Philips PHB73N06T, PHP73N06T Datasheet

1. Description

2. Features

PHP73N06T; PHB73N06T
N-channel enhancement mode field-effect transistor
Rev. 01 — 12 March 2001 Product specification
N-channel enhancement mode field-effect powertransistorina plastic package using TrenchMOS™1 technology.
Product availability:
PHP73N06T in SOT78 (TO-220AB) PHB73N06T in SOT404 (D2-PAK).
Fast switching
Very low on-state resistance.

3. Applications

General purpose switching
Switched mode power supplies.
c

4. Pinning information

Table 1: Pinning - SOT78 and SOT404, simplified outline and symbol
Pin Description Simplified outline Symbol
1 gate (g) 2 drain (d) 3 source (s) mb mounting base;
[1] It is not possible to make connection to pin 2 of the SOT404 package.
c
connected to drain (d)
[1]
12mb3
SOT78 (TO-220AB)
MBK106
mb
2
13
SOT404 (D
2-
PAK)
MBK116
g
MBB076
d
s
1. TrenchMOS is a trademark of Royal Philips Electronics.
Philips Semiconductors
PHP73N06T; PHB73N06T
N-channel enhancement mode field-effect transistor

5. Quick reference data

Table 2: Quick reference data
Symbol Parameter Conditions Typ Max Unit
V I P T R
DS
D
tot j DSon
drain-source voltage (DC) Tj=25to175°C 55 V drain current (DC) Tmb=25°C; VGS=10V 73 A total power dissipation Tmb=25°C 149 W junction temperature 175 °C drain-source on-state resistance Tj=25°C; VGS= 10 V; ID= 25 A 12 14 m

6. Limiting values

Table 3: Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
V
DS
V
DGR
V
GS
I
D
I
DM
P
tot
T
stg
T
j
Source-drain diode
I
S
I
SM
Avalanche ruggedness
E
AS
drain-source voltage (DC) Tj=25to175°C 55 V drain-gate voltage (DC) Tj=25to175°C; RGS=20kΩ−55 V gate-source voltage (DC) −±20 V drain current (DC) Tmb=25°C; VGS=10V;
73 A
Figure 2 and 3
T
= 100 °C; VGS=10V;
mb
52 A
Figure 2 and 3
peak drain current Tmb=25°C; pulsed; tp≤ 10 µs;
266 A
Figure 3
total power dissipation Tmb=25°C; Figure 1 166 W storage temperature 55 175 °C operating junction temperature 55 175 °C
source (diode forward) current (DC) Tmb=25°C 73 A peak source (diode forward) current Tmb=25°C; pulsed; tp≤ 10 µs 266 A
non-repetitive avalanche energy unclamped inductive load; IAS=50A;
= 0.1 ms; VDD≤ 25 V; RGS=50Ω;
t
p
= 5 V; starting Tj=25°C;
V
GS
125 mJ
Figure 4
9397 75008107
Product specification Rev. 01 — 12 March 2001 2 of 14
© Philips Electronics N.V. 2001. All rights reserved.
Philips Semiconductors
PHP73N06T; PHB73N06T
N-channel enhancement mode field-effect transistor
120
P
der
(%)
100
80
60
40
20
0
0 25 50 75 100 125 150 175 200
P
P
der
tot
----------------------
P
tot 25 C°()
100%×=
03aa16
Tmb (oC)
Fig 1. Normalized total power dissipation as a
function of mounting base temperature.
3
10
R
= VDS / I
DSon
I
D
(A)
2
10
D
003aaa083
tp = 1 µs
10 µs
100 µs
tp =
120
I
der (%)
100
80
60
40
20
0
0 25 50 75 100 125 150 175 200
03aa24
Tmb (oC)
VGS≥ 5V
I
I
der
D
------------------ -
I
D25C°()
100%×=
Fig 2. Normalized continuous drain current as a
function of mounting base temperature.
2
10
I
AS (A)
10
003aaa085
25 oC
VDS (V)
1 ms
10 1
10 ms
100 ms
2
10
10
P
1
1
t
p
D.C.
δ =
T
t
t
p
T
10
Tj prior to avalanche = 150 oC
1
-3
10
-2
10
-1
10
tp ms
101
Tmb=25°C; IDM is single pulse Unclamped inductive load; VDD≤ 25 V; RGS=50Ω;
VGS= 5 V; starting Tj=25°C and 150 °C
Fig 3. Safe operating area; continuous and peak drain
currents as a function of drain-source voltage.
9397 750 08107
Fig 4. Non-repetitive avalanche ruggedness current
as a function of pulse duration.
© Philips Electronics N.V. 2001. All rights reserved.
Product specification Rev. 01 — 12 March 2001 3 of 14
Philips Semiconductors
PHP73N06T; PHB73N06T
N-channel enhancement mode field-effect transistor

