Philips saa3323 DATASHEETS

INTEGRATED CIRCUITS

DATA SH EET

SAA3323

Drive processor for DCC systems

Preliminary speciﬁcation File under Integrated Circuits, IC01

Philips Semiconductors

May 1994

Philips Semiconductors Preliminary speciﬁcation

Drive processor for DCC systems SAA3323

FEATURES

• Operating supply voltage: 2.7 to 3.6 V

• Low power dissipation: 84 mW (typ)

• Single chip digital equalizer, tape formatting and error

correction

• 8-bit flash analog-to-digital converter (ADC) for low symbol error rate

• Two switchable Infinite Impulse-Response (IIR) filter sections

• 10-tap Finite Impulse-Response (FIR) filter per main data channel, with 8 bit coefficients, identical for all main channels

• 10-tap FIR filter for the AUX channel

• Analog and digital eye outputs

• Interrupt line triggered by internal auxiliary envelope

processing e.g. label, counter, and others

• Robust programmable digital PLL clock extraction unit

• Low power SLEEP mode

• Slew rate limited Electromagnetic Compatibility (EMC)

friendly output

• Digital Compact Cassette (DCC) optimized error correction

• Programmable symbol synchronization strategy for tape input data

• Microcontroller control of capstan servo possible during playback and recording

• Frequency and phase regulation of capstan servo during playback

• Choice of Dynamic Random Access Memory (DRAM) and Static Random Access Memory (SRAM) types for system Random Access Memory (RAM)

• Scratch pad RAM for microcontroller in system RAM

• Integrated interface for Precision Adaptive Sub-band

Coding (PASC) data bus

• Three wire microcontroller ‘L3’ interface

• Protection against invalid auxiliary data

• Seamless joins between recordings.

GENERAL DESCRIPTION

The SAA3323 performs the drive processor function in the DCC system. This function is built up of digital equalizer, error correction and tape formatting functions. The digital equalizer is intended for use with DCC read amplifiers TDA1318 or TDA1380. The tape formatting and error correction circuit is intended for use with PASC ICs SAA2003 and SAA2013, and write amplifiers TDA1319 or TDA1381.

ORDERING INFORMATION

TYPE NUMBER

SAA3323H 80 TQFP80 SAA3323GP 80 QFP80

Note

1. When using reflow soldering it is recommended that the Dry Packing instructions in the

Pocketbook”

May 1994 2

are followed. The pocketbook can be ordered using the code 9398 510 34011.

PINS PIN POSITION MATERIAL CODE

(1)

PACKAGE

plastic SOT315-1 plastic SOT318-2

“Quality Reference

Philips Semiconductors Preliminary speciﬁcation

Drive processor for DCC systems SAA3323

BLOCK DIAGRAM

handbook, full pagewidth

SBDIR

SBMCLK

SBEF

SBDA

SBCL

SBWS

SAA3323

SUB-BAND

I S

INTERFACE

DIGITAL-

TO-ANALOG

CONVERTER

PHASE

LOCKED

LOOP

TAPE

INPUT

BUFFER

ERROR

CORRECTOR

ZERO

CROSSING

INTERNAL DATA BUS

RAM

INTERFACE

8116

(1)

FIR

IIR

AUXILIARY ENVELOPE

DETECTION

ANAEYE

RDSYNC

(2)

ANALOG

TO-DIGITAL

CONVERTER

EQUALIZER

MODULE

TAPE

OUTPUT

BUFFER

CONTROL

INTERFACE

RDMUX BIAS V

ref(p)

ref(n)

TCLOCK WDATA

SPEED URDA RESET SLEEP

L3REF L3DATA

(1) FIR = Finite Impulse-Response. (2) IIR = Infinite Impulse-Response.

OEN

WEN

D0 to D7

A0 to A10

A11 to A16

Fig.1 Block diagram.

