Philips PHP71NQ03LT, PHB71NQ03LT, PHD71NQ03LT User Guide

Page 1
1. Product profile

1.1 Description

1.2 Features

PHP/PHB/PHD71NQ03LT
TrenchMOS™ logic level FET
Rev. 01 — 25 June 2002 Product data
N-channel enhancement mode field-effect transistor in a plastic package using TrenchMOS™ technology.
Product availability:
Logic level compatible ■ Low gate charge

1.3 Applications

DC to DC converters Switched mode power supplies

1.4 Quick reference data

VDS=30V ■ ID=75A
P
= 120 W R
tot
DSon
10 m

2. Pinning information

Table 1: Pinning - SOT78, SOT404, SOT428 simplified outline and symbol
Pin Description Simplified outline Symbol
1 gate (g) 2 drain (d) 3 source (s) mb mounting base,
connected to drain (d)
[1]
MBK106
12mb3
SOT78 (TO-220) SOT404 (D
mb
2
13
MBK116
2
-PAK) SOT428 (D-PAK)
mb
2
13
Top view
MBK091
MBB076
d
g
s
[1] It is not possible to make connection to pin 2 of the SOT404 or SOT428 packages.
Page 2
Philips Semiconductors
PHP/PHB/PHD71NQ03LT
TrenchMOS™ logic level FET

3. Limiting values

Table 2: Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
V
DS
V
DGR
V
GS
V
GSM
I
D
I
DM
P
tot
T
stg
T
j
Source-drain diode
I
S
I
SM
drain-source voltage (DC) 25 °C Tj≤ 175 °C - 30 V drain-gate voltage (DC) 25 °C Tj≤ 175 °C; RGS=20k -30V gate-source voltage (DC) - ±20 V peak gate-source voltage tp≤ 50 µs; pulsed; duty cycle = 25 % - ±25 V drain current (DC) Tmb=25°C; VGS=10V;Figure 2 and 3 -75A
= 100 °C; VGS=10V;Figure 2 - 57.7 A
T
mb
peak drain current Tmb=25°C; pulsed; tp≤ 10 µs; Figure 3 - 240 A total power dissipation Tmb=25°C; Figure 1 - 120 W storage temperature 55 +175 °C junction temperature 55 +175 °C
source (diode forward) current (DC) Tmb=25°C - 75 A peak source (diode forward) current Tmb=25°C; pulsed; tp≤ 10 µs - 57.7 A
9397 750 09821
Product data Rev. 01 — 25 June 2002 2 of 14
© Koninklijke Philips Electronics N.V. 2002. All rights reserved.
Page 3
Philips Semiconductors
03aa16
0
40
80
120
0 50 100 150 200
Tmb (°C)
P
der
(%)
PHP/PHB/PHD71NQ03LT
TrenchMOS™ logic level FET
P
tot
P
der
-----------------------
P
tot 25 C°()
100%×= I
Fig 1. Normalized total power dissipation as a
function of mounting base temperature.
3
10
120
I
der
(%)
80
40
0
0 50 100 150 200
I
D
der
-------------------
I
D25C
()
100%×=
°
03ai74
Tmb (°C)
Fig 2. Normalized continuous drain current as a
function of mounting base temperature.
03ai76
I
D
(A)
2
10
10
1
1 10 10
Limit R
DSon
= V
DS
/ I
D
DC
tp = 10 µs
100 µs
1 ms
10 ms
2
VDS (V)
Tmb=25°C; IDM is single pulse; VGS = 10V.
Fig 3. Safe operating area; continuous and peak drain currents as a function of drain-source voltage.
9397 750 09821
Product data Rev. 01 — 25 June 2002 3 of 14
© Koninklijke Philips Electronics N.V. 2002. All rights reserved.
Page 4
Philips Semiconductors
PHP/PHB/PHD71NQ03LT
TrenchMOS™ logic level FET

4. Thermal characteristics

Table 3: Thermal characteristics
Symbol Parameter Conditions Min Typ Max Unit
R
th(j-mb)
R
th(j-a)
thermal resistance from junction to mounting base Figure 4 - - 1.25 K/W thermal resistance from junction to ambient
SOT78 vertical in still air - 60 - K/W SOT428 SOT428 minimum footprint;
- 75 - K/W
mounted on a PCB
SOT404 and SOT428 SOT404 minimum footprint;
- 50 - K/W
mounted on a PCB