7. Thermal characteristics

Table 4: Thermal characteristics
Symbol Parameter Conditions Value Unit
R
th(j-mb)
R
th(j-a)
thermal resistance from junction to mounting base
thermal resistance from junction to ambient SOT78 package; vertical in still air 60 K/W

7.1 Transient thermal impedance

Figure 5 0.9 K/W
SOT404 package; mounted on
50 K/W printed circuit board; minimum footprint.
Z
th (j-mb)
(K/W)
10
δ = 0.5
1
δ =
0.5
0.2
-1
10
10
0.1
0.05
0.02
-2
-3
-7
10
10
Single pulse
-6
10
10
-4
-5
-3
10
P
-1
-2
10
10
003aaa084
t
p
δ =
T
t
p
t
T
101
tp (s)
Fig 5. Transient thermal impedance from junction to mounting base as a function of
pulse duration.
9397 750 08107
© Philips Electronics N.V. 2001. All rights reserved.
Product specification Rev. 01 — 12 March 2001 4 of 14
Philips Semiconductors
PHP73N06T; PHB73N06T
N-channel enhancement mode field-effect transistor

8. Characteristics

Table 5: Characteristics
Tj=25°C unless otherwise specified
Symbol Parameter Conditions Min Typ Max Unit
Static characteristics
V
(BR)DSS
V
GS(th)
I
DSS
I
GSS
R
DSon
Dynamic characteristics
Q
g(tot)
Q
gs
Q
gd
C
iss
C
oss
C
rss
t
d(on)
t
r
t
d(off)
t
f
Source-drain diode
V
SD
t
rr
Q
r
drain-source breakdown voltage ID= 250 µA; VGS=0V 55 −−V gate-source threshold voltage ID= 1 mA; VDS=VGS;
Figure 10
=25°C 234V
T
j
= 175 °C1−−V
T
j
drain-source leakage current VDS=55V; VGS=0V
=25°C 0.05 10 µA
T
j
= 175 °C −−500 µA
T
j
gate-source leakage current VGS= ±20 V; VDS=0V 2 100 nA drain-source on-state resistance VGS= 10 V; ID=25A;
Figure 8 and 9
=25oC 12 14 m
T
j
= 175 °C −−28 m
T
j
total gate charge ID= 50 A; VDD=44V;
=10V;Figure 15
V
gate-source charge 10 nC
GS
54 nC
gate-drain (Miller) charge 19 nC input capacitance VGS=0V; VDS=25V; output capacitance 421 506 pF
f = 1 MHz; Figure 13
1848 2464 pF
reverse transfer capacitance 231 317 pF turn-on delay time VDD=30V; RD= 1.2 ;
=5V; RG=10
V
rise time 79 119 ns
GS
17 26 ns
turn-off delay time 57 80 ns fall time 51 71 ns
source-drain (diode forward) voltage IS= 25 A; VGS=0V;
0.85 1.2 V
Figure 14
reverse recovery time IS=73A;
/dt = 100 A/µs;
dI
recovered charge 0.12 −µC
S
= 10 V; VR=30V
V
GS
54 ns
9397 750 08107
Product specification Rev. 01 — 12 March 2001 5 of 14
© Philips Electronics N.V. 2001. All rights reserved.
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