PINO1

PINO2

PINI

L3INT

L3CLK

L3MODE

MLB761

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Philips Semiconductors Preliminary speciﬁcation

Drive processor for DCC systems SAA3323

PINNING

SYMBOL

DESCRIPTION TYPE

(1)

QFP80 TQFP80

SBWS 1 79 word select for sub-band PASC interface I/O (1 mA) SBCL 2 80 bit clock for sub-band PASC interface I/O (1 mA) SBDA 3 1 data line for sub-band PASC interface I/O (1 mA) SBDIR 4 2 direction line for sub-band PASC interface O (1 mA) SBMCLK 5 3 master clock for sub-band PASC interface I URDA 6 4 unreliable data O (1 mA) L3MODE 7 5 mode line for L3 interface I L3CLK 8 6 bit clock line for L3 interface I L3DATA 9 7 serial data line for L3 interface I/O (2 mA) L3INT 10 8 L3 interrupt output O (1 mA) V V

DD1 SS1

11 9 digital supply voltage S

12 10 digital ground S L3REF 13 11 L3 bus timing reference O (1 mA) RESET 14 12 reset SAA3323 I SLEEP 15 13 sleep mode selection of SAA3323 I CLK24 16 14 24.576 MHz clock input I AZCHK 17 15 channel 0 and channel 7 azimuth monitor O (1 mA) MCLK 18 16 6.144 MHz clock output O (1 mA) TEST3 19 17 TEST3 output; do not connect O (1 mA) ERCOSTAT 20 18 ERCO status, for symbol error rate measurements O (1 mA) OEN 21 19 output enable for RAM O (2 mA) A10/

RAS 22 20 address SRAM; RAS DRAM O (2 mA) V V

DD2 SS2

23 21 digital supply voltage S

24 22 digital ground S D7 25 23 data SRAM I/O (4 mA) D6 26 24 data SRAM I/O (4 mA) D5 27 25 data SRAM I/O (4 mA) D4 28 26 data SRAM I/O (4 mA) D3 29 27 data SRAM; data DRAM I/O (4 mA) D2 30 28 data SRAM; data DRAM I/O (4 mA) D1 31 29 data SRAM; data DRAM I/O (4 mA) V V

DD7 SS7

32 30 digital supply voltage for RAM S

33 31 digital ground for RAM S D0 34 32 data SRAM; data DRAM I/O (4 mA) A0 35 33 address SRAM; address DRAM O (2 mA) A1 36 34 address SRAM; address DRAM O (2 mA) A2 37 35 address SRAM; address DRAM O (2 mA) A3 38 36 address SRAM; address DRAM O (2 mA)

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Philips Semiconductors Preliminary speciﬁcation

Drive processor for DCC systems SAA3323

SYMBOL

DESCRIPTION TYPE

QFP80 TQFP80

A4 39 37 address SRAM; address DRAM O (2 mA)

V V

SS3 DD3

40 38 digital ground S

41 39 digital supply voltage S A5 42 40 address SRAM; address DRAM O (2 mA) A6 43 41 address SRAM; address DRAM O (2 mA) A7 44 42 address SRAM; address DRAM O (2 mA) A12/PINO5 45 43 address SRAM; Port expander output 5 O (2 mA) A14/PINO1 46 44 address SRAM; Port expander output 1 O (2 mA) A16/PINO3 47 45 address SRAM; Port expander output 3 O (2 mA) A15/PINO4 48 46 address SRAM; Port expander output 4 O (2 mA) WEN 49 47 write enable for RAM O (2 mA) A13/PINO2 50 48 address SRAM; Port expander output 2 O (2 mA) A8 51 49 address SRAM; address DRAM O (2 mA) V

DD4

SS4

CAS 54 52 address SRAM; CAS for DRAM O (2 mA)

A9/

52 50 digital supply voltage S

53 51 digital ground S

A11 55 53 address SRAM O (2 mA) SPEED 56 54 Pulse Width Modulation (PWM) capstan control output for deck O PINO2 57 55 Port expander output 2 O

(1 mA)

WDATA 58 56 serial output to write ampliﬁer O (1 mA) TCLOCK 59 57 3.072 MHz clock output for tape I/O O (1 mA) V

SS5

DD5

TEST2 62 60 TEST mode select; do not connect I RDMUX 63 61 analog multiplexed input from read ampliﬁer I V

ref(p)

ref(n)