4.1 Transient thermal impedance

03ai75
δ =
t
p
T
tp (s)
Z
th(j-mb)
(K/W)
10
1
10
10
δ = 0.5
0.2
0.1
-1
0.05
0.02
single pulse
-2 10
-5
10
-4
10
-3
10
P
-2
Fig 4. Transient thermal impedance from junction to mounting base as a function of pulse duration.
t
p
T
t
-1
10
9397 750 09821
© Koninklijke Philips Electronics N.V. 2002. All rights reserved.
Product data Rev. 01 — 25 June 2002 4 of 14
Page 5
Philips Semiconductors
PHP/PHB/PHD71NQ03LT
TrenchMOS™ logic level FET

5. Characteristics

Table 4: Characteristics
Tj=25°C unless otherwise specified
Symbol Parameter Conditions Min Typ Max Unit
Static characteristics
V
(BR)DSS
V
GS(th)
I
DSS
I
GSS
R
DSon
Dynamic characteristics
Q
g(tot)
Q
gs
Q
gd
C
iss
C
oss
C
rss
t
d(on)
t
r
t
d(off)
t
f
Source-drain diode
V
SD
t
rr
Q
r
drain-source breakdown voltage ID= 250 µA; VGS=0V
T
=25°C 30--V
j
= 55 °C 27--V
T
j
gate-source threshold voltage ID= 1 mA; VDS=VGS; Figure 9
T
=25°C 1 1.9 2.5 V
j
= 175 °C 0.6 - - V
T
j
= 55 °C - - 2.9 V
T
j
drain-source leakage current VDS=30V; VGS=0V
T
=25°C - 0.05 1 µA
j
= 175 °C - - 500 µA
T
j
gate-source leakage current VGS= ±20 V; VDS= 0 V - 10 100 nA drain-source on-state resistance VGS=5V; ID=25A;Figure 7 and 8
T
=25°C - 12 15.2 mΩ
j
= 175 °C - 21.6 27.4 m
T
j
= 10 V; ID=25A;Figure 7 - 8 10 m
V
GS
total gate charge ID= 50 A; VDD=15V; VGS=5V;Figure 13 - 13.2 - nC gate-source charge - 5.3 - nC gate-drain (Miller) charge - 4.6 - nC input capacitance VGS=0V; VDS= 25 V; f = 1 MHz; Figure 11 - 1220 - pF output capacitance - 330 - pF reverse transfer capacitance - 140 - pF turn-on delay time VDD=15V; ID= 25 A; VGS= 4.5 V; RG= 5.6 -15-ns rise time - 150 - ns turn-off delay time - 13.5 - ns fall time -18-ns
source-drain (diode forward) voltage IS= 25 A; VGS=0V;Figure 12 - 0.9 1.2 V reverse recovery time IS= 10 A; dIS/dt = 100 A/µs; VGS=0V - 29 - ns recovered charge - 20 - nC
9397 750 09821
Product data Rev. 01 — 25 June 2002 5 of 14
© Koninklijke Philips Electronics N.V. 2002. All rights reserved.
Page 6
Philips Semiconductors
PHP/PHB/PHD71NQ03LT
TrenchMOS™ logic level FET
7 V
03ai77
5.5 V6 V 5 V
4.5 V
4 V
3.5 V
VGS = 3 V
VDS (V)
03ai78
5 V
80
VDS > ID x R
I
D
(A)
60
40
20
0
0246
=25°C and 175 °C; VDS> IDxR
j
DSon
175 °C
Tj = 25 °C
Fig 6. Transfer characteristics: drain current as a
function of gate-source voltage; typical values.
2
a
1.5
80
Tj = 25 °C
I
D
(A)
60
40
20
0
0 0.2 0.4 0.6 0.8 1
10 V
Tj=25°CT
Fig 5. Output characteristics: drain current as a
function of drain-source voltage; typical values.
20
R
(mΩ)
DSon
15
VGS = 4.5 VTj = 25 °C
03ai79
VGS (V)
DSon
03af18
5.5 V
10
5
0
0
20
40
6 V 7 V
10 V
60
ID (A)
80
Tj=25°C
Fig 7. Drain-source on-state resistance as a function
of drain current; typical values.
1
0.5
0
-60 0 60 120 180
R
DSon
=
a
---------------------------- -
R
DSon 25 C°()
Tj (°C)
Fig 8. Normalized drain-source on-state resistance
factor as a function of junction temperature.
9397 750 09821
© Koninklijke Philips Electronics N.V. 2002. All rights reserved.
Product data Rev. 01 — 25 June 2002 6 of 14
Page 7
Philips Semiconductors
PHP/PHB/PHD71NQ03LT
TrenchMOS™ logic level FET
3.2
V
GS(th)
(V)
2.4
1.6
0.8
0
-60 0 60 120 180
ID= 1 mA; VDS=V
max
typ
min
GS
03ai29
Tj (°C)
Fig 9. Gate-source threshold voltage as a function of
junction temperature.
4
10
-1
10
I
D
(A)
-2
10
-3
10
-4
10
-5
10
-6
10
0 0.8 1.6 2.4 3.2
typ maxmin
03ai28
VGS(V)
Tj=25°C; VDS=5V
Fig 10. Sub-threshold drain current as a function of
gate-source voltage.
03ai81
C
(pF)
C
10
10
3
2
-1
10
1 10 10
iss
C
oss
C
rss
VDS (V)
2
VGS=0V;f=1MHz
Fig 11. Input, output and reverse transfer capacitances as a function of drain-source voltage; typical values.
9397 750 09821
© Koninklijke Philips Electronics N.V. 2002. All rights reserved.
Product data Rev. 01 — 25 June 2002 7 of 14
Page 8
Philips Semiconductors
03ai82
0
2
4
6
8
10
0 5 10 15 20 25
QG (nC)
V
GS
(V)
ID = 50 A Tj = 25 °C VDD = 15 V
PHP/PHB/PHD71NQ03LT
TrenchMOS™ logic level FET
80
VGS = 0 V
I
S
(A)
60
40
20
0
0 0.3 0.6 0.9 1.2
03ai80
Tj = 25 °C175 °C
VSD (V)
Tj=25°C and 175 °C; VGS=0V ID= 50 A; VDD=15V
Fig 12. Source (diode forward) current as a function of
source-drain (diode forward) voltage; typical
Fig 13. Gate-source voltage as a function of gate
charge; typical values.
values.
9397 750 09821
© Koninklijke Philips Electronics N.V. 2002. All rights reserved.
Product data Rev. 01 — 25 June 2002 8 of 14
Page 9
Philips Semiconductors
PHP/PHB/PHD71NQ03LT
TrenchMOS™ logic level FET

