Datasheet PMEG3020EH, PMEG3020EJ Datasheet (Philips)

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PMEG3020EH; PMEG3020EJ
30 V, 2 A ultra low VF MEGA Schottky barrier rectifiers
Rev. 03 — 31 May 2005 Product data sheet
1. Product profile
1.1 General description
Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifiers with an integrated guard ring for stress protection encapsulated in small SMD plastic packages.
Table 1: Product overview
Type number Package Configuration
PMEG3020EH SOD123F - single isolated diodes PMEG3020EJ SOD323F SC-90 single isolated diodes
Philips JEITA
1.2 Features
Forward current: 2 A
Reverse voltage: 30 V
Ultra low forward voltage
1.3 Applications
Low voltage rectification
High efficiency DC-to-DC conversion
Switched-mode power supply
Inverse polarity protection
Low power consumption applications
1.4 Quick reference data
Table 2: Quick reference data
Symbol Parameter Conditions Min Typ Max Unit
I
F
V
R
V
F
[1] Pulse test: tp≤ 300 µs; δ≤0.02.
forward current Tsp≤ 55 °C --2A reverse voltage - - 30 V forward voltage IF= 2000 mA
[1]
- 510 620 mV
Philips Semiconductors
2. Pinning information
Table 3: Pinning
Pin Description Simplified outline Symbol
1 cathode 2 anode
[1] The marking bar indicates the cathode.
3. Ordering information
Table 4: Ordering information
Type number Package
PMEG3020EH - plastic surface mounted package; 2 leads SOD123F PMEG3020EJ SC-90 plastic surface mounted package; 2 leads SOD323F
PMEG3020EH; PMEG3020EJ
30 V, 2 A ultra low VF MEGA Schottky barrier rectifiers
[1]
12
12
sym001
001aab540
Name Description Version
4. Marking
Table 5: Marking codes
Type number Marking code
PMEG3020EH A7 PMEG3020EJ E9
9397 750 15077 © Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet Rev. 03 — 31 May 2005 2 of 9
Philips Semiconductors
5. Limiting values
Table 6: Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
V
R
I
F
I
FRM
I
FSM
P
tot
T
j
T
amb
T
stg
[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
[2] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2.
PMEG3020EH; PMEG3020EJ
30 V, 2 A ultra low VF MEGA Schottky barrier rectifiers
reverse voltage - 30 V forward current Tsp≤ 55 °C-2A repetitive peak forward
current non-repetitive peak forward
current total power dissipation T
PMEG3020EH
PMEG3020EJ
junction temperature - 150 °C ambient temperature 65 +150 °C storage temperature 65 +150 °C
tp≤ 1 ms; δ≤0.25 - 4.5 A
t = 8 ms; square
[1]
-9A
wave
25 °C
amb
[1]
- 375 mW
[2]
- 830 mW
[1]
- 360 mW
[2]
- 830 mW
6. Thermal characteristics
Table 7: Thermal characteristics
Symbol Parameter Conditions Min Typ Max Unit
R
th(j-a)
R
th(j-sp)
[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. [2] For Schottky barrier diodes thermal run-away has to be considered, as in some applications the reverse
power losses PR are a significant part of the total power losses. Nomograms for determining the reverse power losses PR and I
[3] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2.
thermal resistance from junction to ambient
PMEG3020EH
PMEG3020EJ
thermal resistance from junction to solder point
PMEG3020EH - - 60 K/W PMEG3020EJ - - 55 K/W
in free air
rating will be available on request.
F(AV)
[1] [2]
- - 330 K/W
[2] [3]
- - 150 K/W
[1] [2]
- - 350 K/W
[2] [3]
- - 150 K/W
9397 750 15077 © Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet Rev. 03 — 31 May 2005 3 of 9
Philips Semiconductors
7. Characteristics
Table 8: Characteristics
T
=25°C unless otherwise specified.
amb
Symbol Parameter Conditions Min Typ Max Unit
V
F
I
R
C
d
[1] Pulse test: tp≤ 300 µs; δ≤0.02.
PMEG3020EH; PMEG3020EJ
30 V, 2 A ultra low VF MEGA Schottky barrier rectifiers
forward voltage
IF= 1 mA - 125 160 mV
= 10 mA - 185 220 mV
I
F
= 100 mA - 255 290 mV
I
F
= 500 mA - 330 380 mV
I
F
= 1000 mA - 400 480 mV
I
F
= 2000 mA - 510 620 mV
I
F
reverse current VR= 10 V - 60 150 µA
= 30 V - 400 1000 µA
V
R
diode capacitance VR= 1 V; f = 1 MHz - 60 72 pF
[1]
4
10
I
F
(mA)
3
10
2
10
10
1
1
10
0 0.60.40.1 0.3 0.50.2
(1) T
amb
(2) T
amb
(3) T
amb
(4) T
amb
(5) T
amb
(1) (2) (3) (4) (5)
= 150 °C = 125 °C =85°C =25°C = 40 °C
006aaa293
VF (V)
Fig 1. Forward current as a function of forward
voltage; typical values
006aaa294
VR (V)
I
(µA)
R
10
10
(1) T (2) T (3) T (4) T (5) T
6
10
5
10
4
10
3
10
2
10
10
1
1
2
03520515 302510
= 150 °C
amb
= 125 °C
amb
=85°C
amb
=25°C
amb
= 40 °C
amb
(1)
(2) (3)
(4)
(5)
Fig 2. Reverse current as a function of reverse
voltage; typical values
9397 750 15077 © Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet Rev. 03 — 31 May 2005 4 of 9
Philips Semiconductors
PMEG3020EH; PMEG3020EJ
30 V, 2 A ultra low VF MEGA Schottky barrier rectifiers
006aaa295
T
=25°C; f = 1 MHz
amb
140
C
d
(pF)
120
100
80
60
40
20
0
0301510 20525
Fig 3. Diode capacitance as a function of reverse voltage; typical values
8. Package outline
1.2
1.0
2.7
2.3
3.6
3.4
2.7
2.5
1.7
1.5
1
0.55
0.35
VR (V)
1.8
1.6
1.35
1.15
0.80
0.65
1
0.5
0.3
2
0.40
0.25
0.25
0.10 04-09-13Dimensions in mm
0.70
0.55
2
0.25
0.10 04-11-29Dimensions in mm
Fig 4. Package outline SOD123F Fig 5. Package outline SOD323F (SC-90)
9. Packing information
Table 9: Packing methods
The -xxx numbers are the last three digits of the 12NC ordering code.