SUBSTR 66 64 substrate connection I BIAS 67 65 bias current for ADC I V

SSA

DDA

ANAEYE 70 68 analog eye pattern output O

60 58 digital ground S

61 59 digital supply voltage S

64 62 ADC positive reference voltage I

65 63 ADC negative reference voltage I

68 66 analog ground S

69 67 analog supply voltage S

pd A A A A A

RDSYNC 71 69 synchronization output for read ampliﬁer O (1 mA) V V

DD6 SS6

72 70 digital supply voltage S

73 71 digital ground S CHTST1 74 72 channel test pin 1 O (1 mA) CHTST2 75 73 channel test pin 2 O (1 mA) TEST0 76 74 TEST mode select; do not connect I TEST1 77 75 TEST mode select; do not connect I

pd pd

(1)

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Philips Semiconductors Preliminary speciﬁcation

Drive processor for DCC systems SAA3323

SYMBOL

DESCRIPTION TYPE

(1)

QFP80 TQFP80

PINI 78 76 Port expander input I PINO1 79 77 Port expander output 1 O (1 mA) SBEF 80 78 sub-band PASC error ﬂag line O (1 mA)

Note

1. I = input; IA= analog input; Ipd= input with pull-down resistance; I/O = bidirectional; O = output; OA= analog output; Ot= 3-state output; S = supply.

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SBDA

SBDIR

SBMCLK

URDA

L3MODE

L3CLK

L3DATA

L3INT

DD1

SS1

L3REF RESET SLEEP

SBWS

SBCL

80 1 2 3 4 5 6 7 8 9

10 11 12 13

SBEF

PINO1

PINI 76

TEST1 75

CHTST1

CHTST2 73

SAA3323

TEST0

SS6

DD6

ANAEYE

RDSYNC 69

DDA

SSA

BIAS 65

ref(n)Vref(p)

SUBSTR

RDMUX 61

60 59 58 57 56 55 54 53 52 51 50 49 48

TEST2

DD5

SS5

TCLOCK WDATA

PINO2 SPEED A11

A9/CAS

SS4

DD4 A8 A13/PINO2

MCLK

OEN

14 15 16 17 18 19 20

DD2

SS2

23 D7

24 D6

28 D2

29 D1

CLK24

AZCHK

TEST3

ERCOSTAT

A10/RAS

Fig.2 Pin configuration (SOT315-1; TQFP80).

May 1994 6

DD7

SS7

32 D0

WEN A15/PINO4

A16/PINO3

A14/PINO1

A12/PINO5

DD3

40 A5

MLB762

SS3

Philips Semiconductors Preliminary speciﬁcation

Drive processor for DCC systems SAA3323

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SBMCLK

L3MODE

L3DATA

ERCOSTAT

A10/RAS

SBWS SBCL

SBDA

SBDIR

URDA

L3CLK

L3INT

DD1

SS1

L3REF

RESET

SLEEP

CLK24

AZCHK

MCLK

TEST3

OEN

DD2

SS2

DD6

SBEF

PINO1

79 1 2 3 4 5 6 7 8 9

10 11 12 13 14 15 16 17 18 19 20 21 22 23 24

PINI 78

TEST1 77

CHTST2 75

TEST0

SS6

CHTST1 74

SAA3323

ANAEYE

RDSYNC 71

DDA

SSA

BIAS

ref(n)

SUBSTR

64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41

ref(p)

RDMUX TEST2

DD5

SS5

TCLOCK

WDATA PINO2 SPEED A11 A9/CAS

SS4

DD4

A8 A13/PINO2

WEN A15/PINO4 A16/PINO3 A14/PINO1

A12/PINO5 A7 A6 A5

DD3

27 D5

31 D1

DD7

Fig.3 Pin configuration (SOT318-2; QFP80).

May 1994 7

SS7

34 D0

35 A0

36 A1

37 A2

38 A3

39 A4

SS3

MLB763

May 1994 8

FUNCTIONAL DESCRIPTION

Philips Semiconductors Preliminary speciﬁcation

Drive processor for DCC systems SAA3323

RAM

41464

analog

output

analog

input

IEC958

analog CC

L output

analog CC

R output

DAC

TDA1305

SFC3 SAA2003 STEREO

FILTER CODEC

ADAS3

SAA2013

ADAPTIVE

ALLOCATION

baseband

I S

ADC

SAA7366

DIGITAL

AUDIO I/O

TDA1315

filtered I S

AUDIO IN/OUT PASC PROCESSOR

sub-band

I S

BUFFER

64K x 4

DRP

SAA2023

SAA3323

DRIVE

PROCESSOR

search data

TAPE DRIVE PROCESSING

speed control

WRAMP

TDA1381

WRITE AMP.