6. Package outline

Plastic single-ended package; heatsink mounted; 1 mounting hole; 3-lead TO-220AB SOT78

AE
p
A
1
q
D
1
D
(1)
L
1
b
L
1
L
2
mounting
base
Q
123
b
e
e
0 5 10 mm
scale
c
DIMENSIONS (mm are the original dimensions)
L
(1)
b
A
4.5
4.1
A
1.39
1.27
1
UNIT
mm
Note
1. Terminals in this zone are not tinned.
OUTLINE
VERSION
SOT78 SC-463-lead TO-220AB
b
c
1
1.3
1.0
0.7
0.4
0.9
0.7
IEC JEDEC EIAJ
D
D
15.8
6.4
15.2
5.9
REFERENCES
e
E
1
10.3
9.7
2.54
L
15.0
13.5
L
3.30
2.79
2
1
max.
3.0
qQ
p
3.8
3.0
3.6
2.7
EUROPEAN
PROJECTION
2.6
2.2
ISSUE DATE
00-09-07 01-02-16
Fig 14. SOT78 (TO-220AB).
9397 750 09821
Product data Rev. 01 — 25 June 2002 9 of 14
© Koninklijke Philips Electronics N.V. 2002. All rights reserved.
Page 10
Philips Semiconductors
PHP/PHB/PHD71NQ03LT
TrenchMOS™ logic level FET
Plastic single-ended surface mounted package (Philips version of D2-PAK); 3 leads (one lead cropped)
A
E
D
1
D
H
D
mounting
base
2
A
1

SOT404

13
e e
DIMENSIONS (mm are the original dimensions)
0.64
0.46
D
max.
11
UNIT
mm
VERSION
A
4.50
4.10
OUTLINE
SOT404
A
1.40
1.27
b
1
0.85
0.60
IEC JEDEC EIAJ
D
1
1.60
10.30
1.20
9.70
REFERENCES
b
0 2.5 5 mm
scale
E
eLpH
2.90
2.54
2.10
D
15.80
14.80
Qc
2.60
2.20
L
p
c
Q
EUROPEAN
PROJECTION
ISSUE DATE
99-06-25 01-02-12
Fig 15. SOT404 (D2-PAK)
9397 750 09821
Product data Rev. 01 — 25 June 2002 10 of 14
© Koninklijke Philips Electronics N.V. 2002. All rights reserved.
Page 11
Philips Semiconductors
PHP/PHB/PHD71NQ03LT
Plastic single-ended surface mounted package (Philips version of D-PAK); 3 leads (one lead cropped)
seating plane
y
A
E
b
2
A
mounting
base
A
2
A
1
TrenchMOS™ logic level FET