Type number Package Description Packing quantity
PMEG3020EH SOD123F 4 mm pitch, 8 mm tape and reel -115 -135 PMEG3020EJ SOD323F 4 mm pitch, 8 mm tape and reel -115 -135
[1] For further information and the availability of packing methods, seeSection 16.
9397 750 15077 © Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet Rev. 03 — 31 May 2005 5 of 9
[1]
3000 10000
Philips Semiconductors
10. Soldering
Fig 6. Reflow soldering footprint SOD123F
PMEG3020EH; PMEG3020EJ
30 V, 2 A ultra low VF MEGA Schottky barrier rectifiers
4.4 4
2.9
1.6
1.6
1.1
(2×)
Reflow soldering is the only recommended soldering method. Dimensions in mm
1.1 1.22.1
solder lands
solder resist
solder paste
occupied area
3.05
2.80
2.10
1.60
1.65
0.50 (2×)
0.500.95
msa433
Reflow soldering is the only recommended soldering method. Dimensions in mm
Fig 7. Reflow soldering footprint SOD323F (SC-90)
solder lands
solder resist
0.60 occupied area
solder paste
9397 750 15077 © Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet Rev. 03 — 31 May 2005 6 of 9
Philips Semiconductors
PMEG3020EH; PMEG3020EJ
30 V, 2 A ultra low VF MEGA Schottky barrier rectifiers
11. Revision history
Table 10: Revision history
Document ID Release date Data sheet status Change notice Doc. number Supersedes
PMEG3020EH_EJ_3 20050531 Product data sheet - 9397 750 15077 PMEG3020EH_EJ_2 Modifications: PMEG3020EH_EJ_2 20050404 Product data sheet - 9397 750 14883 PMEG3020EJ_1 PMEG3020EJ_1 20050125 Product data sheet - 9397 750 13917 -
Table 6 “Limiting values” I
value changed to 9 A
FSM
9397 750 15077 © Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet Rev. 03 — 31 May 2005 7 of 9
Philips Semiconductors
12. Data sheet status
PMEG3020EH; PMEG3020EJ
30 V, 2 A ultra low VF MEGA Schottky barrier rectifiers
Level Data sheet status
I Objective data Development This data sheet contains data from the objective specification for product development. Philips
II Preliminary data Qualification Thisdata sheet contains data from the preliminary specification. Supplementary data will be published
III Product data Production This data sheet contains data from the product specification. Philips Semiconductors reserves the
[1] Please consult the most recently issued data sheet before initiating or completing a design. [2] The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at
URL http://www.semiconductors.philips.com.
[3] For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
[1]
Product status
13. Definitions
Short-form specification — The data in a short-form specification is
extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook.
Limiting values definition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification.
[2] [3]
Definition
Semiconductors reserves the right to change the specification in any manner without notice.
at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product.
right to make changes at any time in order to improve the design, manufacturing and supply. Relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN).
customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application.
Right to make changes — Philips Semiconductors reserves the right to make changes in the products - including circuits, standard cells, and/or software - described or contained herein in order to improve design and/or performance. When the product is in full production (status ‘Production’), relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified.
15. Trademarks
14. Disclaimers
Life support — These products are not designed for use in life support
appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors
Notice — All referenced brands, product names, service names and trademarks are the property of their respective owners.
16. Contact information
For additional information, please visit: http://www.semiconductors.philips.com For sales office addresses, send an email to: sales.addresses@www.semiconductors.philips.com
9397 750 15077 © Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet Rev. 03 — 31 May 2005 8 of 9
Philips Semiconductors
PMEG3020EH; PMEG3020EJ
17. Contents
1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1 General description. . . . . . . . . . . . . . . . . . . . . . 1
1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.4 Quick reference data. . . . . . . . . . . . . . . . . . . . . 1
2 Pinning information. . . . . . . . . . . . . . . . . . . . . . 2
3 Ordering information. . . . . . . . . . . . . . . . . . . . . 2
4 Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3
6 Thermal characteristics. . . . . . . . . . . . . . . . . . . 3
7 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 4
8 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 5
9 Packing information. . . . . . . . . . . . . . . . . . . . . . 5
10 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
11 Revision history. . . . . . . . . . . . . . . . . . . . . . . . . 7
12 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . . 8
13 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
14 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
15 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
16 Contact information . . . . . . . . . . . . . . . . . . . . . 8
30 V, 2 A ultra low VF MEGA Schottky barrier rectifiers
© Koninklijke Philips Electronics N.V. 2005
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Published in The Netherlands
Date of release: 31 May 2005
Document number: 9397 750 15077
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