RDAMP

TDA1380

READ AMP.

FIXED HEAD

CAPSTAN

DRIVE

TAPE

MECHANICS

DRIVERS

detect switch

SYSTEM CONTROL

Fig.4 DCC system block diagram.

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SYSTEM

MICROCONTROLLER

MBD620

Philips Semiconductors Preliminary speciﬁcation

Drive processor for DCC systems SAA3323

A simplified block diagram of the SAA3323 is shown in Fig.1.

DCC drive processing

The SAA3323 provides the following functions for the DCC drive processing.

LAYBACK MODES

• Analog-to-digital conversion

• Tape channel equalization

• Tape channel data and clock recovery

• 10-to-8 demodulation

• Data placement in system RAM

• C1 and C2 error correction decoding

• Interfacing to sub-band serial PASC interface

• Interfacing to microcontroller for SYSINFO and AUX

data

• Capstan control for tape deck.

ECORD MODES

• Interfacing to sub-band serial PASC interface

• C1 and C2 error correction encoding

• Formatting for tape transfer

• 8-to-10 modulation

• Interfacing to microcontroller for SYSINFO and AUX

data

• Capstan control for tape deck, programmable by microcontroller.

EARCH MODE

Table 1 Basic modes of TFE module.

MODE EXPLANATION

DPAP audio and SYSINFO (main data) play;

AUX play

DPAR audio and SYSINFO (main data) play;

AUX record

DRAR audio and SYSINFO (main data) record;

AUX record

REGISTERS

TFE The TFE module has 8 writable and 5 readable registers

that are accessible via the L3 interface, one write register (CMD) and four read registers (STATUS0 to STATUS3) which are directly addressable, the other registers are indirectly addressable via commands sent to the CMD register. The registers are named as shown in Table 2.

Table 2 TFE register names.

CMD W STATUS0 R STATUS1 R STATUS2 R STATUS3 R SET0 W SET1 W SET2 W SET3

(1)

W SPDDTY W BYTCNT W RACCNT W SPEED R

• Detection and interpretation of AUX envelope information

• AUX envelope counting

• Search speed estimation.

Tape Formatting and Error (TFE) correction module

The TFE module has 3 basic modes of operation as shown in Table 1.

May 1994 9

Note

1. The 4 LSBs of register ‘SET3’ set RAM type (RType) and RAM timing (RTim). See Table 3.

For normal operation the 4 MSBs of register ‘SET3’ should be logic 0.

Philips Semiconductors Preliminary speciﬁcation

Drive processor for DCC systems SAA3323

Table 3 RAM settings by register SET3.

RAM REGISTER SET3

RTYPE 0 bit 0 RTYPE 1 bit 1 RTim 0 bit 2 RTim 1 bit 3

TFE

DATA STREAMS

The TFE module has three read/write data streams that are accessible via the L3 interface and they are shown in Table 4.

Table 5 TFE commands.

NAME

RDSPEED 00000000read SPEED register LDSET0 00010000load new TFE settings register 0 LDSET1 00010001load new TFE settings register 1 LDSET2 00010010load new TFE settings register 2 LDSET3 00010011load new TFE settings register 3 LDSPDDTY 00010101load SPDDTY register LDBYTCNT 00010111load BYTCNT register LDRACCNT 00011000load RACCNT register RDAUX 00100000read AUXILIARY information RDSYS 00100001read SYSINFO RDDRAC Y Z 100010read RAM data bytes (8 bits) from quarter YZ RDWDRAC Y Z 100011read RAM data words (12 bits) from quarter YZ WRAUX 00110000write AUXILIARY information WRSYS 00110001write SYSINFO WRDRAC Y Z 110010write RAM data bytes (8 bits) to quarter YZ WRWDRAC Y Z 110011write RAM data words (12 bits) to quarter YZ

COMMAND BYTE

76543210

Table 4 TFE data streams.

