Philips rs1 DATASHEETS
DISCRETE SEMICONDUCTORS
DATA SH EET
ook, halfpage
M3D168
RS1 series
SMA fast soft-recovery
controlled avalanche rectifiers
Product specification 2000 Feb 14
Philips Semiconductors Product specification
SMA fast soft-recovery
controlled avalanche rectifiers
FEATURES
• Glass passivated
• High maximum operating temperature
• Ideal for surface mount automotive applications
• Low leakage current
• Excellent stability
• Guaranteed avalanche energy absorption capability
• UL 94V-O classified plastic package
• Shipped in 12 mm embossed tape
• Marking: cathode, date code, type code
• Easy pick and place.
RS1 series
DESCRIPTION
DO-214AC surface mountable package with glass
passivated chip.
The well-defined void-free case is of a transfer-moulded
thermo-setting plastic. The small rectangular package
has two J bent leads.
lumns
ka
Top view Side view
Fig.1 Simplified outline (DO-214AC) and symbol.
cathode
band
MSA474
LIMITING VALUES
In accordance with the Absolute Maximum Rating
System (IEC 134).
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
V
RRM
repetitive peak reverse voltage
RS1A − 50 V
RS1B − 100 V
RS1D − 200 V
RS1G − 400 V
RS1J − 600 V
RS1K − 800 V
RS1M − 1000 V
V
R
continuous reverse voltage
RS1A − 50 V
RS1B − 100 V
RS1D − 200 V
RS1G − 400 V
RS1J − 600 V
RS1K − 800 V
RS1M − 1000 V
2000 Feb 14 2
Philips Semiconductors Product specification
SMA fast soft-recovery
RS1 series
controlled avalanche rectifiers
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
V
RMS
I
F(AV)
I
FSM
T
stg
T
j
root mean square voltage
RS1A − 35 V
RS1B − 70 V
RS1D − 140 V
RS1G − 280 V
RS1J − 420 V
RS1K − 560 V
RS1M − 700 V
average forward current averaged over any 20 ms period;
− 1A
Ttp= 110 °C; see Fig.2
non-repetitive peak forward current t = 8.3 ms half sine wave;
− 25 A
Tj=25°C prior to surge;
VR=V
RRMmax
storage temperature −65 +175 °C
junction temperature See Fig.3 −65 +175 °C
ELECTRICAL CHARACTERISTICS
Tj=25°C unless otherwise specified.
SYMBOL PARAMETER CONDITIONS TYP. MAX. UNIT
V
F
I
R
t
rr
forward voltage IF= 1 A; see Fig.4 − 1.3 V
reverse current VR=V
V
R=VRRMmax
; see Fig.5 − 5 µA
RRMmax
; Tj= 165 °C; see Fig.5 − 50 µA
reverse recovery time when switched from IF= 0.5 A to IR=1A;
RS1A to RS1J − 250 ns
measured at IR= 0.25 A; see Fig.9
RS1K and RS1M − 300 ns
C
d
diode capacitance VR= 4 V; f = 1 MHz; see Fig.6 7 − pF
THERMAL CHARACTERISTICS
SYMBOL PARAMETER CONDITIONS VALUE UNIT
R
R
th j-tp
th j-a
thermal resistance from junction to tie-point; see Fig.7 27 K/W
thermal resistance from junction to ambient note 1 100 K/W
note 2 150 K/W
Notes
1. Device mounted on Al
printed-circuit board, 0.7 mm thick; thickness of copper ≥35 µm.
2O3
2. Device mounted on epoxy-glass printed-circuit board, 1.5 mm thick; thickness of copper ≥40 µm. For more
information please refer to the
‘General Part of associated Handbook’
.
2000 Feb 14 3
Philips Semiconductors Product specification
SMA fast soft-recovery
controlled avalanche rectifiers
GRAPHICAL DATA
handbook, halfpage
2
I
F(AV)
(A)
1.5
1
0.5
0
0 40 200
VR=V
; δ= 0.5; a = 1.57.
RRMmax
80
120 160
Fig.2 Maximum permissible average forward
current as a function of tie-point
temperature (including losses due to
reverse leakage).
MCD822
Ttp (°C)
RS1 series
200
handbook, halfpage
T
j
(°C)
160
120
80
DG JKM
40
0
0 400 1200
Device mounted as shown in Fig.8.
Solid line: Al2O3 printed-circuit board.
Dotted line: epoxy printed-circuit board.
800
Fig.3 Maximum permissiblejunction temperature
as a function of reverse voltage.
MGD483
VR (V)
2
10
handbook, halfpage
I
F
(A)
10
1
−1
10
−2
10
−3
10
Tj=25°C.
10
MCD791
VF (V)
Fig.4 Forward current as a function of forward
voltage; typical values.
VR (%V
MCD803
Rmax
1000 20 40
)
2
10
handbook, halfpage
I
R
(µA)
10
1
−1
10
−2
10
−3
32
10
Tj = 165 °C
Tj = 25 °C
60 80
Fig.5 Reverse current as a function of reverse
voltage; typical values.
2000 Feb 14 4
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