Philips PUMH10 Technical data

DISCRETE SEMICONDUCTORS
DATA SH EET
PEMH10; PUMH10
NPN/NPN resistor-equipped transistors; R1 = 2.2 k,R2=47k
Product specification Supersedes data of 2001 Oct 22
2003 Oct 20
Philips Semiconductors Product specification
NPN/NPN resistor-equipped transistors;
PEMH10; PUMH10
R1 = 2.2 kΩ, R2 = 47 k
FEATURES
Built-in bias resistors
Simplified circuit design
Reduction of component count
Reduced pick and place costs.
APPLICATIONS
Low current peripheral driver
Replacement of general purpose transistors in digital
applications
Control of IC inputs.
PRODUCT OVERVIEW
TYPE
NUMBER
PHILIPS EIAJ
PACKAGE
MARKING CODE
PEMH10 SOT666 10 PEMB10 PEMD10 PUMH10 SOT363 SC-88 H*0
QUICK REFERENCE DATA
SYMBOL PARAMETER TYP. MAX. UNIT
V
CEO
collector-emitter
50 V
voltage
I
O
output current (DC) 100 mA TR1 NPN −−− TR2 NPN −−− R1 bias resistor 2.2 k R2 bias resistor 47 k
DESCRIPTION
NPN/NPN resistor-equipped transistors (see “Simplified outline, symbol and pinning” for package details).
PNP/PNP
(1)
COMPLEMENT
PUMB10 PUMD10
COMPLEMENT
NPN/PNP
Note
1. * = p: Made in Hong Kong. * = t: Made in Malaysia. * = W: Made in China.
SIMPLIFIED OUTLINE, SYMBOL AND PINNING
PINNING
TYPE NUMBER SIMPLIFIED OUTLINE AND SYMBOL
PIN DESCRIPTION
PEMH10 1 emitter TR1 PUMH10 2 base TR1
handbook, halfpage
123
Top view
465
MHC650
654
R1 R2
TR1
R2
123
TR2
R1
3 collector TR2 4 emitter TR2 5 base TR2 6 collector TR1
2003 Oct 20 2
Philips Semiconductors Product specification
NPN/NPN resistor-equipped transistors;
PEMH10; PUMH10
R1 = 2.2 kΩ, R2 = 47 k
ORDERING INFORMATION
TYPE NUMBER
NAME DESCRIPTION VERSION
PEMH10 plastic surface mounted package; 6 leads SOT666 PUMH10 plastic surface mounted package; 6 leads SOT363
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
Per transistor
V V V V
CBO CEO EBO I
collector-base voltage open emitter 50 V collector-emitter voltage open base 50 V emitter-base voltage open collector 10 V input voltage
positive +12 V negative −−5V
I
O
I
CM
P
tot
output current (DC) 100 mA peak collector current 100 mA total power dissipation T
amb
25 °C SOT363 note 1 200 mW SOT666 notes 1 and 2 200 mW
T T T
stg j amb
storage temperature 65 +150 °C junction temperature 150 °C operating ambient temperature 65 +150 °C
Per device
P
tot
total power dissipation T
amb
25 °C SOT363 note 1 300 mW SOT666 notes 1 and 2 300 mW
PACKAGE
Notes
1. Device mounted on an FR4 printed-circuit board, single-sided copper, standard footprint.
2. Reflow soldering is the only recommended soldering method.
2003 Oct 20 3
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