DATA STREAM NAME READ/WRITE

SYSINFO R/W AUXINFO R/W Scratch pad RAM R/W

COMMANDS’

TFE ‘ These are the commands that need to be sent to the TFE

in order to access the indirectly accessible registers and the data streams, see Table 5.

EXPLANATION

Digital equalizer module

The digital equalizer module has 2 basic modes of operation as shown in Table 6.

Table 6 Basic modes of equalizer module.

MODE EXPLANATION

Play main data and AUX channels are

equalized

Search only AUX channel is processed; AUX

envelope information is processed

May 1994 10

DIGITAL EQUALIZER REGISTERS The digital equalizer module has 9 write only, 3 read only

and 1 read/write register(s) that are accessible via the L3 interface, one write register (CMD) and 2 read registers (STATUS0 and STATUS1) which are directly addressable, the other registers are indirectly addressable via commands sent to the CMD register. The registers are named as shown in Table 7.

Philips Semiconductors Preliminary speciﬁcation

Drive processor for DCC systems SAA3323

Table 7 Digital equalizer register names.

CMD W STATUS0 R STATUS1 R COEFCNT W FCTRL W CHT1SEL W CHT2SEL W ANAEYE W AEC R/W SSPD R INTMASK W DEQ2SET W CLKSET W

Table 9 Digital equalizer commands.

COMMAND BYTE

NAME

76543210

WRCOEF 0 0 1 1 0 0 0 0 write FIR coefﬁcients to the digital equalizer buffer bank RDCOEF 0 0 1 0 0 0 0 0 read FIR coefﬁcients from the digital equalizer active bank LDCOEFCNT 0 0 0 1 0 0 1 1 load FIR coefﬁcient counter LDFCTRL 0 0 0 1 0 1 0 0 load ﬁlter control register LDT1SEL 0 0 0 1 0 1 1 0 load CHTST1 pin selection register LDT2SEL 0 0 0 1 0 1 1 1 load CHTST2 pin selection register LDTAEYE 0 0 0 1 1 0 0 0 load ANAEYE channel selection register LDAEC 0 0 0 1 1 0 0 1 load AEC counter RDAEC 0 0 1 0 0 0 1 0 read AEC counter RDSSPD 0 0 1 0 0 1 0 0 read SEARCH speed register LDINTMSK 0 0 0 1 0 0 1 0 load interrupt mask register LDDEQ3SET 0 0 0 1 0 0 0 0 load digital equalizer settings register LDCLKSET 0 0 0 1 0 0 0 1 load PLL clock extraction settings register

DATA STREAMS The digital equalizer module has one write only and one

read only data stream that are accessible via the L3 interface and they are shown in Table 8.

Table 8 Digital equalizer data streams.

DATA STREAM NAME READ/WRITE

FIR coefﬁcients to buffer bank W FIR coefﬁcients from active bank W

IGITAL EQUALIZER “COMMANDS”

D These are the commands that need to be sent to the digital

equalizer in order to access the indirectly accessible registers and the data streams.

EXPLANATION

Table 10 Filter control register.

BIT 7654321 0

Meaning −−−µCS Default 0 0 0 0 1 0 1 1

Note

1. µCS is a microcontroller controlled coefficient bank switch. This causes the filter coefficients to be activated at a time that is safe for the digital equalizer, i.e. at the end of the FIR program and that the complete value of coefficient number 9 has been received.

May 1994 11

(1)

SH1 SH0 Reserved

Philips Semiconductors Preliminary speciﬁcation

Drive processor for DCC systems SAA3323

Table 11 SH1 and SH2 (FIR output scaling).

0 0 FIR mod 256 01

EFFECT ON FIR OUTPUT

FIR

mod 256

---------2

FIR

mod 256

---------4

FIR

mod 256

---------8

Transfer of FIR coefﬁcients

For the main data channels (tracks 0 to 7) there are 10 coefficients (taps) each of 8 bits, where all of the data channels make use of the same coefficients. The addresses for the main data coefficients 0 to 9 are 0to9

There are ten coefficients (taps) each of 8 bits for the aux channel (CHAUX). The addresses for the auxiliary coefficients 0 to 9 are 16 to 25

respectively.

dec

respectively.

dec

There are 2 banks of coefficients for both the aux and the main data channels, namely the ‘buffer’, and the ‘active’ banks. The microcontroller writes only to the ‘buffer’ banks, and reads only from the ‘active’ banks.

