784 (correlated double sampling and black clamping).

Table 1 Medium resolution CCD sensors driven by the internal PPG; note 1

BRAND FORMAT TYPE

SHARP PAL 1/4” LZ2423A

NTSC 1/4” LZ2413A PAL 1/5” LZ2523 NTSC 1/5” LZ2513

TOSHIBA PAL 1/4” TCD5391AP

NTSC 1/4” TCD5381AP

SHARP low voltage PAL 1/4” LZ2425

NTSC 1/4” LZ2415

PANASONIC PAL 1/4” MN37210FP

PAL 1/4” MN37201FP NTSC 1/4” MN37110FP NTSC 1/4” MN37101FP

The PPG is dedicated to the medium resolution sensors with complementary mosaic colour filters (512 × 492 NTSC and 512 × 582 PAL) described in Table 1. Figs. 11 and 12 show the PPG outputs.

Note

1. All sensors are used with the vertical driver: NEC µPD16510.

The PPG includes special features:

• A charge reset is possible in every active line during the horizontal line blanking and multiple times during the vertical blanking

• A fast shutter interface is available.

1999 Sep 27 14

+ 30 hidden pages

Philips saa8113hl DATASHEETS

Specifications and Main Features

Frequently Asked Questions

User Manual

1 FEATURES

2 APPLICATIONS

3 GENERAL DESCRIPTION

4 ORDERING INFORMATION

5 QUICK REFERENCE DATA

6 BLOCK DIAGRAM

7 PINNING

8 FUNCTIONAL DESCRIPTION

8.1 Black offset preprocessing

8.2 Y, CRand CB separation

8.3 RGB processing

8.4 Y processing

8.5 RGB to UV conversion

8.6 UV processing

8.7 Display function

8.8 Analog output processing

8.9 Measurement engine

8.10 VH reference and window timing and control

8.11 Pulse pattern generator