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PMEG3015EV
30 V, 1.5 A ultra low VF MEGA Schottky barrier rectifier in
SOT666 package
Rev. 01 — 4 April 2005 Product data sheet
1. Product profile
1.1 General description
Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier with an
integrated guard ring for stress protection, encapsulated in an ultra small SMD SOT666
plastic package.
1.2 Features
■ Forward current: 1.5 A
■ Reverse voltage: 30 V
■ Ultra low forward voltage
■ Ultra small SMD packages
1.3 Applications
■ Low voltage rectification
■ High efficiency DC-to-DC conversion
■ Voltage clamping
■ Inverse polarity protection
■ Low power consumption applications
1.4 Quick reference data
Table 1: Quick reference data
Symbol Parameter Conditions Min Typ Max Unit
I
F
V
R
V
F
[1] Pulse test: tp≤ 300µs; δ≤0.02.
forward current Tsp≤ 55 °C - - 1.5 A
reverse voltage - - 30 V
forward voltage IF= 1.5 A
[1]
- 480 550 mV
Philips Semiconductors
2. Pinning information
Table 2: Pinning
Pin Description Simplified outline Symbol
1 cathode
2 cathode
3 anode
4 anode
5 cathode
6 cathode
3. Ordering information
Table 3: Ordering information
Type number Package
PMEG3015EV - plastic surface mounted package; 6 leads SOT666
PMEG3015EV
30 V, 1.5 A ultra low VF MEGA Schottky barrier rectifier
456
123
Name Description Version
1, 2
5, 6
3, 4
sym038
4. Marking
Table 4: Marking codes
Type number Marking code
PMEG3015EV 1A
9397 750 14638 © Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet Rev. 01 — 4 April 2005 2 of 10
Philips Semiconductors
5. Limiting values
Table 5: Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
V
R
I
F
I
FRM
I
FSM
P
tot
T
j
T
amb
T
stg
[1] For SOT666 only valid, if pins 3 and 4 are connected in parallel.
[2] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
[3] Device mounted on an FR4 PCB, single-sided copper, tin-plated and mounting pad for cathode 1 cm2.
PMEG3015EV
30 V, 1.5 A ultra low VF MEGA Schottky barrier rectifier
reverse voltage - 30 V
forward current Tsp≤ 55 °C - 1.5 A
repetitive peak forward current tp≤ 1 ms; δ≤0.25
non-repetitive peak forward
current
total power dissipation T
tp= 8 ms; square
wave
≤ 25 °C
amb
junction temperature - 150 °C
ambient temperature −65 +150 °C
storage temperature −65 +150 °C
[1]
- 4.5 A
[1]
- 9.5 A
[2]
- 0.31 W
[3]
- 0.58 W
6. Thermal characteristics
Table 6: Thermal characteristics
Symbol Parameter Conditions Min Typ Max Unit
R
th(j-a)
R
th(j-sp)
[1] For Schottky barrier diodes thermal run-away has to be considered, as in some applications the reverse
power losses PR are a significant part of the total power losses. Nomograms for determining the reverse
power losses PR and I
[2] Reflow soldering is the only recommended soldering method.
[3] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
[4] Device mounted on an FR4 PCB, single-sided copper, tin-plated and mounting pad for cathode 1 cm2.
thermal resistance fromjunction
to ambient
thermal resistance fromjunction
to solder point
in free air
rating will be available on request.
F(AV)
[1] [2]
[3]
- - 405 K/W
[4]
- - 215 K/W
--80K/W
9397 750 14638 © Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet Rev. 01 — 4 April 2005 3 of 10