The microcontroller can poll the digital equalizer status bit BKSW to see when the switch occurs. BKSW starts life LOW, goes HIGH as a result of the bank switching and goes LOW as result of the complete value of a main data coefficient being received by the digital equalizer.

The microcontroller sets µCS HIGH before sending the new set of aux or main data coefficients, the digital equalizer resets it once the bank switch occurs.

The actual FIR coefficients that are used are a function of the tape head, read amplifier and type of tape (i.e. pre-recorded or own recorded) used, such information is outside of the scope of this data sheet.

Coefﬁcient address counter (COEFCNT)

This 5 bit counter is used to point to the FIR coefficient to be transferred to or from the digital equalizer.

Table 12 Coefﬁcient address counter.

BIT 7654321 0

Meaning −−−CC4 CC3 CC2 CC1 CC0 Default 0 0 0 0 0 0 0 0

Pin explanations and interfacing to other hardware

RESET This is an active HIGH input which resets the SAA3323

and brings it into its default mode, DPAP. This reset does not affect the contents of the FIR filter coefficients in the digital equalizer. This should be connected to the system reset, which can be driven by the microcontroller. The duration of the reset pulse should be at least 15 µs.

SLEEP This pin is an active HIGH input which puts the SAA3323

in a low power consumption SLEEP mode. This pin should be connected to the DCC SLEEP signal, which can be driven by the microcontroller. The CLK24 clock may be stopped and the VREFP and VREFN inputs brought to ground while the SAA3323 is in ‘sleep’ mode to further reduce power consumption. When recovering from sleep

mode, the SLEEP pin should be taken LOW and the SAA3323 reset.

CLK24 This is the 24.576 MHz clock input and should be

connected directly to the SAA2003 (pin CLK24).

Sub-band serial PASC interface connections

The timing for the sub-band serial PASC interface is given in Figs 5 to 7.

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Philips Semiconductors Preliminary speciﬁcation

Drive processor for DCC systems SAA3323

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SBCL(in) SBWS(in) SBDA(in)

SBCL(in)

SBWS(in)

SBDA(in)

bit number

2 x t 40 ns

MCLK

40 ns

1514131211109876543210

31302928272625242322212019181716

MGB381

Fig.5 Sub-band serial PASC interface timing; DRAR mode.

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Philips Semiconductors Preliminary speciﬁcation

Drive processor for DCC systems SAA3323

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SBCL(out) SBWS(out) SBDA(out) SBEF(out)

SBMCLK(in)

SBCL(out)

SBWS(out)

SBDA(out)

60 ns

7 ns

1514131211109876543210

31302928272625242322212019181716

bit number

MGB382

Fig.6 Sub-band serial PASC interface timing in play modes; DRPMAS = logic 1.

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Philips Semiconductors Preliminary speciﬁcation

Drive processor for DCC systems SAA3323

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SBCL(in) SBWS(in) SBDA(out) SBEF(out)

SBCL(in)

SBWS(in)

SBDA(out)

2 x t 40 ns

MCLK

t (40 85) ns

MCLK

t (40 40) ns

MCLK

40 ns

1514131211109876543210

31302928272625242322212019181716

bit number

MGB383

Fig.7 Sub-band serial PASC interface timing in play modes; DRPMAS = logic 0.

SBMCLK This is the sub-band master clock input for the sub-band

serial PASC interface. The frequency of this signal is nominally 6.144 MHz. When the SAA3323 is used with SAA2003 this pin is tied to ground, and the TFE settings bit ‘DRPMAS’ set to logic 1.

SBDIR This output pin is the sub-band serial PASC bus direction

signal, it indicates the direction of transfer on the sub-band serial PASC bus. This pin connects directly to the SBDIR pin on the SAA2003. The transfer directions are shown in Table 13.

Table 13 PASC bus transfer directions.

SBDIR DIRECTION

1 SAA3323 to SAA2003 transfer (audio play) 0 SAA2003 to SAA3323 transfer (audio record)

SBCL This input/output pin is the bit clock line for the sub-band

serial PASC interface to the SAA2003. When used with SAA2003 this pin is input only. It has a nominal frequency of 768 kHz.

