Philips RZ1214B65Y Datasheet

DISCRETE SEMICONDUCTORS
DATA SH EET
fpage
M3D034
RZ1214B65Y
NPN microwave power transistor
Product specification Supersedes data of 1997 Feb 18
1999 Dec 24
Philips Semiconductors Product specification
NPN microwave power transistor RZ1214B65Y
FEATURES
Interdigitated structure provides high emitter efficiency
Diffused emitter ballasting resistor providing excellent
current sharing and withstanding a high VSWR
Gold metallization realizes very stable characteristics and excellent lifetime
Multicell geometry gives good balance of dissipated power and low thermal resistance
Internal input and output matching ensures good stability and allows an easier design of wideband circuits.
APPLICATIONS
Intended for use in common base class C wideband pulsed poweramplifiers for L-band radar applications in the 1.2 to 1.4 GHz band.
DESCRIPTION
NPN silicon planar epitaxial microwave power transistor in a SOT443A metal ceramic flange package with the base connected to the flange.
PINNING - SOT443A
PIN DESCRIPTION
1 collector 2 emitter 3 base connected to flange
handbook, halfpage
1
2
Top view
Fig.1 Simplified outline and symbol.
c
b
3
e
MAM314
QUICK REFERENCE DATA
Microwave performance up to Tmb=25°C in a common base class-C wideband amplifier.
MODE OF OPERATION
Class-C; t
= 150 µs; δ = 5% 1.2 to 1.4 50 70 7 35 see Fig4
p
f
(GHz)
V
(V)
CC
P
(W)
L
G
(dB)
p
η
C
(%)
Zi; Z
()
L
WARNING
Product and environmental safety - toxic materials This product contains beryllium oxide. The product is entirely safe provided that the BeO slab is not damaged.
All persons who handle, use or dispose of this product should be aware of its nature and of the necessary safety precautions. After use, dispose of as chemical or special waste according to the regulations applying at the location of the user. It must never be thrown out with the general or domestic waste.
1999 Dec 24 2
Philips Semiconductors Product specification
NPN microwave power transistor RZ1214B65Y
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
V
CBO
V
CEO
V
CES
V
EBO
I
C
P
tot
T
stg
T
j
T
sld
collector-base voltage open emitter 65 V collector-emitter voltage open base 15 V collector-emitter voltage RBE=0Ω−60 V emitter-base voltage open collector 3V collector current (DC) tp≤ 150 µs; δ≤5% 6A total power dissipation Tmb≤ 75 °C;
225 W
tp≤ 150 µs; δ≤5% storage temperature 65 +200 °C operating junction temperature 200 °C soldering temperature at 0.2 mm from the case;
235 °C
t 10 s
250
handbook,
P
tot
(W)
200
150
100
50
0
0 50 100 200
tp= 150 µs; δ=5%.
MGD977
150
Tmb (°C)
Fig.2 Power derating curve.
1999 Dec 24 3
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