SOT428

E
1
D
H
E
L
2
2
L
13
b
1
e
e
1
DIMENSIONS (mm are the original dimensions)
(1)
A
A
A
UNIT
mm
Note
1. Measured from heatsink back to lead.
OUTLINE VERSION
SOT428 TO-252 SC-63
2.38
2.22
1
0.65
0.45
b
2
0.89
0.93
0.71
0.73
IEC JEDEC JEITA
bc
b
1
1.1
0.9
b
5.46
5.26
wAM
D
c
2
0.4
6.22
0.2
5.98
REFERENCES
D
1
L
1
0 10 20 mm
scale
D
1
min.
4.0
E
EH
6.73
6.47
4.81
4.45
1
2.285
ee
1
4.57
10.4
9.6
E
2.95
2.55
L
1
L
min.
0.5
EUROPEAN
PROJECTION
L
0.9
0.5
2
y
w
max.
0.2 0.2
ISSUE DATE
99-09-13 01-12-11
Fig 16. SOT428 (D-PAK)
9397 750 09821
Product data Rev. 01 — 25 June 2002 11 of 14
© Koninklijke Philips Electronics N.V. 2002. All rights reserved.
Page 12
Philips Semiconductors

7. Revision history

Table 5: Revision history
Rev Date CPCN Description
01 20020625 Product data; initial version.
PHP/PHB/PHD71NQ03LT
TrenchMOS™ logic level FET
9397 750 09821
Product data Rev. 01 — 25 June 2002 12 of 14
© Koninklijke Philips Electronics N.V. 2002. All rights reserved.
Page 13
Philips Semiconductors
Philips Semiconductors

8. Data sheet status

PHP/PHB/PHD71NQ03LT
PHP/PHB/PHD71NQ03LT
TrenchMOS™ logic level FET
TrenchMOS™ logic level FET
Data sheet status
Objective data Development This data sheet containsdata from the objectivespecification for productdevelopment. Philips Semiconductors
Preliminary data Qualification This data sheet contains data from the preliminary specification. Supplementary data will be published at a
Product data Production This data sheet contains data from the product specification. Philips Semiconductors reserves the right to
[1] Please consult the most recently issued data sheet before initiating or completing a design. [2] The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at
URL http://www.semiconductors.philips.com.
[1]
Product status
9. Definitions
Short-form specification — The data in a short-form specification is
extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook.
Limiting values definition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitablefor the specified use without further testing or modification.
[2]
Definition
reserves the right to change the specification in any manner without notice.
later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product.
make changes at any time in order to improve the design, manufacturing and supply. Changes will be communicated according to the Customer Product/Process Change Notification (CPCN) procedure SNW-SQ-650A.

10. Disclaimers

Life support — These products are not designed for use in life support
appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application.
Right to make changes — Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, andmakes no representationsor warranties thatthese products are free frompatent,copyright, or mask workright infringement, unlessotherwise specified.

11. Trademarks

TrenchMOS —is a trademark of Koninklijke Philips Electronics N.V.
Contact information
For additional information, please visit http://www.semiconductors.philips.com. For sales office addresses, send e-mail to: sales.addresses@www.semiconductors.philips.com. Fax: +31 40 27 24825
© Koninklijke Philips Electronics N.V. 2002. All rights reserved.
9397 750 09821
9397 750 09821
Product data Rev. 01 — 25 June 2002 13 of 14
Product data Rev. 01 — 25 June 2002 13 of 14
© Koninklijke Philips Electronics N.V. 2002. All rights reserved.
Page 14
Philips Semiconductors
Contents
1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1 Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.4 Quick reference data. . . . . . . . . . . . . . . . . . . . . 1
2 Pinning information. . . . . . . . . . . . . . . . . . . . . . 1
3 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2
4 Thermal characteristics. . . . . . . . . . . . . . . . . . . 4
4.1 Transient thermal impedance . . . . . . . . . . . . . . 4
5 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 5
6 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9
7 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 12
8 Data sheet status. . . . . . . . . . . . . . . . . . . . . . . 13
9 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
10 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
11 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
PHP/PHB/PHD71NQ03LT
TrenchMOS™ logic level FET
© Koninklijke Philips Electronics N.V. 2002. Printed in The Netherlands
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Date of release: 25 June 2002 Document order number: 9397 750 09821
Loading...