SBWS This input/output pin is the word select line for the

sub-band serial PASC interface to the SAA2003. When used with SAA2003 this pin is input only. It has a nominal frequency of 12 kHz.

SBDA This input/output pin is the serial data line for the sub-band

serial PASC interface to the SAA2003.

SBEF This active HIGH output pin is the error-per-byte line for

the sub-band serial PASC interface to the SAA2003.

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Philips Semiconductors Preliminary speciﬁcation

Drive processor for DCC systems SAA3323

URDA This active HIGH output pin indicates that the main data

(audio), the SYSINFO and the AUXILIARY data are NOT usable, regardless of the state of the corresponding reliability flags. The state of this pin is reflected in the URDA bit of STATUS byte 0, which can be read by the microcontroller. This pin should be connected directly to

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SNUM

SBWS

L3REF

'FIRST BYTE"

SBDA

the URDA pin of the SAA2003. URDA goes active as a result of a reset, a mode change from mode DRAR to DPAP, or if the SAA3323 has had to re-synchronize with the incoming data from tape.

The position of the first sub-band serial PASC bytes in a tape frame is shown in Figs 8 and 9.

MGB384

byte 0

byte 1 byte 2

Fig.8 Position of first sub-band serial PASC bytes in a tape frame in DPAP/DPAR mode.

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SNUM

SBWS

L3REF

'FIRST BYTE'

SBDA

byte 0 byte 1 byte 2

Fig.9 Position of first sub-band serial PASC bytes in a tape frame in DRAR mode.

MGB385

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Philips Semiconductors Preliminary speciﬁcation

Drive processor for DCC systems SAA3323

RAM connections

The SAA3323 has been designed to operate with DRAMs and SRAMs. Suitable DRAMs are 64K × 4-bit or 256K × 4-bit configurations operating in page mode, with an access time of 80 to 100 ns. The timing for read, write and refresh cycles for DRAMs is shown in Figs 10 to 12. The timing for SRAMs is shown in Figs 13 to 19.

For fast SRAMs: (these values are subject to verification during characterization in). The conditions (most critical at the required VDD) are shown in Table 14.

Table 14 Fast SRAM conditions.

CONDITION

Write pulse duration t Data set-up to rising Write cycle time T Read access time t

(1)

≤ 140 ns

WEN tsu≤ 72 ns

≤ 200 ns

≤ 240 ns

ACC

TIME

Note

1. The SAA3323 should work in: RType = ‘01’; RTim = ‘00’ mode.

A9/

CAS

When SAA3323 is used with SRAM this output pin is Address line 9, and should be connected directly to the corresponding address pin on the SRAM. When SAA3323 is used with DRAM this output pin is the column address strobe (active LOW), it connects directly to the column address strobe pin of the DRAM.

A10/

RAS

When SAA3323 is used with SRAM this output pin is Address line 10, and should be connected to the corresponding address pin of the SRAM. When SAA3323 is used with DRAM this output pin is the row address strobe (active LOW), it connects directly to the row address strobe pin of the DRAM.

OEN This output pin is the output enable (active LOW) for the

RAM, it connects directly to the output enable pin of the RAM.

WEN This output pin is the write enable (active LOW) for the

RAM, it connects directly to the write enable pin of the RAM.

TO A8

A0 When SAA3323 is used with DRAM these output pins are

the multiplexed column and row address lines. When the 64K × 4-bit DRAM is used, pins A0 to A7 should be connected to the DRAM address input pins, and pin A8 should be left unconnected. When using the 256K × 4-bit DRAM the address pins A0 to A8 should be connected to the address input pins of the DRAM.

When SAA3323 is used with SRAM these are the lower address pins and should be connected directly to the SRAM address pins.

A11 This output pin is the an address pin for the SRAM and

when SRAM is used they should be connected directly to the address pins of the SRAM. When DRAM is used this pin should not be connected.

A10 AND A12 TO A16 These output pins are the upper address pins for the

SRAM and when SRAM is used they should be connected directly to the address pins of the SRAM. When DRAM is used or when the small SRAM is used all or some of these pins become available as Port expander outputs.

May 1994 17

+ 39 hidden pages